Advanced Science And Novel Technology Company, Inc.
2790 Skypark Drive Suite 112, Torrance, CA 90505
Offices: 310-530-9400 / Fax: 310-530-9402
www.adsantec.com
ASNT2111-KMF
Programmable CDR DMUX 1-to-2
1:2 demultiplexer (DMUX) with integrated full-rate CDR
Input data range from 18Gb/s to 36Gb/s
NRZ input data format
CML compliant differential input and output high-speed data and clock interfaces
1.3V CMOS 3-wire interface for digital controls
LVDS or CML compliant input reference clock interface
Full-rate clock and retimed data output for 1:1 CDR operation
Half-rate data outputs with toggle synchronization functionality
Signal inversion and muting capabilities in all output buffers
Single +3.3V or -3.3V power supply
Low power consumption of 1.8W at the maximum operational speed
Industrial temperature range
Custom CQFP 64-pin package
vee
vcc
dop
vcc
don
vcc
3wdo
3wdin
3wcin
3wenin
vcc
c2p
vcc
c2n
vcc
vee
ASNT2111
vee
vcc
q0p
vcc
q0n
vcc
nc
lolp
nc
nc
vcc
q1p
vcc
nq1n
vcc
vee
vee
vcc
nc
vcc
nc
vcc
nc
ftr
vcc_vco
nc
vcc
c32p
vcc
c32n
vcc
vee
vee
vee
pkdtp
pkdtn
dcinp
vcc
vcc
dp
vcc
dn
vcc
vcc
dcinn
nc
vee
vee
Rev. 1.0.2
1
October 2020
Advanced Science And Novel Technology Company, Inc.
2790 Skypark Drive Suite 112, Torrance, CA 90505
Offices: 310-530-9400 / Fax: 310-530-9402
www.adsantec.com
DESCRIPTION
DOB
d
dcinp
dcinn
pkdtp
pkdtn
Data
IB
c32
CLK
IB
D
CDR
DMX
1:2
c2
onco
ondo
ond2o
DAC
rangecrl
vcosel
tog
pol
upicpp
upicpf
COB
offcml
q0
q1
C2
lolp
fltp
3wdin
3wcin
3wenin
3wdo
D2OB
x2
do
3-Wire Interface
Fig. 1. Functional Block Diagram
ASNT2111-KMF is a 1:2 demultiplexer (DMUX) with full-rate integrated clock and data recovery
(CDR). The IC shown in Fig. 1 functions in CDR mode covering a wide range of input data rates (fbit) by
utilizing its six on-chip VCOs (voltage-controlled oscillators). To reduce the physical number of control
inputs to the chip, a shift register with a 3-wire input interface (SPI) has been included on chip. The SPI
block provides all the digital controls for the chip. It also provides digital controls for digital-to-analog
converters (DACs) that handle internal analog DC voltage adjustments.
Selection of the desired working data rate of the CDR is accomplished through the digital control vcosel
(see Table 1). An external low speed system clock c32p/c32n running at 1/32 the frequency of the active
VCO must be applied to the low-speed clock input buffer (CLK IB).
The main function of the chip is to convert a RZ or NRZ input data signal dp/dn with a bit rate of fbit
accepted by CML buffer (Data IB) into 2 parallel NRZ data signals q0p/q0n and q1p/q1n running at bit
rates of fbit/2 and delivered to the outputs by CML data output buffers (D2OBx2). The clock and data are
recovered from the input data stream by the CDR.
A full rate retimed NRZ data output signal dop/don is also available through the CML data output buffer
(DOB) allowing the part to be used as a 1:1 CDR. Half rate clock c2p/c2n delivered through the CML
clock output buffer (COB) has a tight phase alignment to the demultiplexed data output signals q0p/q0n
and q1p/q1n.
Rev. 1.0.2
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Advanced Science And Novel Technology Company, Inc.
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Offices: 310-530-9400 / Fax: 310-530-9402
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Data IB can operate with either differential or single-ended input signals. It includes tuning pins
dcinp/dcinn for DC offset of the input signals in case of AC termination. When the buffer is operating
with a DC-terminated single ended input signal, a correct threshold voltage should be applied to the
unused input pin. A peak detector is also included to provide means of demodulating AM components
carried by the input data with frequency ranges of up to a few hundred kHz. The peak detector’s output
signal is delivered to the differential port pkdtp/pkdtn.
All CML I/Os provide on chip 50Ohm termination to vcc and may be used differentially, AC/DC
coupled, single-ended, or in any combination (see also POWER SUPPLY CONFIGURATION). Output
buffers DOB, COB, and D2OBx2 can be individually disabled through control bits ondo, onco, and
ond2o to save power.
Utilizing control bit pol, the deserializer can invert the polarity of the three output data signals. Control bit
tog flips the order of q0p/q0n and q1p/q1n signals thus simplifying the interface between the DMUX
and a following ASIC. It also allows for synchronization of the bit order of two or more DMUXes
working in parallel.
A loss of lock CMOS alarm signal lolp is generated by the CDR to indicate its locking state. An off chip
passive filter is required by the CDR, and should be connected to pin ftr (see CDR).
The deserializer is characterized for operation from 0°C to 125°C of junction temperature. The package
temperature resistance is 15°C /W.
Data IB
The Data Input Buffer (Data IB) can process an input CML data signal dp/dn in either RZ or NRZ format
due to its high analog bandwidth. It provides on-chip single-ended termination of 50Ohm to vcc for each
input line. The buffer can also accept a single-ended signal to one of its input ports dp or dn with a
threshold voltage applied to the unused pin in case of DC termination. In case of AC termination, tuning
pins dcinp/dcinn allow for data common mode adjustment. The tuning pins have 1kOhm terminations to
vcc and allow the user to change the slicing level before the data is sampled by the recovered clock.
Tuning voltages from vcc to vee deliver 150mV of DC voltage shift.
Also included in Data IB is an input signal peak detector that delivers its response through the output
differential signal pkdtp/pkdtn. The detector can demodulate AM component(s) carried by the input data
with frequency ranges of up to a few hundred kHz. The detector’s output impedance is 4kOhm single
ended to vcc.
CLK IB
The Clock Input Buffer (CLK IB) consists of a proprietary universal input buffer (UIB) that can operate
in either CML or LVDS mode depending on the state of digital control bit offcml. This control should be
set to “low” for CML mode and to “high” for LVDS mode. Depending on the mode of operation, the
input impedance switches between 50 Ohms to vcc single-ended in CML mode, and 100 Ohms
differential in LVDS mode. The input buffer exceeds LVDS standards IEEE Std. 1596.3-1996 and
ANSI/TIA/EIA-644-1995. UIB is designed to accept differential signals with a speed up to 1Gb/s, DC
common mode voltage variation between vcc and vee, AC common mode noise with a frequency up to
Rev. 1.0.2
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Offices: 310-530-9400 / Fax: 310-530-9402
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5MHz, and voltage levels ranging from 0 to 2.4V. It can also receive a DC-terminated single-ended signal
with a threshold voltage between vcc and vee applied to the unused pin.
CDR
The Clock and Data Recovery Block (CDR) contains a phase acquisition loop, and a frequency
acquisition loop. The frequency loop works in concert with low-speed clock c32p/c32n while the phase
loop utilizes input data signal dp/dn. The CDR requires a single off-chip filter shown in Fig. 2 to be
connected to the pin ftr.
66Ohm
ftr
390pF
22nF
Fig. 2. External Loop Filter
The main function of the CDR is to frequency-lock the selected on-chip VCO to the input data signal
(clock recovery) while phase-aligning it to latch in the incoming data with minimal error (data recovery).
By default, the CDR aligns the recovered clock’s working edge in the middle of the incoming data bits.
The recovered clock is divided down in frequency by two (C2), and utilized by DMX 1:2 for
demultiplexation of the recovered data.
By utilizing the 3-bit digital control vcosel, the desired working frequency of the CDR can be selected in
accordance with Table 1 below.
Table 1. CDR Mode Selection
vcosel
0
1
2
3
4
5
6
7
vcosel vcosel vcosel VCO Operation Frequency (GHz)
0
0
0
off
0
0
1
fmin≤16.7, fmax≥24.5
0
1
0
fmin≤19.4, fmax≥28.2
0
1
1
fmin≤22.2, fmax≥31.6
1
0
0
fmin≤25.1, fmax≥34.7
1
0
1
fmin≤27.8, fmax≥37.2
1
1
0
fmin≤31.0, fmax≥39.9
1
1
1
off
The loop gain can be adjusted by two control bits upicpp and upicpf that control the charge pump current
as shown in Table 2.
Table 2. Charge Pump Current Control
upicpp upicpf Charge Pump current, mA
0
0
Imax-0.31
0
1
Imax-0.27
1
0
Imax-0.04
1
1
Imax
Rev. 1.0.2
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October 2020
Advanced Science And Novel Technology Company, Inc.
2790 Skypark Drive Suite 112, Torrance, CA 90505
Offices: 310-530-9400 / Fax: 310-530-9402
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By utilizing the control byte rngcrl the DC current of the control emitter follower of the active VCO can
be adjusted linearly. Higher values of the control result in higher emitter follower currents. Higher emitter
follower currents result in a more linear VCO frequency dependence on the control voltage at the expense
of the frequency range.
The lock detect circuitry signals an alarm through the 2.5V CMOS signal lolp when a frequency
difference exists between an applied system reference clock c32p/c32n and a recovered full rate clock
divided-by-32 that is greater than ±1000ppm.
Another feature included in the CDR is the ability to simultaneously invert the polarity of all three data
outputs through the 2.5V CMOS input pin pol (pol = “1” (default): direct; pol = “0”: inverted). The order
of the half-rate output data streams can be inverted by using the 2.5V CMOS input pin tog, which
provides means to synchronize two adjacent DMUXes operating in parallel. The synchronization process
may be accomplished by the “blind” toggling in one of the chips and leaving the task of recognizing the
“right” position to downstream components (e.g. FEC chip).
DMX1:2
The 1 to 2 Demultiplexer (DMX1:2) latches in the retimed data stream D from the CDR on both edges of
the half rate clock signal C2. The high speed data signal is subsequently demultiplexed into two half rate
NRZ data signals, and delivered to D2OBx2 in parallel fashion as a 2-bit wide word with the order
defined by the tog signal.
DOB
The Data Output Buffer (DOB) receives a full rate retimed serial data stream D from the CDR and
converts it into a CML output signal dop/don. This CML buffer requires 50Ohm external termination
resistors connected between vcc and each output. The buffer can be enabled or disabled by the control bit
ondo (ondo = “1”: enabled; ondo = “0”: disabled).
D2OBx2
The Half Rate Data Output Buffer (D2OBx2) receives two half rate data signals from DMX1:2 and
converts them into CML output signals q0p/q0n and q1p/q1n. The buffer requires 50Ohm external
termination resistors connected between vcc and each output. The buffer can be enabled or disabled by
the control bit ond2o (ond2o = “1”: enabled; ond2o = “0”: disabled).
COB
The Clock Output Buffer (COB) receives a half rate clock signal from DMX1:2 and converts it into CML
output signal c2p/c2n. The buffer requires 50Ohm external termination resistors connected between vcc
and each output. The buffer can be enabled, or disabled by the control bit onco (onco = “1”: enabled;
onco = “0”: disabled). The negative edge of the c2 signal is aligned to the half rate output data crossing
points.
3-Wire Interface Control Block
To reduce the physical number of control inputs to the chip, a 3-byte shift register with a 3-wire input
interface has been included on chip. The SPI block is powered by an internally generated supply voltage
of +1.2V from vee. The digital control bits applied through 3wdin input are latched in and shifted down
Rev. 1.0.2
5
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Offices: 310-530-9400 / Fax: 310-530-9402
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the register with the clock 3wcin. Write enable signal 3wenin must be set to logic “0” during the data
read-in phase. The SPI data can be monitored through the output 3wdo. Table 3 presents the byte order of
the 3-wire interface block.
Table 3. Control Bytes
Byte
Number
1
2
3
7
6
5
upicpf
X
upicpp
X
tog
X
Bit Number
4
3
rngcrl(7:0)
onco ond2o
X
X
2
1
0
ondo pol offcml
vcosel(2:0)
SPI load order is illustrated in Fig. 3.
3wcin
3wenin
Sample
Latch
3wdin
X 7 6 5 4 3 2 1 0
7 6 5 4 3 2 1 0 X
Byte 1
Byte N
Fig. 3. SPI Load Order
Rev. 1.0.2
6
October 2020
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2790 Skypark Drive Suite 112, Torrance, CA 90505
Offices: 310-530-9400 / Fax: 310-530-9402
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POWER SUPPLY CONFIGURATION
The ASNT2111-KMF can operate with either a negative supply (vcc = 0.0V = ground and vee = -3.3V),
or a positive supply (vcc = +3.3V and vee = 0.0V = ground). In case of a positive supply, all I/Os need
AC termination when connected to any devices with 50Ohm termination to ground. Different PCB layouts
will be needed for each different power supply combination.
All the characteristics detailed below assume vcc = 3.3V and vee = 0V (external
ground)
ABSOLUTE MAXIMUM RATINGS
Caution: Exceeding the absolute maximum ratings shown in Table 3 may cause damage to this product
and/or lead to reduced reliability. Functional performance is specified over the recommended operating
conditions for power supply and temperature only that are specified in ELECTRICAL
CHARACTERISTICS. AC and DC device characteristics at or beyond the absolute maximum ratings are
not assumed or implied. All min and max voltage limits are referenced to ground (assumed vee).
Table 4. Absolute Maximum Ratings
Parameter
Supply Voltage (vcc)
Power Consumption
Input Voltage Swing (SE)
Case Temperature*)
Storage Temperature
Operational Humidity
Storage Humidity
*) - Operating the part at temperatures over
Min
-40
10
10
Max
+3.8
1.8
1.0
+90
+100
98
98
Units
V
W
V
ºC
ºC
%
%
this value could/will damage the part. Operating at this
temperature or any temperatures above the recommended maximum value specified in ELECTRICAL
CHARACTERISTICS does not guarantee correct functionality as is stated above.
Rev. 1.0.2
7
October 2020
Advanced Science And Novel Technology Company, Inc.
2790 Skypark Drive Suite 112, Torrance, CA 90505
Offices: 310-530-9400 / Fax: 310-530-9402
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TERMINAL FUNCTIONS
Name
vcc
vcc_vco
vee
nc
Name
Supply and Termination Voltages
Description
Pin Number
Positive power supply (+3.3V)
2, 4, 6, 11, 13, 15, 18, 20, 22, 27, 29, 31, 34, 36,
38, 43, 45, 47, 54, 55, 57, 59, 60
Positive power supply for VCO
9
(+3.3V)
Negative power supply (GND or 0V)
1, 16, 17, 32, 33, 48, 49, 50, 63, 64
Not connected pins
3, 5, 7, 10, 23, 24, 26, 62
TERMINAL
No.
Type
dp
dn
q1p
q1n
q0p
q0n
c2p
c2n
dop
don
56
58
21
19
30
28
37
35
46
44
c32p
c32n
pkdtp
pkdtn
3wenin
3wcin
3wdin
3wdo
12
Input
14
51
Output
52
39 1.2V CMOS
input
40
41
42 1.2V CMOS
output
lolp
25
dcinp
dcinn
ftr
Rev. 1.0.2
Input
Output
Output
Output
DESCRIPTION
High-Speed I/Os
CML differential data inputs with internal SE 50Ohm termination to
vcc
CML differential half rate data outputs. Require external SE 50Ohm
termination to vcc
CML differential half rate clock outputs. Require external SE 50Ohm
termination to vcc
CML differential full rate data outputs. Require external SE 50Ohm
termination to vcc
Low-Speed I/Os
CML or LVDS clock input with internal SE 50Ohm SE or differential
100Ohm termination
Peak detector outputs
Enable input signal for 3-wire interface
Clock input signal for 3-wire interface
Data input signal for 3-wire interface
Data output signal of 3-wire interface
Controls
LS out,
CDR lock indicator (high: no lock; low: locked)
2.5V CMOS
53
LS IN
Input data common mode voltage adjustment
61
8
I/O
External CDR filter connection
8
October 2020
Advanced Science And Novel Technology Company, Inc.
2790 Skypark Drive Suite 112, Torrance, CA 90505
Offices: 310-530-9400 / Fax: 310-530-9402
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ELECTRICAL CHARACTERISTICS
PARAMETER
TYP MAX
UNIT
COMMENTS
General Parameters
+3.0
+3.3
+3.6
V
±9%
vcc
0.0
V
vee
Ivcc
535
mA
All functions active
Power Consumption
1.8
W
Junction Temperature
-25
50
125
°C
Case temperature
75
°C
Recommended value
HS Input Data (dp/dn)
Data Rate
18
36
Gbps
NRZ
Swing p-p (Diff or SE)
0.05
0.6
V
CM Voltage Level
vcc-0.8
vcc
V
LS Input Reference Clock (c32p/c32n)
Frequency
562.5
1.125
MHz
Swing p-p (Diff or SE)
0.06
0.8
V
CM Voltage Level
V
vee
vcc
Duty Cycle
40
50
60
%
HS Output Full Rate Data (dop/don)
Data Rate
18
36
Gbps
NRZ
Logic “1” level
V
vcc
Logic “0” level
vcc -0.4 vcc -0.3
V
Jitter
7
8
ps
p-p
HS Output Half Rate Data (q0p/q0n, q1p/q1n)
Data Rate
9
18
Gbps
Logic “1” level
V
vcc
Logic “0” level
vcc -0.4
V
Jitter
7
ps
p-p
HS Output Half Rate Clock (c2p/c2n)
Clock Rate
9
18
GHz
24 to 36Gbps input
Logic “1” level
V
vcc
Logic “0” level
vcc -0.4
vcc -0.15
V
Jitter
5
8
ps
p-p
Input Data Common Mode Control (dcinp/dcinn)
Input DC Voltage
V
vee
vcc
Input Data Voltage Shift
0
-150
mV
Referenced to vcc
Output of Peak Detector (pkdtp/pkdtn)
Swing p-p (Diff)
-1
1
V
Over full input range
CM Voltage Level
vcc -1.0
V
3-Wire Inputs (3wdin, 3wcin, 3wenin)
High voltage level
vee+1.1
vee+1.35
V
Low voltage level
vee
vee+0.35
V
Clock speed
350
400
MHz
Rev. 1.0.2
MIN
9
October 2020
Advanced Science And Novel Technology Company, Inc.
2790 Skypark Drive Suite 112, Torrance, CA 90505
Offices: 310-530-9400 / Fax: 310-530-9402
www.adsantec.com
PACKAGE INFORMATION
The chip die is housed in a custom 64-pin CQFP package. The dimensioned drawings are shown in Fig. 4.
The package’s leads will be trimmed to a length of 1.0mm. After trimming, the package’s leads will be
further processed as follows:
Fig. 4. CQFP 64-Pin Package Drawing (All Dimensions in mm)
Rev. 1.0.2
10
October 2020
Advanced Science And Novel Technology Company, Inc.
2790 Skypark Drive Suite 112, Torrance, CA 90505
Offices: 310-530-9400 / Fax: 310-530-9402
www.adsantec.com
1. The lead’s gold plating will be removed per the following sections of J-STD-001D:
3.9.1 Solderability
3.2.2 Solder Purity Maintenance
3.9.2 Solderability Maintenance
3.9.3 Gold Removal
2. The leads will be tinned with Sn63Pb37 solder
The package provides a center heat slug located on its back side to be used for heat dissipation.
ADSANTEC recommends for this section to be soldered to the vcc plain, which is ground for a negative
supply, or power for a positive supply.
The part’s identification label is ASNT2111-KMF. The first 8 characters of the name before the dash
identify the bare die including general circuit family, fabrication technology, specific circuit type, and part
version while the 3 characters after the dash represent the package’s manufacturer, type, and pin out
count.
This device complies with the Restriction of Hazardous Substances (RoHS) per EU 2011/65/EU for all
ten substances.
REVISION HISTORY
Revision
1.0.2
Date
10-2020
0.0.1
03-2020
Rev. 1.0.2
Changes
Official release
Corrected frequency range
Corrected filter schematic
Preliminary release
11
October 2020