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SN74LS253D

SN74LS253D

  • 厂商:

    ROCHESTER(罗切斯特)

  • 封装:

    SOIC-16

  • 描述:

    MULTIPLEXER/DEMULTIPLEXER

  • 数据手册
  • 价格&库存
SN74LS253D 数据手册
                      SDLS147 − SEPTEMBER 1972 − REVISED MARCH 1988 Copyright  1988, Texas Instruments Incorporated    !"# $ %&'# "$  (&)*%"# +"#', +&%#$ %! # $('%%"#$ (' #-' #'!$  '."$ $#&!'#$ $#"+"+ /""#0, +&%# (%'$$1 +'$ # '%'$$"*0 %*&+' #'$#1  "** (""!'#'$, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1                       SDLS147 − SEPTEMBER 1972 − REVISED MARCH 1988 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265                       SDLS147 − SEPTEMBER 1972 − REVISED MARCH 1988 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3                       SDLS147 − SEPTEMBER 1972 − REVISED MARCH 1988 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265                       SDLS147 − SEPTEMBER 1972 − REVISED MARCH 1988 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 9-Aug-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 76017012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI -55 to 125 76017012A SNJ54LS 253FK 7601701EA ACTIVE CDIP J 16 1 TBD Call TI Call TI -55 to 125 7601701EA SNJ54LS253J 7601701EA ACTIVE CDIP J 16 1 TBD Call TI Call TI -55 to 125 7601701EA SNJ54LS253J 7601701FA NRND CFP W 16 1 TBD Call TI Call TI -55 to 125 7601701FA SNJ54LS253W 7601701FA NRND CFP W 16 1 TBD Call TI Call TI -55 to 125 7601701FA SNJ54LS253W JM38510/30908B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 30908B2A JM38510/30908B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 30908B2A JM38510/30908BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30908BEA JM38510/30908BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30908BEA JM38510/30908BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30908BFA JM38510/30908BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30908BFA M38510/30908B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 30908B2A M38510/30908B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 30908B2A M38510/30908BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30908BEA M38510/30908BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30908BEA M38510/30908BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30908BFA M38510/30908BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 9-Aug-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 30908BFA SN54LS253J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS253J SN54LS253J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS253J SN74LS253D ACTIVE SOIC D 16 TBD Call TI Call TI 0 to 70 LS253 SN74LS253D ACTIVE SOIC D 16 TBD Call TI Call TI 0 to 70 LS253 SN74LS253DE4 ACTIVE SOIC D 16 TBD Call TI Call TI 0 to 70 LS253 SN74LS253DE4 ACTIVE SOIC D 16 TBD Call TI Call TI 0 to 70 LS253 SN74LS253DG4 ACTIVE SOIC D 16 TBD Call TI Call TI 0 to 70 LS253 SN74LS253DG4 ACTIVE SOIC D 16 TBD Call TI Call TI 0 to 70 LS253 SN74LS253DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS253 SN74LS253DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS253 SN74LS253DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS253 SN74LS253DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS253 SN74LS253DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS253 SN74LS253DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS253 SN74LS253J OBSOLETE CDIP J 16 TBD Call TI Call TI 0 to 70 SN74LS253J OBSOLETE CDIP J 16 TBD Call TI Call TI 0 to 70 SN74LS253N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS253N SN74LS253N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS253N SN74LS253N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS253N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 9-Aug-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) SN74LS253NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS253N SN74LS253NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS253N SN74LS253NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS253 SN74LS253NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS253 SN74LS253NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS253 SN74LS253NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS253 SN74LS253NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS253 SN74LS253NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS253 SN74S253N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74S253N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SNJ54LS253FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76017012A SNJ54LS 253FK SNJ54LS253FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76017012A SNJ54LS 253FK SNJ54LS253J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601701EA SNJ54LS253J SNJ54LS253J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601701EA SNJ54LS253J SNJ54LS253W NRND CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601701FA SNJ54LS253W SNJ54LS253W NRND CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601701FA SNJ54LS253W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 9-Aug-2013 PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54LS253, SN74LS253 : • Catalog: SN74LS253 • Military: SN54LS253 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LS253DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74LS253NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS253DR SN74LS253NSR SOIC D 16 2500 333.2 345.9 28.6 SO NS 16 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. 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