IS32LT3361
INTEGRATED NMOS SWITCH 40V/1.3A LED DRIVER
WITH FAULT REPORTING
July 2020
GENERAL DESCRIPTION
FEATURES
The IS32LT3361 is a continuous mode inductive
step-down converter, designed for driving a single
LED or multiple series connected LEDs efficiently
from a voltage source higher than the LED voltage.
The chip operates from an input supply between 6V
and 40V and provides an externally adjustable output
current of up to 1.3A.
The IS32LT3361 includes an integrated low-side
output NMOS switch and a high-side output current
sensing circuit, which uses an external resistor to set
the nominal average output current.
Output current can be adjusted linearly by applying
an external control signal to the ADJ pin. The ADJ
pin will accept either a DC voltage or a PWM
waveform. This will provide either a continuous or a
gated output current. Applying a voltage less than
0.6V to the ADJ pin turns the output off and switches
the chip into a low current standby state.
IS32LT3361 also features robust protections with
fault reporting to ensure reliable operation.
Wide input voltage range: 6V~40V
Integrated 40V NMOS switch
Up to 1.3A output current
High efficiency (up to 98%)
Simple low parts count
±5% output current accuracy over -40°C to
+125°C temperature
Single pin on/off and brightness control using DC
voltage or PWM
Up to 2000: 1 dimming ratio at 100Hz PWM
Up to 1MHz switching frequency
Robust fault protections
Open drain shared fault reporting
LED string open/short protection
Integrated NMOS over current protection
Diode open/short protection
Thermal shutdown protection
AEC-Q100 Qualified
APPLICATIONS
Automotive and avionic lighting
Fog lights
Daytime running lights
Combination tail lights
Courtesy lights
Other LED lighting
The chip is assembled in a thermally enhanced
SOP-8-EP package and operates over the
temperature range of -40°C to +125°C.
TYPICAL APPLICATION CIRCUIT
VIN
RS
D1
8
C1
C2
4.7 F
2
RFAULTB
47kΩ
VIN
ISENSE
5
COUT
1 F
GND
IS32LT3361
3
4
CADJ
2.2nF
FAULTB
ADJ
LX
1
L1
47 H
Figure 1 Typical Application Circuit
Note 1: The capacitor, C2, can’t be removed. And it MUST be placed as close as possible to the VIN and GND pins, otherwise the operation
might be abnormal.
Note 2: RS must be placed as close as possible to VIN and ISENSE pins to avoid noise interference.
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1
IS32LT3361
PIN CONFIGURATION
Package
Pin Configuration
SOP-8-EP
PIN DESCRIPTION
No.
Pin
Description
1
LX
Drain of NMOS switch.
2
GND
Ground pin.
FAULTB
Open drain I/O diagnostic pin. Active low output driven by the device
when it detects a fault condition. As an input, this pin will accept an
externally generated FAULTB signal to disable the device output to
satisfy the “One Fail All Fail” function. Note this pin requires an external
pull up resistor (RFAULTB) to logic high level voltage. Do not allow to float.
4
ADJ
Multi-function On/Off and brightness control pin:
* Leave floating for normal operation. (VADJ= VREF= 2.5V giving nominal
average output current IOUT_NOM = 0.1V/RS)
* Drive to below 0.6V to turn off output current. Keep low for over tSD to
enter low current standby mode
* Drive with DC voltage (0.81V 100Hz
tSD
The low voltage persist time on ADJ
pin to shutdown IC
VADJ20ms
24
22
22
VIN = 12V
ADJ=GND for >20ms
20
20
ISD (μA)
ISD (µA)
35
Temperature (°C)
IINQ_ON vs. Supply Voltage
Figure 2
20
18
18
16
16
14
14
12
12
10
5
10
15
20
25
30
35
10
-40
40
-25
-10
5
Supply Voltage (V)
35
50
65
Temperature (°C)
ISD vs. Supply Voltage
Figure 4
20
Figure 5
0.26
ISD vs. Temperature
0.36
VIN = 12V
TA = 25°C
0.24
0.22
RLX (Ω)
RLX (Ω)
0.31
0.20
0.21
0.18
0.16
0.26
5
10
15
20
25
30
35
40
0.16
-40
-25
-10
5
Supply Voltage (V)
Figure 6
RLX vs. Supply Voltage
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20
35
50
65
Temperature (°C)
Figure 7
RLX vs. Temperature
6
IS32LT3361
2.6
2.6
TA = 25°C
ADJ Floating
2.5
2.5
2.4
2.4
VADJ (V)
VADJ (V)
VIN = 12V
ADJ Floating
2.3
2.3
2.2
2.2
2.1
2.1
2.0
5
10
15
20
25
30
35
2.0
-40
40
-25
-10
5
20
50
65
80
95
110
125
80
95
110
125
80
90
100
Temperature (°C)
Supply Voltage (V)
VADJ vs. Supply Voltage
Figure 8
35
Figure 9
VADJ vs. Temperature
106
110
VIN = 12V
TA = 25°C
100
VIN = 12V
ADJ Floating
104
102
80
VSENSE (mV)
VSENSE (mV)
90
70
60
50
100
98
40
96
30
94
20
92
10
0
0.8
1
1.2
1.4
1.6
1.8
2
2.2
2.4
2.6
90
-40
2.8
-25
-10
5
20
VSENSE vs. VADJ
Figure 11
65
VSENSE vs. Temperature
1400
5.5
5.4
VIN = 12V
VLED = 6V
L1 = 47μH
RS= 0.077Ω
fPWM= 100Hz, 500Hz, 1kHz
1200
Output Current (mA)
5.3
VIN_UVLO (V)
50
Temperature (°C)
VADJ (V)
Figure 10
35
5.2
5.1
5.0
4.9
4.8
1000
800
600
400
4.7
200
4.6
4.5
-40
-25
-10
5
20
35
50
65
80
95
110
125
0
0
10
20
30
Temperature (°C)
Figure 12
VIN_UVLO vs. Temperature
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Rev. A, 07/21/2020
40
50
60
70
Duty Cycle (%)
Figure 13
PWM Dimming
7
IS32LT3361
1400
1380
L1 = 47μH
RS= 0.077Ω
95
1360
1340
2LED
3LED
1320
1300
4LED
1280
5LED 6LED 7LED
10LED
8LED 9LED
7LED
3LED
90
2LED
85
80 1LED
10LED
9LED
8LED
1260
5LED
6LED
4LED
1LED
Efficiency (%)
Output Current (mA)
100
L1 = 47μH
RS= 0.077Ω
1240
75
1220
1200
5
10
15
20
25
30
35
70
40
5
10
15
Supply Voltage (V)
Figure 14
750
Output Current vs. Supply Voltage
30
35
40
Efficiency vs. Supply Voltage
Figure 15
100
L1 = 47μH
RS= 0.154Ω
L1 = 47μH
RS= 0.154Ω
5LED
6LED 7LED 8LED 9LED
10LED
4LED
700
3LED
Efficiency (%)
Output Current (mA)
25
Supply Voltage (V)
95
1LED
2LED
650
3LED
4LED
5LED
600
550
20
5
10
15
7LED
8LED
6LED
9LED
20
25
2LED
90
85
1LED
80
10LED
30
35
75
40
70
5
10
15
Supply Voltage (V)
Figure 16
Output Current vs. Supply Voltage
Figure 17
VIN
10V/Div
VLX
10V/Div
VLX
10V/Div
Time (2ms/Div)
Power Up
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30
35
40
Efficiency vs. Supply Voltage
VADJ
5V/Div
VIN = 12V
VLED = 6V
L1 = 47μH
RS = 0.2Ω
CADJ = 2.2nF
Figure 18
25
Supply Voltage (V)
VIN
10V/Div
IL1
200mA/Div
20
IL1
200mA/Div
VIN = 12V
VLED = 6V
L1 = 47μH
RS = 0.2Ω
CADJ = 2.2nF
Time (200μs/Div)
Figure 19
Power Down
8
IS32LT3361
VIN
10V/Div
VIN
10V/Div
VLX
10V/Div
VLX
10V/Div
VADJ
2V/Div
VIN = 12V
VLED = 6V
L1 = 47μH
RS = 0.2Ω
VADJ
2V/Div
IL1
500mA/Div
Time (10μs/Div)
Figure 20
IL1
500mA/Div
Time (10μs/Div)
PWM On
Figure 21
PWM Off
VLX
20V/Div
VIN
10V/Div
VLX
10V/Div
VADJ
2V/Div
VIN = 12V
VLED = 6V
L1 = 47μH
RS = 0.2Ω
VFAULTB
10V/Div
VLED10V/Div
VIN = 12V
VLED = 6V
L1 = 47μH
RS = 0.2Ω
IL1
1A/Div
IL1
500mA/Div
Time (20μs/Div)
Figure 22
Time (20ms/Div)
Enabling from Shutdown Mode
Figure 23
VIN = 12V
L1 = 47μH
VIN = 12V
COUT = 1μF
L1 = 47μH
LED Open and Recovery
VIN = 12V
L1 = 47μH
VLX
20V/Div
VLX
10V/Div
VFAULTB
10V/Div
VFAULTB
10V/Div
IL1
500mA/Div
ILX
5A/Div
Time (20ms/Div)
Figure 24
Diode Open
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Time (20ms/Div)
Figure 25
Diode Short and Recovery
9
IS32LT3361
FUNCTIONAL BLOCK DIAGRAM
VIN
ISENSE
FAULTB
Fault
Thermal
Shutdown
Fault Shutdown
Input
Thermal
VDD
Thermal
ADJ
Regulator
580kΩ
ADJ
2.5V
4.5V
POR
Voltage
Regulator
Fault
Report
BandGap
Didoe Short
Detect
OP
Didoe Open
Detect
LX
Clamp
LPF
LED Open
Detect
CMP
Logic
Driver
Shutdown Fault Shutdown
Command
Detector
GND
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Rev. A, 07/21/2020
10
IS32LT3361
APPLICATION INFORMATION
The IS32LT3361 is a current hysteresis control LED
buck driver with integrated NMOS switch. When
power is applied, the integrated NMOS switch is
turned on and the current starts to flow through the
sense resistor RS, the LED string, the inductor L1 and
internal NMOS switch to ground. The current ramps
up linearly and its ramp up rate is determined by the
supply voltage, LED string voltage and inductor L1
value. The device monitors the voltage across the
sense resistor RS, which is produced by RS x IOUT.
Once the voltage reaches the internal upper
threshold (about +15% over VSENSE), the integrated
NMOS switch is turned off and the current in the
inductor L1 continues to flow through the Schottky
diode D1, sense resistor RS, LED string and back into
the inductor. The current linearly ramps down and its
ramp down rate is determined by the Schottky diode
D1 forward voltage, the LED string voltage and
inductor L1 value. When the voltage reaches the
internal lower threshold (about -15% below VSENSE),
the integrated NMOS switch is turned on again.
Therefore the on/off of the NMOS switch maintains
an average current in the LED string set by sense
resistor RS.
for the sense resistor to maintain a switch current
below the specified maximum value of 1.3A.
Table 1 gives values of nominal average output
current for several values of current setting resistor
(RS) in the typical application circuit Figure 1:
Table 1 Output Current Setting
Nominal Average Output
RS (Ω)
Current (mA)
0.077
1300
0.15
667
0.3
333
The above values assume that the ADJ pin is floating
and at a nominal voltage of VREF = 2.5V.
RS needs to be a 1% accuracy resistor with enough
power tolerance and good temperature characteristic
to ensure a stable output current. On PCB layout, this
resistor MUST be placed as close to VIN and
ISENSE pins as possible to avoid the EMI noise
interference.
ENABLE AND PWM DIMMING
A high logic signal (>2.5V) on the ADJ pin will enable
the IC. The buck converter ramps up the LED current
to a target level which is set by current sense resistor,
RS.
Figure 26
Operation Waveforms
UNDER VOLTAGE LOCKOUT (UVLO)
The device features an under voltage lockout (UVLO)
function on VIN pin. This is a fixed value which
cannot be adjusted. The device is enabled when the
VIN voltage rises to exceed VIN_UVLO (Typ. 5.25V),
and disabled when the VIN voltage falls below
(VIN_VLO – VIN_UVLO_HY) (Typ. 5.05V).
OUTPUT CURRENT SETTING
The nominal average output current in the LED(s) is
determined by the value of the external current sense
resistor (RS) connected between VIN and ISENSE
pins and is given by Equation (1):
I OUT _ NOM
0.1V
RS
(1)
Note that RS=0.077Ω is the minimum allowed value
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When the ADJ pin goes from high to low ( 150ns.
LX Switch ‘OFF’ time:
t OFF
VLED
L I
VD I AVG ( RL RS )
(6)
very important to consider the reverse leakage of the
diode when operating at high temperature. Excess
leakage will increase the power dissipation in the
device.
The higher forward voltage and overshoot due to
reverse recovery time in silicon diodes will increase
the peak voltage on the LX output. If a silicon diode is
used, care should be taken to ensure that the total
voltage appearing on the LX pin including supply
ripple, does not exceed the specified maximum
value.
REDUCING LED CURRENT RIPPLE
VIN is the supply voltage (V)
In a buck architecture, the output current is identical
with the inductor current. For the IS32LT3361, the
output current ripple is fixed at about ±15%.
Connecting an output capacitor in parallel with LED
string will further reduce the current ripple in the LED
string. A value of 1μF will reduce nominal ripple
current by a factor of three (approx.). Proportionally
lower ripple can be achieved with higher capacitor
values. Note that the capacitor will not affect
operating frequency or efficiency, but it will increase
start-up delay, by reducing the rate of rise of LED
voltage.
VLED is the total LED forward voltage (V)
FAULT PROTECTION AND REPORTING
RLX is the NMOS switch resistance (Ω)
For robust system reliability, the IS32LT3361
integrates the detection circuitry to protect various
fault conditions and report the fault conditions by the
FAULTB pin which can be monitored by an external
host. The fault protections include LED string open,
Schottky diode open/short and thermal shutdown.
Refer to Table 2. The FAULTB pin is an open drain
structure with both input and output functionality. The
FAULTB pin is not allowed to float. An external
resistor, RFAULTB, must be added to pull up the
FAULTB pin above 2V for normal operation. The
recommended resistor value is 47kΩ. The FAULTB
pin will go low after a delay time, tFAULTB, if the
IS32LT3361 detects a fault condition. If the fault
condition is removed, the FAULTB pin will recover to
a high impedance state after tFAULTB. The delay time
is helpful to block some unwanted false fault
reporting.
Note: tOFF_MIN > 150ns.
Where:
L is the inductor inductance (H)
RL is the inductor resistance (Ω)
IAVG is the required LED current (A)
∆I is the inductor peak-peak ripple current (A)
[Internally set to 0.3 × IAVG]
VD is the diode forward voltage at the required load
current (V)
Example:
For VIN=12V, L=47μH, RL=0.26Ω, VLED=3.4V, IAVG
=333mA, VD =0.36V, RS = 0.3Ω, RLX=0.25Ω:
47 0.3 0.333
0.564 s
12 3.4 0.333 (0.3 0.26 0.25)
47 0.3 0.333
1.19 s
3.4 0.36 0.333 (0.26 0.3)
t ON
t OFF
This gives an operating frequency of 570kHz and a
duty cycle of 32%.
Optimum performance will be achieved by setting the
duty cycle close to 50% at the nominal supply voltage.
This helps to equalize the undershoot and overshoot
and improves temperature stability of the output
current.
DIODE SELECTION
For maximum efficiency and performance, the
rectifier (D1) should be a fast and low capacitance
Schottky diode with low reverse leakage at the
maximum operating voltage and temperature.
If alternative diodes are used, it is important to select
diodes with a peak current rating above the peak
inductor current and a continuous current rating
higher than the maximum output load current. It is
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As an input pin, externally pulling the FAULTB pin
low will disable the output at once. For lighting
systems with multiple IS32LT3361 drivers which
require the complete lighting system be shut down
when a fault is detected, the FAULTB pin can be
used in a parallel connection. A fault output by one
device will pull low the FAULTB pins of the other
parallel connected devices and simultaneously turn
them off. This satisfies the “One Fail All Fail”
operating requirement. If the FAULTB pin is shared
with multiple devices and more than one external
RFAULTB is used, the resulting equivalent parallel
resistor value should not result in >5mA to each
FAULTB input.
13
IS32LT3361
LED STRING OPEN PROTECTION
The LED string open detection is enabled after the
VIN voltage rises above the internally fixed threshold,
VFT_UVLO, which is to prevent insufficient VIN voltage
falsely triggering an open detection. If the connection
to the LED(s) is open, the loop current flow is cut off,
the voltage cross the sense resistor RS will never
reach the internal upper threshold, preventing
switching operation (the NMOS switch stays in the
ON state). This prevents damage to the IS32LT3361,
unlike in many boost converters, where the back
EMF may damage the internal switch by forcing the
drain above its breakdown voltage. If the switching
stops for more than 20μs (Typ.) and if tFAULTB time is
exceeded, the device recognizes this as an LED
string open fault pulls the FAULTB pin low to report a
fault. Once the open fault condition is removed, the
device will recover to normal operation and the
FAULTB pin will go back to high impedance state
after tFAULTB.
the integrated NMOS switch turns off, the voltage on
LX pin will increase due to the back EMF of the
inductor. When the LX pin voltage exceeds the open
diode detection threshold, VOD_TH, the IS32LT3361
latches at the off state (stop switching) and pulls
FAULTB pin low to report after exceeding tFAULTB.
The back EMF is discharged by the breakdown of the
integrated NMOS switch, which is overstressed and
may cause permanent damage to the device.
Therefore the protection is not auto recoverable but
needs a power cycle. Note that even though the
diode open protection is able to latch the switching
off, the back EMF still might cause permanent
damage to the NMOS switch. To avoid an open
diode condition, it is recommended that the soldering
reliability of the Schottky diode must be ensured
during the mass-production.
IS32LT3361
LED SHORT PROTECTION
D1
COUT
1 F
L1
47 H
If the LED string is shorted by a low impedance wire,
the system will continue operation with the set
current but at a very low duty cycle, however it will
not cause any damage to system. An LED
short-circuit will not be reported at the FAULTB pin.
LX
Overshoot
DIODE SHORT PROTECTION
Should the Schottky diode be shorted by a low
impedance wire, the power supply is directly
connected to the drain of the integrated NMOS
switch and will be shorted to ground when the NMOS
switch turns on. That triggers the NMOS switch
current limit protection and the integrated NMOS
switch will immediately turn off and the FAULTB pin
will go low after tFAULTB. The device enters a hiccup
mode of tSKIP cycle time until the fault condition is
removed and FAULTB pin goes back to high
impedance state after tFAULTB.
DIODE OPEN PROTECTION
In the event the Schottky diode fails open and once
Figure 29
Schottky Diode Open
THERMAL SHUTDOWN PROTECTION
To protect the device from damage due to high
power dissipation, the junction temperature is
monitored. If the junction temperature exceeds the
thermal shutdown temperature of 165°C (Typ.) then
the device will shut down immediately, and the output
current is shut off and FAULTB pin is pulled low after
tFAULTB. After a thermal shutdown event, the
IS32LT3361 will not try to restart until its temperature
has reduced to less than 150°C (Typ.). Once it
restarts the FAULTB pin will recover to a high
impedance state after tFAULTB.
Table 2 Fault Conditions
Fault Type Detection Condition
Driver Action
LED open
VIN>VFT_UVLO and NMOS
switch on-time exceeds
20µs
Normal operation
Diode short
NMOS switch current
exceeds ILX_LIMIT
NMOS switch turns off immediately
and retrys after every tSKIP cycle time
Diode open
LX pin voltage exceeds
VOD_TH for 1 switching
cycles time
Latch at off state immediately
Thermal
shutdown
The junction temperature
exceeds 165°C
NMOS switch turns off immediately
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Fault Reporting
Fault Recovering
NMOS switch on-time is
shorter than 20µs
FAULTB pin is
pulled low after the
delay time tFAULTB
NMOS switch current drops
below ILX_LIMIT
Power cycle
The junction temperature
falls below 150°C.
14
IS32LT3361
THERMAL CONSIDERATIONS
The package thermal resistance, θJA, determines the
amount of heat that can pass from the silicon die to
the surrounding ambient environment. The θJA is a
measure of the temperature rise created by power
dissipation and is usually measured in degree
Celsius per watt (°C/W).
When operating the chip at high ambient
temperatures, or when driving maximum load current,
care must be taken to avoid exceeding the package
power dissipation limits. The maximum power
dissipation can be calculated using the following
Equation:
PD ( MAX )
PD ( MAX )
So,
TJ ( MAX ) TA
125C 25C
2.3W
43.5C / W
Figure 30, shows the power derating of the
IS32LT3361 on a JEDEC boards (in accordance with
JESD 51-5 and JESD 51-7) standing in still air.
2.5
SOP-8-EP
Power Dissipation (W)
Board Via Layout For Thermal Dissipation
LAYOUT CONSIDERATIONS
(7)
JA
Figure 31
2
As for all switching power supplies, especially those
providing high current and using high switching
frequencies, layout is an important design step. If
layout is not carefully handled, the operation could
show instability as well as EMI problems.
The high dV/dt surface and dI/dt loops are a big
noise emission source. To optimize the EMI
performance, maintain a compact PCB layout for all
high switching frequency points with a high voltage.
Meantime, keep all traces carrying high current as
short as possible to minimize the loops.
VIN Pin
The capacitor C1 and C2 should be placed as close
as possible to VIN and GND pins for good filtering.
Especially the C2 (4.7µF), it must be right next to the
IS32LT3361 to prevent ground bounce, otherwise
the device operation may be abnormal.
1.5
1
RS Resistor
0.5
0
-40
-25
-10
5
20
35
50
65
80
95
110 125
Temperature (°C)
Figure 30
Dissipation Curve
The thermal resistance is achieved by mounting the
IS32LT3361 on a standard FR4 double-sided printed
circuit board (PCB) with a copper area of a few
square inches on each side of the board under the
IS32LT3361. Multiple thermal vias, as shown in
Figure 31, help to conduct the heat from the exposed
pad of the IS32LT3361 to the copper on each side of
the board. The thermal resistance can be reduced by
using a metal substrate or by adding a heatsink.
To avoid ground jitter, the current monitoring resistor,
RS, should be placed close to the device with short
trace length to the device pins. To prevent noise
coupling, the RS traces should either be far away or
be isolated from high-current paths and high-speed
switching nodes. These practices are essential for
improved accuracy and stability.
LX Pin
Keep the traces of the switching points short. The
inductor L1, LX and free wheeling Schottky diode D1
should be placed as close to each other as possible
and the traces of connection between them kept as
short and wide as possible.
ADJ Pin
The ADJ pin is a high impedance input, so when left
floating, PCB traces to this pin should be as short as
possible to reduce noise pickup. A small nanofarad
capacitor is recommended for soft start and noise
decoupling.
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15
IS32LT3361
Thermal Pad
The thermal pad under the IS32LT3361 package
must be soldered to a sufficient size of copper
ground plane with sufficient vias to conduct the heat
to opposite side PCB for adequate cooling.
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16
IS32LT3361
CLASSIFICATION REFLOW PROFILES
Profile Feature
Pb-Free Assembly
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
150°C
200°C
60-120 seconds
Average ramp-up rate (Tsmax to Tp)
3°C/second max.
Liquidous temperature (TL)
Time at liquidous (tL)
217°C
60-150 seconds
Peak package body temperature (Tp)*
Max 260°C
Time (tp)** within 5°C of the specified
classification temperature (Tc)
Max 30 seconds
Average ramp-down rate (Tp to Tsmax)
6°C/second max.
Time 25°C to peak temperature
Figure 32
8 minutes max.
Classification Profile
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Rev. A, 07/21/2020
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IS32LT3361
PACKAGE INFORMATION
SOP-8-EP
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Rev. A, 07/21/2020
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IS32LT3361
RECOMMENDED LAND PATTERN
SOP-8-EP
Note:
1. Land pattern complies to IPC-7351.
2. All dimensions in MM.
3. This document (including dimensions, notes & specs) is a recommendation based on typical circuit board manufacturing parameters. Since
land pattern design depends on many factors unknown (eg. User’s board manufacturing specs), user must determine suitability for use.
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Rev. A, 07/21/2020
19
IS32LT3361
REVISION HISTORY
Revision
Detail Information
Date
0A
Initial release
2020.03.06
A
Update to final version
2020.07.21
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