RS721P, RS722P, RS724P
10MHz, Precision, Rail-to-Rail I/O
CMOS Operational Amplifier
FEATURES
DESCRIPTION
•
HIGH GAIN BANDWIDTH:10MHz
•
RAIL-TO-RAIL INPUT AND OUTPUT
0.8mV Max Vos
INPUT VOLTAGE RANGE: -0.2V to +5.7V
with Vs = 5.5V
•
•
SUPPLY RANGE: +2.5V to +5.5V
•
•
SPECIFIED UP TO +125°C
Micro SIZE PACKAGES: SOT23-5
SOT353(SC70-5)
The RS721P, RS722P, RS724P families of products
offer low voltage operation and rail-to-rail input and
output, as well as excellent speed/power
consumption ratio, providing an excellent bandwidth
(10MHz) and slew rate of 6V/us. The op-amps are
unity gain stable and feature an ultra-low input bias
current.
The RS721P, RS722P and RS724P has lower offset,
which is guaranteed not upper than 0.5mV at 25°C
with Vs = 5V, VCM = Vs/2.
The devices are ideal for sensor interfaces, active
filters and portable applications. The RS721P,
RS722P, RS724P families of operational amplifiers
are specified at the full temperature range of −40°C
to +125°C under single or dual power supplies of 2.5V
to 5.5V.
APPLICATIONS
•
SENSORS
•
•
ACTIVE FILTERS
TEST EQUIPMENT
•
•
DRIVING A/D CONVERTERS
PHOTODIODE AMPLIFICATION
Device Information (1)
PART NUMBER
RS721P
RS722P
RS724P
PACKAGE
BODY SIZE(NOM)
SOT23-5
2.90mm×1.60mm
SOIC-8(SOP8)
4.90mm×3.90mm
MSOP-8
3.00mm×3.00mm
SOT353(SC70-5)
2.10mm×1.25mm
SOIC-8(SOP8)
4.90mm×3.90mm
MSOP-8
3.00mm×3.00mm
TSSOP-8
3.00mm×4.40mm
TDFN2×2-8
2.00mm×2.00mm
SOIC-14(SOP14)
8.65mm×3.90mm
TSSOP-14
5.00mm×4.40mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
REV B.5
1
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RS721P, RS722P, RS724P
Pin Configuration and Functions (Top View)
RS721P
2
+IN
3
V+
+IN
1
V-
2
-IN
3
5
V+
+
-
4
-IN
SOT23-5/SOT353(SC70-5)
4
NC
1
-IN
2
+IN
3
V-
4
+
V-
5
-
1
+
OUT
RS721P
RS721BP
8
NC
7
V+
6 OUT
OUT
SOT23-5/SOT353(SC70-5)
5
NC
SOIC-8(SOP8),MSOP-8
Pin Description
NAME
-IN
+IN
NC
OUT
VV+
RS721P
SOT23-5/
SOT353(SC
70-5)
4
3
1
2
5
PIN
RS721BP
SOT23-5/
SOT353(SC
70-5)
3
1
4
2
5
RS721P
SOIC8(SOP8)/
MSOP8
2
3
1,5,8
6
4
7
I/O
DESCRIPTION
I
I
O
-
Negative (inverting) input
Positive (noninverting) input
No internal connection (can be left floating)
Output
Negative (lowest) power supply
Positive (highest) power supply
RS722P
OUT A
8
1
-IN A
2
+IN A
3
V-
RS722P
4
+
A
B+
V+
OUT A
1
Pin 1
Indicator
8
V+
7
OUTB
-IN A
2
7
OUTB
6
-IN B
+IN A
3
6
-IN B
5
+IN B
V-
4
5
+IN B
TDFN2x2-8
SOIC-8(SOP8),MSOP-8,TSSOP-8
Thermal Pad
on Bottom
(can be left floating)
Pin Description
NAME
-INA
+INA
-INB
+INB
OUTA
OUTB
VV+
PIN
SOIC-8(SOP8)/MSOP8/
TSSOP-8/TDFN2×2-8
2
3
6
5
1
7
4
8
I/O
DESCRIPTION
I
I
I
I
O
O
-
Inverting input, channel A
Noninverting input, channel A
Inverting input, channel B
Noninverting input, channel B
Output, channel A
Output, channel B
Negative (lowest) power supply
Positive (highest) power supply
2
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RS721P, RS722P, RS724P
Pin Configuration and Functions (Top View)
RS724P
OUT A
1
14
OUT D
-IN A
2
13
-IN D
+IN A
3
12
+IN D
V+
4
11
V-
+IN B
5
10
+IN C
9
-IN C
8
OUT C
-IN B
6
OUT B
7
A
- +
- +
B
D
+ -
+ C
SOIC-14(SOP14),TSSOP-14
Pin Description
NAME
-INA
+INA
-INB
+INB
-INC
+INC
-IND
+IND
OUTA
OUTB
OUTC
OUTD
VV+
PIN
SOIC-14(SOP14)/TSSOP-14
2
3
6
5
9
10
13
12
1
7
8
14
11
4
I/O
DESCRIPTION
I
I
I
I
I
I
I
I
O
O
O
O
-
Inverting input, channel A
Noninverting input, channel A
Inverting input, channel B
Noninverting input, channel B
Inverting input, channel C
Noninverting input, channel C
Inverting input, channel D
Noninverting input, channel D
Output, channel A
Output, channel B
Output, channel C
Output, channel D
Negative (lowest) power supply
Positive (highest) power supply
3
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RS721P, RS722P, RS724P
SPECIFICATIONS
Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted) (1)
MIN
Supply, Vs=(V+) - (V-)
Signal input pin (2)
Signal output pin (3)
Signal input pin (2)
Signal output pin (3)
Output short-circuit (4)
Operating range, TA
Junction, TJ
Storage, Tstg
Voltage
Current
Temperature
MAX
UNIT
7
(V-)-0.5
(V+) + 0.5
(V-)-0.5
(V+) + 0.5
-10
10
-150
150
Continuous
-40
125
150
-65
150
V
mA
mA
°C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device
reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be currentlimited to 10mA or less.
(3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.5V beyond the supply rails should be
current-limited to ±150mA or less.
(4) Short-circuit to ground, one amplifier per package.
ESD Ratings
VALUE
V(ESD)
Electrostatic discharge
Human-body model (HBM)
3000
Machine Model (MM)
200
UNIT
V
Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
MIN
Supply voltage, Vs= (V+) - (V-)
Signal-supply
Dual-supply
Specified temperature
NOM
MAX
2.5
5.5
±1.25
±2.75
-40
125
UNIT
V
°C
Thermal Information:RS721P
RS721P
5PINS
THERMAL METRIC (1)
8PINS
UNIT
SOT23-5
SOT353
(SC70-5)
SOIC-8
MSOP8
RϴJA
Junction-to-ambient thermal resistance
273.8
214.7
116
165
°C/W
RϴJC(top)
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
126.8
85.9
127.1
60.0
60
56
53
87
°C/W
RϴJB
ѰJT
ѰJB
Junction-to-top characterization parameter
Junction-to-board characterization parameter
10.9
84.9
33.4
59.8
12.8
98.3
4.9
85
°C/W
°C/W
RϴJC(bot)
Junction-to-case(bottom) thermal resistance
N/A
N/A
N/A
N/A
°C/W
4
°C/W
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RS721P, RS722P, RS724P
Thermal Information:RS722P
RS722P
8PINS
THERMAL METRIC (1)
SOIC-8
MSOP8
UNIT
TSSOP-8
TDFN2×2-8
RϴJA
Junction-to-ambient thermal resistance
116
165
192
80.1
°C/W
RϴJC(top)
Junction-to-case(top) thermal resistance
60
53
64.3
100
°C/W
RϴJB
Junction-to-board thermal resistance
56
87
105.3
45
°C/W
ѰJT
ѰJB
Junction-to-top characterization parameter
Junction-to-board characterization parameter
12.8
98.3
4.9
85
7.6
105.5
6.8
45.2
°C/W
°C/W
RϴJC(bot)
Junction-to-case(bottom) thermal resistance
N/A
N/A
N/A
22.7
°C/W
Thermal Information:RS724P
RS724P
14PINS
THERMAL METRIC (1)
UNIT
SOIC-14
TSSOP-14
RϴJA
Junction-to-ambient thermal resistance
83.8
120.8
°C/W
RϴJC(top)
Junction-to-case(top) thermal resistance
70.7
34.3
°C/W
RϴJB
Junction-to-board thermal resistance
59.5
62.8
°C/W
ѰJT
ѰJB
Junction-to-top characterization parameter
Junction-to-board characterization parameter
11.6
37.7
1
56.5
°C/W
°C/W
RϴJC(bot)
Junction-to-case(bottom) thermal resistance
N/A
N/A
°C/W
5
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RS721P, RS722P, RS724P
PACKAGE/ORDERING INFORMATION
Orderable
Device
Package Type
Pin
Channel
Op Temp(°C)
Device Marking
Package Qty
RS721PXF
SOT23-5
5
1
-40°C ~125°C
721P
Tape and Reel,3000
RS721PXC5
SOT353(SC70-5)
5
1
-40°C ~125°C
721P
Tape and Reel,3000
RS721BPXF
SOT23-5
5
1
-40°C ~125°C
721BP
Tape and Reel,3000
RS721BPXC5
SOT353(SC70-5)
5
1
-40°C ~125°C
721BP
Tape and Reel,3000
RS721PXK
SOIC-8(SOP8)
8
1
-40°C ~125°C
RS721P
Tape and Reel,2500
RS721PXM
MSOP-8
8
1
-40°C ~125°C
RS721P
Tape and Reel,3000
RS722PXK
SOIC-8(SOP8)
8
2
-40°C ~125°C
RS722P
Tape and Reel,2500
RS722PXM
MSOP-8
8
2
-40°C ~125°C
RS722P
Tape and Reel,3000
RS722PXQ
TSSOP-8
8
2
-40℃~125℃
RS722P
Tape and Reel,3000
RS722PXTDE8
TDFN2x2-8
8
2
-40°C ~125°C
RS722P
Tape and Reel,3000
RS724PXP
SOIC-14(SOP14)
14
4
-40°C ~125°C
RS724P
Tape and Reel,2500
RS724PXQ
TSSOP-14
14
4
-40°C ~125°C
RS724P
Tape and Reel,3000
6
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RS721P, RS722P, RS724P
ELECTRICAL CHARACTERISTICS
(At TA = +25C, Vs=5V, RL = 10kΩ connected to VS/2, and VOUT = VS/2, unless otherwise noted.)
PARAMETER
CONDITIONS
TJ
RS721P, RS722P,
RS724P
MIN
TYP MAX
UNITS
POWER SUPPLY
Vs
Operating Voltage Range
25C
IQ
Quiescent Current/Amplifier
25C
PSRR
Ton
Power-Supply Rejection Ratio
Vs=2.5V to 5.5V,
VCM=(V-)+0.5V
Turn-on Time
25C
-40C to 125C
2.5
1.1
75
5.5
V
1.55
mA
97
dB
65
13
25C
us
INPUT
Vos
Vos TC
Input Offset Voltage
VCM= VS/2
Input Offset Voltage Average Drift
-40C to125C
25C
-0.8
±0.3
0.8
2.6
mV
uV/C
IB
Input Bias Current
25C
1
10
pA
IOS
Input Offset Current
25C
1
10
pA
VCM
Common-Mode Voltage Range
5.7
V
CMRR
Vs= 5.5V
25C
-0.2
Vs= 5.5V, VCM
=-0.2V to 4V
25C
77
Common-Mode Rejection Ratio
Vs= 5.5V, VCM
=-0.2V to 5.7V
-40C to 125C
25C
-40C to 125C
97
67
65
81
dB
57
OUTPUT
RL=2KΩ, Vo=
0.15V to 4.85V
AOL
Open-Loop Voltage Gain
RL=10KΩ, Vo=
0.05V to 4.95V
Output Swing From Rail
Iout
RL=2KΩ
25C
-40C to 125C
25C
-40C to 125C
25C
RL=10KΩ
Output Current Source
95
103
65
100
110
dB
66
12
3
mV
25C
140
mA
Slew Rate
25C
6
V/us
Gain-Bandwidth Product
25C
10
MHz
Phase Margin
25C
62
°
Setting Time,0.1%
25C
0.7
us
VIN·Gain≥VS，
G=-100
25C
3.2
us
f = 1KHz
25C
9.5
nV/√Hz
f = 10KHz
25C
6.5
nV/√Hz
FREQUENCY RESPONSE
SR
GBP
PM
ts
Overload Recovery Time
NOISE
en
Input Voltage Noise Density
7
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RS721P, RS722P, RS724P
TYPICAL CHARACTERISTICS
At TA = +25C, Vs=5V, RL = 10kΩ connected to VS/2, VOUT = VS/2, unless otherwise noted.
Gain
Phase
100
160
120
80
100
60
80
40
60
20
40
0
20
-20
10
100
1K
120
100
80
60
40
0
10K 100K 1M 10M 100M
20
1
Frequency(Hz)
INPUT VOLTAGE NOISE
SPECTRAL DENSITY vs FREQUENCY
120
10
100
1K
Frequency(KHz) Vs=5V
10K
POWER−SUPPLY REJECTION RATIO vs
FREQUENCY
100
PSRR(dB)
Voltage Noise(nV/√Hz)
100
10
80
60
40
20
1
10
100
1K
10K
Frequency(Hz)
1
100K
QUIESCENT CURRENT vs TEMPERATURE
1.3
Quiescent Current(mA)
1.3
Quiescent Current(mA)
COMMON−MODE REJECTION RATIO vs
FREQUENCY
140
CMRR(dB)
Open-Loop Gain(dB)
120
Phase Margin (°)
OPEN-LOOP GAIN AND PHASE vs
FREQUENCY
1.2
1.1
1
0.9
0.8
10
100
1K
Frequency(KHz) Vs=5V
10K
QUIESCENT CURRENT vs TEMPERATURE
1.2
1.1
1
0.9
0.8
0.7
-40 -20 0
-40 -20 0
20 40 60 80 100 120 140
Temperature(℃) Vs=2.5V
20 40 60 80 100 120 140
Temperature(℃) Vs=5V
8
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RS721P, RS722P, RS724P
TYPICAL CHARACTERISTICS
At TA = +25C, Vs=5V, RL = 10kΩ connected to VS/2, VOUT = VS/2, unless otherwise noted.
SINK CURRENT vs TEMPERATURE
170
Source Current(mA)
Sink Current(mA)
160
150
140
130
120
110
130
120
-40 -20 0
INPUT BIAS CURRENT vs TEMPERATURE
10
1
0.1
20 40 60 80 100 120 140
Temperature(℃)
Quiescent Current vs Supply Voltage
1400
Quiescent Current(uA)
Input Bias Current(pA)
140
Temperature(℃)
100
1200
1000
800
600
400
-40 -20 0
20 40 60 80 100 120 140
2.5
Temperature(℃)
3
3.5
4
4.5
5
5.5
Supply Voltage(V)
Offset Voltage vs. Common-Mode Voltag
0.1HZ to 10HZ Input Voltage Noise
0
5uV/div
Offset Voltage(mV)
150
20 40 60 80 100 120 140
1K
0.5
160
110
-40 -20 0
10K
SOURCE CURRENT vs TEMPERATURE
-0.5
-1
-1.5
-2
-1
0
1
2
3
4
5
Time(1s/div)
6
Common-Mode Voltage(V)
9
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RS721P, RS722P, RS724P
TYPICAL CHARACTERISTICS
At TA = +25C, Vs=5V, RL = 10kΩ connected to VS/2, VOUT = VS/2, unless otherwise noted.
POSITIVE OVERVOLTAGE RECOVERY
VIN
200mV/div
0V
0V
1V/div
VIN
0V
VOUT
0V
Vs=±2.5V
G=-100
VOUT
1V/div
200mV/div
NEGATIVE OVERVOLTAGE RECOVERY
Time(1us/div)
Time(1us/div)
LARGE-SIGNAL STEP RESPONSE
LARGE-SIGNAL STEP RESPONSE
VS=2.5V
1V/div
500mV/div
2V/div
1V/div
VS=5V
Time(4us/div)
Time(4us/div)
Closed Loop Output Voltage Swing
6
Setting Time vs Closed-Loop Gain
10
5
Setting Time(us)
Output Voltage(Vpp)
VS=±2.5V
G=-100
4
3
2
1
1
0
0.1
1
10
100
Frequency(kHz)
1000
10000
1
10
10
Closed-Loop Gain(V/V)
100
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RS721P, RS722P, RS724P
TYPICAL CHARACTERISTICS
At TA = +25C, Vs=5V, RL = 10kΩ connected to VS/2, VOUT = VS/2, unless otherwise noted.
Output Voltage vs.Output Current
1
2
1
0
-1
-3
0
-0.5
-1.5
0
20
40
60
80
100
120
0
Output Current(mA) VS=5V
5
10
15
20
25
30
35
Output Current(mA) VS=2.5V
Offset Voltage Production Distribution
14
12
10
8
6
4
2
0.5
0.4
0.3
0.2
0
0.1
-0.1
-0.2
-0.3
-0.4
0
-0.5
Percentage of Amplifiers(%)
0.5
-1
-2
16
Output Voltage vs.Output Current
1.5
Output Voltage(V)
Output Voltage(V)
3
Offset Voltage(mV)
11
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RS721P, RS722P, RS724P
Detailed Description
Overview
The RS72XP devices are unity-gain stable, dual and qual-channel op amps with low noise and distortion. The
device consists of a low noise input stage with a folded cascade and a rail-to-rail output stage. This topology
exhibits superior noise and distortion performance across a wide range of supply voltages that are not delivered
by legacy commodity audio operational amplifiers.
Phase Reversal Protection
The RS72XP family has internal phase-reversal protection. Many op amps exhibit phase reversal when the
input is driven beyond the linear common-mode range. This condition is most often encountered in noninverting
circuits when the input is driven beyond the specified common-mode voltage range, causing the output to
reverse into the opposite rail. The input of the RS72XP prevents phase reversal with excessive common-mode
voltage. Instead, the appropriate rail limits the output voltage. This performance is shown in figure 1.
3
Voltage (V)
2
1
0
-1
-2
-3
VIN
VOUT
Time (125us/div)
C004
Figure 1. Output Waveform Devoid of Phase Reversal During an Input Overdrive Condition
EMI Rejection Ratio (EMIRR)
The electromagnetic interference (EMI) rejection ratio, or EMIRR, describes the EMI immunity of operational
amplifiers. An adverse effect that is common to many operational amplifiers is a change in the offset voltage as
a result of RF signal rectification. An operational amplifier that is more efficient at rejecting this change in offset
as a result of EMI has a higher EMIRR and is quantified by a decibel value. Measuring EMIRR can be performed
in many ways, but this document provides the EMIRR IN+, which specifically describes the EMIRR performance
when the RF signal is applied to the noninverting input pin of the operational amplifier. In general, only the
noninverting input is tested for EMIRR for the following three reasons:
• Operational amplifier input pins are known to be the most sensitive to EMI, and typically rectify RF signals
better than the supply or output pins.
• The noninverting and inverting operational amplifier inputs have symmetrical physical layouts and exhibit
nearly matching EMIRR performance.
• EMIRR is easier to measure on noninverting pins than on other pins because the noninverting input pin can
be isolated on a printed-circuit-board (PCB). This isolation allows the RF signal to be applied directly to the
noninverting input pin with no complex interactions from other components or connecting PCB traces.
12
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RS721P, RS722P, RS724P
Detailed Description（continued）
The EMIRR IN+ of the RS72XP is plotted versus frequency in Figure 2. If available, any dual and quad
operational amplifier device versions have approximately identical EMIRR IN+ performance. The RS72XP unitygain bandwidth is 10MHz. EMIRR performance below this frequency denotes interfering signals that fall within
the operational amplifier bandwidth.
100
90
EMIRR(dB)
80
70
60
50
40
30
20
10
10M
100M
1G
Frequency(Hz)
PRF=-10dBm
Figure 2.RS72XP EMIRR vs Frequency
EMIRR IN+ Test Configuration
Figure 3 shows the circuit configuration for testing the EMIRR IN+. An RF source is connected to the operational
amplifier noninverting input pin using a transmission line. The operational amplifier is configured in a unity-gain
buffer topology with the output connected to a low-pass filter (LPF) and a digital multimeter (DMM). A large
impedance mismatch at the operational amplifier input causes a voltage reflection; however, this effect is
characterized and accounted for when determining the EMIRR IN+. The resulting dc offset voltage is sampled
and measured by the multimeter. The LPF isolates the multimeter from residual RF signals that can interfere
with multimeter accuracy.
Ambient temperature: 25° C
+VS
50Ω
Low-Pass Filter
+
RF source
DC Bias: 0 V
Modulation: None (CW)
Frequency Sweep: 201 pt. Log
-VS
Not shown: 0.1 µ F and 10 µ F
supply decoupling
Sample /
Averaging
Digital Multimeter
Figure 3. EMIRR IN+ Test Configuration Schematic
13
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RS721P, RS722P, RS724P
APPLICATION NOTE
The RS721P, RS722P, RS724P are high precision, rail-to-rail operational amplifiers that can be run from a
single-supply voltage 2.5V to 5.5V (±1.25V to ±2.75V). Supply voltages higher than 7V (absolute maximum)
can permanently damage the amplifier. Rail-to-rail input and output swing significantly increases dynamic range,
especially in low-supply applications. Good layout practice mandates use of a 0.1uF capacitor place closely
across the supply pins.
Typical Applications
25-kHz Low-pass Filter
R4
2.94 kΩ
Input
R1
590Ω
C5
1 nF
R3
499Ω
Output
+
RS72XP
C2
39 nF
Figure 4. 25-kHz Low-Pass Filter
Design Requirements
Low-pass filters are commonly employed in signal processing applications to reduce noise and prevent aliasing.
The RS72XP devices are ideally suited to construct high-speed, high-precision active filters. Figure 4 shows a
second-order, low-pass filter commonly encountered in signal processing applications.
Use the following parameters for this design example:
• Gain = 5 V/V (inverting gain)
• Low-pass cutoff frequency = 25 kHz
• Second-order Chebyshev filter response with 3-dB gain peaking in the passband
Detailed Design Procedure
The infinite-gain multiple-feedback circuit for a low-pass network function is shown in Figure 4. Use Equation 1
to calculate the voltage transfer function.
(1)
This circuit produces a signal inversion. For this circuit, the gain at dc and the low-pass cutoff frequency are
calculated by Equation 2:
（
）
(2)
Application Curve
Figure 5. Low-pass filter transfer function
14
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RS721P, RS722P, RS724P
LAYOUT
Layout Guideline
Attention to good layout practices is always recommended. Keep traces short. When possible, use a PCB
ground plane with surface-mount components placed as close to the device pins as possible. Place a 0.1uF
capacitor closely across the supply pins.
These guidelines should be applied throughout the analog circuit to improve performance and provide benefits
such as reducing the EMI susceptibility.
Layout Example
+
VIN A
+
VIN B
VOUT A
RG
VOUT B
RG
RF
RF
Figure 6. Schematic Representation
Place compon ents
close to device and to
each other to reduce
parasitic e rro rs.
OUT A
VS+
OUT A
V+
-IN A
OUT B
+IN A
-IN B
Use low-ESR,
ceramic bypass
capacitor. Pla ce as
close to the d evice
as possible.
GND
RF
OUT B
GND
RG
VIN A
RF
GND
RG
V-
Use low-ESR,
ceramic bypass
capacitor. Pla ce as
close to the d evice
as possible.
+IN B
Ground (GND) plane on another layer
GND
VS-
VIN B
Keep input traces short
and run the input tra ces
as far aw ay from
the supply lines
as possible.
Figure 7. Layout Example
15
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RS721P, RS722P, RS724P
PACKAGE OUTLINE DIMENSIONS
SOT23-5
D
1.90
b
2.59
E1
E
0.99
0.95
0.69
e
e1
RECOMMENDED LAND PATTERN (Unit: mm)
0.2
A A2
c
θ
L
A1
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
1.050
1.250
0.041
0.049
A1
0.000
0.100
0.000
0.004
A2
1.050
1.150
0.041
0.045
b
0.300
0.500
0.012
0.020
c
0.100
0.200
0.004
0.008
D
2.820
3.020
0.111
0.119
E
1.500
1.700
0.059
0.067
E1
2.650
2.950
0.104
0.116
e
0.950(BSC)
0.037(BSC)
e1
1.800
2.000
0.071
0.079
L
0.300
0.600
0.012
0.024
θ
0°
8°
0°
8°
16
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RS721P, RS722P, RS724P
SOT353(SC70-5)
D
1.30
b
1.9
E
E1
0.75
Pin1
Index Area
0.65
0.4
e
e1
RECOMMENDED LAND PATTERN (Unit: mm)
0.2
A A2
c
θ
L
A1
Symbol
Dimensions In Millimeters
L1
Dimensions In Inches
Min
Max
Min
Max
A
0.900
1.100
0.035
0.043
A1
0.000
0.100
0.000
0.004
A2
0.900
1.000
0.035
0.039
b
0.150
0.350
0.006
0.014
c
0.080
0.150
0.003
0.006
D
2.000
2.200
0.079
0.087
E
1.150
1.350
0.045
0.053
E1
2.150
2.450
0.085
0.096
e
0.650(BSC)
0.026(BSC)
e1
1.300(BSC)
0.051(BSC)
L
0.260
L1
θ
0.460
0.010
0.525
0°
0.018
0.021
8°
17
0°
8°
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RS721P, RS722P, RS724P
MSOP-8
b
e
E
E1
4.8
1.02
D
0.65
0.41
RECOMMENDED LAND PATTERN (Unit: mm)
A2
c
A
A1
L
Symbol
Dimensions In Millimeters
θ
Dimensions In Inches
Min
Max
Min
Max
A
0.820
1.100
0.032
0.043
A1
0.020
0.150
0.001
0.006
A2
0.750
0.950
0.030
0.037
b
0.250
0.380
0.010
0.015
c
0.090
0.230
0.004
0.009
D
2.900
3.100
0.114
0.122
e
0.650(BSC)
0.026(BSC)
E
2.900
3.100
0.114
0.122
E1
4.750
5.050
0.187
0.199
L
0.400
0.800
0.016
0.031
θ
0°
6°
0°
6°
18
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RS721P, RS722P, RS724P
TSSOP-14
e
b
5.6
E1 E
1.78
D
0.65
0.42
RECOMMENDED LAND PATTERN (Unit: mm)
A2
A1
Symbol
H
C
A
θ
L
Dimensions In Millimeters
Min
Max
A
Dimensions In Inches
Min
Max
1.200
0.047
A1
0.050
0.150
0.002
0.006
A2
0.800
1.050
0.031
0.041
b
0.190
0.300
0.007
0.012
c
0.090
0.200
0.004
0.008
D
4.860
5.100
0.191
0.201
E
4.300
4.500
0.169
0.177
E1
6.250
6.550
0.246
0.258
e
L
0.650(BSC)
0.500
H
θ
0.026(BSC)
0.700
0.020
0.25(TYP)
1°
0.028
0.01(TYP)
7°
19
1°
7°
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RS721P, RS722P, RS724P
SOIC-8(SOP8)
b
e
5.2
E
E1
2.2
D
1.27
0.6
RECOMMENDED LAND PATTERN (Unit: mm)
A2
c
A
A1
L
Symbol
Dimensions In Millimeters
θ
Dimensions In Inches
Min
Max
Min
Max
A
1.350
1.750
0.053
0.069
A1
0.100
0.250
0.004
0.010
A2
1.350
1.550
0.053
0.061
b
0.330
0.510
0.013
0.020
c
0.170
0.250
0.007
0.010
D
4.800
5.000
0.189
0.197
e
1.270(BSC)
0.050(BSC)
E
5.800
6.200
0.228
0.244
E1
3.800
4.000
0.150
0.157
L
0.400
1.270
0.016
0.050
θ
0°
8°
0°
8°
20
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RS721P, RS722P, RS724P
SOIC-14(SOP14)
e
b
5.2
1.27
E E1
0.6
D
1.27
RECOMMENDED LAND PATTERN (Unit: mm)
A2
A1
A
c
θ
L
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
1.350
1.750
0.053
0.069
A1
0.100
0.250
0.004
0.010
A2
1.350
1.550
0.053
0.061
b
0.310
0.510
0.012
0.020
c
0.100
0.250
0.004
0.010
D
8.450
8.850
0.333
0.348
e
1.270(BSC)
0.050(BSC)
E
5.800
6.200
0.228
0.244
E1
3.800
4.000
0.150
0.157
L
0.400
1.270
0.016
0.050
θ
0°
8°
0°
8°
21
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RS721P, RS722P, RS724P
TSSOP-8
e
b
5.6
E1 E
1.78
D
0.65
0.42
RECOMMENDED LAND PATTERN (Unit: mm)
A2
A1
Symbol
H
C
A
θ
L
Dimensions In Millimeters
Min
Max
A
Dimensions In Inches
Min
Max
1.200
0.047
A1
0.050
0.150
0.002
0.006
A2
0.800
1.050
0.031
0.041
b
0.190
0.300
0.007
0.012
c
0.090
0.200
0.004
0.008
D
2.900
3.100
0.114
0.122
E
4.300
4.500
0.169
0.177
E1
6.250
6.550
0.246
0.258
e
L
0.650(BSC)
0.500
H
θ
0.026(BSC)
0.700
0.020
0.25(TYP)
1°
0.028
0.01(TYP)
7°
22
1°
7°
www.run-ic.com
RS721P, RS722P, RS724P
TDFN2x2-8
E
e
D
E1
L
b
D1
TOP VIEW
BOTTOM VIEW
0.50
0.70
A1
1.95
A2
A
0.65
0.24
1.20
SIDE VIEW
RECOMMENDED LAND
PATTERN (Unit: mm)
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A2
0.203(TYP)
0.008(TYP)
b
0.180
0.300
0.007
0.012
D
1.900
2.100
0.075
0.083
D1
1.100
1.300
0.043
0.051
E
1.900
2.100
0.075
0.083
E1
0.600
0.800
0.024
0.031
e
L
0.500(TYP)
0.250
0.020(TYP)
0.450
23
0.010
0.018
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