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IS31FL3746B-QFLS4-TR

IS31FL3746B-QFLS4-TR

  • 厂商:

    LUMISSIL

  • 封装:

    WFQFN32

  • 描述:

    IC 18N (N=1~4) LED MATRIX DRIVER

  • 数据手册
  • 价格&库存
IS31FL3746B-QFLS4-TR 数据手册
IS31FL3746B 18×4 DOTS MATRIX LED DRIVER WITH 12MHZ SPI December 2018 GENERAL DESCRIPTION FEATURES The IS31FL3746B is a general purpose 18×n (n=1~4) LED Matrix programmed via 12MHz SPI interface. Each LED can be dimmed individually with 8-bit PWM data and 8-bit DC scaling data which allowing 256 steps of linear PWM dimming and 256 steps of DC current adjustable level.     Additionally each LED open state can be detected, IS31FL3746B store the open information in OpenRegisters. The Open Registers allowing MCU to read out via SPI, inform MCU whether there are LEDs open or short LEDs. Supply voltage range: 2.7V to 5.5V 18 current sinks Support 18×n (n=1~4) LED matrix configurations Accurate color rendition - 8-bit PWM - 8-bit dot correction - 8-bit global current adjust SDB rising edge reset SPI module 29kHz PWM frequency 12MHz SPI interface Individual open and short error detect function 180 degree phase delay operation to reduce power noise Spread spectrum De-ghost QFN-32 (4mm×4mm) package      The IS31FL3746B operates from 2.7V to 5.5V and features a very low shutdown and operational current. IS31FL3746B is available in QFN-32 (4mm×4mm) package. It operates from 2.7V to 5.5V over the temperature range of -40°C to +125°C.    APPLICATIONS    Hand-held devices for LED display Gaming device (Keyboard, Mouse etc.) LED in white goods application TYPICAL APPLICATION CIRCUIT 5V 3.3V 29 *Note 3 VCC VIO *Note 3 19 1 F 0.1 F SW1 SW2 SW3 SW4 0.1 F *Note 2 3.3V 23 21 Micro Controller 22 *Note 4 24 20 100k SW1 MOSI SW2 SCK SW3 CS MISO SDB SW4 28 27 51 CS18 20 26 25 CS17 20 CS16 IS31FL3746B CS1 0.1 F CS2 32 1 51 CS3 20 31 RISET 10k 9 30 ISET GND CS2 CS17 17 CS18 18 20 CS1 Figure 1 Typical Application Circuit: 24 RGBs Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 1 IS31FL3746B TYPICAL APPLICATION CIRCUIT (CONTINUED) 5V 3.3V 29 *Note 3 VCC VIO *Note 3 19 1 F 0.1 F 0.1 F *Note 2 SW1 SW2 SW3 SW4 3.3V 23 21 Micro Controller 22 *Note 4 24 20 100k SW1 MOSI SW2 SCK SW3 CS MISO SDB SW4 28 27 20 CS18 20 26 25 CS17 20 CS16 IS31FL3746B CS1 0.1 F CS2 32 1 20 CS3 20 31 ISET RISET 10k   9 30 GND CS2 CS17 17 CS18 18 20 CS1 Figure 2 Typical Application Circuit: 72 Mono Color LEDs Note 1: IC should be placed far away from the antenna in order to prevent the EMI. Note 2: The 20Ω or 51Ω resistors between LED and IC are only for thermal reduction, for mono red LED, if VCC=3.3V, don’t need these resistors. Note 3: The VIH of SPI bus should be same as VIO pin. VIO pin need to connect to a reference voltage and usually it is same as the VCC of MCU. If VCC of MCU is 1.8V, VIO=1.8V, if VCC of MCU is 5V, VIO=5V. Note 4: MISO VOH=VIO. Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 2 IS31FL3746B PIN CONFIGURATION Package Pin Configuration (Top View) QFN-32 PIN DESCRIPTION No. Pin Description 1~8, 10~18 CS2~CS18 Current sink pin for LED matrix. 9,30 GND Ground. 19 VIO Input logic reference voltage, can’t be floated. 20 SDB Shutdown pin. 21 SCK SPI clock. 22 CS CS of SPI. 23 MOSI SPI input data. 24 MISO MISO of SPI. 25~28 SW4~SW1 Power SW. 29 VCC Power for current source SW and analog. 31 ISET Set the maximum IOUT current. 32 CS1 Current sink pin for LED matrix. Thermal Pad Connect to GND. Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 3 IS31FL3746B ORDERING INFORMATION Industrial Range: -40°C to +125°C Order Part No. Package QTY/Reel IS31FL3746B-QFLS4-TR QFN-32, Lead-free 2500 Copyright  ©  2018  Lumissil  Microsystems.  All  rights  reserved.  Lumissil Microsystems reserves  the  right  to  make  changes  to  this  specification  and  its  products  at  any  time  without  notice.  Lumissil  Microsystems  assumes  no  liability  arising  out  of  the  application  or  use  of  any  information,  products  or  services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and  before placing orders for products.  Lumissil Microsystems does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can  reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use  in such applications unless Lumissil Microsystems receives written assurance to its satisfaction, that:  a.) the risk of injury or damage has been minimized;  b.) the user assume all such risks; and  c.) potential liability of Lumissil Microsystems is adequately protected under the circumstances  Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 4 IS31FL3746B ABSOLUTE MAXIMUM RATINGS Supply voltage, VCC Voltage at any input pin Maximum junction temperature, TJMAX Storage temperature range, TSTG Operating temperature range, TA=TJ Package thermal resistance, junction to ambient (4 layer standard test PCB based on JESD 51-2A), θJA ESD (HBM) ESD (CDM) -0.3V ~+6.0V -0.3V ~ VCC+0.3V +150°C -65°C ~+150°C -40°C ~ +125°C 52°C/W ±8kV ±750V Note 5: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other condition beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS The following specifications apply for VCC= 5V, TA = 25°C, unless otherwise noted. Symbol Parameter VCC Supply voltage ICC Quiescent power supply current Conditions Min. Typ. 2.7 Max. Unit 5.5 V mA VSDB=VCC, all LEDs off 2.3 3 VSDB=0V 2.8 4 4 ISD Shutdown current VSDB= VCC, Configuration Register written “0000 0000 2.8 IOUT Maximum constant current of CSx RISET=10kΩ, GCC=0xFF, SL=0xFF 34.5 mA ILED Average current on each LED ILED = IOUT(PEAK)/Duty(1/4.14) RISET=10kΩ, GCC=0xFF, SL=0xFF 8.33 mA Current switch headroom voltage SWx ISWITCH=612mA RISET=10kΩ, GCC=0xFF, SL=0xFF 450 Current sink headroom voltage CSx ISINK=34mA, RISET=10kΩ, GCC=0xFF, SL=0xFF 250 VHR tSCAN Period of scanning tNOL1 Non-overlap blanking time during scan, the SWx and CSy are all off during this time tNOL2 Delay total time for CS1 to CS 18, during this time, the SWx is on but CSx is not all turned on μA mV (Note 6) 33 µs 0.83 µs 0.3 µs Logic Electrical Characteristics (SCK, MISO, MOSI, CS, SDB) VIL Logic “0” input voltage VIO=1.8V, VIO=3.3V GND 0.2VIO V VIH Logic “1” input voltage VIO=1.8V, VIO=3.3V 0.75VIO VIO V VHYS Input Schmitt trigger hysteresis VIO=3.3V VOH H level MISO pin output voltage IOH= -8mA, VIO=1.8V, VIO=3.3V VIO-0.4V VIO V VOL L level MISO pin output voltage IOL= 8mA, VIO=1.8V, VIO=3.3V 0 0.4 V IIL Logic “0” input current SDB=L, VINPUT = L (Note 6) 5 nA IIH Logic “1” input current SDB=L, VINPUT = H (Note 6) 5 nA Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 0.2 V 5 IS31FL3746B DIGITAL INPUT SPI SWITCHING CHARACTERISTICS (NOTE 6) Symbol fC tSLCH tSHCH tSHSL tCHSH tCHSL tCH tCL tCLCH tCHCL tDVCH tCHDX tSHQZ tCLQV tCLQX tQLQH tQLQH Parameter Clock frequency CS active set-up time CS not active set-up time CS detect time CS active hold time CS not active hold time Clock high time Clock low time Clock rise time Clock fall time Data in set-up time Data in hold time Output disable time Clock low to output valid Output hold time Output rise time Output fall time Min. 34 Typ. Max. Units 12 MHz 9 9 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 17 167 34 17 34 34 7 9 34 39 0 17 17 Note 6: Guaranteed by design. Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 6 IS31FL3746B FUNCTIONAL BLOCK DIAGRAM ISET SDB VCC Global Current 256 Steps VIO Bias Trim Spread Spectrum Bandgap OSC SSD Config SWX Sequence SCK MOSI CS Level Shift PWM Counter 1 SPI Pointer PWM PWM Counter 2 MISO Scan Switch & Current Sink SW1~SW4 CS1~CS18 Scaling Pull-down Resister Selection Open/Short Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 Ghost Eliminating GND 7 IS31FL3746B DETAILED DESCRIPTION SPI INTERFACE ADDRESS AUTO INCREMENT IS31FL3746B uses a SPI protocol to control the chip’s function with four wires: CS, SCK, MOSI and MISO. SPI transfer starts form CS pin from high to low controlled by Master (Microcontroller), and IS31FL3746B latches data when clock rising. To write multiple bytes of data into IS31FL3746B, load the address of the data register that the first data byte is intended for. During the 8th rising edge of receiving the data byte, the internal address pointer will increment by one. The next data byte sent to IS31FL3746B will be placed in the new address, and so on. The auto increment of the address will continue as long as data continues to be written to IS31FL3746B (Figure 6). SPI data format is 8-bit length. The first command byte composite of 1-bit R/W bit, 3-bit chip ID bit and 4-bit page bit. The command byte must be sent first, and is followed by register address byte then the register data. If the R/W bit is “0”, it will be write operation and Master (Micro-controller) can write the register data into the register. The maximum SCK IS31FL3746B is 12MHz. frequency Table 1 SPI Command Byte Name R/W ID bit supported Page No. Bit D7 D6:D4 D3:D0 Value 0: Write 1: Read 100 0x00: Point to Page 0 0x01: Point to Page 1 in READING OPERATION Page 0~Page 1 registers can be read by SPI. To read the registers of Page 0 thru Page 1, The D7 of the Command Byte need to be set to “1” and select the page number. If read one register, as shown in figure 7, read the MISO data after sending the command byte and register address. If read more registers, as shown in figure 8, the register address will auto increase during the 8th rising edge of receiving the last bit of the previous register data. Figure 3 SPI Input Timing Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 8 IS31FL3746B Figure 4 SPI Input Timing Figure 5 SPI writing to IS31FL3746B (Typical) Figure 6 SPI writing to IS31FL3746B (Automatic Address Increment) Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 9 IS31FL3746B Figure 7 SPI Reading From IS31FL3746B (Typical) Figure 8 SPI Reading From IS31FL3746B (Automatic Address Increment) Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 10 IS31FL3746B Table 2 Register Definition Address Name Function Table R/W Default Set PWM for each LED 3 R/W 0000 0000 Scaling Register Set Scaling for each LED 4 R/W 0000 0000 50h Configuration Register Configure the operation mode 6 R/W 0000 0000 51h Global Current Control Register Set the global current 7 R/W 0000 0000 52h Pull Down/Up Resistor Selection Register Set the pull down resistor for SWx and pull up resistor for CSy 8 R/W 0011 0011 53h~5Eh Open/Short Register Store the open information 9 R 0000 0000 5Fh Temperature Status Store the temperature point of the IC 10 R/W 0000 0000 60h Spread Spectrum Register Spread spectrum function enable 11 R/W 0000 0000 8Fh Reset Register Reset all register to POR state - W 0000 0000 E0h PWM Frequency Enable Register Enable PWM frequency setting 12 W 0000 0000 E2h PWM Frequency Setting Register Set the PWM frequency 13 W 0000 0000 PG0 (0x40): PWM Register 01h~48h PWM Register PG1 (0x41): LED Scaling Register 01h~48h Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 11 IS31FL3746B Page 0 (PG0, Page No. = 0x40): PWM Register T01 T02 T03 T04 PVCC SW1 SW2 SW3 SW4 PWM PWM PWM CS18 12 24 36 48 CS17 11 23 35 47 CS16 10 22 34 46 PAGE 0 Y X PWM PWM PWM CS03 03 15 27 39 CS02 02 14 26 38 01 13 25 37 CS01 Figure 9 PWM Register Table 3 PG0: 01h ~ 48h PWM Register Bit D7:D0 Name PWM Default 0000 0000 Duty  PWM  I OUT ( PEAK )  Duty 256 PWM  7  D[n ]  2 (2) IOUT is the output current of CSy (y=1~18), Each dot has a byte to modulate the PWM duty in 256 steps. The value of the PWM Registers decides the average current of each LED noted ILED. ILED computed by Formula (1): I LED  33s 1 1   33s  0.83  0.3s 4 4.14 n n0 Where Duty is the duty cycle of SWx, Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 (1) I OUT( PEAK)  343 GCC SL   RISET 256 256 (3) GCC is the Global Current Control Register (PG1, 51h) value, SL is the Scaling Register value as Table 9 and RISET is the external resistor of ISET pin. D[n] stands for the individual bit value, 1 or 0, in location n. For example: if D7:D0=1011 0101 (0xB5, 181), GCC=1111 1111, RISET =10kΩ, SL=1111 1111: I LED  343 255 255 1 181     10 k  256 256 4 .14 256 12 IS31FL3746B Page 1 (PG1, Page No.= 0x41): LED Scaling Register T01 T02 T03 T04 PVCC SW1 SW2 SW3 SW4 PWM PWM PWM CS18 12 24 36 48 CS17 11 23 35 47 CS16 10 22 34 46 PAGE 1 Y X PWM PWM PWM CS03 03 15 27 39 CS02 02 14 26 38 CS01 01 13 25 37 Figure 10 Scaling Register IOUT is the output current of CSy (y=1~18), GCC is the Global Current Control Register (PG1, 51h) value and RISET is the external resistor of ISET pin. D[n] stands for the individual bit value, 1 or 0, in location n. Table 4 PG1: 01h ~ 48h Scaling Register Bit D7:D0 Name SL Default 0000 0000 Scaling register control the DC output current of each dot. Each dot has a byte to modulate the scaling in 256 steps. The value of the Scaling Register decides the peak current of each LED noted IOUT(PEAK). 343 GCC SL   RISET 256 256 SL  SL  (3) 7  D[n ]  2 n  127 n0 I OUT  IOUT(PEAK) computed by Formula (3): IOUT( PEAK)  For example: if RISET=10kΩ, GCC=1111 1111, SL=0111 1111: 343 255 127    16 .8 mA 10 k  256 256 I LED  16 .8 mA  1 PWM   4 .14 256 7  D[n]  2 n n0 Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 13 IS31FL3746B Table 5 Page 1 (PG1, Page No. = 0x41): Function Register Register Name Function Table R/W Default 50h Configuration Register Configure the operation mode 6 R/W 0000 0000 51h Global Current Control Register Set the global current 7 R/W 0000 0000 52h Pull Down/Up Resistor Selection Register Set the pull down resistor for SWx and pull up resistor for CSy 8 R/W 0011 0011 53h~5Eh Open/Short Register Store the open/short information 9 R 0000 0000 5Fh Temperature Status Store the temperature point of the IC 10 R/W 0000 0000 60h Spread Spectrum Register Spread spectrum function enable 11 R/W 0000 0000 8Fh Reset Register Reset all register to POR state - W 0000 0000 E0h PWM Frequency Enable Register Enable PWM frequency setting 12 W 0000 0000 E2h PWM Frequency Setting Register Set the PWM frequency 13 W 0000 0000 Table 6 50h Configuration Register Bit D7:D4 D3 D2:D1 D0 Name SWS - OSDE SSD Default 0000 0 00 0 The Configuration Register sets operating mode of IS31FL3746B. SSD 0 1 Software Shutdown Control Software shutdown Normal operation OSDE 00 01/11 10 Open Short Detection Enable Disable open/short detection Enable open detection Enable short detection SWS 0000 0001 0010 0011 Others SWx Setting SW1~SW4, 1/4 SW1~SW3, 1/3, SW4 no-active SW1~SW2, 1/2, SW3~SW4 no-active All CSx work as current sinks only, no scan SW1~SW4, 1/4 When OSDE set to “01”, open detection will be trigger once, the user could trigger open detection again by set OSDE from “00” to “01”. When OSDE set “10”, short detection will be trigger once, the user could trigger short detection again by set OSDE from “00” to “10”. When SSD is “0”, IS31FL3746B works in software shutdown mode and to normal operate the SSD bit should set to “1”. Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 SWS control the duty cycle of the SWx, default mode is 1/4. Table 7 51h Global Current Control Register Bit D7:D0 Name GCC Default 0000 0000 The Global Current Control Register modulates all CSy (y=1~18) DC current which is noted as IOUT in 256 steps. IOUT is computed by the Formula (3): IOUT( PEAK)  343 GCC SL   RISET 256 256 (3) 7 GCC   D[n]  2 n n 0 Where D[n] stands for the individual bit value, 1 or 0, in location n. Table 8 52h Pull Down/Up Resistor Selection Register Bit D7 D6:D4 D3 D2:D0 Name PHC SWPDR - CSPUR Default 0 011 0 011 Set pull down resistor for SWx and pull up resistor for CSy. PHC 0 1 Phase choice 0 degree phase delay 180 degree phase delay 14 IS31FL3746B CS09 PWM CS08 PWM CS07 PWM CS06 PWM CS05 PWM CS04 PWM CS03 PWM CS02 PWM CS01 SW2 T04 SW3 SW4 54 57 5A 5D 53 56 59 5C 55 CS10 PWM When OSDE (PG1, 50h) is set to “01”, open detection will be trigger once, and the open information will be stored at 53h~5Eh. When OSDE (PG1, 50h) set to “10”, short detection will be trigger once, and the short information will be stored at 53h~5Eh. Before set OSDE, the GCC should set to 0x0F~0x40 and the 52h should set to 0x00. CS11 PWM 00 0000 CS12 PWM 00 CS13 PWM Default CS14 PWM CS18:CS13, CS12:CS07,CS06:CS01 CS15 PWM - CS16 PWM Name CS17 PWM D5:D0 PWM D7:D6 PWM Table 9 53h~5Eh Open/Short Register (Read Only) CS18 T03 PVCC 5E SW1 CSPUR CSy Pull up Resistor Selection Bit 000 No pull up resistor 001 0.5kΩ only in CSx off time 010 1.0kΩ only in CSx off time 011 2.0kΩ only in CSx off time 100 1.0kΩ all the time 101 2.0kΩ all the time 110 4.0kΩ all the time 111 8.0kΩ all the time Bit T02 5B T01 58 SWPDR SWx Pull down Resistor Selection Bit 000 No pull down resistor 001 0.5kΩ only in SWx off time 010 1.0kΩ only in SWx off time 011 2.0kΩ only in SWx off time 100 1.0kΩ all the time 101 2.0kΩ all the time 110 4.0kΩ all the time 111 8.0kΩ all the time Figure 11 Open/Short Register Table 10 5Fh Temperature Status Bit D7:D4 D3:D2 D1:D0 Name - TS TROF Default 0000 00 00 TS store the temperature point of the IC. If the IC temperature reaches the temperature point the IC will trigger the thermal roll off and will decrease the current as TROF set percentage. Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 TROF 00 01 10 11 percentage of output current 100% 75% 55% 30% TS 00 01 10 11 Temperature Point, Thermal roll off start point 140°C 120°C 100°C 90°C 15 IS31FL3746B Table 11 60h Spread Spectrum Register Table 12 E0h PWM Frequency Enable Register Bit D7:D6 D4 D3:D2 D1:D0 Bit D7:D1 D0 Name - SSP RNG CLT Name - PFEN Default 00 0 00 00 Default 0000 000 0 When SSP enable, the spread spectrum function will be enabled and the RNG & CLT bits will adjust the range and cycle time of spread spectrum function. The PWM Frequency Enable Register enables or disables to change the PWM frequency. If PFEN=”1”, user can change the PWM frequency by modifying the E2h register. SSP 0 1 Spread spectrum function enable Disable Enable PFEN PWM Frequency Enable 0 Disable 1 Enable RNG 00 01 10 11 Spread spectrum range ±5% ±15% ±24% ±34% Table 13 E2h PWM Frequency Setting Register CLT 00 01 10 11 Spread spectrum cycle time 1980μs 1200μs 820μs 660μs 8Fh Reset Register Once user writes the Reset Register with 0xAE, IS31FL3746B will reset all the IS31FL3746B registers to their default value. On initial power-up, the IS31FL3746B registers are reset to their default values for a blank display. Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 Bit D7:D5 D4:D0 Name PF - Default 000 0 0000 PWM Frequency Setting Register is used to set the PWM frequency. PF 000/111 001 010 011 100 101 110 PWM Frequency 29kHz 14.5kHz 7.25kHz 3.63kHz 1.81kHz 906Hz 453Hz 16 IS31FL3746B APPLICATION INFORMATION I OUT  3 4 3 GCC SL   R ISET 256 256 Figure 12 Scanning Timing SCANING TIMING As shown in Figure 12, the SW1~SW4 is turned on by serial, LED is driven 4 by 4 within the SWx (x=1~4) on time (SWx, x=1~4 is source and it is high when LED on) , including the non-overlap blanking time during scan, the duty cycle of SWx (active high, x=1~4) is: Duty  33s 1 1   33s  0.83s  0.3s 4 4.14 (2) Where 33μs is tSCAN, the period of scanning, 0.83μs is tNOL1, 0.3μs is tNOL2, the non-overlap time and CSy (y=1~18) delay time. PWM CONTROL After setting the IOUT and GCC, the brightness of each LEDs (LED average current (ILED)) can be modulated with 256 steps by PWM Register, as described in Formula (1). I LED  PWM  I OUT( PEAK)  Duty 256 (1) Where PWM is PWM Registers (PG0, 01h~48h /PG0) data showing in Table 6. For example, in Figure 1, if RISET= 10kΩ, PWM= 255, and GCC= 255, SL= 255, then 243 255 255 IOUT( PEAK)     34mA 10k 256 256 1 PWM I LED  I OUT( PEAK)   4.14 256 Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 Writing new data continuously to the registers can modulate the brightness of the LEDs to achieve a breathing effect. GAMMA CORRECTION In order to perform a better visual LED breathing effect we recommend using a gamma corrected PWM value to set the LED intensity. This results in a reduced number of steps for the LED intensity setting, but causes the change in intensity to appear more linear to the human eye. Gamma correction, also known as gamma compression or encoding, is used to encode linear luminance to match the non-linear characteristics of display. Since the IS31FL3746B can modulate the brightness of the LEDs with 256 steps, a gamma correction function can be applied when computing each subsequent LED intensity setting such that the changes in brightness matches the human eye's brightness curve. Table 14 32 Gamma Steps with 256 PWM Steps C(0) C(1) C(2) C(3) C(4) C(5) C(6) C(7) 0 1 2 4 6 10 13 18 C(8) C(9) C(10) C(11) C(12) C(13) C(14) C(15) 22 28 33 39 46 53 61 69 C(16) C(17) C(18) C(19) C(20) C(21) C(22) C(23) 78 86 96 106 116 126 138 149 C(24) C(25) C(26) C(27) C(28) C(29) C(30) C(31) 161 173 186 199 212 226 240 255 17 256 256 224 224 192 192 PWM Data PWM Data IS31FL3746B 160 128 96 160 128 96 64 64 32 32 0 0 4 8 12 16 20 24 28 32 0 0 8 16 Intensity Steps Figure 13 Gamma Correction (32 Steps) C(2) C(3) C(4) C(5) 40 48 56 64 Figure 14 Gamma Correction (64 Steps) Table 15 64 Gamma Steps with 256 PWM Steps C(1) 32 Intensity Steps Choosing more gamma steps provides for a more continuous looking breathing effect. This is useful for very long breathing cycles. The recommended configuration is defined by the breath cycle T. When T=1s, choose 32 gamma steps, when T=2s, choose 64 gamma steps. The user must decide the final number of gamma steps not only by the LED itself, but also based on the visual performance of the finished product. C(0) 24 C(6) C(7) 0 1 2 3 4 5 6 7 C(8) C(9) C(10) C(11) C(12) C(13) C(14) C(15) 8 10 12 14 16 18 20 22 C(16) C(17) C(18) C(19) C(20) C(21) C(22) C(23) 24 26 29 32 35 38 41 44 C(24) C(25) C(26) C(27) C(28) C(29) C(30) C(31) 47 50 53 57 61 65 69 73 C(32) C(33) C(34) C(35) C(36) C(37) C(38) C(39) 77 81 85 89 94 99 104 109 C(40) C(41) C(42) C(43) C(44) C(45) C(46) C(47) 114 119 124 129 134 140 146 152 C(48) C(49) C(50) C(51) C(52) C(53) C(54) C(55) 158 164 170 176 182 188 195 202 C(56) C(57) C(58) C(59) C(60) C(61) C(62) C(63) 209 216 223 230 237 244 251 255 Note 7: The data of 32 gamma steps is the standard value and the data of 64 gamma steps is the recommended value. OPERATING MODE IS31FL3746B can only operate in PWM Mode. The brightness of each LED can be modulated with 256 steps by PWM registers. For example, if the data in PWM Register is “0000 0100”, then the PWM is the fourth step. Writing new data continuously to the registers can modulate the brightness of the LEDs to achieve a breathing effect. OPEN/SHORT DETECT FUNCTION IS31FL3746B has open and short detect bit for each LED. By setting the OSD bits of the Configuration Register (PG1, 50h) from “00” to “01” or “10”, the LED Open/short Register will start to store the open/short information and after at least 2 scanning cycles and the MCU can get the open/short information by reading the 53h~5Eh, for those dots are turned off via LED Scaling Registers (PG1, 01h~48h), the open/short data will not get refreshed when setting the OSD bit of the Configuration Register. To get the correct open and short information, two configurations need to set before setting the OSD bits: 1 0x0F≤ GCC≤ 0x40 2 52h= 0x00 Where GCC is the Global Current Control Register (PG1, 51h) and 52h is the Pull Down/UP Resistor Selection Register and set to 0x00 is to disable the SWx pull-down and CSy pull-up function. The detect action is one-off event and each time before reading out the open/short information, the OSDE bit of the Configuration Register (PG1, 50h) need to be set from “00” to “01”/“10” (clear before set operation). Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 18 IS31FL3746B De-Ghost Function Hardware Shutdown The “ghost” term is used to describe the behavior of an LED that should be OFF but instead glows dimly when another LED is turned ON. A ghosting effect typically can occur when multiplexing LEDs. In matrix architecture any parasitic capacitance found in the constant-current outputs or the PCB traces to the LEDs may provide sufficient current to dimly light an LED to create a ghosting effect. The chip enters hardware shutdown when the SDB pin is pulled low. All analog circuits are disabled during hardware shutdown, typical the current consume is 2.8μA. To prevent this LED ghost effect, the IS31FL3746B has integrated Pull down resistors for each SWx (x=1~4) and Pull up resistors for each CSy (y=1~18). Select the right SWx Pull down resistor (PG1, 52h) and CSy Pull up resistor (PG1, 52h) which eliminates the ghost LED for a particular matrix layout configuration. Typically, selecting the 8kΩ will be sufficient to eliminate the LED ghost phenomenon. The SWx Pull down resistors and CSy Pull up resistors are active only when the CSy/SWx output working the OFF state and therefore no power is lost through these resistors. When IS31FL3746B works in hardware shutdown mode, the de-ghost function should be disabled, otherwise it will be extra about 1μA shutdown current. I2C RESET The I2C will be reset if the SDB pin is pull-high from 0V to logic high, at the operating SDB rising edge, the I2C operation is not allowed. SHUTDOWN MODE Shutdown mode can be used as a means of reducing power consumption. During shutdown mode all registers retain their data. Software Shutdown By setting SSD bit of the Configuration Register (PG1, 50h) to “0”, the IS31FL3746B will operate in software shutdown mode. When the IS31FL3746B is in software shutdown, all current sources are switched off, so that the matrix is blanked. All registers can be operated. Typical current consume is 2.8μA. Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 The chip releases hardware shutdown when the SDB pin is pulled high. During hardware shutdown state Function Register can be operated. If VCC has risk drop below 1.75V but above 0.1V during SDB pulled low, please re-initialize all Function Registers before SDB pulled high. LAYOUT The IS31FL3746B consumes lots of power so good PCB layout will help improve the reliability of the chip. Please consider below factors when layout the PCB. Power Supply Lines When designing the PCB layout pattern, the first step should consider about the supply line and GND connection, especially those traces with high current, also the digital and analog blocks’ supply line and GND should be separated to avoid the noise from digital block affect the analog block. At least one 0.1μF capacitor, if possible with a 0.47μF or 1μF capacitor is recommended to connected to the ground at each power supply pins of the chip, and it needs to close to the chip and the ground net of the capacitor should be well connected to the GND plane. RISET RISET should be close to the chip and the ground side should well connect to the GND plane. Thermal Consideration The over temperature of the chip may result in deterioration of the properties of the chip. IS31FL3746B has thermal pad but the chip could be very hot if power is very large. So do consider the ground area connects to the GND pins and thermal pad. Other traces should keep away and ensure the ground area below the package is integrated, and the back layer should be connected to the thermal pad thru 9 or 16 vias to be maximized the area size of ground plane. 19 IS31FL3746B Current Rating Example For a RISET=10kΩ application, the current rating for each net is as follows: • VCC and SWx pins= 34mA ×18=612mA, recommend trace width: 0.2032mm~0.5mm. • CSy pins= 34mA, recommend trace width: 0.1016mm~0.254mm. • All other pins< 3mA, recommend trace width: 0.1016mm~0.254mm. Figure 15 Layout Example Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 20 IS31FL3746B CLASSIFICATION REFLOW PROFILES Profile Feature Pb-Free Assembly Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) 150°C 200°C 60-120 seconds Average ramp-up rate (Tsmax to Tp) 3°C/second max. Liquidous temperature (TL) Time at liquidous (tL) 217°C 60-150 seconds Peak package body temperature (Tp)* Max 260°C Time (tp)** within 5°C of the specified classification temperature (Tc) Max 30 seconds Average ramp-down rate (Tp to Tsmax) 6°C/second max. Time 25°C to peak temperature 8 minutes max. Figure 16 Classification Profile Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 21 IS31FL3746B PACKAGE INFORMATION QFN-32 Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 22 IS31FL3746B RECOMMENDED LAND PATTERN QFN-32 Note 8: 1. Land pattern complies to IPC-7351. 2. All dimensions in MM. 3. This document (including dimensions, notes & specs) is a recommendation based on typical circuit board manufacturing parameters. Since land pattern design depends on many factors unknown (eg. User’s board manufacturing specs), user must determine suitability for use. Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 23 IS31FL3746B REVISION HISTORY Revision Detail Information Date 0B Initial release 2018.10.22 A Update EC table, features and other information 2018.12.11 Lumissil Microsystems – www.lumissil.com Rev. A, 12/11/2018 24
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