TS19501CB10
Taiwan Semiconductor
High Integrated Dimmable LED Controller with Spread Spectrum
Frequency Modulation for Automotive Headlight
DESCRIPTION
FEATURES
TS19501CB10 is a single channel LED driver of low-
● Operating Ambient Temperature Range -40°C to
125°C
● Drives LEDs in Boost, Buck-Boost and SEPIC
Topology
● Operation in DCM, BCM, CCM mode
● Input Voltage 4.5V ~ 38V (42V Abs. Max.)
● Adjustable Switching Frequency 70k ~ 700kHz
● Low-Side Current Sense
● Internal Voltage Reference 150mV ±3.3%
● Both PWM Dimming and Analog Dimming
● Over Voltage Protection (OVP)
● Over Current Protection (OCP)
● Over Temperature Protection (OTP)
● Under Voltage Lockout (UVLO)
● Jitter function for effective spread spectrum to
reduce EMI
● Fault Status flag
● Internal Soft Start
● Compliant to RoHS Directive 2011/65/EU and in
accordance to WEEE 2002/96/EC.
● Halogen-Free according to IEC 61249-2-21
side-current sense. This device can operate in DCM,
BCM and CCM mode with full protection and
diagnostics. This device is dedicated for and ideally
suited to automotive headlight. This controller supports
typical topologies such as boost, buck-boost and
SEPIC.
Output current regulation is based on average current
mode control supervised by a control loop. The fault
flag is connected to pullup resistor from VDC for
highlight the information of fault, fault status flag is
latched by the timer when output is low.
APPLICATION
● Automotive LED Lighting: High and low Beam,
Daytime Running Light, Turn indicator, Position
Light, Fog Light
● General Lighting Applications
● High Brightness LED Applications
Pin Definition:
1. EN
10. OUT
2. DIM
9. VIN
3. FLT
8. GND
4. CS
7. RT
5. COM
6. OVP
MSOP-10EP
Notes: MSL 1 (Moisture Sensitivity Level) per J-STD-020
TYPICAL APPLICATION CIRCUIT
RDMY
RDMY
VIN
CO
CO
BOOST
BOOST
D1
LED
BUCK-BOOST
VIN
BUCK-BOOST
L1
RLC
D1
LED
L1
RLC
ROVPH
9
RENH
VDC
CIN
CBAT
RFLT 3
CEN
RENL
1
RT
CCOM
7
5
VIN
OVP
FLT
DIM
EN
OUT
RT
CS
COM
GND
ROVPH
6
9
VDIM
2
10
RENH
VDC
CIN
RG
RFLT 3
CEN
1
ROVPL
Q1
4
8
RCC
CCC
CBAT
RCS
RENL
RT
CCOM
CDIM
TS19501CB10
7
5
VIN
OVP
FLT
DIM
EN
OUT
RT
CS
COM
GND
6
VDIM
2
10
RG
ROVPL
4
8
Q1
RCC
CCC
RCS
CDIM
TS19501CB10
Buck-Boost Regulator
Boost Regulator
1
Version: A1904
TS19501CB10
Taiwan Semiconductor
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified) (Note 1)
PARAMETER
SYMBOL
LIMIT
UNIT
Battery power input Pin
VIN
-0.3 to 42
V
FLT output to GND
VFLT
-0.3 to 42
V
OUT voltage to GND
VOUT
-0.3 to 20
V
EN voltage to GND
VEN
-0.3 to 5.5
V
DIM voltage to GND
VDIM
-0.3 to 5.5
V
CS voltage to GND
VCS
-0.3 to 5.5
V
COM voltage to GND
VCOM
-0.3 to 5.5
V
OVP voltage to GND
VOVP
-0.3 to 5.5
V
RT voltage to GND
VRT
-0.3 to 5.5
V
Junction Temperature Range
TJ
-40 to +150
°C
Storage Temperature Range
TSTG
-65 to +150
°C
Lead Temperature (Soldering 10 sec)
TLEAD
260
°C
PD
1.1
W
ESD Rating (Human Body Model)
HBM
±2
kV
ESD Rating (Charged Device Model)
CDM
±1
kV
SYMBOL
TYP
UNIT
Thermal Resistance Junction to Ambient
RθJA
113
°C/W
Thermal Resistance Junction to Case
RθJC
38
°C/W
Power Dissipation @ TA=25°C
THERMAL PERFORMANCE
(Note 2)
PARAMETER
RECOMMENDED OPERATING CONDITION (TA = 25°C unless otherwise specified) (Note 3)
PARAMETER
SYMBOL
LIMIT
UNIT
Battery power input Pin
VIN
8 to 38
V
FLT output to GND
VFLT
0 to 38
V
OUT voltage to GND
VOUT
0 to 18
V
EN voltage to GND
VEN
0 to 5
V
DIM voltage to GND
VDIM
0 to 5
V
CS voltage to GND
VCS
0 to 0.8
V
COM voltage to GND
VCOM
1.2 to 3.6
V
OVP voltage to GND
VOVP
1.6 to 3.1
V
RT voltage to GND
VRT
1.2
V
Storage Temperature Range
TSTG
-55 to +150
°C
Operating Junction Temperature Range
TJ
-40 to +150
°C
Operating Ambient Temperature Range
TOPA
-40 to +125
°C
2
Version: A1904
TS19501CB10
Taiwan Semiconductor
ELECTRICAL SPECIFICATIONS (VIN= 14V, TA = 25°C unless otherwise specified)
PARAMETER
SYMBOL
CONDITION
MIN
TYP
MAX
UNIT
VIN_ON
3.9
4.5
5
V
VHYS
--
0.1
--
V
EN Turn-on Threshold
VEN_ON
1.05
--
1.35
V
EN Hysteresis Current
IHYS_EN
10
20
30
μA
Quiescent Current
IQ
--
150
240
μA
Operating Supply Current
IIN
0.3
--
4
mA
145
150
155
mV
Supply Voltage
VIN Turn-on Threshold
VIN Hysteresis
RRT=50kohm
GM Amplifier
Internal Reference Voltage
VREF
Gm
ICOM_SINK/0.4
80
100
120
μA/V
Sink Current
ICOM_SINK
VCS= 400mV
32
40
48
μA
Source Current
ICOM_SOUR
VCS= 0V
12
15
18
μA
RRT=50kohm
185
200
215
kHz
--
±8.5
--
%
Transconductance
Oscillator
Oscillator Frequency
FOSC
Jitter Frequency
FJT
Design Guarantee
Soft Start Time
TSS
--
1024
--
Fault Blank Time
TFB
--
2048
--
Hiccup Time
THUP
--
32768
--
--
550
--
mV
--
50
--
mV
--
50
--
ns
Clock
Cycles
Driver
Output Rising Time
TR
VIN=12V, CO =1nF,
IO= 10mA
VIN=12V, CO =1nF,
IO= -10mA
CO =1nF
Output Falling Time
TF
CO =1nF
--
50
--
ns
VO_CLAMP
CO =1nF
--
12.5
18
V
VOH
Dropout Voltage
VOL
Output Clamp Voltage
Protection
Output Voltage Protection
Short Circuit Protection
VOVP
3.0
3.25
3.5
V
VSCP
1.4
--
1.6
V
Current Limit Voltage
VCSL
--
800
900
mV
Leading Edge Blanking Time
LEBt
CO =1nF
--
320
--
ns
MOS Current Protection
VMCP
CO =1nF
--
1.2
1.35
V
FLT Dropout Voltage
VFLT
IFLT=10mA
--
200
--
mV
CO =1nF
--
85
--
%
Maximum Duty
VDUTY
3
Version: A1904
TS19501CB10
Taiwan Semiconductor
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise specified)
PARAMETER
SYMBOL
CONDITION
MIN
TYP
MAX
UNIT
VOH_DIM
2.5
--
--
V
VMAX_DIMA
--
1.6
--
V
IDIM
7.5
10
12.5
μA
Thermal Shutdown
TSD
--
165
--
°C
Temperature Hysteresis
THYS
--
30
--
°C
Dimming
PWM Dimming High Threshold
Voltage
Linear Dimming Threshold Voltage
of 100% Current Regulation
Source Current of DIM
Thermal Section
(Note 4, 5)
Note:
1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. Functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
2. Test boards conditions:
(a) 5.6mm × 4mm, 2 layers, thickness: 1mm.
(b) 1-oz copper traces located on the top of the PCB.
(c) 1-oz copper ground plane, bottom layer.
(d) 5-thermal vias (0.3mm) located under the device package.
3. The device is not guaranteed to function outside its operating conditions.
4. Guaranteed by design.
5. Auto Recovery type.
ORDERING INFORMATION
ORDERING CODE
PACKAGE
PACKING
TS19501CB10 RBG
MSOP-10EP
5,000pcs / 13”Reel
4
Version: A1904
TS19501CB10
Taiwan Semiconductor
FUNCTION BLOCK
VIN
OVP
5V
3.2V
3.2V
2.0V
1.5V
0.8V
0.4V
0.2V
BIAS
& BG
EN
1.5V
TOFF
Level
Shift
S/H
OVP
SCP
FLT
OTP
Logic
SS
Jitter
S1 S0
OneShot
OSC
PRO
Current
Compensation
RT
SET
RST
S
Q
GM
Amplifier
DIM
DIM
VREF
OUT
1.2V
COM
0.2V
10µA
Gate
Driver
R /Q
VRAMP
5V
TON
MCP
LEB
OCP
Soft
Start
TON
TOFF
VIAVG
S1
∫
CS
0.8V
0.4V
0.2V
S0
GND
PIN DESCRIPTION
PIN NO.
NAME
FUNCTION
1
EN
Enable and shut down pin
2
PWM/Linear dimming voltage input
3
DIM
FLT
4
CS
5
COM
Compensation output pin of error amplifier.
6
OVP
Over voltage sensing pin
7
RT
8
GND
Ground return for all internal circuitry.
9
VIN
Battery power input pin for all internal circuitry.
10
OUT
Power MOS output pin.
Open drain output pin for fault status flag.
Input current sense pin.
Connect external resistor to GND to set frequency.
5
Version: A1904
TS19501CB10
Taiwan Semiconductor
TYPICAL PERFORMANCE CURVES
600
600
500
500
400
400
ILED (mA)
ILED (mA)
VIN=12V, ILED=600mA, VO=24V (8 LEDs) unless otherwise specified.
300
300
200
200
100
100
0
0
0
20
40
60
80
0
100
0.2
0.4
0.8
1
1.2
1.4
1.6
Figure 2. ILED vs. Linear Dimming
Figure 1. ILED vs. PWM Dimming Duty
600
10.00
595
9.50
IDIM (uA)
ILED (mA)
0.6
Linear Dimming (V)
PWM Dimming Duty(%)
9.00
590
8.50
585
580
8.00
-40
0
40
80
120
160
-40
0
40
Temperature (°C)
80
120
160
Temperature (°C)
Figure 3. ILED vs. Temperature
Figure 4. IDIM vs. Temperature
900
3.4
800
700
Frequency (KHz)
VOVP (V)
3.3
3.2
3.1
600
500
400
300
200
100
0
3
-40
0
40
80
120
0
160
50
100
150
200
RT(KΩ)
Temperature (°C)
Figure 6. Frequency vs. RT
Figure 5. OVP vs. Temperature
6
Version: A1904
TS19501CB10
Taiwan Semiconductor
TYPICAL APPLICATION CIRCUITS
RDMY
CO
BOOST
VIN
D1
LED
BUCK-BOOST
L1
RLC
ROVPH
9
RENH
VDC
CIN
RFLT 3
CEN
RENL
CBAT
1
RT
7
CCOM
5
VIN
OVP
FLT
DIM
EN
OUT
RT
CS
COM
GND
6
VDIM
2
RG
10
ROVPL
Q1
4
RCC
CCC
8
RCS
CDIM
TS19501CB10
Buck-Boost Regulator
RDMY
CO
BOOST
VIN
D1
LED
BUCK-BOOST
L1
RLC
ROVPH
9
RENH
VDC
CIN
CBAT
RFLT 3
CEN
RENL
1
RT
7
CCOM
5
VIN
OVP
FLT
DIM
EN
OUT
RT
CS
COM
GND
6
VDIM
2
10
RG
ROVPL
Q1
4
RCC
CCC
8
RCS
CDIM
TS19501CB10
Boost Regulator
LED
RDMY
CO
D1
L2
Cs
VIN
L1
9
CBAT
RENH
FLT
CIN
CEN
RENL
3
1
RT
CCOM
7
5
ROVPH
VIN
OVP
FLT
DIM
EN
OUT
RT
CS
COM
GND
6
VDIM
2
10
4
8
RG
ROVPL
Q1
RCS
TS19501CB10
SEPIC
7
Version: A1904
TS19501CB10
Taiwan Semiconductor
APPLICATION INFORMATION
The TS19501CB10 uses an external current sense resistor (RCS) between the MOSFET source and the GND to
convert the input power. The MOSFET ON current signal and VREF are input to the GM amplifier. The special GM
amplifier follow the design formula to combine the TON and TOFF information which are force to be equal potential
through system negative feedback.
The average LED current can be expressed as below.
ILED_avg
VREF
RCS
Where:
ILED_avg is the average LED current
VREF is the internal reference voltage (150mV)
RCS is the sensing resistor connected between the MOSFET source and the GND
Pin Definitions
EN Pin
The EN pin can sense VIN information by voltage divider resister. The hysteresis current (IEN) is 20μA when the
divider voltage over VEN_ON.
DIM Pin
A PWM and linear dimming function is applied in TS19501CB10. The linear dimming range is an analog voltage
from 0V to 1.6V. PWM dimming function is the same pin of linear dimming. The current regulation is decided by
duty cycle of external PWM signal. Built-in 10μA source current is for NTC resistance application.
FLT Pin
Open drain output for fault status flag.
CS Pin
MOSFET current signal sensing and current limit setting function.
ICS(LIMIT)
0.8
RCS
Where:
ICS(LIMIT) is the input current limit
RCS is the sensing resistor connected between the MOSFET source and GND
COM Pin
This is the output of the Gm amplifier. Connect with a suitable RC network to ground.
8
Version: A1904
TS19501CB10
Taiwan Semiconductor
APPLICATION INFORMATION
Pin Definitions (Continue)
OVP Pin
The Output voltage is reflected by inductor voltage. The OVP pin can sense output information to depart from startup voltage (VSCP) and protect voltage (VOVP).
When the OVP sense voltage under VSCP a period of time (8 clock cycles), The short circuit protection (SCP) will
work. When the OVP sense voltage over VOVP a period of time (8 clock cycles), the over voltage protection (OVP)
will work. it will attempt to recover after every 32768 clock cycles.
D1
L1
VBAT
For Boost
LED
ROVPH
CO
RDMY
OVP
ROVPL
OUT
CS
RCS
GND
Boost
GND
VBAT
Buck-Boost
VO_OVP 3.2
ROVPH ROVPL
ROVPL
VO_SCP 1.5
ROVPH ROVPL
ROVPL
For Buck-Boost and SEPIC
ROVPH ROVPL
VO_OVP 3.2
VBAT
ROVPL
ROVPH ROVPL
VO_SCP 1.5
VBAT
ROVPL
Where:
VOVP is the output-over-voltage protection point (3.2V)
VSCP is the output-short-circuit protection point (1.5V)
RT Pin
This pin is to program the operation frequency by connecting a resistor to ground.
Reference formula as below:
FS
1
1 10
-10
RT
GND Pin
GND is the reference node of internal circuit.
VIN Pin
Power supply input for the controller during normal operation. The controller will start up when V IN reaches 4.2V
(typical) and will shut-down when VIN voltage is below 4.0V (typical) when VEN over 1.2V. A decoupling capacitor
should be connected between the VIN and GND pin as close as possible.
OUT Pin
Gate drive for external MOSFET switch and built-in gate clamp function.
9
Version: A1904
TS19501CB10
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS (Unit: Millimeters)
MSOP-10EP
SUGGESTED PAD LAYOUT (Unit: Millimeters)
MARKING DIAGRAM
TS19501
YML
Y = Year Code
M = Month Code for Halogen Free Product
O =Jan P =Feb Q =Mar R =Apr
S =May T =Jun U =Jul
V =Aug
W =Sep X =Oct
Y =Nov Z =Dec
L = Lot Code (1~9, A~Z)
10
Version: A1904
TS19501CB10
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular
purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
11
Version: A1904
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