AB-EZPC-10

AB-EZPC (AC IC series) datasheet Current regulator with bias voltage rectification Features • Automotive applications • DFN packages • PWM dimmable • Built-in rectification circuit • Accurate constant current (Is±3%) • Over Current Protection (OCP) • Over temperature protection (OTP) Description AB-EZPC is a constant current regulator with built-in bias voltage rectification circuit. It is designed to maintain constant current and hence constant luminance for DC powered LED lighting applications. AB-EZPC rectifies power input for the LED string to operate regardless of the polarity of the bias voltage. Additionally, to ensure system reliability, it is built with thermal protection function (OTP). *The information in this document is subject to change without American Bright Optoelectronics Crop. notice. 1|Page Marking Information DFN Package Pin Configuration (Top View & Backside) Pin Description Pin No. 1 2 3 4 5 6 2|Page Name N1 NC P1 VA NC VB Function Output pin to connect external LED negative (-) No connection Output pin to connect external LED positive (+) Power input pin A No connection Power input pin B Ordering Information Part number Power (W) Output Current (mA) Applied Voltage (V) AB-EZPC-05 0.5W 25mA 0.5-40V AB-EZPC-10 1.0W 50mA 0.5-40V AB-EZPC-20 2.0W 100mA 0.5-40V Absolute Maximum Ratings Parameter Value Supply Voltage |VA-VB| 38V Junction Temperature 150°C Operating ambient temperature TA -20°C-85°C Storage temperature range -40°C-150°C DFN Package thermal resistance (junction to ambience) 50°C/W Lead temperature (All Pb free packages, soldering, 10s) 260°C ESD voltage protection, human body model 4KV Recommended Operating Conditions Symbol Parameter Min/Max Unit | VA-VB | TA Supply Voltage Operating ambient temperature 1.8 / 40 -20 / 85 V °C Electrical Characteristics (TA=+25°C, unless otherwise specified) Characteristic Output current Output ramp down temperature Shutdown temperature 3|Page Symbol Condition Min. Typ. Max. Unit 25 200 Is |VA-VB | > 1.8 mA T1A Start point (100% current) 120 °C T2 IP = 0mA (0 current) 160 °C Function Block Application Note 4|Page Package Information Dual Flat No-Lead (DFN) packages is lead-less, near Chip Scale Packages (CSP) with a low profile, moderate thermal dissipation for high power application, and good electrical performance. DFN is a surface mount plastic package with leads located at the bottom of the package, with the DFN having leads on two sides of the package versus on four sides for the QFN. The dimension of currently available package is 2.0 x 2.0 x 0.75 mm. The electrical lead pitch is 0.65mm; six electrical pads exposed area are all 0.3 x 0.35 mm; central thermal pad exposed is 1.0 x 1.6 mm. (For AB-EZPC series only) 5|Page