AB-EZDC

AB-EZDC (DC IC series) datasheet Constant Current regulator Features • • • • • • • 1.3-18V Wide input voltage 0.3-1V output dropout voltage DFN packages Support power supply PWM dimming Accurate constant current (Is±3%) Over temperature protection (current ramp down during 120-160°C TJ) -40~85° operating ambient temperature Description AB-EZDC is a constant current LED driver with the adjustable current. It is designed to maintain constant current and hence constant luminance for DC powered LED lighting applications. Additionally, to ensure system reliability, AB-EZDC is built with thermal protection function (OTP) and offers the adjustable current by an external sense resistor. (current limited by heat dissipation of IC package and heat sink) *The information in this document is subject to change without American Bright Optoelectronics Crop. notice. Page 1 of 5 Pin Description Pin VDD OPT GND REXT Function Power source Current sink Ground Current setting resistor Ideal IV characteristic Page 2 of 5 Recommended Operating Conditions Characteristic Symbol Supply voltage Working voltage Rext output voltage Output current Output current skew Line/Load regulation VDD VOPT VREXT IS ISkew %/VOPT Condition Min. Typ. Max. Unit IPN=IS Bond wire effect exclusive Spec. Is 9V > VOPT >1.6V 1.6 1.6 0.152 - 0.16 - 18 15 0.168 150 5 ±1 V V V mA % %/V Absolute Maximum Ratings Parameter Symbol Rating Unit Supply voltage VDDmax -0.2~20 V Output voltage VOPTmax -0.2~16 V Output current IOPTmax 200 mA VR 0.5 V Operating temperature TOPR -40~+85 °C Storage temperature TSTG -55~+150 °C Reverse voltage (VN to VP/VDD) Thermal Protection Output current will decrease to lower down the power dissipation on chip as junction temperature more than thermal protection temperature (~125°C); output current will almost shut down as junction temperature reach 160°C Page 3 of 5 Application note The current can be modulated via exterior resistor at REXT. The current range is during 20mA to 200mA. Page 4 of 5 Package Information Dual Flat No-Lead (DFN) packages is lead-less, near Chip Scale Packages (CSP) with a low profile, moderate thermal dissipation for high power application, and good electrical performance. DFN is a surface mount plastic package with leads located at the bottom of the package, with the DFN having leads on two sides of the package versus on four sides for the QFN. The dimension of currently available package is 2.0 x 2.0 x 0.75 mm. The electrical lead pitch is 0.65mm; six electrical pads exposed area are all 0.3 x 0.35 mm; central thermal pad exposed is 1.0 x 1.6 mm. (For AB-EZPD series only) Page 5 of 5