XLF224-1024-FB374-C40

XLF224-1024-FB374 Datasheet 2016/04/20 XMOS © 2016, All Rights Reserved Document Number: X009607, XLF224-1024-FB374 Datasheet 1 Table of Contents 1 xCORE Multicore Microcontrollers . . . . . 2 XLF224-1024-FB374 Features . . . . . . . 3 Pin Configuration . . . . . . . . . . . . . . 4 Signal Description . . . . . . . . . . . . . . 5 Example Application Diagram . . . . . . . 6 Product Overview . . . . . . . . . . . . . . 7 PLL . . . . . . . . . . . . . . . . . . . . . . . 8 Boot Procedure . . . . . . . . . . . . . . . . 9 Memory . . . . . . . . . . . . . . . . . . . . 10 JTAG . . . . . . . . . . . . . . . . . . . . . . 11 Board Integration . . . . . . . . . . . . . . 12 DC and Switching Characteristics . . . . . 13 Package Information . . . . . . . . . . . . 14 Ordering Information . . . . . . . . . . . . Appendices . . . . . . . . . . . . . . . . . . . . . A Configuration of the XLF224-1024-FB374 B Processor Status Configuration . . . . . . C Tile Configuration . . . . . . . . . . . . . . D Node Configuration . . . . . . . . . . . . . E JTAG, xSCOPE and Debugging . . . . . . . F Schematics Design Check List . . . . . . . G PCB Layout Design Check List . . . . . . . H Associated Design Documentation . . . . I Related Documentation . . . . . . . . . . . J Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 6 7 13 14 17 18 19 21 22 24 28 29 30 30 32 43 51 59 61 63 64 64 65 TO OUR VALUED CUSTOMERS It is our intention to provide you with accurate and comprehensive documentation for the hardware and software components used in this product. To subscribe to receive updates, visit http://www.xmos.com/. XMOS Ltd. is the owner or licensee of the information in this document and is providing it to you “AS IS” with no warranty of any kind, express or implied and shall have no liability in relation to its use. XMOS Ltd. makes no representation that the information, or any particular implementation thereof, is or will be free from any claims of infringement and again, shall have no liability in relation to any such claims. XMOS and the XMOS logo are registered trademarks of XMOS Ltd in the United Kingdom and other countries, and may not be used without written permission. Company and product names mentioned in this document are the trademarks or registered trademarks of their respective owners. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 1 2 xCORE Multicore Microcontrollers The xCORE200 Series is a comprehensive range of 32-bit multicore microcontrollers that brings the low latency and timing determinism of the xCORE architecture to mainstream embedded applications. Unlike conventional microcontrollers, xCORE multicore microcontrollers execute multiple real-time tasks simultaneously and communicate between tasks using a high speed network. Because xCORE multicore microcontrollers are completely deterministic, you can write software to implement functions that traditionally require dedicated hardware. X3Dxx I/O pins xTIME scheduler Hardware response ports PLL JTAG xCORE logical core xCORE logical core xCORE logical core xCORE logical core SRAM OTP xCORE logical core xCORE logical core Figure 1: XLF224-1024FB374 block diagram xTIME scheduler Hardware response ports xCORE logical core SRAM OTP SRAM xCORE logical core xCORE logical core X0Dxx I/O pins xCORE logical core xCORE logical core xCONNECT Switch Node 0 xCORE logical core xCORE logical core OTP xCORE logical core xCORE logical core xCORE logical core Link 0 Link 1 Link 2 Link 3 OTP Hardware response ports Link 7 Link 6 Link 5 Link 4 xCORE logical core SRAM X2Dxx I/O pins xCORE logical core xCONNECT Switch Node 2 xCORE logical core xTIME scheduler xCORE logical core xCORE logical core xCORE logical core FLASH xCORE logical core xCORE logical core PLL JTAG xTIME scheduler X1Dxx I/O pins Hardware response ports Key features of the XLF224-1024-FB374 include: · Tiles: Devices consist of one or more xCORE tiles. Each tile contains between five and eight 32-bit xCOREs with highly integrated I/O and on-chip memory. · Logical cores Each logical core can execute tasks such as computational code, DSP code, control software (including logic decisions and executing a state machine) or software that handles I/O. Section 6.1 · xTIME scheduler The xTIME scheduler performs functions similar to an RTOS, in hardware. It services and synchronizes events in a core, so there is no requirement for interrupt handler routines. The xTIME scheduler triggers cores X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 3 on events generated by hardware resources such as the I/O pins, communication channels and timers. Once triggered, a core runs independently and concurrently to other cores, until it pauses to wait for more events. Section 6.2 · Channels and channel ends Tasks running on logical cores communicate using channels formed between two channel ends. Data can be passed synchronously or asynchronously between the channel ends assigned to the communicating tasks. Section 6.5 · xCONNECT Switch and Links Between tiles, channel communications are implemented over a high performance network of xCONNECT Links and routed through a hardware xCONNECT Switch. Section 6.6 · Ports The I/O pins are connected to the processing cores by Hardware Response ports. The port logic can drive its pins high and low, or it can sample the value on its pins optionally waiting for a particular condition. Section 6.3 · Clock blocks xCORE devices include a set of programmable clock blocks that can be used to govern the rate at which ports execute. Section 6.4 · Memory Each xCORE Tile integrates a bank of SRAM for instructions and data, and a block of one-time programmable (OTP) memory that can be configured for system wide security features. Section 9 · PLL The PLL is used to create a high-speed processor clock given a low speed external oscillator. Section 7 · Flash The device has a built-in 2MBflash. Section 8 · JTAG The JTAG module can be used for loading programs, boundary scan testing, in-circuit source-level debugging and programming the OTP memory. Section 10 1.1 Software Devices are programmed using C, C++ or xC (C with multicore extensions). XMOS provides tested and proven software libraries, which allow you to quickly add interface and processor functionality such as USB, Ethernet, PWM, graphics driver, and audio EQ to your applications. 1.2 xTIMEcomposer Studio The xTIMEcomposer Studio development environment provides all the tools you need to write and debug your programs, profile your application, and write images into flash memory or OTP memory on the device. Because xCORE devices operate deterministically, they can be simulated like hardware within xTIMEcomposer: uniquely in the embedded world, xTIMEcomposer Studio therefore includes a static timing analyzer, cycle-accurate simulator, and high-speed in-circuit instrumentation. xTIMEcomposer can be driven from either a graphical development environment, or the command line. The tools are supported on Windows, Linux and MacOS X X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 4 and available at no cost from xmos.com/downloads. Information on using the tools is provided in the xTIMEcomposer User Guide, X3766. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 2 5 XLF224-1024-FB374 Features · Multicore Microcontroller with Advanced Multi-Core RISC Architecture • 24 real-time logical cores on 4 xCORE tiles • Cores share up to 2000 MIPS — Up to 4000 MIPS in dual issue mode • Each logical core has: — Guaranteed throughput of between 1/5 and 1/6 of tile MIPS — 16x32bit dedicated registers • 167 high-density 16/32-bit instructions — All have single clock-cycle execution (except for divide) — 32x32→64-bit MAC instructions for DSP, arithmetic and user-definable cryptographic functions · Programmable I/O • 256 general-purpose I/O pins, configurable as input or output — Up to 56 x 1bit port, 22 x 4bit port, 13 x 8bit port, 6 x 16bit port, 4 x 32bit port — 8 xCONNECT links • Port sampling rates of up to 60 MHz with respect to an external clock • 128 channel ends (32 per tile) for communication with other cores, on or off-chip · Memory • 1024KB internal single-cycle SRAM (max 256KB per tile) for code and data storage • 32KB internal OTP (max 8KB per tile) for application boot code • 2MB internal flash for application code and overlays · Hardware resources • 24 clock blocks (6 per tile) • 40 timers (10 per tile) • 16 locks (4 per tile) · JTAG Module for On-Chip Debug · Security Features • Programming lock disables debug and prevents read-back of memory contents • AES bootloader ensures secrecy of IP held on external flash memory · Ambient Temperature Range • Commercial qualification: 0 °C to 70 °C • Industrial qualification: -40 °C to 85 °C · Speed Grade • 40: 2000 MIPS · Power Consumption • 1140 mA (typical) · 374-pin FBGA package 0.8 mm pitch X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 3 6 Pin Configuration 4 5 8 9 6 7 8D 4F 4F VDDIOT X1D41 X0D31 X0D29 15 18 17 VDDIOT _2 4F 4F 4E X2D31 X2D29 X2D32 4E 4F TDI VDDIO CLK TDO X3D32 X3D30 4E 4F 4E 4F 4F 4E 4E 1L GND RST_N TCK X3D33 X3D31 X3D27 X2D30 X2D28 X2D27 X2D26 X2D35 X2 Lo4 7 X2 Lo3 7 X2 Lo2 7 1J 1K VDD X2D25 X2D34 X2 Lo0 7 X2 Lo1 7 1D 4E 4E VDDIO X1D11 X1D32 X1D26 B 1N 1M 1C 4E 4E 8D 8D 4F 4F 1M X0D37 X0D36 X1D10 X1D33 X1D27 X1D42 X1D40 X0D30 X0D28 X2D36 X0 Li40 D E F 1O X0D38 X0 Li30 VDD 4F 4F 8D X1D30 X1D28 X1D43 8D 8D 1K 4F 4F X0D41 X0D40 X1D34 X1D31 X1D29 X0 Li00 X0 Li10 X0 Lo2 0 GND GND VDDIO 4E 4E X0D33 X0D32 NC DEBUG_ N H J K L MODE1 OTP_ VCC MODE0 TRST_ N 1C 4F X3D10 X3D29 1D 4F 4E 8D 8D 32A 1A 1B 1I TMS X3D11 X3D28 X3D26 X3D42 X3D40 X2D70 X3D00 X3D01 X2D24 X2 Lo4 6 X2 Li27 X2 Li17 X2 Li07 32A 4A 4A VDD X2D69 X3D08 X3D09 X2 Lo3 6 X2 Li47 X2 Li37 GND VDDIO X2D68 32A 32A 32A GND 8D 8D 4E X3D43 X3D41 X2D33 8D 8D 1L X0D43 X0D42 X1D35 X0 Lo1 0 X0 Lo0 0 X0 Lo3 0 VDDIO GND 32A 32A 32A X1D49 X1D50 X1D51 X2D67 X2D66 X2D65 X0 Li41 X0 Li31 X0 Li21 X2 Lo1 6 X2 Lo0 6 X2 Li06 32A 32A VDD VDD X2D63 X2D64 VDD VDD GND VDDIO VDD VDD 1M X1D36 VDD VDD VDD VDD VDD VDD X0 Lo4 0 G NC NC NC NC NC VDD PLL_ AGND PLL_ AVDD VDD VDDIO GND VDD 32A VDD VDD VDD VDD VDD VDD VDD X2 Lo2 6 NC NC NC NC NC NC NC 32A 32A X1D53 X1D52 X0 Li01 X0 Li11 X2 Li26 X2 Li16 32A 32A 32A 32A X1D54 X1D55 X2D62 X2D61 X0 Lo0 1 X0 Lo1 1 X2 Li36 X2 Li46 VDD GND GND GND GND GND GND GND GND GND GND VDD 32A 32A 32A 32A 32A 32A X1D58 X1D57 X1D56 X2D56 X2D57 X2D58 X0 Lo4 1 X0 Lo3 1 X0 Lo2 1 X2 Lo2 5 X2 Lo3 5 X2 Lo4 5 32A 32A GND VDDIO VDDIO GND GND X1D61 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND X2D55 X0 Li42 M N P R T GND 14 GND 1P VDDIO 13 A X0 Li20 21 12 3 X0D39 20 11 2 C 19 16 10 1 X2 Lo1 5 32A 32A 32A X1D64 X1D63 X1D62 X0 Li12 X0 Li22 X0 Li32 32A 32A X1D65 X1D66 X0 Li02 X0 Lo0 2 32A 32A 4B 4B X1D68 X1D67 X3D06 X3D07 X0 Lo2 2 X0 Lo1 2 X2 Lo3 4 X2 Lo4 4 GND VDD GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND 32A 32A 1N X1D70 X1D37 X0 Lo3 2 X0 Lo4 2 X0 Li43 VDDIO GND 32A 32A X2D53 X2D52 X2 Lo0 5 X2 Li05 X2 Li15 32A 32A X2D50 X2D51 X2 Li35 X2 Li25 VDD VDD X1D69 32A X2D54 VDD NC NC NC NC NC NC NC NC NC NC NC NC 32A 4B 4B X2D49 X3D04 X3D05 X2 Li45 X2 Lo1 4 X2 Lo2 4 GND VDDIO X3D03 1O X1D38 4A VDD VDD VDD VDD VDD VDD VDD GND VDD VDD VDD VDD VDD VDD VDD X0 Li33 U V W X2 Lo0 4 4D 4D 1P X1D17 X1D16 X1D39 X0 Li03 X0 Li13 X0 Li23 VDD VDD GND 4D 4D 1B 4A 4A 1D X1D19 X1D18 X0D01 X0D02 X0D08 X0D11 X0 Lo1 3 X0 Lo0 3 X0 Lo2 3 1C 1G X0D10 X1D22 X0 Lo3 3 X0 Lo4 3 VDD33 4A 4A X0D03 X0D09 NC GND NC VDD VDDIO 4C 1J 4C X1D14 X1D25 X0D21 NC VDD VDD 1H 4B 4B X3D23 X2D05 X2D07 4C 4C 1E 1H 1A 4B 4B X1D15 X0D14 X0D12 X0D23 X2D00 X2D04 X2D06 VDDIO NC GND GND NC NC VDD VDD NC 4D 4A X2D19 X3D02 X2 Li14 X2 Li04 4C 4C 1E 4D 4D X3D15 X3D21 X2D12 X2D17 X2D18 X2 Li34 X2 Li24 4C 4C X3D14 X3D20 VDD33 1H 4D X2D23 X2D16 X2 Li44 Y 1H 1A 4B 4B 1E X1D23 X0D00 X0D04 X0D06 X1D12 AA 4B 4B 1F GND VDDIO X0D05 X0D07 X1D13 X009607, NC VDDIO 1I 4C 4C 1F NC X1D24 X1D20 X0D15 X0D13 4C 4C 1G NC NC X1D21 X0D20 X0D22 1D 4A 4A 1F 4C 4C 1I 1F 1G GND X2D11 X2D02 X2D08 X3D13 NC X2D14 X2D20 X3D24 X2D13 X2D22 1E 4A 4A 4C 4C 1J VDDIO X3D12 X2D03 X2D09 NC NC X2D15 X2D21 X3D25 VDDIO GND XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 4 7 Signal Description This section lists the signals and I/O pins available on the XLF224-1024-FB374. The device provides a combination of 1bit, 4bit, 8bit and 16bit ports, as well as wider ports that are fully or partially (gray) bonded out. All pins of a port provide either output or input, but signals in different directions cannot be mapped onto the same port. Pins may have one or more of the following properties: · PD/PU: The IO pin has a weak pull-down or pull-up resistor. On GPIO pins this resistor can be enabled. This resistor is designed to ensure defined logic input state for unconnected pins. It should not be used to pull external circuitry. Note that the resistors are highly non-linear and only a maximum pull current is specified in Section 12.2. · ST: The IO pin has a Schmitt Trigger on its input. · IOT: The IO pin is powered from VDDIOT (X1) or VDDIOT_2 (X3), not VDDIO · IO: the pin is powered from VDDIO Power pins (9) Signal Function Type GND Digital ground GND OTP_VCC OTP power supply PWR PLL_AGND Analog ground for PLL PWR PLL_AVDD Analog PLL power PWR VDD Digital tile power PWR VDD33 Peripheral power PWR VDDIO Digital I/O power PWR VDDIOT Digital I/O power (top) PWR VDDIOT_2 Digital I/O power (top, X3) PWR Properties JTAG pins (6) X009607, Signal Function Type Properties RST_N Global reset input Input IO, PU, ST TCK Test clock Input IO, PD, ST TDI Test data input Input IO, PU TDO Test data output Output IO, PD TMS Test mode select Input IO, PU TRST_N Test reset input Input IO, PU, ST XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 8 I/O pins (176) Signal Function X0D00 X0D01 X0 L32 out Type Properties 1A0 I/O IO, PD 1B0 I/O— IO, PD X0D02 4A0 8A0 16A0 32A20 I/O IO, PD X0D03 4A1 8A1 16A1 32A21 I/O IO, PD X0D04 4B0 8A2 16A2 32A22 I/O— IO, PD X0D05 4B1 8A3 16A3 32A23 I/O— IO, PD X0D06 4B2 8A4 16A4 32A24 I/O— IO, PD X0D07 4B3 8A5 16A5 32A25 I/O— IO, PD X0D08 4A2 8A6 16A6 32A26 I/O IO, PD X0D09 4A3 8A7 16A7 32A27 I/O IO, PD 1C0 I/O— IO, PD X0D11 1D0 I/O IO, PD X0D12 1E0 I/O IO, PD X0D13 1F0 I/O IO, PD X0D10 X0 L33 out X0D14 4C0 8B0 16A8 32A28 I/O IO, PD X0D15 4C1 8B1 16A9 32A29 I/O IO, PD X0D20 4C2 8B6 16A14 32A30 I/O IO, PD X0D21 4C3 8B7 16A15 32A31 I/O IO, PD X0D22 1G0 I/O IO, PD X0D23 1H0 I/O IO, PD X0D28 4F0 8C2 16B2 I/O IO, PD X0D29 4F1 8C3 16B3 I/O IO, PD X0D30 4F2 8C4 16B4 I/O IO, PD X0D31 4F3 8C5 16B5 I/O IO, PD X0D32 4E2 8C6 16B6 I/O IO, PD X0D33 4E3 8C7 16B7 I/O IO, PD 1M0 8D0 16B8 I/O IO, PD X0D36 X0D37 X0 L04 in 1N0 8D1 16B9 I/O IO, PD X0D38 X0 L03 in 1O0 8D2 16B10 I/O IO, PD X0D39 X0 L02 in 1P0 8D3 16B11 I/O IO, PD X0D40 X0 L01 in 8D4 16B12 I/O IO, PD X0D41 X0 L00 in 8D5 16B13 I/O IO, PD X0D42 X0 L00 out 8D6 16B14 I/O IO, PD X0D43 X0 L01 out 8D7 16B15 I/O IO, PD X1D10 1C0 I/O IOT, PD X1D11 1D0 I/O IOT, PD X1D12 1E0 I/O IO, PD X1D13 1F0 I/O IO, PD X1D14 4C0 8B0 16A8 32A28 I/O IO, PD X1D15 4C1 8B1 16A9 32A29 I/O IO, PD 4D0 8B2 16A10 I/O IO, PD X1D16 X0 L31 in (continued) X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 9 Signal Function Type Properties X1D17 X0 L30 in 4D1 8B3 16A11 I/O IO, PD X1D18 X0 L30 out 4D2 8B4 16A12 I/O IO, PD X1D19 X0 L31 out 4D3 8B5 16A13 I/O IO, PD X1D20 4C2 8B6 16A14 32A30 I/O IO, PD X1D21 4C3 8B7 16A15 32A31 I/O IO, PD 1G0 I/O IO, PD X1D23 1H0 I/O IO, PD X1D24 1I0 I/O IO, PD X1D25 1J0 I/O IO, PD X1D22 X0 L34 out X1D26 4E0 8C0 16B0 I/O IOT, PD X1D27 4E1 8C1 16B1 I/O IOT, PD X1D28 4F0 8C2 16B2 I/O IOT, PD X1D29 4F1 8C3 16B3 I/O IOT, PD X1D30 4F2 8C4 16B4 I/O IOT, PD X1D31 4F3 8C5 16B5 I/O IOT, PD X1D32 4E2 8C6 16B6 I/O IOT, PD X1D33 4E3 8C7 16B7 I/O IOT, PD X1D34 X0 L02 out 1K0 I/O IO, PD X1D35 X0 L03 out 1L0 I/O IO, PD X1D36 X0 L04 out 1M0 8D0 16B8 I/O IO, PD X1D37 X0 L34 in 1N0 8D1 16B9 I/O IO, PD X1D38 X0 L33 in 1O0 8D2 16B10 I/O IO, PD X1D39 X0 L32 in 1P0 8D3 16B11 I/O IO, PD X1D40 8D4 16B12 I/O IOT, PD X1D41 8D5 16B13 I/O IOT, PD X1D42 8D6 16B14 I/O IOT, PD X1D43 8D7 16B15 I/O IOT, PD X1D49 X0 L14 in 32A0 I/O IO, PD X1D50 X0 L13 in 32A1 I/O IO, PD X1D51 X0 L12 in 32A2 I/O IO, PD X1D52 X0 L11 in 32A3 I/O IO, PD X1D53 X0 L10 in 32A4 I/O IO, PD X1D54 X0 L10 out 32A5 I/O IO, PD X1D55 X0 L11 out 32A6 I/O IO, PD X1D56 X0 L12 out 32A7 I/O IO, PD X1D57 X0 L13 out 32A8 I/O IO, PD X1D58 X0 L14 out 32A9 I/O IO, PD X1D61 X0 L24 in 32A10 I/O IO, PD X1D62 X0 L23 in 32A11 I/O IO, PD X1D63 X0 L22 in 32A12 I/O IO, PD X1D64 X0 L21 in 32A13 I/O IO, PD X1D65 X0 L20 in 32A14 I/O IO, PD X1D66 X0 L20 out 32A15 I/O IO, PD (continued) X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 10 Signal Function Type Properties X1D67 X0 L21 out 32A16 I/O IO, PD X1D68 X0 L22 out 32A17 I/O IO, PD X1D69 X0 L23 out 32A18 I/O IO, PD X1D70 X0 L24 out 32A19 I/O IO, PD I/O IO, PD 1A0 X2D00 X2D02 4A0 8A0 16A0 32A20 I/O IO, PD X2D03 4A1 8A1 16A1 32A21 I/O IO, PD X2D04 4B0 8A2 16A2 32A22 I/O IO, PD X2D05 4B1 8A3 16A3 32A23 I/O IO, PD X2D06 4B2 8A4 16A4 32A24 I/O IO, PD X2D07 4B3 8A5 16A5 32A25 I/O IO, PD X2D08 4A2 8A6 16A6 32A26 I/O IO, PD X2D09 4A3 8A7 16A7 32A27 I/O IO, PD X2D11 1D0 I/O IO, PD X2D12 1E0 I/O IO, PD X2D13 1F0 I/O IO, PD X2D14 4C0 8B0 16A8 32A28 I/O IO, PD X2D15 4C1 8B1 16A9 32A29 I/O IO, PD X2D16 X2 L44 in 4D0 8B2 16A10 I/O IO, PD X2D17 X2 L43 in 4D1 8B3 16A11 I/O IO, PD X2D18 X2 L42 in 4D2 8B4 16A12 I/O IO, PD X2D19 X2 L41 in 4D3 8B5 16A13 I/O IO, PD X2D20 4C2 8B6 16A14 32A30 I/O IO, PD X2D21 4C3 8B7 16A15 32A31 I/O IO, PD X2D22 1G0 I/O IO, PD X2D23 1H0 I/O IO, PD X2D24 X2 L70 in 1I0 I/O IO, PD X2D25 X2 L70 out 1J0 I/O IO, PD X2D26 X2 L73 out 4E0 8C0 16B0 I/O IO, PD X2D27 X2 L74 out 4E1 8C1 16B1 I/O IO, PD X2D28 4F0 8C2 16B2 I/O IO, PD X2D29 4F1 8C3 16B3 I/O IO, PD X2D30 4F2 8C4 16B4 I/O IO, PD X2D31 4F3 8C5 16B5 I/O IO, PD X2D32 4E2 8C6 16B6 I/O IO, PD X2D33 4E3 8C7 16B7 I/O IO, PD X2D34 X2 L71 out 1K0 I/O IO, PD X2D35 X2 L72 out 1L0 I/O IO, PD I/O IO, PD 1M0 X2D36 8D0 16B8 X2D49 X2 L54 in 32A0 I/O IO, PD X2D50 X2 L53 in 32A1 I/O IO, PD X2D51 X2 L52 in 32A2 I/O IO, PD X2D52 X2 L51 in 32A3 I/O IO, PD (continued) X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 11 Signal Function Type Properties X2D53 X2 L50 in 32A4 I/O IO, PD X2D54 X2 L50 out 32A5 I/O IO, PD X2D55 X2 L51 out 32A6 I/O IO, PD X2D56 X2 L52 out 32A7 I/O IO, PD X2D57 X2 L53 out 32A8 I/O IO, PD X2D58 X2 L54 out 32A9 I/O IO, PD X2D61 X2 L64 in 32A10 I/O IO, PD X2D62 X2 L63 in 32A11 I/O IO, PD X2D63 X2 L62 in 32A12 I/O IO, PD X2D64 X2 L61 in 32A13 I/O IO, PD X2D65 X2 L60 in 32A14 I/O IO, PD X2D66 X2 L60 out 32A15 I/O IO, PD X2D67 X2 L61 out 32A16 I/O IO, PD X2D68 X2 L62 out 32A17 I/O IO, PD X2D69 X2 L63 out 32A18 I/O IO, PD X2D70 X2 L64 out 32A19 I/O IO, PD X3D00 X2 L72 in 1A0 I/O IO, PD X3D01 X2 L71 in 1B0 I/O IO, PD X3D02 X2 L40 in 4A0 8A0 16A0 32A20 I/O IO, PD X3D03 X2 L40 out 4A1 8A1 16A1 32A21 I/O IO, PD X3D04 X2 L41 out 4B0 8A2 16A2 32A22 I/O IO, PD X3D05 X2 L42 out 4B1 8A3 16A3 32A23 I/O IO, PD X3D06 X2 L43 out 4B2 8A4 16A4 32A24 I/O IO, PD X3D07 X2 L44 out 4B3 8A5 16A5 32A25 I/O IO, PD X3D08 X2 L74 in 4A2 8A6 16A6 32A26 I/O IO, PD X3D09 X2 L73 in 4A3 8A7 16A7 32A27 I/O IO, PD X3D10 1C0 I/O IOT, PD X3D11 1D0 I/O IOT, PD X3D12 1E0 I/O IO, PD X3D13 1F0 I/O IO, PD X3D14 4C0 8B0 16A8 32A28 I/O IO, PD X3D15 4C1 8B1 16A9 32A29 I/O IO, PD X3D20 4C2 8B6 16A14 32A30 I/O IO, PD X3D21 4C3 8B7 16A15 32A31 I/O IO, PD X3D23 1H0 I/O IO, PD X3D24 1I0 I/O IO, PD X3D25 1J0 I/O IO, PD X3D26 4E0 8C0 16B0 I/O IOT, PD X3D27 4E1 8C1 16B1 I/O IOT, PD X3D28 4F0 8C2 16B2 I/O IOT, PD X3D29 4F1 8C3 16B3 I/O IOT, PD X3D30 4F2 8C4 16B4 I/O IOT, PD X3D31 4F3 8C5 16B5 I/O IOT, PD (continued) X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet Signal 12 Type Properties X3D32 Function 4E2 8C6 16B6 I/O IOT, PD X3D33 4E3 8C7 16B7 I/O IOT, PD X3D40 8D4 16B12 I/O IOT, PD X3D41 8D5 16B13 I/O IOT, PD X3D42 8D6 16B14 I/O IOT, PD X3D43 8D7 16B15 I/O IOT, PD System pins (4) X009607, Signal Function Type Properties CLK PLL reference clock Input IO, PD, ST DEBUG_N Multi-chip debug I/O IO, PU MODE0 Boot mode select Input PU MODE1 Boot mode select Input PU XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet Example Application Diagram IN EN 3V3 PG RESET SUPERVISOR VDD OUT OUT PLL_AGND IN 1V0 PLL_AVDD 5 13 RST_N TRST_N OSCILLATOR 25 MHz CLK X0D01 OTP_VCC XnDnn GPIO xCORE200 VDDIOT GND Figure 2: Simplified Reference Schematic X2D06 VDDIO · see Section 11 for details on the power supplies and PCB design X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 6 14 Product Overview The XLF224-1024-FB374 is a powerful device that consists of four xCORE Tiles, each comprising a flexible logical processing cores with tightly integrated I/O and on-chip memory. 6.1 Logical cores Each tile has 6 active logical cores, which issue instructions down a shared fivestage pipeline. Instructions from the active cores are issued round-robin. If up to five logical cores are active, each core is allocated a fifth of the processing cycles. If more than five logical cores are active, each core is allocated at least 1/n cycles (for n cores). Figure 3 shows the guaranteed core performance depending on the number of cores used. Figure 3: Logical core performance Speed MIPS Frequency grade 20 2000 MIPS 500 MHz Minimum MIPS per core (for n cores) 1 2 3 4 5 6 100 100 100 100 100 83 There is no way that the performance of a logical core can be reduced below these predicted levels (unless priority threads are used: in this case the guaranteed minimum performance is computed based on the number of priority threads as defined in the architecture manual). Because cores may be delayed on I/O, however, their unused processing cycles can be taken by other cores. This means that for more than five logical cores, the performance of each core is often higher than the predicted minimum but cannot be guaranteed. The logical cores are triggered by events instead of interrupts and run to completion. A logical core can be paused to wait for an event. 6.2 xTIME scheduler The xTIME scheduler handles the events generated by xCORE Tile resources, such as channel ends, timers and I/O pins. It ensures that all events are serviced and synchronized, without the need for an RTOS. Events that occur at the I/O pins are handled by the Hardware-Response ports and fed directly to the appropriate xCORE Tile. An xCORE Tile can also choose to wait for a specified time to elapse, or for data to become available on a channel. Tasks do not need to be prioritised as each of them runs on their own logical xCORE. It is possible to share a set of low priority tasks on a single core using cooperative multitasking. 6.3 Hardware Response Ports Hardware Response ports connect an xCORE tile to one or more physical pins and as such define the interface between hardware attached to the XLF224-1024-FB374, and the software running on it. A combination of 1bit, 4bit, 8bit, 16bit and 32bit X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 15 ports are available. All pins of a port provide either output or input. Signals in different directions cannot be mapped onto the same port. reference clock readyOut conditional value clock port clock block readyIn port port counter port logic stamp/time PORT FIFO PINS Figure 4: Port block diagram port value output (drive) SERDES transfer register CORE input (sample) The port logic can drive its pins high or low, or it can sample the value on its pins, optionally waiting for a particular condition. Ports are accessed using dedicated instructions that are executed in a single processor cycle. xCORE-200 IO pins can be used as open collector outputs, where signals are driven low if a zero is output, but left high impedance if a one is output. This option is set on a per-port basis. Data is transferred between the pins and core using a FIFO that comprises a SERDES and transfer register, providing options for serialization and buffered data. Each port has a 16-bit counter that can be used to control the time at which data is transferred between the port value and transfer register. The counter values can be obtained at any time to find out when data was obtained, or used to delay I/O until some time in the future. The port counter value is automatically saved as a timestamp, that can be used to provide precise control of response times. The ports and xCONNECT links are multiplexed onto the physical pins. If an xConnect Link is enabled, the pins of the underlying ports are disabled. If a port is enabled, it overrules ports with higher widths that share the same pins. The pins on the wider port that are not shared remain available for use when the narrower port is enabled. Ports always operate at their specified width, even if they share pins with another port. 6.4 Clock blocks xCORE devices include a set of programmable clocks called clock blocks that can be used to govern the rate at which ports execute. Each xCORE tile has six clock blocks: the first clock block provides the tile reference clock and runs at a default frequency of 100MHz; the remaining clock blocks can be set to run at different frequencies. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 100MHz reference clock 16 1-bit port ... ... divider readyIn clock block Figure 5: Clock block diagram port counter A clock block can use a 1-bit port as its clock source allowing external application clocks to be used to drive the input and output interfaces. xCORE-200 clock blocks optionally divide the clock input from a 1-bit port. In many cases I/O signals are accompanied by strobing signals. The xCORE ports can input and interpret strobe (known as readyIn and readyOut) signals generated by external sources, and ports can generate strobe signals to accompany output data. On reset, each port is connected to clock block 0, which runs from the xCORE Tile reference clock. 6.5 Channels and Channel Ends Logical cores communicate using point-to-point connections, formed between two channel ends. A channel-end is a resource on an xCORE tile, that is allocated by the program. Each channel-end has a unique system-wide identifier that comprises a unique number and their tile identifier. Data is transmitted to a channel-end by an output-instruction; and the other side executes an input-instruction. Data can be passed synchronously or asynchronously between the channel ends. 6.6 xCONNECT Switch and Links XMOS devices provide a scalable architecture, where multiple xCORE devices can be connected together to form one system. Each xCORE device has an xCONNECT interconnect that provides a communication infrastructure for all tasks that run on the various xCORE tiles on the system. The interconnect relies on a collection of switches and XMOS links. Each xCORE device has an on-chip switch that can set up circuits or route data. The switches are connected by xConnect Links. An XMOS link provides a physical connection between two switches. The switch has a routing algorithm that supports many different topologies, including lines, meshes, trees, and hypercubes. The links operate in either 2 wires per direction or 5 wires per direction mode, depending on the amount of bandwidth required. Circuit switched, streaming X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 17 xCONNECT Link to another device switch CORE CORE CORE CORE CORE CORE CORE CORE CORE CORE xCONNECT switch CORE CORE Figure 6: Switch, links and channel ends CORE CORE CORE CORE xCORE Tile xCORE Tile and packet switched data can both be supported efficiently. Streams provide the fastest possible data rates between xCORE Tiles (up to 250 MBit/s), but each stream requires a single link to be reserved between switches on two tiles. All packet communications can be multiplexed onto a single link. Information on the supported routing topologies that can be used to connect multiple devices together can be found in the XS1-LF Link Performance and Design Guide, X2999. 7 PLL The PLL creates a high-speed clock that is used for the switch, tile, and reference clock. The PLL multiplication value is selected through the two MODE pins, and can be changed by software to speed up the tile or use less power. The MODE pins are set as shown in Figure 7: Figure 7: PLL multiplier values and MODE pins X009607, Oscillator Frequency 3.25-10 MHz 9-25 MHz 25-50 MHz 50-100 MHz MODE 1 0 0 0 1 1 1 0 0 1 Tile Frequency 130-400 MHz 144-400 MHz 167-400 MHz 196-400 MHz PLL Ratio 40 16 8 4 PLL settings OD F R 1 159 0 1 63 0 1 31 0 1 15 0 XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 18 Figure 7 also lists the values of OD, F and R, which are the registers that define the ratio of the tile frequency to the oscillator frequency: Fcor e = Fosc × F +1 1 1 × × 2 R+1 OD + 1 OD, F and R must be chosen so that 0 ≤ R ≤ 63, 0 ≤ F ≤ 4095, 0 ≤ OD ≤ 7, and F +1 1 260MHz ≤ Fosc × 2 × R+1 ≤ 1.3GHz. The OD, F , and R values can be modified by writing to the digital node PLL configuration register. The MODE pins must be held at a static value during and after deassertion of the system reset. If a different tile frequency is required (eg, 500 MHz), then the PLL must be reprogrammed after boot to provide the required tile frequency. The XMOS tools perform this operation by default. Further details on configuring the clock can be found in the xCORE-200 Clock Frequency Control document. 8 Boot Procedure The device is kept in reset by driving RST_N low. When in reset, all GPIO pins have a pull-down enabled. The processor must be held in reset until VDDIOL is in spec for at least 1 ms. When the device is taken out of reset by releasing RST_N the processor starts its internal reset process. After 15-150 µs (depending on the input clock) the processor boots. Pin X2D06 must be pulled high with an external pull-up whilst the chip comes out of reset, to ensure that tile 2 will boot from link. X2D04, X2D05, and X2D07 should be kept low whilst the chip comes out of reset. The device boots from a QSPI flash (IS25LQ016B) that is embedded in the device. The QSPI flash is connected to the ports on Tile 0 as shown in Figure 8. An external 1K resistor must connect X0D01 to VDDIOL. X0D10 should ideally not be connected. If X0D10 is connected, then a 150 ohm series resistor close to the device is recommended. X0D04..X0D07 should be not connected. VDDIOL Figure 8: QSPI port connectivity X0D04..7 X0D01 X0D10 PORT_4B PORT_1B PORT_1C CS_N CLK D[0..3] 1K xCORE QSPI Flash The xCORE Tile boot procedure is illustrated in Figure 9. If bit 5 of the security register (see §9.1) is set, the device boots from OTP. Otherwise, the device boots from the internal flash. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 19 Start Boot ROM Primary boot Security Register Bit [5] set No Yes OTP Figure 9: Boot procedure Copy OTP contents to base of SRAM Copy flash contents to base of SRAM Execute program Execute program The boot image has the following format: · A 32-bit program size s in words. · Program consisting of s × 4 bytes. · A 32-bit CRC, or the value 0x0D15AB1E to indicate that no CRC check should be performed. The program size and CRC are stored least significant byte first. The program is loaded into the lowest memory address of RAM, and the program is started from that address. The CRC is calculated over the byte stream represented by the program size and the program itself. The polynomial used is 0xEDB88320 (IEEE 802.3); the CRC register is initialized with 0xFFFFFFFF and the residue is inverted to produce the CRC. 8.1 Security register The security register enables security features on the xCORE tile. The features shown in Figure 10 provide a strong level of protection and are sufficient for providing strong IP security. 9 Memory 9.1 OTP Each xCORE Tile integrates 8 KB one-time programmable (OTP) memory along with a security register that configures system wide security features. The OTP holds data in four sectors each containing 512 rows of 32 bits which can be used to implement secure bootloaders and store encryption keys. Data for the security X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 20 Feature Bit Description Disable JTAG 0 The JTAG interface is disabled, making it impossible for the tile state or memory content to be accessed via the JTAG interface. Disable Link access 1 Other tiles are forbidden access to the processor state via the system switch. Disabling both JTAG and Link access transforms an xCORE Tile into a “secure island” with other tiles free for non-secure user application code. Secure Boot 5 The xCORE Tile is forced to boot from address 0 of the OTP, allowing the xCORE Tile boot ROM to be bypassed (see §8). Redundant rows 7 Enables redundant rows in OTP. Sector Lock 0 8 Disable programming of OTP sector 0. Sector Lock 1 9 Disable programming of OTP sector 1. Sector Lock 2 10 Disable programming of OTP sector 2. Sector Lock 3 11 Disable programming of OTP sector 3. OTP Master Lock 12 Disable OTP programming completely: disables updates to all sectors and security register. Disable JTAG-OTP 13 Disable all (read & write) access from the JTAG interface to this OTP. Disable Global Debug 14 Disables access to the DEBUG_N pin. 21..15 General purpose software accessable security register available to end-users. 31..22 General purpose user programmable JTAG UserID code extension. Figure 10: Security register features register is loaded from the OTP on power up. All additional data in OTP is copied from the OTP to SRAM and executed first on the processor. The OTP memory is programmed using three special I/O ports: the OTP address port is a 16-bit port with resource ID 0x100200, the OTP data is written via a 32-bit port with resource ID 0x200100, and the OTP control is on a 16-bit port with ID 0x100300. Programming is performed through libotp and xburn. 9.2 SRAM Each xCORE Tile integrates a single 256KB SRAM bank for both instructions and data. All internal memory is 32 bits wide, and instructions are either 16-bit or 32-bit. Byte (8-bit), half-word (16-bit) or word (32-bit) accesses are supported and are executed within one tile clock cycle. There is no dedicated external memory interface, although data memory can be expanded through appropriate use of the ports. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 10 21 JTAG The JTAG module can be used for loading programs, boundary scan testing, incircuit source-level debugging and programming the OTP memory. BS TAP TDI TDI CHIP TAP TDO NODE0 TDI BS TAP TDO TDI NODE0 CHIP TAP TDO NODE2 TDI TDO TDO NODE2 TCK TMS Figure 11: JTAG chain structure TRST_N DEBUG_N The JTAG chain structure is illustrated in Figure 11. Directly after reset, two TAP controllers are present in the JTAG chain for each xCORE Tile: the boundary scan TAP and the chip TAP. The boundary scan TAP is a standard 1149.1 compliant TAP that can be used for boundary scan of the I/O pins. The chip TAP provides access into the xCORE Tile, switch and OTP for loading code and debugging. The TRST_N pin must be asserted low during and after power up for 100 ns. If JTAG is not required, the TRST_N pin can be tied to ground to hold the JTAG module in reset. The DEBUG_N pin is used to synchronize the debugging of multiple xCORE Tiles. This pin can operate in both output and input mode. In output mode and when configured to do so, DEBUG_N is driven low by the device when the processor hits a debug break point. Prior to this point the pin will be tri-stated. In input mode and when configured to do so, driving this pin low will put the xCORE Tile into debug mode. Software can set the behavior of the xCORE Tile based on this pin. This pin should have an external pull up of 4K7-47K Ω or left not connected in single core applications. The JTAG device identification register can be read by using the IDCODE instruction. Its contents are specified in Figure 12. Figure 12: IDCODE return value X009607, Bit31 Device Identification Register Version 0 0 0 0 Bit0 Part Number 0 0 0 0 0 0 0 0 0 0 0 0 Manufacturer Identity 0 0 0 0 0 1 1 6 0 0 1 1 6 0 0 0 1 3 1 1 0 0 1 1 3 XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 22 The JTAG usercode register can be read by using the USERCODE instruction. Its contents are specified in Figure 13. The OTP User ID field is read from bits [22:31] of the security register on xCORE Tile 0, see §9.1 (all zero on unprogrammed devices). Figure 13: USERCODE return value 11 Bit31 Usercode Register OTP User ID 0 0 0 0 0 0 0 0 0 Bit0 Unused 0 0 0 0 0 0 0 Silicon Revision 0 1 0 2 1 0 0 8 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Board Integration The device has the following power supply pins: · VDD pins for the xCORE Tile · VDDIO pins for the I/O lines · PLL_AVDD pins for the PLL · OTP_VCC pins for the OTP Several pins of each type are provided to minimize the effect of inductance within the package, all of which must be connected. The power supplies must be brought up monotonically and input voltages must not exceed specification at any time. The VDD supply must ramp from 0 V to its final value within 10 ms to ensure correct startup. The VDDIO and OTP_VCC supply must ramp to its final value before VDD reaches 0.4 V. The PLL_AVDD supply should be separated from the other noisier supplies on the board. The PLL requires a very clean power supply, and a low pass filter (for example, a 2.2 Ω resistor and 100 nF multi-layer ceramic capacitor) is recommended on this pin. The following ground pins are provided: · PLL_AGND for PLL_AVDD · GND for all other supplies All ground pins must be connected directly to the board ground. The VDD and VDDIO supplies should be decoupled close to the chip by several 100 nF low inductance multi-layer ceramic capacitors between the supplies and GND (for example, 100nF 0402 for every other supply pin). The ground side of the decoupling capacitors should have as short a path back to the GND pins as possible. A bulk decoupling capacitor of at least 10 uF should be placed on each of these supplies. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 23 RST_N is an active-low asynchronous-assertion global reset signal. Following a reset, the PLL re-establishes lock after which the device boots up according to the boot mode (see §8). RST_N and must be asserted low during and after power up for 100 ns. 11.1 Land patterns and solder stencils The package is a 374 ball Fine Ball Grid Array (FBGA) on a 0.8 mm pitch. The land patterns and solder stencils will depend on the PCB manufacturing process. We recommend you design them with using the IPC specifications “Generic Requirements for Surface Mount Design and Land Pattern Standards” IPC-7351B. This standard aims to achieve desired targets of heel, toe and side fillets for solder-joints. The mechanical drawings in Section 13 specify the dimensions and tolerances. 11.2 Ground and Thermal Vias Vias next to each ground ball into the ground plane of the PCB are recommended for a low inductance ground connection and good thermal performance. 11.3 Moisture Sensitivity XMOS devices are, like all semiconductor devices, susceptible to moisture absorption. When removed from the sealed packaging, the devices slowly absorb moisture from the surrounding environment. If the level of moisture present in the device is too high during reflow, damage can occur due to the increased internal vapour pressure of moisture. Example damage can include bond wire damage, die lifting, internal or external package cracks and/or delamination. All XMOS devices are Moisture Sensitivity Level (MSL) 3 - devices have a shelf life of 168 hours between removal from the packaging and reflow, provided they are stored below 30C and 60% RH. If devices have exceeded these values or an included moisture indicator card shows excessive levels of moisture, then the parts should be baked as appropriate before use. This is based on information from Joint IPC/JEDEC Standard For Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface-Mount Devices J-STD-020 Revision D. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 12 24 DC and Switching Characteristics 12.1 Operating Conditions Symbol Parameter MIN TYP MAX UNITS VDD Tile DC supply voltage 0.95 1.00 1.05 V VDDIO I/O supply voltage 2.30 3.30 3.60 V VDDIOT_0 I/O supply voltage 2.25 3.30 3.60 V VDDIOT_1 I/O supply voltage 2.25 3.30 3.60 V USB_VDD USB tile DC supply voltage 0.95 1.00 1.05 V VDD33 Peripheral supply 3.135 3.30 3.465 V PLL_AVDD PLL analog supply 0.95 1.00 1.05 V Cl xCORE Tile I/O load capacitance Ambient operating temperature (Commercial) Ta Figure 14: Operating conditions Ambient operating temperature (Industrial) Tj Junction temperature Tstg Storage temperature 12.2 Figure 15: DC characteristics 25 pF 0 70 °C -40 85 °C 125 °C -65 150 °C Notes DC Characteristics, VDDIO=3V3 Symbol Parameter MIN MAX UNITS Notes V(IH) Input high voltage 2.00 TYP 3.60 V A V(IL) Input low voltage -0.30 0.70 V A V(OH) Output high voltage V B, C V(OL) Output low voltage V B, C I(PU) Internal pull-up current (Vin=0V) µA D I(PD) Internal pull-down current (Vin=3.3V) 100 µA D I(LC) Input leakage current 10 µA 2.20 0.40 -100 -10 A All pins except power supply pins. B Pins X1D40, X1D41, X1D42, X1D43, X1D26, X1D27, X3D40, X3D41, X3D42, X3D43, X3D26, and X3D27 are nominal 8 mA drivers, the remainder of the general-purpose I/Os are 4 mA. C Measured with 4 mA drivers sourcing 4 mA, 8 mA drivers sourcing 8 mA. D Used to guarantee logic state for an I/O when high impedance. The internal pull-ups/pull-downs should not be used to pull external circuitry. In order to pull the pin to the opposite state, a 4K7 resistor is recommended to overome the internal pull current. X009607, XS2-LF24A-1024-FB374 25 3.0 3.0 2.0 2.0 1.0 1.0 0.0 0 20 40 60 80 100 -100 -80 I(PD) current, uA 12.3 Figure 17: ESD stress voltage Figure 18: Reset timing -40 -20 0 0.0 I(PU) current, uA ESD Stress Voltage Symbol Parameter HBM Human body model CDM Charged Device Model 12.4 -60 IO Pin Voltage, V Figure 16: Typical internal pull-down and pull-up currents IO Pin Voltage, V XLF224-1024-FB374 Datasheet MAX UNITS -2.00 MIN TYP 2.00 KV -500 500 Notes V Reset Timing Symbol Parameters MIN T(RST) Reset pulse width 5 T(INIT) Initialization time TYP MAX UNITS Notes µs 150 µs A A Shows the time taken to start booting after RST_N has gone high. 12.5 Figure 19: xCORE Tile currents Power Consumption Symbol Parameter UNITS Notes I(DDCQ) Quiescent VDD current MIN TYP 45 MAX mA A, B, C PD Tile power dissipation 325 µW/MIPS A, D, E, F IDD Active VDD current 1140 1400 mA A, G I(ADDPLL) PLL_AVDD current 5 mA H 7 A B C D E F G Use for budgetary purposes only. Assumes typical tile and I/O voltages with no switching activity. Includes PLL current. Assumes typical tile and I/O voltages with nominal switching activity. Assumes 1 MHz = 1 MIPS. PD(TYP) value is the usage power consumption under typical operating conditions. Measurement conditions: VDD = 1.0 V, VDDIO = 3.3 V, 25 °C, 500 MHz, average device resource usage. H PLL_AVDD = 1.0 V The tile power consumption of the device is highly application dependent and should be used for budgetary purposes only. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 26 More detailed power analysis can be found in the XS1-LF Power Consumption document, 12.6 Figure 20: Clock Clock Symbol Parameter MIN TYP MAX UNITS f Frequency 3.25 25 100 MHz Notes SR Slew rate 0.10 TJ(LT) Long term jitter (pk-pk) 2 % A f(MAX) Processor clock frequency 500 MHz B V/ns A Percentage of CLK period. B Assumes typical tile and I/O voltages with nominal activity. Further details can be found in the XS1-LF Clock Frequency Control document, 12.7 Figure 21: I/O AC characteristics xCORE Tile I/O AC Characteristics Symbol Parameter MIN TYP MAX UNITS T(XOVALID) Input data valid window 8 T(XOINVALID) Output data invalid window 9 T(XIFMAX) Rate at which data can be sampled with respect to an external clock Notes ns ns 60 MHz The input valid window parameter relates to the capability of the device to capture data input to the chip with respect to an external clock source. It is calculated as the sum of the input setup time and input hold time with respect to the external clock as measured at the pins. The output invalid window specifies the time for which an output is invalid with respect to the external clock. Note that these parameters are specified as a window rather than absolute numbers since the device provides functionality to delay the incoming clock with respect to the incoming data. Information on interfacing to high-speed synchronous interfaces can be found in the XS1 Port I/O Timing document, X5821. 12.8 Figure 22: Link performance xConnect Link Performance Symbol Parameter MAX UNITS Notes B(2blinkP) 2b link bandwidth (packetized) MIN TYP 87 MBit/s A, B B(5blinkP) 5b link bandwidth (packetized) 217 MBit/s A, B B(2blinkS) 2b link bandwidth (streaming) 100 MBit/s B B(5blinkS) 5b link bandwidth (streaming) 250 MBit/s B A Assumes 32-byte packet in 3-byte header mode. Actual performance depends on size of the header and payload. B 7.5 ns symbol time. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 27 The asynchronous nature of links means that the relative phasing of CLK clocks is not important in a multi-clock system, providing each meets the required stability criteria. 12.9 Figure 23: JTAG timing JTAG Timing Symbol Parameter f(TCK_D) TCK frequency (debug) MIN TYP MAX UNITS 18 MHz 10 MHz f(TCK_B) TCK frequency (boundary scan) T(SETUP) TDO to TCK setup time 5 ns A T(HOLD) TDO to TCK hold time 5 ns A T(DELAY) TCK to output delay ns B 15 Notes A Timing applies to TMS and TDI inputs. B Timing applies to TDO output from negative edge of TCK. All JTAG operations are synchronous to TCK apart from the global asynchronous reset TRST_N. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 13 28 Package Information X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 13.1 Part Marking FXCCRNTMM MCYYWWXX Figure 24: Part marking scheme 14 29 LLLLLL.LL F - Product family X - Reserved CC - Number of logical cores R - RAM [in log2(kbytes)] N - Flash size [in log2(Mbytes)+1] T - Temperature grade MM - Speed grade MC - Manufacturer YYWW - Date XX - Reserved Wafer lot code Ordering Information Figure 25: Orderable part numbers X009607, Product Code XLF224-1024-FB374-C40 XLF224-1024-FB374-I40 Marking L124A2C40 L124A2I40 Qualification Commercial Industrial Speed Grade 2000 MIPS 2000 MIPS XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 30 Appendices A Configuration of the XLF224-1024-FB374 The device is configured through banks of registers, as shown in Figure 26. xTIME scheduler Hardware response ports PLL JTAG xTIME scheduler Hardware response ports OTP SRAM OTP xCORE logical core SRAM OTP SRAM Figure 26: Registers X0Dxx I/O pins xTIME scheduler Hardware response ports PLL JTAG xCORE logical core Tile configuration xCORE logical core Tile configuration Processor status xCORE logical core xCONNECT Switch Node configuration Node 0 xCORE logical core xCORE logical core xCORE logical core xCORE logical core OTP xCORE logical core xCORE logical core xCORE logical core Link 0 Link 1 Link 2 Link 3 SRAM xCORE logical core Link 7 Link 6 Link 5 Link 4 xCORE logical core xCORE logical core Processor status xCORE logical core Tile configuration xCORE logical core Tile configuration Processor status xCORE logical core xCORE logical core xCONNECT Switch Node configuration Node 2 xCORE logical core xCORE logical core X2Dxx I/O pins xCORE logical core Processor status X3Dxx I/O pins xCORE logical core FLASH xCORE logical core xCORE logical core xTIME scheduler X1Dxx I/O pins Hardware response ports The following communication sequences specify how to access those registers. Any messages transmitted contain the most significant 24 bits of the channel-end to which a response is to be sent. This comprises the node-identifier and the channel number within the node. if no response is required on a write operation, supply 24-bits with the last 8-bits set, which suppresses the reply message. Any multi-byte data is sent most significant byte first. A.1 Accessing a processor status register The processor status registers are accessed directly from the processor instruction set. The instructions GETPS and SETPS read and write a word. The register number should be translated into a processor-status resource identifier by shifting the register number left 8 places, and ORing it with 0x0B. Alternatively, the functions getps(reg) and setps(reg,value) can be used from XC. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet A.2 31 Accessing an xCORE Tile configuration register xCORE Tile configuration registers can be accessed through the interconnect using the functions write_tile_config_reg(tileref, ...) and read_tile_config_reg(tile > ref, ...), where tileref is the name of the xCORE Tile, e.g. tile[1]. These functions implement the protocols described below. Instead of using the functions above, a channel-end can be allocated to communicate with the xCORE tile configuration registers. The destination of the channel-end should be set to 0xnnnnC20C where nnnnnn is the tile-identifier. A write message comprises the following: control-token 24-bit response 16-bit 32-bit control-token 192 channel-end identifier register number data 1 The response to a write message comprises either control tokens 3 and 1 (for success), or control tokens 4 and 1 (for failure). A read message comprises the following: control-token 24-bit response 16-bit control-token 193 channel-end identifier register number 1 The response to the read message comprises either control token 3, 32-bit of data, and control-token 1 (for success), or control tokens 4 and 1 (for failure). A.3 Accessing node configuration Node configuration registers can be accessed through the interconnect using the functions write_node_config_reg(device, ...) and read_node_config_reg(device, > ...), where device is the name of the node. These functions implement the protocols described below. Instead of using the functions above, a channel-end can be allocated to communicate with the node configuration registers. The destination of the channel-end should be set to 0xnnnnC30C where nnnn is the node-identifier. A write message comprises the following: control-token 24-bit response 16-bit 32-bit control-token 192 channel-end identifier register number data 1 The response to a write message comprises either control tokens 3 and 1 (for success), or control tokens 4 and 1 (for failure). A read message comprises the following: control-token 24-bit response 16-bit control-token 193 channel-end identifier register number 1 The response to a read message comprises either control token 3, 32-bit of data, and control-token 1 (for success), or control tokens 4 and 1 (for failure). X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet B 32 Processor Status Configuration The processor status control registers can be accessed directly by the processor using processor status reads and writes (use getps(reg) and setps(reg,value) for reads and writes). Number Figure 27: Summary X009607, Perm Description 0x00 RW RAM base address 0x01 RW Vector base address 0x02 RW xCORE Tile control 0x03 RO xCORE Tile boot status 0x05 RW Security configuration 0x06 RW Ring Oscillator Control 0x07 RO Ring Oscillator Value 0x08 RO Ring Oscillator Value 0x09 RO Ring Oscillator Value 0x0A RO Ring Oscillator Value 0x0C RO RAM size 0x10 DRW Debug SSR 0x11 DRW Debug SPC 0x12 DRW Debug SSP 0x13 DRW DGETREG operand 1 0x14 DRW DGETREG operand 2 0x15 DRW Debug interrupt type 0x16 DRW Debug interrupt data 0x18 DRW Debug core control 0x20 .. 0x27 DRW Debug scratch 0x30 .. 0x33 DRW Instruction breakpoint address 0x40 .. 0x43 DRW Instruction breakpoint control 0x50 .. 0x53 DRW Data watchpoint address 1 0x60 .. 0x63 DRW Data watchpoint address 2 0x70 .. 0x73 DRW Data breakpoint control register 0x80 .. 0x83 DRW Resources breakpoint mask 0x90 .. 0x93 DRW Resources breakpoint value 0x9C .. 0x9F DRW Resources breakpoint control register XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet B.1 33 RAM base address: 0x00 This register contains the base address of the RAM. It is initialized to 0x00040000. 0x00: RAM base address Bits Perm 31:2 RW 1:0 RO B.2 Init Description Most significant 16 bits of all addresses. - Reserved Vector base address: 0x01 Base address of event vectors in each resource. On an interrupt or event, the 16 most significant bits of the destination address are provided by this register; the least significant 16 bits come from the event vector. 0x01: Vector base address Bits Perm 31:18 RW 17:0 RO B.3 Init Description The event and interrupt vectors. - Reserved xCORE Tile control: 0x02 Register to control features in the xCORE tile Bits 0x02: xCORE Tile control X009607, Perm Init Description 31:26 RO - Reserved 25:18 RW 0 RGMII TX data delay value (in PLL output cycle increments) 17:9 RW 0 RGMII TX clock divider value. TX clk rises when counter (clocked by PLL output) reaches this value and falls when counter reaches (value»1). Value programmed into this field should be actual divide value required minus 1 8 RW 0 Enable RGMII interface periph ports 7:6 RO - 5 RW 0 Reserved Select the dynamic mode (1) for the clock divider when the clock divider is enabled. In dynamic mode the clock divider is only activated when all active threads are paused. In static mode the clock divider is always enabled. 4 RW 0 Enable the clock divider. This divides the output of the PLL to facilitate one of the low power modes. 3:0 RO - Reserved XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet B.4 34 xCORE Tile boot status: 0x03 This read-only register describes the boot status of the xCORE tile. Bits Perm Init RO 23:16 RO 15:9 RO 8 RO 7:6 RO 5 RO Indicates if core1 has been powered off 4 RO Cause the ROM to not poll the OTP for correct read levels 3 RO Boot ROM boots from RAM 2 RO Boot ROM boots from JTAG 1:0 RO The boot PLL mode pin value. 0x03: xCORE Tile boot status B.5 - Description 31:24 Reserved Processor number. - Reserved Overwrite BOOT_MODE. - Reserved Security configuration: 0x05 Copy of the security register as read from OTP. Bits 0x05: Security configuration X009607, Perm 31 RW 30:15 RO 14 RW Init Description Disables write permission on this register - Reserved Disable access to XCore’s global debug 13 RO 12 RW lock all OTP sectors 11:8 RW lock bit for each OTP sector 7 RW 6 RO 5 RW 4 RW 3:1 RO 0 RW - Reserved Enable OTP reduanacy - Reserved Override boot mode and read boot image from OTP Disable JTAG access to the PLL/BOOT configuration registers - Reserved Disable access to XCore’s JTAG debug TAP XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet B.6 35 Ring Oscillator Control: 0x06 There are four free-running oscillators that clock four counters. The oscillators can be started and stopped using this register. The counters should only be read when the ring oscillator has been stopped for at least 10 core clock cycles (this can be achieved by inserting two nop instructions between the SETPS and GETPS). The counter values can be read using four subsequent registers. The ring oscillators are asynchronous to the xCORE tile clock and can be used as a source of random bits. 0x06: Ring Oscillator Control Bits Perm 31:2 RO - 1 RW 0 Core ring oscillator enable. 0 RW 0 Peripheral ring oscillator enable. B.7 Init Description Reserved Ring Oscillator Value: 0x07 This register contains the current count of the xCORE Tile Cell ring oscillator. This value is not reset on a system reset. 0x07: Ring Oscillator Value Bits Perm Init 31:16 RO - 15:0 RO 0 B.8 Description Reserved Ring oscillator Counter data. Ring Oscillator Value: 0x08 This register contains the current count of the xCORE Tile Wire ring oscillator. This value is not reset on a system reset. 0x08: Ring Oscillator Value Bits Perm Init 31:16 RO - 15:0 RO 0 B.9 Description Reserved Ring oscillator Counter data. Ring Oscillator Value: 0x09 This register contains the current count of the Peripheral Cell ring oscillator. This value is not reset on a system reset. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 0x09: Ring Oscillator Value Bits Perm 36 Init 31:16 RO - 15:0 RO 0 B.10 Description Reserved Ring oscillator Counter data. Ring Oscillator Value: 0x0A This register contains the current count of the Peripheral Wire ring oscillator. This value is not reset on a system reset. 0x0A: Ring Oscillator Value Bits Perm Init 31:16 RO - 15:0 RO 0 B.11 Description Reserved Ring oscillator Counter data. RAM size: 0x0C The size of the RAM in bytes 0x0C: RAM size Bits Perm 31:2 RO 1:0 RO B.12 Init Description Most significant 16 bits of all addresses. - Reserved Debug SSR: 0x10 This register contains the value of the SSR register when the debugger was called. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet Bits 31:11 Perm 37 Init RO - Description Reserved 10 DRW Address space indentifier 9 DRW Determines the issue mode (DI bit) upon Kernel Entry after Exception or Interrupt. 8 RO 7 DRW When 1 the thread is in fast mode and will continually issue. 6 DRW When 1 the thread is paused waiting for events, a lock or another resource. 0x10: Debug SSR Determines the issue mode (DI bit). 5 RO 4 DRW - Reserved 1 when in kernel mode. 3 DRW 1 when in an interrupt handler. 2 DRW 1 when in an event enabling sequence. 1 DRW When 1 interrupts are enabled for the thread. 0 DRW When 1 events are enabled for the thread. B.13 Debug SPC: 0x11 This register contains the value of the SPC register when the debugger was called. 0x11: Debug SPC Bits Perm 31:0 DRW B.14 Init Description Value. Debug SSP: 0x12 This register contains the value of the SSP register when the debugger was called. 0x12: Debug SSP Bits Perm 31:0 DRW B.15 Init Description Value. DGETREG operand 1: 0x13 The resource ID of the logical core whose state is to be read. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 0x13: DGETREG operand 1 Bits Perm 31:8 RO 7:0 B.16 38 Init Description - Reserved DRW Thread number to be read DGETREG operand 2: 0x14 Register number to be read by DGETREG 0x14: DGETREG operand 2 Bits Perm 31:5 RO 4:0 B.17 Init Description - Reserved DRW Register number to be read Debug interrupt type: 0x15 Register that specifies what activated the debug interrupt. Bits Perm Init - Description 31:18 RO 17:16 DRW Number of the hardware breakpoint/watchpoint which caused the interrupt (always 0 for =HOST= and =DCALL=). If multiple breakpoints/watchpoints trigger at once, the lowest number is taken. 15:8 DRW Number of thread which caused the debug interrupt (always 0 in the case of =HOST=). 7:3 RO - 2:0 DRW 0 0x15: Debug interrupt type B.18 Reserved Reserved Indicates the cause of the debug interrupt 1: Host initiated a debug interrupt through JTAG 2: Program executed a DCALL instruction 3: Instruction breakpoint 4: Data watch point 5: Resource watch point Debug interrupt data: 0x16 On a data watchpoint, this register contains the effective address of the memory operation that triggered the debugger. On a resource watchpoint, it countains the resource identifier. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 0x16: Debug interrupt data Bits Perm 31:0 DRW B.19 39 Init Description Value. Debug core control: 0x18 This register enables the debugger to temporarily disable logical cores. When returning from the debug interrupts, the cores set in this register will not execute. This enables single stepping to be implemented. 0x18: Debug core control Bits Perm 31:8 RO 7:0 B.20 Init - DRW Description Reserved 1-hot vector defining which threads are stopped when not in debug mode. Every bit which is set prevents the respective thread from running. Debug scratch: 0x20 .. 0x27 A set of registers used by the debug ROM to communicate with an external debugger, for example over JTAG. This is the same set of registers as the Debug Scratch registers in the xCORE tile configuration. 0x20 .. 0x27: Debug scratch Bits Perm 31:0 DRW B.21 Init Description Value. Instruction breakpoint address: 0x30 .. 0x33 This register contains the address of the instruction breakpoint. If the PC matches this address, then a debug interrupt will be taken. There are four instruction breakpoints that are controlled individually. 0x30 .. 0x33: Instruction breakpoint address X009607, Bits Perm 31:0 DRW Init Description Value. XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet B.22 40 Instruction breakpoint control: 0x40 .. 0x43 This register controls which logical cores may take an instruction breakpoint, and under which condition. Bits 0x40 .. 0x43: Instruction breakpoint control Perm Init Description 31:24 RO - 23:16 DRW 0 RO - 1 DRW 0 When 0 break when PC == IBREAK_ADDR. When 1 = break when PC != IBREAK_ADDR. 0 DRW 0 When 1 the instruction breakpoint is enabled. 15:2 B.23 Reserved A bit for each thread in the machine allowing the breakpoint to be enabled individually for each thread. Reserved Data watchpoint address 1: 0x50 .. 0x53 This set of registers contains the first address for the four data watchpoints. 0x50 .. 0x53: Data watchpoint address 1 Bits Perm 31:0 DRW B.24 Init Description Value. Data watchpoint address 2: 0x60 .. 0x63 This set of registers contains the second address for the four data watchpoints. 0x60 .. 0x63: Data watchpoint address 2 Bits Perm 31:0 DRW B.25 Init Description Value. Data breakpoint control register: 0x70 .. 0x73 This set of registers controls each of the four data watchpoints. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet Bits 0x70 .. 0x73: Data breakpoint control register Perm 41 Init 31:24 RO - 23:16 DRW 0 15:3 Description Reserved A bit for each thread in the machine allowing the breakpoint to be enabled individually for each thread. RO - 2 DRW 0 When 1 the breakpoints will be be triggered on loads. 1 DRW 0 Determines the break condition: 0 = A AND B, 1 = A OR B. 0 DRW 0 When 1 the instruction breakpoint is enabled. B.26 Reserved Resources breakpoint mask: 0x80 .. 0x83 This set of registers contains the mask for the four resource watchpoints. 0x80 .. 0x83: Resources breakpoint mask Bits Perm 31:0 DRW B.27 Init Description Value. Resources breakpoint value: 0x90 .. 0x93 This set of registers contains the value for the four resource watchpoints. 0x90 .. 0x93: Resources breakpoint value Bits Perm 31:0 DRW B.28 Init Description Value. Resources breakpoint control register: 0x9C .. 0x9F This set of registers controls each of the four resource watchpoints. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet Bits 0x9C .. 0x9F: Resources breakpoint control register X009607, Perm 42 Init 31:24 RO - 23:16 DRW 0 15:2 Description Reserved A bit for each thread in the machine allowing the breakpoint to be enabled individually for each thread. RO - 1 DRW 0 Reserved When 0 break when condition A is met. When 1 = break when condition B is met. 0 DRW 0 When 1 the instruction breakpoint is enabled. XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet C 43 Tile Configuration The xCORE Tile control registers can be accessed using configuration reads and writes (use write_tile_config_reg(tileref, ...) and read_tile_config_reg(tileref, > ...) for reads and writes). Number Perm Description 0x00 CRO Device identification 0x01 CRO xCORE Tile description 1 0x02 CRO xCORE Tile description 2 0x04 CRW Control PSwitch permissions to debug registers 0x05 CRW Cause debug interrupts 0x06 CRW xCORE Tile clock divider 0x07 CRO Security configuration 0x20 .. 0x27 CRW Debug scratch 0x40 CRO PC of logical core 0 0x41 CRO PC of logical core 1 Figure 28: Summary C.1 0x42 CRO PC of logical core 2 0x43 CRO PC of logical core 3 0x44 CRO PC of logical core 4 0x45 CRO PC of logical core 5 0x46 CRO PC of logical core 6 0x47 CRO PC of logical core 7 0x60 CRO SR of logical core 0 0x61 CRO SR of logical core 1 0x62 CRO SR of logical core 2 0x63 CRO SR of logical core 3 0x64 CRO SR of logical core 4 0x65 CRO SR of logical core 5 0x66 CRO SR of logical core 6 0x67 CRO SR of logical core 7 Device identification: 0x00 This register identifies the xCORE Tile X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 0x00: Device identification 44 Bits Perm 31:24 CRO Processor ID of this XCore. 23:16 CRO Number of the node in which this XCore is located. 15:8 CRO XCore revision. 7:0 CRO XCore version. C.2 Init Description xCORE Tile description 1: 0x01 This register describes the number of logical cores, synchronisers, locks and channel ends available on this xCORE tile. 0x01: xCORE Tile description 1 Bits Perm 31:24 CRO Number of channel ends. 23:16 CRO Number of the locks. 15:8 CRO Number of synchronisers. 7:0 C.3 RO Init - Description Reserved xCORE Tile description 2: 0x02 This register describes the number of timers and clock blocks available on this xCORE tile. Bits 0x02: xCORE Tile description 2 31:16 Perm RO Init - Description Reserved 15:8 CRO Number of clock blocks. 7:0 CRO Number of timers. C.4 Control PSwitch permissions to debug registers: 0x04 This register can be used to control whether the debug registers (marked with permission CRW) are accessible through the tile configuration registers. When this bit is set, write -access to those registers is disabled, preventing debugging of the xCORE tile over the interconnect. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 0x04: Control PSwitch permissions to debug registers 45 Bits Perm Init 31 CRW 0 RO - CRW 0 30:1 0 C.5 Description When 1 the PSwitch is restricted to RO access to all CRW registers from SSwitch, XCore(PS_DBG_Scratch) and JTAG Reserved When 1 the PSwitch is restricted to RO access to all CRW registers from SSwitch Cause debug interrupts: 0x05 This register can be used to raise a debug interrupt in this xCORE tile. Bits 0x05: Cause debug interrupts Perm 31:2 C.6 Init Description RO - 1 CRW 0 Reserved 1 when the processor is in debug mode. 0 CRW 0 Request a debug interrupt on the processor. xCORE Tile clock divider: 0x06 This register contains the value used to divide the PLL clock to create the xCORE tile clock. The divider is enabled under control of the tile control register 0x06: xCORE Tile clock divider Bits Perm Init 31 CRW 0 30:16 15:0 C.7 RO - CRW 0 Description Clock disable. Writing ’1’ will remove the clock to the tile. Reserved Clock divider. Security configuration: 0x07 Copy of the security register as read from OTP. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet Bits Perm 31 CRO 30:15 46 Init Disables write permission on this register RO 14 CRO 13 RO Description - Reserved Disable access to XCore’s global debug - Reserved 12 CRO lock all OTP sectors 11:8 CRO lock bit for each OTP sector 7 CRO Enable OTP reduanacy 0x07: Security configuration 6 RO 5 CRO Override boot mode and read boot image from OTP 4 CRO Disable JTAG access to the PLL/BOOT configuration registers 3:1 0 C.8 - RO - CRO Reserved Reserved Disable access to XCore’s JTAG debug TAP Debug scratch: 0x20 .. 0x27 A set of registers used by the debug ROM to communicate with an external debugger, for example over the switch. This is the same set of registers as the Debug Scratch registers in the processor status. 0x20 .. 0x27: Debug scratch Bits Perm 31:0 CRW C.9 Init Description Value. PC of logical core 0: 0x40 Value of the PC of logical core 0. 0x40: PC of logical core 0 Bits Perm 31:0 CRO C.10 Init Description Value. PC of logical core 1: 0x41 Value of the PC of logical core 1. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 0x41: PC of logical core 1 Bits Perm 31:0 CRO C.11 Init 47 Description Value. PC of logical core 2: 0x42 Value of the PC of logical core 2. 0x42: PC of logical core 2 Bits Perm 31:0 CRO C.12 Init Description Value. PC of logical core 3: 0x43 Value of the PC of logical core 3. 0x43: PC of logical core 3 Bits Perm 31:0 CRO C.13 Init Description Value. PC of logical core 4: 0x44 Value of the PC of logical core 4. 0x44: PC of logical core 4 Bits Perm 31:0 CRO C.14 Init Description Value. PC of logical core 5: 0x45 Value of the PC of logical core 5. 0x45: PC of logical core 5 X009607, Bits Perm 31:0 CRO Init Description Value. XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet C.15 48 PC of logical core 6: 0x46 Value of the PC of logical core 6. 0x46: PC of logical core 6 Bits Perm 31:0 CRO C.16 Init Description Value. PC of logical core 7: 0x47 Value of the PC of logical core 7. 0x47: PC of logical core 7 Bits Perm 31:0 CRO C.17 Init Description Value. SR of logical core 0: 0x60 Value of the SR of logical core 0 0x60: SR of logical core 0 Bits Perm 31:0 CRO C.18 Init Description Value. SR of logical core 1: 0x61 Value of the SR of logical core 1 0x61: SR of logical core 1 Bits Perm 31:0 CRO C.19 Init Description Value. SR of logical core 2: 0x62 Value of the SR of logical core 2 X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 0x62: SR of logical core 2 Bits Perm 31:0 CRO C.20 Init 49 Description Value. SR of logical core 3: 0x63 Value of the SR of logical core 3 0x63: SR of logical core 3 Bits Perm 31:0 CRO C.21 Init Description Value. SR of logical core 4: 0x64 Value of the SR of logical core 4 0x64: SR of logical core 4 Bits Perm 31:0 CRO C.22 Init Description Value. SR of logical core 5: 0x65 Value of the SR of logical core 5 0x65: SR of logical core 5 Bits Perm 31:0 CRO C.23 Init Description Value. SR of logical core 6: 0x66 Value of the SR of logical core 6 0x66: SR of logical core 6 X009607, Bits Perm 31:0 CRO Init Description Value. XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet C.24 50 SR of logical core 7: 0x67 Value of the SR of logical core 7 0x67: SR of logical core 7 X009607, Bits Perm 31:0 CRO Init Description Value. XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet D 51 Node Configuration The digital node control registers can be accessed using configuration reads and writes (use write_node_config_reg(device, ...) and read_node_config_reg(device, > ...) for reads and writes). Number 0x00 Figure 29: Summary Perm Description RO Device identification 0x01 RO System switch description 0x04 RW Switch configuration 0x05 RW Switch node identifier 0x06 RW PLL settings 0x07 RW System switch clock divider 0x08 RW Reference clock 0x09 R System JTAG device ID register 0x0A R System USERCODE register 0x0C RW Directions 0-7 0x0D RW Directions 8-15 0x10 RW DEBUG_N configuration, tile 0 0x11 RW DEBUG_N configuration, tile 1 0x1F RO Debug source 0x20 .. 0x28 RW Link status, direction, and network 0x40 .. 0x47 RO PLink status and network 0x80 .. 0x88 RW Link configuration and initialization 0xA0 .. 0xA7 RW Static link configuration D.1 Device identification: 0x00 This register contains version and revision identifiers and the mode-pins as sampled at boot-time. Bits 0x00: Device identification X009607, Perm Init - Description 31:24 RO 23:16 RO Reserved Sampled values of BootCtl pins on Power On Reset. 15:8 RO SSwitch revision. 7:0 RO SSwitch version. XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet D.2 52 System switch description: 0x01 This register specifies the number of processors and links that are connected to this switch. Bits 0x01: System switch description Perm Init RO 23:16 RO Number of SLinks on the SSwitch. 15:8 RO Number of processors on the SSwitch. 7:0 RO Number of processors on the device. D.3 - Description 31:24 Reserved Switch configuration: 0x04 This register enables the setting of two security modes (that disable updates to the PLL or any other registers) and the header-mode. Bits Perm 31 0x04: Switch configuration RW Init 0 30:9 RO - 8 RW 0 7:1 RO - 0 RW 0 D.4 Description 0 = SSCTL registers have write access. 1 = SSCTL registers can not be written to. Reserved 0 = PLL_CTL_REG has write access. 1 = PLL_CTL_REG can not be written to. Reserved 0 = 2-byte headers, 1 = 1-byte headers (reset as 0). Switch node identifier: 0x05 This register contains the node identifier. 0x05: Switch node identifier Bits Perm Init 31:16 RO - 15:0 RW 0 D.5 Description Reserved The unique ID of this node. PLL settings: 0x06 An on-chip PLL multiplies the input clock up to a higher frequency clock, used to clock the I/O, processor, and switch, see Oscillator. Note: a write to this register will cause the tile to be reset. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet Bits Perm 53 Init Description 31 RW If set to 1, the chip will not be reset 30 RW If set to 1, the chip will not wait for the PLL to re-lock. Only use this if a gradual change is made to the PLL 29 DW If set to 1, set the PLL to be bypassed 28 DW If set to 1, set the boot mode to boot from JTAG 27:26 RO 25:23 RW 22:21 RO 20:8 RW 7 RO 6:0 RW 0x06: PLL settings D.6 - Reserved Output divider value range from 1 (8’h0) to 250 (8’hF9). P value. - Reserved Feedback multiplication ratio, range from 1 (8’h0) to 255 (8’hFE). M value. - Reserved Oscilator input divider value range from 1 (8’h0) to 32 (8’h0F). N value. System switch clock divider: 0x07 Sets the ratio of the PLL clock and the switch clock. 0x07: System switch clock divider Bits Perm Init 31:16 RO - 15:0 RW 0 D.7 Description Reserved SSwitch clock generation Reference clock: 0x08 Sets the ratio of the PLL clock and the reference clock used by the node. 0x08: Reference clock X009607, Bits Perm Init 31:16 RO - 15:0 RW 3 Description Reserved Software ref. clock divider XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet D.8 System JTAG device ID register: 0x09 Bits 0x09: System JTAG device ID register Perm 31:28 RO 27:12 RO 11:1 RO 0 RO D.9 0x0A: System USERCODE register 54 Init Description System USERCODE register: 0x0A Bits Perm Init Description 31:18 RO JTAG USERCODE value programmed into OTP SR 17:0 RO metal fixable ID code D.10 Directions 0-7: 0x0C This register contains eight directions, for packets with a mismatch in bits 7..0 of the node-identifier. The direction in which a packet will be routed is goverened by the most significant mismatching bit. Bits 0x0C: Directions 0-7 Perm Init Description 31:28 RW 0 The direction for packets whose dimension is 7. 27:24 RW 0 The direction for packets whose dimension is 6. 23:20 RW 0 The direction for packets whose dimension is 5. 19:16 RW 0 The direction for packets whose dimension is 4. 15:12 RW 0 The direction for packets whose dimension is 3. 11:8 RW 0 The direction for packets whose dimension is 2. 7:4 RW 0 The direction for packets whose dimension is 1. 3:0 RW 0 The direction for packets whose dimension is 0. D.11 Directions 8-15: 0x0D This register contains eight directions, for packets with a mismatch in bits 15..8 of the node-identifier. The direction in which a packet will be routed is goverened by the most significant mismatching bit. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet Bits 0x0D: Directions 8-15 Perm 55 Init Description 31:28 RW 0 The direction for packets whose dimension is F. 27:24 RW 0 The direction for packets whose dimension is E. 23:20 RW 0 The direction for packets whose dimension is D. 19:16 RW 0 The direction for packets whose dimension is C. 15:12 RW 0 The direction for packets whose dimension is B. 11:8 RW 0 The direction for packets whose dimension is A. 7:4 RW 0 The direction for packets whose dimension is 9. 3:0 RW 0 The direction for packets whose dimension is 8. D.12 DEBUG_N configuration, tile 0: 0x10 Configures the behavior of the DEBUG_N pin. 0x10: DEBUG_N configuration, tile 0 Bits Perm 31:2 RO - 1 RW 0 Set 1 to enable GlobalDebug to generate debug request to XCore. 0 RW 0 Set 1 to enable inDebug bit to drive GlobalDebug. D.13 Init Description Reserved DEBUG_N configuration, tile 1: 0x11 Configures the behavior of the DEBUG_N pin. 0x11: DEBUG_N configuration, tile 1 Bits Perm 31:2 RO - 1 RW 0 Set 1 to enable GlobalDebug to generate debug request to XCore. 0 RW 0 Set 1 to enable inDebug bit to drive GlobalDebug. D.14 Init Description Reserved Debug source: 0x1F Contains the source of the most recent debug event. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 0x1F: Debug source Bits Perm 31:5 RO 56 Init Description - Reserved 4 RW 3:2 RO 1 RW If set, XCore1 is the source of last GlobalDebug event. 0 RW If set, XCore0 is the source of last GlobalDebug event. D.15 If set, external pin, is the source of last GlobalDebug event. - Reserved Link status, direction, and network: 0x20 .. 0x28 These registers contain status information for low level debugging (read-only), the network number that each link belongs to, and the direction that each link is part of. The registers control links 0..7. Bits Perm Init RO 25:24 RO Identify the SRC_TARGET type 0 - SLink, 1 - PLink, 2 - SSCTL, 3 Undefine. 23:16 RO When the link is in use, this is the destination link number to which all packets are sent. 15:12 RO - 11:8 RW 0 7:6 RO - 5:4 RW 0 3 RO - 2 RO 1 when the current packet is considered junk and will be thrown away. 1 RO 1 when the dest side of the link is in use. 0 RO 1 when the source side of the link is in use. 0x20 .. 0x28: Link status, direction, and network D.16 - Description 31:26 Reserved Reserved The direction that this link operates in. Reserved Determines the network to which this link belongs, reset as 0. Reserved PLink status and network: 0x40 .. 0x47 These registers contain status information and the network number that each processor-link belongs to. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet Bits Perm 57 Init - Description 31:26 RO Reserved 25:24 RO Identify the SRC_TARGET type 0 - SLink, 1 - PLink, 2 - SSCTL, 3 Undefine. 23:16 RO When the link is in use, this is the destination link number to which all packets are sent. 15:6 RO - 5:4 RW 0 3 RO - 2 RO 1 when the current packet is considered junk and will be thrown away. 1 RO 1 when the dest side of the link is in use. 0 RO 1 when the source side of the link is in use. 0x40 .. 0x47: PLink status and network D.17 Reserved Determines the network to which this link belongs, reset as 0. Reserved Link configuration and initialization: 0x80 .. 0x88 These registers contain configuration and debugging information specific to external links. The link speed and width can be set, the link can be initialized, and the link status can be monitored. The registers control links 0..7. Bits 0x80 .. 0x88: Link configuration and initialization X009607, Perm Init Description 31 RW Write to this bit with ’1’ will enable the XLink, writing ’0’ will disable it. This bit controls the muxing of ports with overlapping xlinks. 30 RW 0 29:28 RO - 27 RO 26 RO 0 This end of the xlink has issued credit to allow the remote end to transmit 25 RO 0 This end of the xlink has credit to allow it to transmit. 24 WO Clear this end of the xlink’s credit and issue a HELLO token. 23 WO Reset the receiver. The next symbol that is detected will be the first symbol in a token. 0: operate in 2 wire mode; 1: operate in 5 wire mode Reserved Rx buffer overflow or illegal token encoding received. 22 RO - 21:11 RW 0 Reserved Specify min. number of idle system clocks between two continuous symbols witin a transmit token -1. 10:0 RW 0 Specify min. number of idle system clocks between two continuous transmit tokens -1. XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet D.18 58 Static link configuration: 0xA0 .. 0xA7 These registers are used for static (ie, non-routed) links. When a link is made static, all traffic is forwarded to the designated channel end and no routing is attempted. The registers control links C, D, A, B, G, H, E, and F in that order. Bits 0xA0 .. 0xA7: Static link configuration X009607, Perm Init 31 RW 0 30:9 RO - 8 RW 0 7:5 RO - 4:0 RW 0 Description Enable static forwarding. Reserved The destination processor on this node that packets received in static mode are forwarded to. Reserved The destination channel end on this node that packets received in static mode are forwarded to. XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet E 59 JTAG, xSCOPE and Debugging If you intend to design a board that can be used with the XMOS toolchain and xTAG debugger, you will need an xSYS header on your board. Figure 30 shows a decision diagram which explains what type of xSYS connectivity you need. The three subsections below explain the options in detail. YES YES Is xSCOPE required YES Figure 30: Decision diagram for the xSYS header Use full xSYS header See section 3 E.1 Is debugging required? NO Is fast printf required ? NO YES Does the SPI flash need to be programmed? NO NO Use JTAG xSYS header See section 2 No xSYS header required See section 1 No xSYS header The use of an xSYS header is optional, and may not be required for volume production designs. However, the XMOS toolchain expects the xSYS header; if you do not have an xSYS header then you must provide your own method for writing to flash/OTP and for debugging. E.2 JTAG-only xSYS header The xSYS header connects to an xTAG debugger, which has a 20-pin 0.1" female IDC header. The design will hence need a male IDC header. We advise to use a boxed header to guard against incorrect plug-ins. If you use a 90 degree angled header, make sure that pins 2, 4, 6, ..., 20 are along the edge of the PCB. Connect pins 4, 8, 12, 16, 20 of the xSYS header to ground, and then connect: · TDI to pin 5 of the xSYS header · TMS to pin 7 of the xSYS header · TCK to pin 9 of the xSYS header · DEBUG_N to pin 11 of the xSYS header X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet 60 · TDO to pin 13 of the xSYS header The RST_N net should be open-drain, active-low, and have a pull-up to VDDIO. E.3 Full xSYS header For a full xSYS header you will need to connect the pins as discussed in Section E.2, and then connect a 2-wire xCONNECT Link to the xSYS header. The links can be found in the Signal description table (Section 4): they are labelled XL0, XL1, etc in the function column. The 2-wire link comprises two inputs and outputs, labelled 0 0 1 1 out , out , in , and in . For example, if you choose to use XL0 for xSCOPE I/O, you need to connect up XL01out , XL00out , XL00in , XL01in as follows: · XL01out (X0D43) to pin 6 of the xSYS header with a 33R series resistor close to the device. · XL00out (X0D42) to pin 10 of the xSYS header with a 33R series resistor close to the device. · XL00in (X0D41) to pin 14 of the xSYS header. · XL01in (X0D40) to pin 18 of the xSYS header. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet F 61 Schematics Design Check List This section is a checklist for use by schematics designers using the XLF224-1024-FB374. Each of the following sections contains items to check for each design. F.1 Power supplies VDDIO and OTP_VCC supply is within specification before the VDD (core) supply is turned on. Specifically, the VDDIO and OTP_VCC supply is within specification before VDD (core) reaches 0.4V (Section 11). The VDD (core) supply ramps monotonically (rises constantly) from 0V to its final value (0.95V - 1.05V) within 10ms (Section 11). The VDD (core) supply is capable of supplying 1400 mA (Section 11 and Figure 15). PLL_AVDD is filtered with a low pass filter, for example an RC filter, . see Section 11 F.2 Power supply decoupling The design has multiple decoupling capacitors per supply, for example at least four0402 or 0603 size surface mount capacitors of 100nF in value, per supply (Section 11). A bulk decoupling capacitor of at least 10uF is placed on each supply (Section 11). F.3 Power on reset The RST_N and TRST_N pins are asserted (low) during or after power up. The device is not used until these resets have taken place. F.4 Clock The CLK input pin is supplied with a clock with monotonic rising edges and low jitter. Pins MODE0 and MODE1 are set to the correct value for the chosen oscillator frequency. The MODE settings are shown in the Oscillator section, Section 7. If you have a choice between two values, choose the value with the highest multiplier ratio since that will boot faster. X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet F.5 62 Boot X0D01 has a 1K pull-up to VDDIO (Section 8). The device is kept in reset for at least 1 ms after VDDIO has reached its minimum level (Section 8). F.6 JTAG, XScope, and debugging You have decided as to whether you need an XSYS header or not (Section E) If you have not included an XSYS header, you have devised a method to program the SPI-flash or OTP (Section E). F.7 GPIO You have not mapped both inputs and outputs to the same multi-bit port. Pins X0D04, X0D05, X0D06, and X0D07 are output only and are, during and after reset, pulled low or not connected (Section 8) Pins X2D04, X2D05, X2D06 and X2D07 are output only and during and after reset, X2D06 is pulled high and X2D04, X2D05, and X2D07 are pulled low (Section 8) F.8 Multi device designs Skip this section if your design only includes a single XMOS device. One device is connected to a QSPI or SPI flash for booting. Devices that boot from link have, for example, X0D06 pulled high and have link XL0 connected to a device to boot from (Section 8). X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet G 63 PCB Layout Design Check List This section is a checklist for use by PCB designers using the XS2LF24A-1024-FB374. Each of the following sections contains items to check for each design. G.1 Ground Plane Each ground ball has a via to minimize impedance and conduct heat away from the device. (Section 11.2) Other than ground vias, there are no (or only a few) vias underneath or closely around the device. This create a good, solid, ground plane. G.2 Power supply decoupling The decoupling capacitors are all placed close to a supply pin (Section 11). The decoupling capacitors are spaced around the device (Section 11). The ground side of each decoupling capacitor has a direct path back to the center ground of the device. G.3 PLL_AVDD The PLL_AVDD filter (especially the capacitor) is placed close to the PLL_AVDD pin (Section 11). X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet H 64 Associated Design Documentation Document Title Information Document Number Estimating Power Consumption For XS1-LF Devices Power consumption X4271 Programming XC on XMOS Devices Timers, ports, clocks, cores and channels X9577 xTIMEcomposer User Guide Compilers, assembler and linker/mapper X3766 Timing analyzer, xScope, debugger Flash and OTP programming utilities I Related Documentation Document Title Information Document Number The XMOS XS1 Architecture ISA manual X7879 XS1 Port I/O Timing Port timings X5821 xCONNECT Architecture Link, switch and system information X4249 XS1-LF Link Performance and Design Guidelines Link timings X2999 XS1-LF Clock Frequency Control Advanced clock control X1433 XS1-L Active Power Conservation Low-power mode during idle X7411 X009607, XS2-LF24A-1024-FB374 XLF224-1024-FB374 Datasheet J 65 Revision History Date Description 2015-03-20 Preliminary release 2015-04-14 Added RST to pins to be pulled hard, and removed reference to TCK from Errata Removed TRST_N references in packages that have no TRST_N New diagram for boot from embedded flash showing ports Pull up requirements for shared clock and external resistor for QSPI 2015-05-06 Removed references to DEBUG_N 2015-07-09 Updated electrical characteristics - Section 12 2015-08-27 Updated part marking and product code - Section 14 2015-11-23 Updated status of X2D04, X2D05, X2D06, X2D07 during boot - Section 8 Updated Schematics Design Checklist: GPIO for X2D04, X2D05, X2D06, X2D07 during boot - Section F 2015-12-18 Clarified connectivity of internal and external xCONNECT links - Sections 3 and 4 Made pin names canonical - Sections 3 and 4 Updated JTAG diagram - Section 10 Removed references to 400MHz parts - Section 12 2016-01-05 Updated signal tables to use VDDIO - Section 4 Updated IDD value - Section 12 Updated land pattern description - Section 11.1 2016-04-20 Typical internal pull-up and pull down current diagrams added - Section 12 Copyright © 2016, All Rights Reserved. Xmos Ltd. is the owner or licensee of this design, code, or Information (collectively, the “Information”) and is providing it to you “AS IS” with no warranty of any kind, express or implied and shall have no liability in relation to its use. Xmos Ltd. makes no representation that the Information, or any particular implementation thereof, is or will be free from any claims of infringement and again, shall have no liability in relation to any such claims. X009607, XS2-LF24A-1024-FB374