AF064GEC5A-2001A3

ATP e.MMC v5.1 Embedded Flash Storage Solution Industrial-Grade Performance, Extreme Endurance & Reliability Key Features The ATP industrial e.MMC is an advanced storage solution that integrates NAND flash memory, a sophisticated flash controller, and a fast MultiMedia Card (MMC) interface in the same package. By incorporating these components in an integrated package, ATP e.MMC manages all background operations internally, freeing the host from handling low-level flash operations for faster and more efficient processing. • AEC-Q100 Grade 2 (-40°C~105°C) Compliant • AEC-Q100 Grade 3 (-40°C~85°C) Compliant • Extra-high endurance: 2-3X higher than standard e.MMC • Native SLC NAND with 60K P/E cycle • Complies with JEDEC e.MMC v5.1 Standard (JESD84-B51) • 153-ball FBGA (RoHS compliant, "green package") • LDPC ECC engine* • Designed with 3D NAND Smaller than a typical postage stamp, ATP e.MMC comes in a 153-ball fine pitch ball grid array (FBGA package). The tiny footprint makes it perfectly suitable for embedded systems with space constraints but require rugged endurance, reliability and durability in harsh environments. ATP e.MMC is built to meet the tough demands of industrial applications. As a soldered-down solution, it is secure against constant vibrations. Its industrial temperature rating means that severe scenarios from freezing cold -40°C to blistering hot 105°C will not cause adverse impact on the device or the data in it. Compliant with the latest JEDEC e.MMC 5.1 Standard (JESD84-B51), ATP e.MMC features Command Queuing and Cache Barrier to enhance random read/write performance; High Speed 400 (HS400) DDR Mode for a bandwidth of up to 400 MB/s; and field firmware update (FFU). Cache Flushing Report ensures the data integrity on cache blocks; Enhanced Strobe in HS400 Mode facilitates faster synchronization between the host and the e.MMC device; and, Secure Write Protection ensures that only trusted entities can protect or unprotect the e.MMC device. It is backward compatible with previous versions (v4.41/v4.5/v5.0), supporting features such as power-off notifications, packed commands, cache, boot or replay protected memory block (RPMB) partitions, high priority interrupt (HPI), and hardware (HW) reset. www.atpinc.com Applications • Surveillance • IoT Gateways / 5G Small Cell • Automation • Test and Measurement • Embedded PCs • Medical • Drones • Transportation • Networking • Mobile/Handheld Computers Specifications e.MMC Product Name Industrial Grade Automotive Grade 3 Automotive Grade 2 Product Line Premium Premium Superior Premium Superior Premium Superior Naming E800Pi E700Pi E600Si E700Pia E600Sia E700Paa E600Saa IC Package 153-ball FBGA JEDEC Specification V4.41 Flash Type Native SLC 3D SLC Mode 3D NAND 3D SLC Mode 3D NAND 3D SLC Mode 3D NAND Density* 1 GB to 2 GB 8 GB to 64 GB 16 GB to 128 GB 8 GB to 64 GB 16 GB to 128 GB 8 GB to 64 GB 16 GB to 128 GB 300 / 170 300 / 240 v5.1, HS400 Bus Speed Modes Performance** x1 / x4 / x8 Seq. Read/Write up to (MB/s) Random Read/Write up to (IOPS) 31 / 23 300 / 240 300 / 240 750 / 1000 -40°C to 85°C (Industrial) Max. TBW** 300 / 170 15K / 30K Operating Temperature Reliability 300 / 170 90 TB -40°C to 85°C (AEC-Q100 Grade 3) 1320 TB 824 TB 1320 TB MTBF @ 25°C -40°C to 105°C (AEC-Q100 Grade 2) 824 TB 1213 TB 309 TB > 2,000,000 Device hours ICC (Typical RMS in Read/Write) mA 93 135 / 155 135 / 180 135 / 155 135 / 180 135 / 155 135 / 180 ICCQ (Typical RMS in Read/Write) mA 69 110 / 95 110 / 100 110 / 95 110 / 100 110 / 95 110 / 100 Dimensions: L x W x H (mm) 11.5 x 13.0 x 1.0 11.5 x 13.0 x 1.3 (max.) *Low-density parity-check error correcting code. By product support. **All performance is collected or measured using ATP proprietary test environment, without file system overhead. Technologies & Add-On Services Product Line Life Monitor Sudden Power-off Recovery (SPOR) Data Path Protection AutoRefresh Vibration-Proof BGA Package Dynamic Data Refresh Industrial Temperature SiP Complete Drive Test (System in Package) Premium ∆ ● ∆ ● ● ● ● ● ● Superior ∆ ● ● ● ● ● ● ● ● ∆: Customization option available on a project basis. To learn more about this product, contact your ATP Representative. ATP Global Footprint ATP TAIWAN(HQ) ATP USA ATP EUROPE ATP JAPAN ATP CHINA TEL: +886-2-2659-6368 FAX: +886-2-2659-4982 sales-apac@atpinc.com TEL: +1-408-732-5000 FAX: +1-408-732-5055 sales@atpinc.com TEL: +49-89-374-9999-0 FAX: +49-89-374-9999-29 sales-europe@atpinc.com TEL: +81-3-6260-0797 FAX: +81-3-6260-0798 sales-japan@atpinc.com TEL: +86-21-5080-2220 FAX: +86-21-9687-0000-026 sales@cn.atpinc.com www.atpinc.com 2001