ATP e.MMC v5.1
Embedded Flash Storage Solution
Industrial-Grade Performance, Extreme Endurance & Reliability
Key Features
The ATP industrial e.MMC is an advanced storage solution that integrates
NAND flash memory, a sophisticated flash controller, and a fast MultiMedia
Card (MMC) interface in the same package. By incorporating these
components in an integrated package, ATP e.MMC manages all background
operations internally, freeing the host from handling low-level flash
operations for faster and more efficient processing.
• AEC-Q100 Grade 2
(-40°C~105°C) Compliant
• AEC-Q100 Grade 3
(-40°C~85°C) Compliant
• Extra-high endurance: 2-3X higher
than standard e.MMC
• Native SLC NAND with 60K P/E cycle
• Complies with JEDEC e.MMC v5.1
Standard (JESD84-B51)
• 153-ball FBGA (RoHS compliant,
"green package")
• LDPC ECC engine*
• Designed with 3D NAND
Smaller than a typical postage stamp, ATP e.MMC comes in a 153-ball fine
pitch ball grid array (FBGA package). The tiny footprint makes it perfectly
suitable for embedded systems with space constraints but require rugged
endurance, reliability and durability in harsh environments.
ATP e.MMC is built to meet the tough demands of industrial applications.
As a soldered-down solution, it is secure against constant vibrations. Its
industrial temperature rating means that severe scenarios from freezing
cold -40°C to blistering hot 105°C will not cause adverse impact on the
device or the data in it.
Compliant with the latest JEDEC e.MMC 5.1 Standard (JESD84-B51), ATP
e.MMC features Command Queuing and Cache Barrier to enhance random
read/write performance; High Speed 400 (HS400) DDR Mode for a
bandwidth of up to 400 MB/s; and field firmware update (FFU). Cache
Flushing Report ensures the data integrity on cache blocks; Enhanced
Strobe in HS400 Mode facilitates faster synchronization between the host
and the e.MMC device; and, Secure Write Protection ensures that only
trusted entities can protect or unprotect the e.MMC device.
It is backward compatible with previous versions (v4.41/v4.5/v5.0),
supporting features such as power-off notifications, packed commands,
cache, boot or replay protected memory block (RPMB) partitions, high
priority interrupt (HPI), and hardware (HW) reset.
www.atpinc.com
Applications
• Surveillance
• IoT Gateways / 5G Small Cell
• Automation
• Test and Measurement
• Embedded PCs
• Medical
• Drones
• Transportation
• Networking
• Mobile/Handheld Computers
Specifications
e.MMC
Product Name
Industrial Grade
Automotive Grade 3
Automotive Grade 2
Product Line
Premium
Premium
Superior
Premium
Superior
Premium
Superior
Naming
E800Pi
E700Pi
E600Si
E700Pia
E600Sia
E700Paa
E600Saa
IC Package
153-ball FBGA
JEDEC Specification
V4.41
Flash Type
Native SLC
3D SLC Mode
3D NAND
3D SLC Mode
3D NAND
3D SLC Mode
3D NAND
Density*
1 GB to 2 GB
8 GB to 64 GB
16 GB to 128 GB
8 GB to 64 GB
16 GB to 128 GB
8 GB to 64 GB
16 GB to 128 GB
300 / 170
300 / 240
v5.1, HS400
Bus Speed Modes
Performance**
x1 / x4 / x8
Seq. Read/Write up
to (MB/s)
Random Read/Write
up to (IOPS)
31 / 23
300 / 240
300 / 240
750 / 1000
-40°C to 85°C (Industrial)
Max. TBW**
300 / 170
15K / 30K
Operating Temperature
Reliability
300 / 170
90 TB
-40°C to 85°C (AEC-Q100 Grade 3)
1320 TB
824 TB
1320 TB
MTBF @ 25°C
-40°C to 105°C (AEC-Q100 Grade 2)
824 TB
1213 TB
309 TB
> 2,000,000 Device hours
ICC (Typical RMS in Read/Write) mA
93
135 / 155
135 / 180
135 / 155
135 / 180
135 / 155
135 / 180
ICCQ (Typical RMS in Read/Write) mA
69
110 / 95
110 / 100
110 / 95
110 / 100
110 / 95
110 / 100
Dimensions: L x W x H (mm)
11.5 x 13.0 x 1.0
11.5 x 13.0 x 1.3 (max.)
*Low-density parity-check error correcting code. By product support.
**All performance is collected or measured using ATP proprietary test environment, without file system overhead.
Technologies &
Add-On Services
Product Line
Life Monitor
Sudden Power-off
Recovery (SPOR)
Data Path
Protection
AutoRefresh
Vibration-Proof
BGA Package
Dynamic Data
Refresh
Industrial
Temperature
SiP
Complete Drive Test
(System in Package)
Premium
∆
●
∆
●
●
●
●
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Superior
∆
●
●
●
●
●
●
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∆: Customization option available on a project basis.
To learn more about this product, contact your ATP Representative.
ATP Global Footprint
ATP TAIWAN(HQ)
ATP USA
ATP EUROPE
ATP JAPAN
ATP CHINA
TEL: +886-2-2659-6368
FAX: +886-2-2659-4982
sales-apac@atpinc.com
TEL: +1-408-732-5000
FAX: +1-408-732-5055
sales@atpinc.com
TEL: +49-89-374-9999-0
FAX: +49-89-374-9999-29
sales-europe@atpinc.com
TEL: +81-3-6260-0797
FAX: +81-3-6260-0798
sales-japan@atpinc.com
TEL: +86-21-5080-2220
FAX: +86-21-9687-0000-026
sales@cn.atpinc.com
www.atpinc.com
2001
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