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S-8213AAE-M6T1U

S-8213AAE-M6T1U

  • 厂商:

    ABLIC(艾普凌科)

  • 封装:

    SOT23-6

  • 描述:

    IC BATT PROT LI-ION 2-3C SOT23-6

  • 数据手册
  • 价格&库存
S-8213AAE-M6T1U 数据手册
S-8213 Series BATTERY PROTECTION IC FOR 2-SERIAL / 3-SERIAL CELL PACK (SECONDARY PROTECTION) N www.ablicinc.com Rev.1.4_01 DE SI G © ABLIC Inc., 2012-2017 The S-8213 Series is used for secondary protection of lithium-ion rechargeable batteries, and incorporates a high-accuracy voltage detection circuit and a delay circuit. Short-circuits between VC3 to VSS accommodate serial connection of two cells or three cells.  Features High-accuracy voltage detection circuit for each cell Overcharge detection voltage n (n = 1 to 3) 4.100 V to 4.500 V (in 50 mV steps) Accuracy: 25 mV (Ta = 25C) Accuracy: 30 mV (Ta = 0C to 60C) Overcharge hysteresis voltage n (n = 1 to 3) 0 V  25 mV, 0.05 V  25 mV, 0.40 V  80 mV Delay times for overcharge detection can be set by an internal circuit only (external capacitors are unnecessary) Output form is selectable: CMOS output, Nch open-drain output Output logic is selectable: Active "H", Active "L" High-withstand voltage: Absolute maximum rating 26 V Wide operation voltage range: 3.6 V to 24 V Wide operation temperature range: Ta = 40C to 85C Low current consumption At VCUn  1.0 V for each cell: 2.0 A max. (Ta = 25C) At 2.0 V for each cell: 0.3 A max. (Ta = 25C) Lead-free (Sn 100%), halogen-free R FO D  DE        NE W   MM EN  Application Lithium-ion rechargeable battery pack (for secondary protection)  Packages RE CO SOT-23-6 SNT-6A NO T   1 BATTERY PROTECTION IC FOR 2-SERIAL / 3-SERIAL CELL PACK (SECONDARY PROTECTION) S-8213 Series Rev.1.4_01  Block Diagram N 1. CMOS output product DE SI G VDD Overcharge detection comparator 1 VC1  W  NE Reference voltage 1 Overcharge detection comparator 2 Oscillator  Control logic   MM EN Reference voltage 3 DE Overcharge detection comparator 3 D Reference voltage 2 VC3 VSS NO T RE CO Remark The diodes in the figure are parasitic diodes. 2 Overcharge detection / release delay circuit FO  R VC2 Figure 1 CO Rev.1.4_01 BATTERY PROTECTION IC FOR 2-SERIAL / 3-SERIAL CELL PACK (SECONDARY PROTECTION) S-8213 Series 2. Nch open-drain output product DE SI G N VDD Overcharge detection comparator 1 VC1   W Reference voltage 1 Oscillator  Control logic MM EN VSS DE Reference voltage 3 D Overcharge detection comparator 3  CO FO Reference voltage 2  Overcharge detection / release delay circuit R  VC3 NE Overcharge detection comparator 2 VC2 Remark The diodes in the figure are parasitic diodes. NO T RE CO Figure 2 3 BATTERY PROTECTION IC FOR 2-SERIAL / 3-SERIAL CELL PACK (SECONDARY PROTECTION) S-8213 Series Rev.1.4_01  Product Name Structure xxx - xxxx U DE SI G S-8213 N 1. Product name Environmental code U: Lead-free (Sn 100%), halogen-free W Package abbreviation and IC packing specifications*1 M6T1: SOT-23-6, Tape I6T1: SNT-6A, Tape NE Serial code*2 Sequentially set from AAA to AAZ R *1. Refer to the tape drawing. *2. Refer to "3. Product name list". 2. Packages SOT-23-6 SNT-6A Dimension Tape Reel Land MP006-A-P-SD PG006-A-P-SD MP006-A-C-SD PG006-A-C-SD MP006-A-R-SD PG006-A-R-SD  PG006-A-L-SD DE 3. Product name list D Package Name FO Table 1 Package Drawing Codes MM EN 3. 1 SNT-6A Table 2 Overcharge Overcharge Overcharge Hysteresis Detection Detection Output Form Output Logic Voltage [VHC] Delay Time [tCU] Voltage [VCU] S-8213AAB-I6T1U 4.300 V 0.40 V 2.0 s CMOS output Active "H" S-8213AAC-I6T1U 4.350 V 0.40 V 2.0 s CMOS output Active "H" S-8213AAD-I6T1U 4.400 V 0.40 V 2.0 s CMOS output Active "H" S-8213AAE-I6T1U 4.450 V 0.40 V 2.0 s CMOS output Active "H" S-8213AAF-I6T1U 4.500 V 0.40 V 2.0 s CMOS output Active "H" S-8213AAG-I6T1U 4.300 V 0.40 V 4.0 s CMOS output Active "H" S-8213AAH-I6T1U 4.350 V 0.40 V 4.0 s CMOS output Active "H" S-8213AAI-I6T1U 4.400 V 0.40 V 4.0 s CMOS output Active "H" S-8213AAJ-I6T1U 4.450 V 0.40 V 4.0 s CMOS output Active "H" S-8213AAK-I6T1U 4.500 V 0.40 V 4.0 s CMOS output Active "H" S-8213AAL-I6T1U 4.300 V 0.40 V 8.0 s CMOS output Active "H" S-8213AAM-I6T1U 4.350 V 0.40 V 8.0 s CMOS output Active "H" S-8213AAN-I6T1U 4.400 V 0.40 V 8.0 s CMOS output Active "H" S-8213AAO-I6T1U 4.450 V 0.40 V 8.0 s CMOS output Active "H" S-8213AAP-I6T1U 4.500 V 0.40 V 8.0 s CMOS output Active "H" S-8213AAQ-I6T1U 4.150 V 0.05 V 2.0 s CMOS output Active "L" S-8213AAR-I6T1U 4.250 V 0.05 V 2.0 s CMOS output Active "L" S-8213AAS-I6T1U 4.150 V 0.05 V 2.0 s Nch open-drain output Active "H" S-8213AAT-I6T1U 4.250 V 0.05 V 2.0 s Nch open-drain output Active "H" Remark Please contact our sales department for the products with detection voltage value other than those specified above. NO T RE CO Product Name 4 BATTERY PROTECTION IC FOR 2-SERIAL / 3-SERIAL CELL PACK (SECONDARY PROTECTION) S-8213 Series Rev.1.4_01  Pin Configurations Table 3 Top view 6 5 4 Symbol 1 VSS 2 VC3 3 VC2 4 5 6 VC1 VDD CO NE Figure 3 W 1 2 3 Description Input pin for negative power supply, connection pin for negative voltage of battery 3 Connection pin for negative voltage of battery 2, connection pin for positive voltage of battery 3 Connection pin for negative voltage of battery 1, connection pin for positive voltage of battery 2 Connection pin for positive voltage of battery 1 Input pin for positive power supply Connection pin of charge control FET gate DE SI G Pin No. N 1. SOT-23-6 Top view Table 4 Description Connection pin of charge control FET gate Input pin for positive power supply Connection pin for positive voltage of battery 1 Connection pin for negative voltage of battery 1, connection pin for positive voltage of battery 2 Connection pin for negative voltage of battery 2, connection pin for positive voltage of battery 3 Input pin for negative power supply, connection pin for negative voltage of battery 3 Figure 4 4 5 VC2 VC3 VSS NO T RE CO MM EN 6 D FO Pin No. Symbol 1 CO 2 VDD 3 VC1 6 5 4 DE 1 2 3 R 2. SNT-6A 5 BATTERY PROTECTION IC FOR 2-SERIAL / 3-SERIAL CELL PACK (SECONDARY PROTECTION) S-8213 Series Rev.1.4_01  Absolute Maximum Ratings Table 5 Storage temperature Tstg N Input voltage between VDD and VSS Input pin voltage CMOS output product CO output pin voltage Nch open-drain output product SOT-23-6 Power dissipation SNT-6A Operation ambient temperature (Ta = 25C unless otherwise specified) Symbol Applied Pin Absolute Maximum Rating Unit VDS VDD VSS  0.3 to VSS  26 V VIN VC1, VC2, VC3 VSS  0.3 to VDD  0.3 V V VSS  0.3 to VDD  0.3 VCO CO VSS  0.3 to VSS  26 V *1 mW 650 PD  *1 400 mW Topr  40 to 85 C  R The absolute maximum ratings are rated values exceeding which the product could suffer physical damage. These values must therefore not be exceeded under any conditions. FO Caution 40 to 125 NE *1. When mounted on board [Mounted board] (1) Board size: 114.3 mm  76.2 mm  t1.6 mm (2) Name: JEDEC STANDARD51-7 W DE SI G Item D SOT-23-6 600 DE SNT-6A 400 MM EN Power Dissipation (PD) [mW] 800 200 0 0 150 100 50 Ambient Temperature (Ta) [C] NO T RE CO Figure 5 Power Dissipation of Package (When Mounted on Board) 6 C BATTERY PROTECTION IC FOR 2-SERIAL / 3-SERIAL CELL PACK (SECONDARY PROTECTION) S-8213 Series Rev.1.4_01  Electrical Characteristics Table 6 N Symbol Condition DE SI G Item (Ta = 25C unless otherwise specified) Test Min. Typ. Max. Unit Circuit DETECTION VOLTAGE VCU  0.025 VCU  0.030 VHC  0.080 VHC  0.025  Overcharge detection voltage n (n = 1, 2, 3) VCUn Overcharge hysteresis voltage n (n = 1, 2, 3) VHCn Ta = 0°C to 60°C*1 VHC = 0.40 V VHC VHC VCU  0.025 VCU  0.030 VHC  0.080 VHC  0.025 V 1 V 1 V 1 V 1 3.6  24 V  V1 = V2 = V3 = VCU  1.0 V   2.0 A 3 IPDN V1 = V2 = V3 = 2.0 V   0.3 A 3  0.3  0 0.3 0.3 A A 4 4  0.4   mA 5  20   A 5    0.1 A 5   tCU  0.8  tCU  tCU  1.2 20 s ms 1 2 R IOPE D NE  VDSOP FO IVC1 V1 = V2 = V3 = VCU  1.0 V IVC2, IVC3 V1 = V2 = V3 = VCU  1.0 V ICOH ICOLL tCU tTST DE ICOL MM EN INPUT VOLTAGE Operation voltage between VDD and VSS INPUT CURRENT Current consumption during operation Current consumption during overdischarge VC1 pin current VC2 pin, VC3 pin current OUTPUT CURRENT CO pin sink current CO pin source current (CMOS output product) CO pin leakage current (Nch open-drain output product) DELAY TIME Overcharge detection delay time Transition time to test mode VCU W VHC = 0 V, 0.05 V VCU NO T RE CO *1. Since products are not screened at high and low temperature, the specification for this temperature range is guaranteed by design, not tested in production. 7 BATTERY PROTECTION IC FOR 2-SERIAL / 3-SERIAL CELL PACK (SECONDARY PROTECTION) S-8213 Series Rev.1.4_01  Test Circuits N 1. Overcharge detection voltage, overcharge hysteresis voltage (Test circuit 1) DE SI G Set SW1 to OFF and ON in CMOS output product and Nch open-drain output product, respectively. 1. 1 Overcharge detection voltage n (VCUn) Set V1 = V2 = V3 = VCU  0.05 V. The Overcharge detection voltage 1 (VCU1) is the V1 voltage when the CO pin’s output changes after the voltage of V1 has been gradually increased. Overcharge detection voltage VCUn (n = 2, 3) can be determined in the same way as when n = 1. 1. 2 Overcharge hysteresis voltage n (VHCn) NE W Set V1 = VCU  0.05 V, V2 = V3 = 2.5 V. The overcharge hysteresis voltage 1 (VHC1) is the difference between V1 voltage and VCU1 when the CO pin’s output changes after the V1 voltage has been gradually decreased. Overcharge hysteresis voltage VHCn (n = 2, 3) can be determined in the same way as when n = 1. 2. Output current (Test circuit 5) R Set SW1 and SW2 to OFF. FO 2. 1 Active "H" 2. 1. 1 CO pin source current (ICOH) D Set SW1 to ON after setting V1 = 5.0 V, V2 = V3 = 3.0 V, V4 = 0.5 V. I1 is the CO pin source current (ICOH) at that time. DE 2. 1. 2 CO pin sink current (ICOL) Set SW2 to ON after setting V1 to V3 = 3.5 V, V5 = 0.5 V. I2 is the CO pin sink current (ICOL) at that time. 2. 1. 3 CO pin leakage current (ICOLL) MM EN Set SW2 to ON after setting V1 = 5.0 V, V2 = V3 = 3.0 V, V5 = 26 V. I2 is the CO pin leakage current (ICOLL) at that time. 2. 2 Active "L" 2. 2. 1 CO pin source current (ICOH) Set SW1 to ON after setting V1 to V3 = 3.5 V, V4 = 0.5 V. I1 is the CO pin source current (ICOH) at that time. CO 2. 2. 2 CO pin sink current (ICOL) RE Set SW2 to ON after setting V1 = 5.0 V, V2 = V3 = 3.0 V, V5 = 0.5 V. I2 is the CO pin sink current (ICOL) at that time. 2. 2. 3 CO pin leakage current (ICOLL) NO T Set SW2 to ON after setting V1 to V3 = 3.5 V, V5 = 26 V. I2 is the CO pin leakage current (ICOLL) at that time. 8 Rev.1.4_01 BATTERY PROTECTION IC FOR 2-SERIAL / 3-SERIAL CELL PACK (SECONDARY PROTECTION) S-8213 Series 3. Overcharge detection delay time (tCU) (Test circuit 1) N Set SW1 to OFF and ON in CMOS output product and Nch open-drain output product, respectively. DE SI G Increase V1 up to 5.0 V after setting V1 = V2 = V3 = 3.5 V. The overcharge detection delay time (tCU) is the time period until the CO pin output changes. 4. Transition time to test mode (tTST) (Test circuit 2) Set SW1 to OFF and ON in CMOS output product and Nch open-drain output product, respectively. W Increase V4 up to 4.0 V, and decrease V4 again to 0 V after setting V1 = V2 = V3 = 3.5 V, and V4 = 0 V. When the period from when V4 was raised to when it has fallen is short, if an overcharge detection operation is NE performed subsequently, the delay time is tCU. However, when the period from when V4 is raised to when it has fallen is gradually made longer, the delay time during the subsequent overcharge detection operation is shorter than tCU. The NO T RE CO MM EN DE D FO R transition time to test mode (tTST) is the period from when V4 was raised to when it has fallen at that time. 9 BATTERY PROTECTION IC FOR 2-SERIAL / 3-SERIAL CELL PACK (SECONDARY PROTECTION) S-8213 Series 100 k SW1 S-8213 Series VDD CO V4 V VC1 VSS V1 V3 VC2 CO V VSS V3 V1 VC2 VC3 V2 VC3 NE W V2 DE SI G VDD N 100 k S-8213 Series VC1 Rev.1.4_01 Figure 7 Test Circuit 2 FO R Figure 6 Test Circuit 1 S-8213 Series IOPE IPDN VDD CO VC1 D A VSS V3 VC2 DE V1 VC3 MM EN V2 CO Figure 8 Test Circuit 3 A I1 SW1 RE VDD CO VC1 VSS NO T V1 VC2 SW2 V3 VC3 V A I2 V2 Figure 10 Test Circuit 5 10 V5 A V1 CO VC1 VSS IVC1 IVC2 IVC3 A A VC2 VC3 V2 Figure 9 Test Circuit 4 V4 S-8213 Series S-8213 Series VDD V3 SW1 BATTERY PROTECTION IC FOR 2-SERIAL / 3-SERIAL CELL PACK (SECONDARY PROTECTION) S-8213 Series Rev.1.4_01  Operation N Remark Refer to " Battery Protection IC Connection Examples". DE SI G 1. Normal status If the voltage of each of the batteries is lower than "the overcharge detection voltage (VCUn)  the overcharge hysteresis voltage (VHCn)", CO pin output changes to "L" (Active "H") or "H" (Active "L"). This is called normal status. 2. Overcharge status When the voltage of one of the batteries exceeds VCUn during charging under normal conditions and the status is retained for the overcharge detection delay time (tCU) or longer, CO pin output changes. This is called overcharge W status. Connecting FET to the CO pin provides charge control and a second protection. If the voltage of each of the batteries is lower than VCUn  VHCn and the status is retained for 2.0 ms typ. or longer, the NO T RE CO MM EN DE D FO R NE S-8213 Series changes to normal status. 11 BATTERY PROTECTION IC FOR 2-SERIAL / 3-SERIAL CELL PACK (SECONDARY PROTECTION) S-8213 Series Rev.1.4_01 3. Test mode The overcharge detection delay time (tCU) can be shortened by entering the test mode. N The test mode can be set by retaining the VDD pin voltage 4.0 V or more higher than the VC1 pin voltage for 20 ms or longer. The status is retained by the internal latch and the test mode is retained even if the VDD pin voltage is DE SI G decreased to the same voltage as that of the VC1 pin voltage. After that, the latch for retaining the test mode is reset and the S-8213 Series exits from test mode under the overcharge status. VDD pin voltage VC1 pin voltage 4.0 V or more NE W Pin voltage VHCn VCUn R Battery voltage DE tTST = 20 ms max. NO T RE CO MM EN CO pin (Active "H") CO pin (Active "L") 12 D Test mode FO (n = 1 to 3) 32 ms typ. Figure 11 2.0 ms typ. Rev.1.4_01 BATTERY PROTECTION IC FOR 2-SERIAL / 3-SERIAL CELL PACK (SECONDARY PROTECTION) S-8213 Series  Timing Charts N 1. Overcharge detection operation DE SI G 1. 1 CMOS output product VHCn VCUn Battery voltage CO pin (Active "H") NE W (n = 1 to 3) FO R tCU or shorter DE D CO pin (Active "L") 2.0 ms typ. Figure 12 NO T RE CO MM EN tCU 13 BATTERY PROTECTION IC FOR 2-SERIAL / 3-SERIAL CELL PACK (SECONDARY PROTECTION) S-8213 Series Rev.1.4_01 1. 2 Nch open-drain output product N VHCn DE SI G VCUn Battery voltage (n = 1 to 3) CO pin (Active "H") tCU or shorter CO pin (Active "L") R NE W High-Z FO High-Z D tCU NO T RE CO MM EN DE Figure 13 14 High-Z 2.0 ms typ. BATTERY PROTECTION IC FOR 2-SERIAL / 3-SERIAL CELL PACK (SECONDARY PROTECTION) S-8213 Series Rev.1.4_01  Battery Protection IC Connection Examples 1. 3-serial cell (CMOS output product) DE SI G VDD RVDD CVDD VC1 R1 C2 BAT2 S-8213 Series NE VC2 R2 VC3 R3 FET R C3 BAT3 CO DP MM EN DE D FO VSS EB W C1 BAT1 N SCP EB Figure 14 Table 7 Constants for External Components Min. 0.2 0.01 50 Typ. 1 0.1 100 Max. 2 1 500 Unit k F  1. The above constants are subject to change without prior notice. 2. It has not been confirmed whether the operation is normal or not in circuits other than the above example of connection. In addition, the example of connection shown above and the constant will not guarantee successful operation. Perform thorough evaluation using the actual application to set the constant. 3. Set the same constants to R1 to R3 and to C1 to C3 and CVDD. 4. Set RVDD, C1 to C3, and CVDD so that the condition (RVDD)  (C1 to C3, CVDD)  5  106 is satisfied. 5. Set R1 to R3, C1 to C3, and CVDD so that the condition (R1 to R3)  (C1 to C3, CVDD)  1  104 is satisfied. 6. Since CO pin may become detection status transiently when the battery is being connected, connect the positive terminal of BAT1 last in order to prevent the three terminal protection fuse from cutoff. NO T RE Caution Part R1 to R3 C1 to C3, CVDD RVDD CO No. 1 2 3 15 BATTERY PROTECTION IC FOR 2-SERIAL / 3-SERIAL CELL PACK (SECONDARY PROTECTION) S-8213 Series Rev.1.4_01 2. 2-serial cell (CMOS output product) DE SI G VDD RVDD CVDD VC1 R1 C2 BAT2 S-8213 Series NE VC2 R2 FET R VC3 VSS EB W C1 BAT1 N SCP CO FO DP D EB DE Figure 15 Table 8 Constants for External Components RE NO T 16 Min. 0.2 0.01 50 Typ. 1 0.1 100 Max. 2 1 500 Unit k F  1. The above constants are subject to change without prior notice. 2. It has not been confirmed whether the operation is normal or not in circuits other than the above example of connection. In addition, the example of connection shown above and the constant will not guarantee successful operation. Perform thorough evaluation using the actual application to set the constant. 3. Set the same constants to R1, R2 and to C1, C2 and CVDD. 4. Set RVDD, C1, C2, and CVDD so that the condition (RVDD)  (C1, C2, CVDD)  5  106 is satisfied. 5. Set R1, R2, C1, C2, and CVDD so that the condition (R1, R2)  (C1, C2, CVDD)  1  104 is satisfied. 6. Since CO pin may become detection status transiently when the battery is being connected, connect the positive terminal of BAT1 last in order to prevent the three terminal protection fuse from cutoff. CO Caution Part R1, R2 C1, C2, CVDD RVDD MM EN No. 1 2 3 BATTERY PROTECTION IC FOR 2-SERIAL / 3-SERIAL CELL PACK (SECONDARY PROTECTION) S-8213 Series Rev.1.4_01 DE SI G N [For SCP, contact] Global Sales & Marketing Division, Dexerials Corporation Gate City Osaki East Tower 8F, 1-11-2 Osaki, Shinagawa-ku, Tokyo, 141-0032, Japan TEL 81-3-5435-3946 Contact Us: http://www.dexerials.jp/en/  Precautions Do not connect batteries charged with VCUn + VHCn or higher. If the connected batteries include a battery charged with VCUn  VHCn or more, the S-8213 series may become overcharge status after all pins are connected.  In some application circuits, even if an overcharged battery is not included, the order of connecting batteries may be restricted to prevent transient output of CO detection pulses when the batteries are connected. Perform thorough evaluation with the actual application circuit.  Before the battery connection, short-circuit the battery side pins RVDD and R1, shown in the figure in " Battery Protection IC Connection Examples".  The application conditions for the input voltage, output voltage, and load current should not exceed the package power dissipation.  Do not apply to this IC an electrostatic discharge that exceeds the performance ratings of the built-in electrostatic protection circuit.  ABLIC Inc. claims no responsibility for any disputes arising out of or in connection with any infringement of patents owned by a third party by products including this IC. NO T RE CO MM EN DE D FO R NE W  17 BATTERY PROTECTION IC FOR 2-SERIAL / 3-SERIAL CELL PACK (SECONDARY PROTECTION) S-8213 Series Rev.1.4_01  Characteristics (Typical Data) DE SI G 1. 2 VCU  VHC vs. Ta 1. 1 VCU vs. Ta VHC = 0.4 V VCU = 4.3 V 4.00 VCU [V] 4.35 4.30 4.25 25 Ta [°C] 50 75 85 0 25 Ta [°C] 50 75 85 R FO VDD = 9.9 V VDD = 6.0 V D IPDN [μA] 0.3 1.5 1.0 0.5 0 2. 3 IOPE vs. VDD 25 Ta [°C] 50 75 85 MM EN −40 −25 DE IOPE [μA] −40 −25 2. 2 IPDN vs. Ta 2.0 Ta = 25C CO 60 40 RE IOPE [μA] 3.85 NE 0 2. 1 IOPE vs. Ta 20 0 5 NO T 0 18 3.90 3.80 −40 −25 2. Current consumption 0 3.95 W VCU + VHC [V] 4.40 4.20 N 1. Detection voltage 10 15 20 VDD [V] 25 30 0.2 0.1 0 −40 −25 0 25 Ta [°C] 50 75 85 BATTERY PROTECTION IC FOR 2-SERIAL / 3-SERIAL CELL PACK (SECONDARY PROTECTION) S-8213 Series Rev.1.4_01 3. Delay time N 3. 1 tCU vs. Ta DE SI G VDD = 12 V 3.0 tCU [s] 2.5 2.0 −40 −25 0 25 Ta [°C] 50 75 85 NE 1.0 W 1.5 4. Output current 4. 2 ICOH vs. VDD R 4. 1 ICOL vs. VDD D 1.5 ICOH [μA] 100 1.0 DE ICOL [mA] Ta = 25C FO Ta = 25C 2.0 0.5 0 5 10 4. 3 ICOLL vs. VDD 15 20 VDD [V] 25 30 MM EN 0 75 50 25 0 0 5 10 15 20 VDD [V] 25 30 Ta = 25C CO 0.075 0.025 0 0 RE 0.050 5 NO T ICOLL [A] 0.100 10 15 20 VDD [V] 25 30 19 BATTERY PROTECTION IC FOR 2-SERIAL / 3-SERIAL CELL PACK (SECONDARY PROTECTION) S-8213 Series Rev.1.4_01  Marking Specification N 1. SNT-6A 6 5 DE SI G Top view Product code (Refer to Product name vs. Product code) Lot number (1) to (3): (4) to (6): 4 (1) (2) (3) (4) (5) (6) 2 3 W 1 CO RE NO T 20 FO D B C D E F G H I J K L M N O P Q R S T DE U U U U U U U U U U U U U U U U U U U MM EN S S S S S S S S S S S S S S S S S S S R Product Code (1) (2) (3) Product Name S-8213AAB-I6T1U S-8213AAC-I6T1U S-8213AAD-I6T1U S-8213AAE-I6T1U S-8213AAF-I6T1U S-8213AAG-I6T1U S-8213AAH-I6T1U S-8213AAI-I6T1U S-8213AAJ-I6T1U S-8213AAK-I6T1U S-8213AAL-I6T1U S-8213AAM-I6T1U S-8213AAN-I6T1U S-8213AAO-I6T1U S-8213AAP-I6T1U S-8213AAQ-I6T1U S-8213AAR-I6T1U S-8213AAS-I6T1U S-8213AAT-I6T1U NE Product name vs. Product code N 2.9±0.2 1 2 3 0.95 +0.1 0.15 -0.05 DE CO MM EN 0.35±0.15 D FO R NE 0.95 4 5 W 6 DE SI G 1.9±0.2 NO T RE No. MP006-A-P-SD-2.1 TITLE SOT236-A-PKG Dimensions No. MP006-A-P-SD-2.1 ANGLE UNIT mm ABLIC Inc. 4.0±0.1(10 pitches:40.0±0.2) 2.0±0.05 0.25±0.1 +0.2 ø1.0 -0 W DE SI G N +0.1 ø1.5 -0 D FO 3.2±0.2 MM EN DE 3 2 1 4 5 6 1.4±0.2 R NE 4.0±0.1 CO Feed direction NO T RE No. MP006-A-C-SD-3.1 TITLE SOT236-A-Carrier Tape No. MP006-A-C-SD-3.1 ANGLE UNIT mm ABLIC Inc. 9.0±0.3 DE MM EN Enlarged drawing in the central part D FO R NE W DE SI G N 12.5max. (60°) CO (60°) ø13±0.2 NO T RE No. MP006-A-R-SD-2.1 TITLE SOT236-A-Reel No. MP006-A-R-SD-2.1 ANGLE QTY UNIT mm ABLIC Inc. 3,000 5 4 2 3 +0.05 0.08 -0.02 NE 1 W DE SI G 6 N 1.57±0.03 0.5 DE D FO R 0.48±0.02 MM EN 0.2±0.05 NO T RE CO No. PG006-A-P-SD-2.1 TITLE SNT-6A-A-PKG Dimensions No. PG006-A-P-SD-2.1 ANGLE UNIT mm ABLIC Inc. N 4.0±0.1 0.25±0.05 +0.1 4.0±0.1 0.65±0.05 4 MM EN 3 2 1 DE D FO R 1.85±0.05 ø0.5 -0 NE W 2.0±0.05 DE SI G +0.1 ø1.5 -0 5 6 CO Feed direction NO T RE No. PG006-A-C-SD-2.0 TITLE SNT-6A-A-Carrier Tape No. PG006-A-C-SD-2.0 ANGLE UNIT mm ABLIC Inc. FO R NE W DE SI G N 12.5max. D 9.0±0.3 DE Enlarged drawing in the central part MM EN ø13±0.2 (60°) No. PG006-A-R-SD-1.0 NO T RE CO (60°) SNT-6A-A-Reel TITLE No. PG006-A-R-SD-1.0 ANGLE QTY. UNIT mm ABLIC Inc. 5,000 1 R 0.2 0.3 NE W 0.52 2 DE SI G 1.36 N 0.52 (0.25 mm min. / 0.30 mm typ.) (1.30 mm ~ 1.40 mm) FO 1. 2. D 0.03 mm DE SNT 1. Pay attention to the land pattern width (0.25 mm min. / 0.30 mm typ.). 2. Do not widen the land pattern to the center of the package ( 1.30 mm ~ 1.40 mm ). MM EN Caution 1. Do not do silkscreen printing and solder printing under the mold resin of the package. 2. The thickness of the solder resist on the wire pattern under the package should be 0.03 mm or less from the land pattern surface. 3. Match the mask aperture size and aperture position with the land pattern. 4. Refer to "SNT Package User's Guide" for details. (0.25 mm min. / 0.30 mm typ.) (1.30 mm ~ 1.40 mm) NO T RE CO 1. 2. No. PG006-A-L-SD-4.1 TITLE SNT-6A-A -Land Recommendation No. PG006-A-L-SD-4.1 ANGLE UNIT mm ABLIC Inc. Disclaimers (Handling Precautions) All the information described herein (product data, specifications, figures, tables, programs, algorithms and application circuit examples, etc.) is current as of publishing date of this document and is subject to change without notice. 2. The circuit examples and the usages described herein are for reference only, and do not guarantee the success of any specific mass-production design. ABLIC Inc. is not responsible for damages caused by the reasons other than the products described herein (hereinafter "the products") or infringement of third-party intellectual property right and any other right due to the use of the information described herein. 3. ABLIC Inc. is not responsible for damages caused by the incorrect information described herein. 4. Be careful to use the products within their specified ranges. Pay special attention to the absolute maximum ratings, operation voltage range and electrical characteristics, etc. ABLIC Inc. is not responsible for damages caused by failures and / or accidents, etc. that occur due to the use of the products outside their specified ranges. 5. When using the products, confirm their applications, and the laws and regulations of the region or country where they are used and verify suitability, safety and other factors for the intended use. 6. When exporting the products, comply with the Foreign Exchange and Foreign Trade Act and all other export-related laws, and follow the required procedures. 7. The products must not be used or provided (exported) for the purposes of the development of weapons of mass destruction or military use. ABLIC Inc. is not responsible for any provision (export) to those whose purpose is to develop, manufacture, use or store nuclear, biological or chemical weapons, missiles, or other military use. 8. The products are not designed to be used as part of any device or equipment that may affect the human body, human life, or assets (such as medical equipment, disaster prevention systems, security systems, combustion control systems, infrastructure control systems, vehicle equipment, traffic systems, in-vehicle equipment, aviation equipment, aerospace equipment, and nuclear-related equipment), excluding when specified for in-vehicle use or other uses. Do not apply the products to the above listed devices and equipments without prior written permission by ABLIC Inc. Especially, the products cannot be used for life support devices, devices implanted in the human body and devices that directly affect human life, etc. Prior consultation with our sales office is required when considering the above uses. ABLIC Inc. is not responsible for damages caused by unauthorized or unspecified use of our products. 9. Semiconductor products may fail or malfunction with some probability. The user of the products should therefore take responsibility to give thorough consideration to safety design including redundancy, fire spread prevention measures, and malfunction prevention to prevent accidents causing injury or death, fires and social damage, etc. that may ensue from the products' failure or malfunction. The entire system must be sufficiently evaluated and applied on customer's own responsibility. MM EN DE D FO R NE W DE SI G N 1. 10. The products are not designed to be radiation-proof. The necessary radiation measures should be taken in the product design by the customer depending on the intended use. CO 11. The products do not affect human health under normal use. However, they contain chemical substances and heavy metals and should therefore not be put in the mouth. The fracture surfaces of wafers and chips may be sharp. Be careful when handling these with the bare hands to prevent injuries, etc. 12. When disposing of the products, comply with the laws and ordinances of the country or region where they are used. RE 13. The information described herein contains copyright information and know-how of ABLIC Inc. The information described herein does not convey any license under any intellectual property rights or any other rights belonging to ABLIC Inc. or a third party. Reproduction or copying of the information from this document or any part of this document described herein for the purpose of disclosing it to a third-party without the express permission of ABLIC Inc. is strictly prohibited. NO T 14. For more details on the information described herein, contact our sales office. 2.0-2018.01 www.ablicinc.com
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