BLF242
HF-VHF power MOS transistor
Rev. 4 — 1 September 2015
Product data sheet
IMPORTANT NOTICE
Dear customer,
As of December 7th, 2015 BL RF Power of NXP Semiconductors will operate as
an independent company under the new trade name Ampleon, which will be used
in future data sheets together with new contact details.
In data sheets, where the previous Philips references is mentioned, please use
the new links as shown below.
http://www.philips.semiconductors.com use http://www.ampleon.com
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sales.addresses@www.semiconductors.philips.com use
http://www.ampleon.com/sales
The copyright notice at the bottom of each page (or elsewhere in the document,
depending on the version)
- © Koninklijke Philips Electronics N.V. (year). All rights reserved is replaced with:
- © Ampleon B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest
sales office (details via http://www.ampleon.com/sales).
Thank you for your cooperation and understanding,
Ampleon
Philips Semiconductors
Product specification
HF-VHF power MOS transistor
FEATURES
BLF242
PIN CONFIGURATION
• High power gain
• Low noise
handbook, halfpage
• Easy power control
1
4
• Good thermal stability
• Withstands full load mismatch
d
• Gold metallization ensures
excellent reliability.
g
MBB072
2
DESCRIPTION
Silicon N-channel enhancement
mode vertical D-MOS transistor
designed for professional transmitter
applications in the HF/VHF frequency
range.
The transistor is encapsulated in a
4-lead, SOT123A flange package,
with a ceramic cap. All leads are
isolated from the flange.
s
3
MSB057
Fig.1 Simplified outline and symbol.
CAUTION
This product is supplied in anti-static packing to prevent damage caused by
electrostatic discharge during transport and handling. For further information,
refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A, and SNW-FQ-302B.
PINNING - SOT123A
PIN
WARNING
DESCRIPTION
1
drain
Product and environmental safety - toxic materials
2
source
3
gate
4
source
This product contains beryllium oxide. The product is entirely safe provided
that the BeO disc is not damaged. All persons who handle, use or dispose of
this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to
the regulations applying at the location of the user. It must never be thrown
out with the general or domestic waste.
QUICK REFERENCE DATA
RF performance at Th = 25 °C in a common source test circuit.
MODE OF OPERATION
CW, class-B
2003 Oct 13
f
(MHz)
VDS
(V)
PL
(W)
Gp
(dB)
ηD
(%)
175
28
5
>13
typ. 16
>50
typ. 60
2
Philips Semiconductors
Product specification
HF-VHF power MOS transistor
BLF242
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDS
drain-source voltage
−
65
V
VGS
gate-source voltage
−
±20
V
ID
drain current (DC)
−
1
A
Ptot
total power dissipation
−
16
W
Tstg
storage temperature
−65
150
°C
Tj
junction temperature
−
200
°C
Tmb ≤ 25 °C
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-mb
thermal resistance from junction to
mounting base
Tmb = 25 °C; Ptot = 16 W
11
K/W
Rth mb-h
thermal resistance from mounting base to
heatsink
Tmb = 25 °C; Ptot = 16 W
0.3
K/W
MRA918
10
MPG141
20
handbook, halfpage
handbook, halfpage
ID
(A)
Ptot
(2)
(W)
1
(2)
(1)
(1)
10
10−1
10−2
1
10
VDS (V)
0
102
0
100
Th (°C)
(1) Continuous operation.
(2) Short-time operation during mismatch.
(1) Current is this area may be limited by RDSon.
(2) Tmb = 25 °C.
Fig.2 DC SOAR.
2003 Oct 13
50
Fig.3 Power derating curves.
3
150
Philips Semiconductors
Product specification
HF-VHF power MOS transistor
BLF242
CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
V(BR)DSS
drain-source breakdown voltage
VGS = 0; ID = 0.1 mA
65
−
−
V
IDSS
drain-source leakage current
VGS = 0; VDS = 28 V
−
−
10
µA
IGSS
gate-source leakage current
VGS = ±20 V; VDS = 0
−
−
1
µA
VGSth
gate-source threshold voltage
ID = 3 mA; VDS = 10 V
2
−
4.5
V
gfs
forward transconductance
ID = 0.3 A; VDS = 10 V
0.16
0.24
−
S
RDSon
drain-source on-state resistance
ID = 0.3 A; VGS = 1 V
−
3.3
5
Ω
IDSX
on-state drain current
VGS = 10 V; VGS = 10 V
−
1.2
−
A
Cis
input capacitance
VGS = 0; VDS = 28 V; f = 1 MHz
−
13
−
pF
Cos
output capacitance
VGS = 0; VDS = 28 V; f = 1 MHz
−
9.4
−
pF
Crs
feedback capacitance
VGS = 0; VDS = 28 V; f = 1 MHz
−
1.7
−
pF
VGS group indicator
LIMITS
(V)
GROUP
LIMITS
(V)
GROUP
MIN.
MAX.
A
2.0
2.1
MIN.
MAX.
O
3.3
3.4
B
2.1
2.2
P
3.4
3.5
C
2.2
2.3
Q
3.5
3.6
D
2.3
2.4
R
3.6
3.7
E
2.4
2.5
S
3.7
3.8
F
2.5
2.6
T
3.8
3.9
G
2.6
2.7
U
3.9
4.0
H
2.7
2.8
V
4.0
4.1
J
2.8
2.9
W
4.1
4.2
K
2.9
3.0
X
4.2
4.3
L
3.0
3.1
Y
4.3
4.4
Z
4.4
4.5
M
3.1
3.2
N
3.2
3.3
2003 Oct 13
4
Philips Semiconductors
Product specification
HF-VHF power MOS transistor
BLF242
MBB777
4
MGP142
1.5
handbook, halfpage
handbook, halfpage
T.C.
(mV/K)
ID
(A)
2
1
0
0.5
–2
0
–4
0
100
200
ID (mA)
0
300
VDS = 10 V.
Fig.4
5
10
VGS (V)
15
VDS = 10 V; Tj = 25 °C.
Temperature coefficient of gate-source
voltage as a function of drain current, typical
values.
Fig.5
MBB778
6
Drain current as a function of gate-source
voltage, typical values.
MBB776
30
handbook, halfpage
handbook, halfpage
RDS (on)
(Ω)
C
(pF)
4
20
Cis
Cos
2
10
0
0
0
50
100
Tj (oC)
150
0
10
20
VDS (V)
30
ID = 0.3 A; VGS = 10 V.
VGS = 0; f = 1 MHz.
Fig.6
Drain-source on-state resistance as a
function of junction temperature, typical
values.
2003 Oct 13
Fig.7
5
Input and output capacitance as functions
of drain-source voltage, typical values.
Philips Semiconductors
Product specification
HF-VHF power MOS transistor
BLF242
MBB775
6
handbook, halfpage
Crs
(pF)
4
2
0
0
10
20
VDS (V)
30
VGS = 0; f = 1 MHz.
Fig.8
Feedback capacitance as a function of
drain-source voltage, typical values.
APPLICATION INFORMATION FOR CLASS-B OPERATION
Th = 25 °C; Rth mb-h = 0.3 K/W; unless otherwise specified.
RF performance in CW operation in a common source class-B test circuit.
MODE OF OPERATION
CW, class-B
f
(MHz)
VDS
(V)
IDQ
(mA)
PL
(W)
GP
(dB)
ηD
(%)
RGS
(Ω)
175
28
10
5
>13
typ. 16
>50
typ. 60
47
Ruggedness in class-B operation
The BLF242 is capable of withstanding a load mismatch corresponding to VSWR = 50 through all phases under the
following conditions: VDS = 28 V; f =175 MHz at rated output power.
Noise figure (see Fig.11)
VDS = 28 V; ID = 0.2 A; f = 175 MHz; RGS = 47 Ω; Th = 25 °C. Input and output power matched for PL = 5 W;
F = typ. 5.5 dB.
2003 Oct 13
6
Philips Semiconductors
Product specification
HF-VHF power MOS transistor
BLF242
MGP143
MGP144
100
20
handbook, halfpage
Gp
(dB)
10
handbook, halfpage
ηd
(%)
Gp
PL
(W)
ηd
10
0
0
5
50
5
0
0
10
PL (W)
0
0.5
PIN (W)
1
Class-B operation; VDS = 28 V; IDQ = 10 mA;
RGS = 47 Ω; f = 175 MHz.
Class-B operation; VDS = 28 V; IDQ = 10 mA;
RGS = 47 Ω; f = 175 MHz.
Fig.9
Fig.10 Load power as a function of input power,
typical values.
Power gain and efficiency as functions of
load power, typical values.
L3
D.U.T.
handbook, full pagewidth
C1
L1
input
50 Ω
L5
C6
output
50 Ω
L2
C7
C2
R1
L4
C3
L6
C3
+VD
R2
+VG
C5
C8
C9
MGP145
f = 175 MHz.
Fig.11 Test circuit for class-B operation.
2003 Oct 13
7
Philips Semiconductors
Product specification
HF-VHF power MOS transistor
BLF242
List of components (see Fig.11)
COMPONENT
DESCRIPTION
VALUE
DIMENSIONS
4 to 40 pF
CATALOGUE NO.
C1, C2, C7
film dielectric trimmer
C3
multilayer ceramic chip capacitor; note 1 100 pF
2222 809 08002
C4, C8
ceramic chip capacitor
100 nF
2222 852 47104
C6
film dielectric trimmer
5 to 60 pF
2222 809 08003
C9
electrolytic capacitor
2.2 µF, 40 V
L1
5 turns enamelled 0.7 mm copper wire
53 nH
length 5.4 mm
int. dia. 3 mm
leads 2 × 5 mm
L2, L3
stripline; note 2
30 Ω
10 × 6 mm
L4
11 turns enamelled 1 mm copper wire
500 nH
length 15.5 mm
int. dia. 8 mm
leads 2 × 5 mm
L5
5 turns enamelled 1 mm copper wire
79 nH
length 9.1 mm
int. dia. 5 mm
leads 2 × 5 mm
L6
grade 3B Ferroxcube RF choke
R1
0.5 W metal film resistor
47 Ω
R2
0.5 W metal film resistor
10 Ω
4312 020 36640
Notes
1. American Technical Ceramics (ATC) capacitor, type 100B or other capacitor of the same quality.
2. The striplines are on a double copper-clad printed circuit board, with epoxy fibre-glass dielectric (εr = 4.5),
thickness 1⁄16 inch.
2003 Oct 13
8
Philips Semiconductors
Product specification
HF-VHF power MOS transistor
BLF242
150
handbook, full pagewidth
strap
strap
70
rivet
L6
+VD
C5
R2
C8
C3
C4
+VG
L4
R1
C1
C2
C9
L5
L1
L2
C6
L3
C7
MGP146
Dimensions in mm.
The circuit and components are situated on one side of the epoxy fibre-glass board, the other side being fully
metallized to serve as earth. Earth connections are made by fixing screws, copper straps and hollow rivets at the
edges of the board and under the source.
Fig.12 Component layout for 175 MHz class-B test circuit.
2003 Oct 13
9
Philips Semiconductors
Product specification
HF-VHF power MOS transistor
BLF242
MGP149
MGP150
50
100
handbook, halfpage
Zi
(Ω)
handbook, halfpage
ri
ZL
(Ω)
30
10
RL
50
XL
−10
xi
−30
0
100
f (MHz)
0
200
0
100
f (MHz)
200
Class-B operation; VDS = 28 V; PL = 30 W;
RGS = 47 Ω; Th = 25 °C.
Class-B operation; VDS = 28 V; PL = 30 W;
RGS = 47 Ω; Th = 25 °C.
Fig.13 Input impedance as a function of frequency
(series components), typical values.
Fig.14 Load impedance as a function of frequency
(series components), typical values.
MGP148
20
handbook, halfpage
Gp
(dB)
10
0
0
100
f (MHz)
200
Class-B operation; VDS = 28 V; PL = 30 W;
RGS = 47 Ω; Th = 25 °C.
Fig.15 Power gain as a function of frequency,
typical values.
2003 Oct 13
10
Philips Semiconductors
Product specification
HF-VHF power MOS transistor
BLF242
BLF242 scattering parameters
VDS = 28 V; ID = 10 mA; note 1
s11
f (MHz)
s21
s12
s22
|s11|
∠Φ
|s21|
∠Φ
|s12|
∠Φ
|s22|
∠Φ
5
0.99
−3.40
5.57
177.10
0.01
87.60
1.00
−2.60
10
0.98
−5.80
5.52
175.10
0.01
85.50
1.00
−5.30
20
0.99
−12.40
5.53
169.40
0.02
80.70
0.99
−10.70
30
0.98
−17.90
5.46
164.90
0.03
76.50
0.99
−16.10
40
0.97
−24.10
5.40
159.80
0.04
71.80
0.98
−21.30
50
0.96
−30.10
5.30
154.80
0.05
67.2
0.97
−26.30
60
0.95
−36.10
5.17
149.80
0.06
62.90
0.95
−31.20
70
0.93
−41.60
5.01
145.10
0.06
58.70
0.94
−35.80
80
0.92
−46.40
4.83
141.00
0.07
55.10
0.93
−40.20
90
0.91
−50.90
4.68
137.30
0.08
51.80
0.92
−44.50
100
0.90
−55.20
4.55
133.60
0.08
48.50
0.90
−48.70
125
0.87
−66.60
4.23
124.20
0.09
40.10
0.87
−58.40
150
0.84
−76.70
3.85
115.60
0.10
32.70
0.84
−66.60
175
0.82
−85.00
3.51
108.60
0.10
27.20
0.82
−74.00
200
0.81
−92.70
3.23
102.10
0.11
22.00
0.81
−80.90
250
0.78
−106.30
2.72
89.90
0.10
12.50
0.78
−92.10
300
0.78
−117.30
2.33
80.30
0.10
6.10
0.78
−101.80
350
0.77
−126.90
2.00
71.40
0.09
1.00
0.78
−109.70
400
0.78
−135.60
1.74
63.90
0.08
−1.50
0.79
−116.80
450
0.79
−143.20
1.53
56.80
0.06
−1.80
0.80
−123.00
500
0.79
−150.30
1.36
51.00
0.05
2.10
0.81
−128.80
600
0.81
−163.30
1.09
40.80
0.03
33.70
0.84
−139.00
700
0.82
−175.10
0.89
32.70
0.05
74.30
0.86
−147.90
800
0.83
173.80
0.74
26.80
0.08
87.20
0.87
−155.90
900
0.83
163.20
0.63
23.00
0.11
86.30
0.89
−162.90
1000
0.83
152.90
0.54
21.70
0.28
144.80
0.65
175.60
Note
1. For more extensive s-parameters see internet:
http://www.semiconductors.philips.com/markets/communications/wirelesscommunication/broadcast.
2003 Oct 13
11
Philips Semiconductors
Product specification
HF-VHF power MOS transistor
BLF242
PACKAGE OUTLINE
Flanged ceramic package; 2 mounting holes; 4 leads
SOT123A
D
A
F
D1
q
C
B
U1
w2 M C M
c
H
b
4
3
α
A
U2
p
U3
w1 M A M B M
1
2
H
Q
0
5
10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT
A
b
c
D
D1
F
H
p
Q
q
U1
U2
U3
w1
w2
mm
7.47
6.37
5.82
5.56
0.18
0.10
9.73
9.47
9.78
9.42
2.72
2.31
20.71
19.93
3.33
3.04
4.63
4.11
18.42
24.87
24.64
6.48
6.22
9.78
9.39
0.25
0.51
inches
0.294
0.251
0.229 0.007
0.219 0.004
0.383 0.385 0.107 0.815
0.373 0.371 0.091 0.785
0.131
0.120
0.182
0.980
0.725
0.162
0.970
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
45°
ISSUE DATE
99-03-29
SOT123A
2003 Oct 13
0.255 0.385
0.010 0.020
0.245 0.370
α
12
Philips Semiconductors
Product specification
HF-VHF power MOS transistor
BLF242
DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
I
Objective data
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2003 Oct 13
13
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
SCA75
© Koninklijke Philips Electronics N.V. 2003
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613524/03/pp14
Date of release: 2003
Oct 13
Document order number:
9397 750 11583
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