TSN525M60 S3G

TSN525M60 Taiwan Semiconductor 25A, 60V Trench Schottky Surface Mount Rectifier FEATURES ● ● ● ● ● ● ● ● ● KEY PARAMETERS Patented Trench Schottky technology Excellent high temperature stability Low forward voltage Lower power loss/ high efficiency High forward surge capability Ideal for automated placement Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 PARAMETER VALUE UNIT IF 25 A VRRM 60 V IFSM 220 A TJ MAX 150 °C Package PDFN56 Configuration Single die APPLICATIONS ● Switching mode power supply (SMPS) ● Adapters ● DC to DC converter MECHANICAL DATA ● ● ● ● ● ● Case: PDFN56 Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: As marked Weight: 0.096g (approximately) PDFN56 ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL Marking code on the device TSN525M60 UNIT 525M60 Repetitive peak reverse voltage VRRM 60 V Reverse voltage, total rms value VR(RMS) 42 V Forward current Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load Junction temperature IF 25 A IFSM 220 A TJ - 55 to +150 °C Storage temperature TSTG - 55 to +150 °C 1 Version: B2103 TSN525M60 Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER Junction-to-lead thermal resistance SYMBOL TYP UNIT RӨJL 9 °C/W ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER CONDITIONS SYMBOL IF = 12.5A, TJ = 25°C Forward voltage IF = 25.0A, TJ = 25°C (1) IF = 12.5A, TJ = 125°C VF IF = 25.0A, TJ = 125°C Reverse current @ rated VR (2) TJ = 25°C IR TJ = 125°C TYP MAX UNIT 0.48 0.54 V 0.57 0.63 V 0.40 0.50 V 0.53 0.59 V - 500 µA - 100 mA Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms ORDERING INFORMATION ORDERING CODE PACKAGE PACKING TSN525M60 PDFN56 6,000 / Tape & Reel 2 Version: B2103 TSN525M60 Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 10000 1000 CAPACITANCE (pF) 20 10 100 10 1 f=1.0MHz Vsig=50mVp-p 0 0 25 50 75 100 125 0.1 0.10 150 1.00 LEAD TEMPERATURE (°C) INSTANTANEOUS FORWARD CURRENT (A) INSTANTANEOUS REVERSE CURRENT (mA) Fig.4 Typical Forward Characteristics 1000 TJ=150°C 10 TJ=125°C 1 TJ=100°C 0.1 0.01 TJ=25°C 0.001 10 20 30 40 50 60 70 80 100.00 REVERSE VOLTAGE (V) Fig.3 Typical Reverse Characteristics 100 10.00 90 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 10010 T =150°C 10 1 J UF1DLW TJ=125°C TJ=125°C TJ=25°C 10.1 (A) AVERAGE FORWARD CURRENT (A) 30 TJ=25°C 0.1 0.01 0.01 0.001 0.0 0.3 TJ=100°C Pulse width 300μs 1% duty cycle Pulse width 0.1 0.4 0.2 0.5 0.3 0.4 0.6 0.7 0.8 0.5 0.9 0.6 1 1.1 FORWARD VOLTAGE (V) 3 Version: B2103 1.2 TSN525M60 Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS PDFN56 SUGGESTED PAD LAYOUT MARKING DIAGRAM 4 P/N = Marking Code YW = Date Code F = Factory Code Version: B2103 TSN525M60 Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 5 Version: B2103