MC74LCX04DR2

MC74LCX04 Low-Voltage CMOS Hex Inverter With 5 V−Tolerant Inputs The MC74LCX04 is a high performance hex inverter operating from a 2.0 to 5.5 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5 V allows MC74LCX04 inputs to be safely driven from 5 V devices if VCC is less than 5.0 V. Current drive capability is 24 mA at the outputs. MARKING DIAGRAMS 14 SOIC−14 D SUFFIX CASE 751A 14 Features • • • • • • http://onsemi.com 1 Designed for 2.0 V to 5.5 V VCC Operation 5 V Tolerant Inputs − Interface Capability With 5 V TTL Logic 1 14 LVTTL Compatible LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability 14 Near Zero Static Supply Current (10 mA) Substantially Reduces System Power Requirements Latchup Performance Exceeds 500 mA 1 LCX 04 ALYWG G TSSOP−14 DT SUFFIX CASE 948G • • ESD Performance: • LCX04G AWLYWW 1 Human Body Model >2000 V; Machine Model >200 V Pb−Free Packages are Available* 14 SOEIAJ−14 M SUFFIX CASE 965 14 1 74LCX04 ALYWG 1 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2009 December, 2009 − Rev. 5 1 Publication Order Number: MC74LCX04/D MC74LCX04 VCC A3 O3 A4 O4 A5 O5 14 13 12 11 10 9 8 A0 A1 A2 A3 1 2 3 4 5 6 7 A0 O0 A1 O1 A2 O2 GND A4 A5 Figure 1. Pinout: 14−Lead (Top View) 1 2 3 4 5 6 13 12 11 10 9 8 O0 O1 O2 O3 O4 O5 Figure 2. Logic Diagram TRUTH TABLE PIN NAMES Pins Function An On Data Inputs Outputs An On L H H L MAXIMUM RATINGS Symbol Parameter Value Condition Unit VCC DC Supply Voltage −0.5 to +7.0 V VI DC Input Voltage −0.5 ≤ VI ≤ +7.0 V VO DC Output Voltage IIK DC Input Diode Current −50 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C −0.5 ≤ VO ≤ VCC +0.5 Output in HIGH or LOW State (Note 1) V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. IO absolute maximum rating must be observed. http://onsemi.com 2 MC74LCX04 RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Unit 2.0 1.5 2.5, 3.3 2.5, 3.3 5.5 5.5 V 0 5.5 V 0 VCC V VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V −24 −12 −8 mA VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V +24 +12 +8 mA −55 +125 °C 0 10 ns/V VCC Supply Voltage Operating Data Retention Only VI Input Voltage VO Output Voltage (HIGH or LOW State) (3−State) IOH HIGH Level Output Current IOL LOW Level Output Current TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V DC ELECTRICAL CHARACTERISTICS TA = −55°C to +125°C Symbol VIH VIL VOH VOL Characteristic HIGH Level Input Voltage (Note 2) LOW Level Input Voltage (Note 2) HIGH Level Output Voltage LOW Level Output Voltage Condition Min 2.3 V ≤ VCC ≤ 2.7 V 1.7 2.7 V ≤ VCC ≤ 3.6 V 2.0 Max V 2.3 V ≤ VCC ≤ 2.7 V 0.7 2.7 V ≤ VCC ≤ 3.6 V 0.8 2.3 V ≤ VCC ≤ 3.6 V; IOH = −100 mA VCC − 0.2 VCC = 2.3 V; IOH = −8 mA 1.8 VCC = 2.7 V; IOH = −12 mA 2.2 VCC = 3.0 V; IOH = −18 mA 2.4 VCC = 3.0 V; IOH = −24 mA 2.2 Unit V V 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA 0.2 VCC = 2.3 V; IOL = 8 mA 0.6 VCC = 2.7 V; IOL = 12 mA 0.4 VCC = 3.0 V; IOL = 16 mA 0.4 VCC = 3.0 V; IOL = 24 mA 0.55 V II Input Leakage Current 2.3 V ≤ VCC ≤ 3.6 V; 0 V ≤ VI ≤ 5.5 V ±5 mA ICC Quiescent Supply Current 2.3 ≤ VCC ≤ 3.6 V; VI = GND or VCC 10 mA 2.3 ≤ VCC ≤ 3.6 V; 3.6 ≤ VI or VO ≤ 5.5 V ±10 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 DICC Increase in ICC per Input 2. These values of VI are used to test DC electrical characteristics only. http://onsemi.com 3 mA MC74LCX04 AC CHARACTERISTICS tR = tF = 2.5 ns; RL = 500 W Limits TA = −55°C to +125°C Symbol VCC = 3.3 V ± 0.3 V VCC = 2.7 V VCC = 2.5 V ± 0.2 V CL = 50 pF CL = 50 pF CL = 30 pF Parameter Waveform Min Max Min Max Min Max Unit tPLH Propagation Delay Time 1 1.5 5.2 1.5 6.0 1.5 6.2 ns tPHL Input to Output 1.5 5.2 1.5 6.0 1.5 6.2 tOSHL Output−to−Output Skew 1.0 tOSLH (Note 3) 1.0 ns 3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter guaranteed by design. DYNAMIC SWITCHING CHARACTERISTICS TA = +25°C Symbol VOLP VOLV Characteristic Condition Min Typ Max Unit Dynamic LOW Peak Voltage VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V 0.8 V (Note 4) VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V 0.6 V Dynamic LOW Valley Voltage VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V −0.8 V (Note 4) VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V −0.6 V 4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state. CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF ORDERING INFORMATION Package Shipping† MC74LCX04DG SOIC−14 (Pb−Free) 55 Units / Rail MC74LCX04DR2 SOIC−14 2500 Tape & Reel MC74LCX04DR2G SOIC−14 (Pb−Free) 2500 Tape & Reel MC74LCX04DT TSSOP−14* 96 Units / Rail MC74LCX04DTG TSSOP−14* (Pb−Free) 96 Units / Rail MC74LCX04DTR2 TSSOP−14* 2500 Tape & Reel MC74LCX04DTR2G TSSOP−14* (Pb−Free) 2500 Tape & Reel MC74LCX04MELG SOEIAJ−14 (Pb−Free) 2000 Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 4 MC74LCX04 VCC Vmi An Vmi 0V tPHL tPLH Vmo On VOH Vmo VOL WAVEFORM 1 − PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns VCC 3.3 V $ 0.3 V 2.7 V 2.5 V $ 0.2 V Vmi 1.5 V 1.5 V VCC/2 Vmo 1.5 V 1.5 V VCC/2 Symbol Figure 3. AC Waveforms VCC PULSE GENERATOR DUT RT CL = CL = RL = RT = CL RL 50 pF at VCC = 3.3 0.3 V or equivalent (includes jig and probe capacitance) 30 pF at VCC = 2.5 0.2 V or equivalent (includes jig and probe capacitance) R1 = 500 W or equivalent ZOUT of pulse generator (typically 50 W) Figure 4. Test Circuit http://onsemi.com 5 MC74LCX04 PACKAGE DIMENSIONS SOIC−14 D SUFFIX CASE 751A−03 ISSUE J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. −A− 14 8 −B− P 7 PL 0.25 (0.010) B M 7 1 G D 14 PL 0.25 (0.010) T B S A DIM A B C D F G J K M P R J M K M F R X 45 _ C −T− SEATING PLANE M S SOLDERING FOOTPRINT 7X 7.04 14X 1.52 1 14X 0.58 1.27 PITCH DIMENSIONS: MILLIMETERS http://onsemi.com 6 MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 MC74LCX04 PACKAGE DIMENSIONS TSSOP−14 DT SUFFIX CASE 948G−01 ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S N 2X 14 L/2 M B −U− L PIN 1 IDENT. N F 7 1 0.15 (0.006) T U 0.25 (0.010) 8 S DETAIL E K A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. K1 J J1 ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D H G DETAIL E DIM A B C D F G H J J1 K K1 L M MILLIMETERS INCHES MIN MAX MIN MAX 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 −−− 1.20 −−− 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 BSC 0.026 BSC 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 BSC 0.252 BSC 0_ 8_ 0_ 8_ SOLDERING FOOTPRINT 7.06 1 0.65 PITCH 14X 0.36 14X 1.26 DIMENSIONS: MILLIMETERS http://onsemi.com 7 MC74LCX04 PACKAGE DIMENSIONS SOEIAJ−14 M SUFFIX CASE 965−01 ISSUE B 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 8 Q1 E HE M_ L 7 1 DETAIL P Z D VIEW P A e A1 b 0.13 (0.005) c M 0.10 (0.004) DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --1.42 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.004 0.008 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --0.056 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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