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S-85S0AB09-I6T1U

S-85S0AB09-I6T1U

  • 厂商:

    ABLIC(艾普凌科)

  • 封装:

    SMD6

  • 描述:

    IC REG BUCK 0.9V 50MA SNT-6A

  • 数据手册
  • 价格&库存
S-85S0AB09-I6T1U 数据手册
S-85S0A Series 5.5 V INPUT, 50 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR WITH 260 nA QUIESCENT CURRENT www.ablic.com www.ablicinc.com Rev.1.2_00 © ABLIC Inc., 2017-2018 The S-85S0A Series introduces own distinctive low power consumption control and COT (Constant On-Time) control, features ultra low current consumption (260 nA quiescent current) and fast transient response, operates at PFM control. The S-85S0A Series realizes high efficiency in a wide range of load current consumption and provides strong support for extended period operation of mobile devices and wearable devices which are equipped with compact batteries. The S-85S0A Series can configure a step-down regulator only with a coil, an input capacitor, and an output capacitor. By using external parts recommended in this datasheet, the occupancy area can be reduced to 1.6 mm × 4.3 mm = 6.9 mm2, and it contributes to miniaturization of electronic equipment.  Features  Applications • Ultra low current consumption: • Efficiency (when under 100 μA load): • Fast transient response: • Input voltage: • Output voltage: 260 nA quiescent current 90.5% COT control 2.2 V to 5.5 V 0.7 V to 2.5 V, in 0.05 V step 2.6 V to 3.9 V, in 0.1 V step • Output voltage accuracy: ±1.5% (1.0 V ≤ VOUT ≤ 3.9 V) ±15 mV (0.7 V ≤ VOUT < 1.0 V) • High side power MOS FET on-resistance: 420 mΩ • Low side power MOS FET on-resistance: 320 mΩ • Soft-start function: 1 ms typ. • Under voltage lockout function (UVLO): 1.8 V typ. (detection voltage) 135°C typ. (detection temperature) • Thermal shutdown function: • Overcurrent protection function: 300 mA (at L = 2.2 μH) • Automatic recovery type short-circuit protection function:Hiccup control • Input and output capacitors: Ceramic capacitor compatible • Operation temperature range: Ta = −40°C to +85°C • Lead-free (Sn 100%), halogen-free  Typical Application Circuit CIN 4.7 F VIN SW PVSS VOUT EN • SNT-6A (1.80 mm × 1.57 mm × t0.5 mm max.) VOUT(S) = 1.8 V 100 VOUT COUT 4.7 F 80 VIN = 2.5 V 60 VIN = 3.6 V 40 VIN = 4.2 V 20 VSS  Package  Efficiency  [%] VIN L 2.2 H • Wearable device • Bluetooth device • Wireless sensor network device • Healthcare equipment • Smart meter • Portable game device 0 0.01 0.1 1 IOUT [mA] 10 100 1 5.5 V INPUT, 50 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR WITH 260 nA QUIESCENT CURRENT Rev.1.2_00 S-85S0A Series  Block Diagram CIN VIN VIN VOUT Error amplifier − ON time generation + + circuit Output control circuit − UVP circuit + Reference voltage circuit EN Enable circuit Soft-start cicuit SW Reverse current detection circuit + − Thermal shutdown circuit Overcurrent protection circuit UVLO circuit VSS Figure 1 2 L PVSS VOUT COUT 5.5 V INPUT, 50 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR WITH 260 nA QUIESCENT CURRENT Rev.1.2_00 S-85S0A Series  Product Name Structure Users can select output voltage for the S-85S0A Series. Refer to "1. Product name" regarding the contents of product name, "2. Package" regarding the package, "3. Product name list" regarding details of the product name. 1. Product name S-85S0A B xx - I6T1 U Environmental code U: Lead-free (Sn 100%), halogen-free *1 Package name abbreviation and packing specification I6T1: SNT-6A, Tape *2, *3 Output voltage 07 to 39 (e.g., when the output voltage is 0.7 V, it is expressed as 07.) *1. *2. *3. 2. Refer to the tape drawing. Refer to "3. Product name list". In the range from 0.7 V to 2.5 V, the products which have 0.05 V step are also available. Contact our sales office when the product is necessary. Package Table 1 Package Name SNT-6A Package Drawing Codes Dimension Tape Reel Land PG006-A-P-SD PG006-A-C-SD PG006-A-R-SD PG006-A-L-SD 3 5.5 V INPUT, 50 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR WITH 260 nA QUIESCENT CURRENT Rev.1.2_00 S-85S0A Series 3. Product name list Table 2 Output Voltage (VOUT) 0.7 V ± 15 mV 0.8 V ± 15 mV 0.9 V ± 15 mV 1.0 V ± 1.5% 1.1 V ± 1.5% 1.2 V ± 1.5% 1.3 V ± 1.5% 1.4 V ± 1.5% 1.5 V ± 1.5% 1.6 V ± 1.5% 1.7 V ± 1.5% 1.8 V ± 1.5% 1.9 V ± 1.5% 2.0 V ± 1.5% 2.1 V ± 1.5% 2.2 V ± 1.5% 2.3 V ± 1.5% 2.4 V ± 1.5% 2.5 V ± 1.5% 2.6 V ± 1.5% 2.7 V ± 1.5% 2.8 V ± 1.5% 2.9 V ± 1.5% 3.0 V ± 1.5% 3.1 V ± 1.5% 3.2 V ± 1.5% 3.3 V ± 1.5% 3.4 V ± 1.5% 3.5 V ± 1.5% 3.6 V ± 1.5% 3.7 V ± 1.5% 3.8 V ± 1.5% 3.9 V ± 1.5% Remark 4 S-85S0A Series S-85S0AB07-I6T1U S-85S0AB08-I6T1U S-85S0AB09-I6T1U S-85S0AB10-I6T1U S-85S0AB11-I6T1U S-85S0AB12-I6T1U S-85S0AB13-I6T1U S-85S0AB14-I6T1U S-85S0AB15-I6T1U S-85S0AB16-I6T1U S-85S0AB17-I6T1U S-85S0AB18-I6T1U S-85S0AB19-I6T1U S-85S0AB20-I6T1U S-85S0AB21-I6T1U S-85S0AB22-I6T1U S-85S0AB23-I6T1U S-85S0AB24-I6T1U S-85S0AB25-I6T1U S-85S0AB26-I6T1U S-85S0AB27-I6T1U S-85S0AB28-I6T1U S-85S0AB29-I6T1U S-85S0AB30-I6T1U S-85S0AB31-I6T1U S-85S0AB32-I6T1U S-85S0AB33-I6T1U S-85S0AB34-I6T1U S-85S0AB35-I6T1U S-85S0AB36-I6T1U S-85S0AB37-I6T1U S-85S0AB38-I6T1U S-85S0AB39-I6T1U Please contact our sales office for products with specifications other than the above. 5.5 V INPUT, 50 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR WITH 260 nA QUIESCENT CURRENT Rev.1.2_00 S-85S0A Series  Pin Configuration 1. SNT-6A Table 3 Top view 1 2 3 Pin No. 6 5 4 Figure 2 Symbol 1 2 3 4 5 VOUT VSS SW PVSS VIN 6 EN Description Voltage output pin GND pin External inductor connection pin Power GND pin Power supply pin Enable pin "H" : Enable (normal operation) "L" : Disable (standby) 5 5.5 V INPUT, 50 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR WITH 260 nA QUIESCENT CURRENT Rev.1.2_00 S-85S0A Series  Absolute Maximum Ratings Table 4 (Unless otherwise specified: Ta = +25°C, VSS = 0 V) Item VIN pin voltage EN pin voltage VOUT pin voltage SW pin voltage PVSS pin voltage Operation temperature Storage temperature Symbol VIN VEN VOUT VSW VPVSS Topr Tstg Absolute Maximum Rating Unit VSS − 0.3 to VSS + 6.0 VSS − 0.3 to VIN + 0.3 ≤ VSS + 6.0 VSS − 0.3 to VIN + 0.3 ≤ VSS + 6.0 VSS − 0.3 to VIN + 0.3 ≤ VSS + 6.0 VSS − 0.3 to VSS + 0.3 ≤ VSS + 6.0 −40 to +85 −40 to +125 V V V V V °C °C Caution The absolute maximum ratings are rated values exceeding which the product could suffer physical damage. These values must therefore not be exceeded under any conditions.  Thermal Resistance Value Table 5 Item Symbol Condition Board A Board B Junction-to-ambient thermal resistance*1 θJA SNT-6A Board C Board D Board E *1. Test environment: compliance with JEDEC STANDARD JESD51-2A Remark Refer to " Power Dissipation" and "Test Board" for details. 6 Min. − − − − − Typ. 224 176 − − − Max. − − − − − Unit °C/W °C/W °C/W °C/W °C/W 5.5 V INPUT, 50 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR WITH 260 nA QUIESCENT CURRENT Rev.1.2_00 S-85S0A Series  Electrical Characteristics Table 6 (VIN = 3.6 V*1, Ta = +25°C unless otherwise specified) Item Operating input voltage Output voltage*2 Symbol VIN Condition Min. Typ. Max. Unit − 2.2 VOUT(S) × 0.985 VOUT(S) − 0.015 3.6 5.5 VOUT(S) × 1.015 VOUT(S) + 0.015 V 1.0 V ≤ VOUT ≤ 3.9 V, no external parts VOUT 0.7 V ≤ VOUT 2.5 V) Table 11 Manufacturer Part Number Capacitance Withstanding Voltage Dimensions (L × W × H) Murata Manufacturing Co., Ltd. TDK Corporation GRJ155R61A106ME12 C1005X5R0J106M050BC 10 μF 10 μF 10 V 6.3 V 1.0 mm × 0.5 mm × 0.5 mm 1.0 mm × 0.5 mm × 0.5 mm 3. Inductor (L) When selecting L, note the allowable current. If a current exceeding this allowable current flows through the inductor, magnetic saturation may occur, and there may be risks which substantially lower efficiency and damage the IC as a result of large current. Therefore, select an inductor so that peak current value (IPK), even during overcurrent detection, does not exceed the allowable current. When prioritizing the load response, select an inductor with a small L value such as 2.2 μH. When prioritizing the efficiency, select an inductor with a large L value such as 4.7 μH. IPK is calculated using the following expression. IPK = IOUT + 1 (VIN − VOUT) × VOUT × VIN 2 × L × fSW Recommended Inductors (L) List (at VIN ≤ 4.2 V) Rated Part Number Inductance Dimensions (L × W × H) Current MBKK1608T2R2M 520 mA 2.2 μH 1.6 mm × 0.8 mm × 1.0 mm 2000 mA 2.0 mm × 1.2 mm × 1.0 mm DFE201210S-2R2M=P2 2.2 μH 74438313022 850 mA 2.2 μH 1.6 mm × 1.6 mm × 1.0 mm MLP2012S2R2MT0S1 800 mA 2.2 μH 2.0 mm × 1.25 mm × 0.85 mm Table 12 Manufacturer TAIYO YUDEN CO.,LTD. Murata Manufacturing Co., Ltd. Würth Elektronik GmbH & Co. KG TDK Corporation Recommended Inductors (L) List (at VIN > 4.2 V) Rated Part Number Inductance Dimensions (L × W × H) Current DFE201210S-2R2M=P2 2000 mA 2.0 mm × 1.2 mm × 1.0 mm 2.2 μH 74438313022 850 mA 2.2 μH 1.6 mm × 1.6 mm × 1.0 mm MLP2012S2R2MT0S1 800 mA 2.2 μH 2.0 mm × 1.25 mm × 0.85 mm Table 13 Manufacturer Murata Manufacturing Co., Ltd. Würth Elektronik GmbH & Co. KG TDK Corporation 13 5.5 V INPUT, 50 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR WITH 260 nA QUIESCENT CURRENT Rev.1.2_00 S-85S0A Series  Board Layout Guidelines Note the following cautions when determining the board layout for the S-85S0A Series. • Place CIN as close to the VIN pin and the PVSS pin as possible. • Make the VIN pattern and GND pattern as wide as possible. • Place thermal vias in the GND pattern to ensure sufficient heat dissipation. • Keep thermal vias near CIN and COUT approximately 3 mm to 4 mm away from capacitor pins. • Large current flows through the SW pin. Make the wiring area of the pattern to be connected to the SW pin small to minimize parasitic capacitance and emission noise. • Do not wire the SW pin pattern under the IC. Total size Figure 8 1.6 mm × 4.3 mm = 6.9 mm2 Reference Board Pattern Caution The above pattern diagram does not guarantee successful operation. Perform thorough evaluation using the actual application to determine the pattern. Remark 14 Refer to the land drawing of SNT-6A and "SNT Package User's Guide". 5.5 V INPUT, 50 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR WITH 260 nA QUIESCENT CURRENT Rev.1.2_00 S-85S0A Series  Precautions • Mount external capacitors and inductors as close as possible to the IC, and make single GND. • Characteristic ripple voltage and spike noise occur in the IC containing switching regulators. Moreover rush current flows at the time of a power supply injection. Because these largely depend on the inductor, the capacitor and impedance of power supply to be used, fully check them using an actually mounted model. • The 4.7 μF capacitor connected between the VIN pin and the VSS pin is a bypass capacitor. It stabilizes the power supply in the IC, and thus effectively works for stable switching regulator operation. Allocate the bypass capacitor as close to the IC as possible, prioritized over other parts. • Although the IC contains a static electricity protection circuit, static electricity or voltage that exceeds the limit of the protection circuit should not be applied. • The power dissipation of the IC greatly varies depending on the size and material of the board to be connected. Perform sufficient evaluation using an actual application before designing. • ABLIC Inc. assumes no responsibility for the way in which this IC is used on products created using this IC or for the specifications of that product, nor does ABLIC Inc. assume any responsibility for any infringement of patents or copyrights by products that include this IC either in Japan or in other countries. 15 5.5 V INPUT, 50 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR WITH 260 nA QUIESCENT CURRENT Rev.1.2_00 S-85S0A Series  Characteristics (Typical Data) Example of major power supply dependence characteristics (Ta = +25°C) ISS1 [nA] 1. 1 Current consumption during switching off (ISS1) vs. Input voltage (VIN) 1. 2 100 400 80 300 200 100 40 0 2.0 2.5 3.0 3.5 4.0 VIN [V] 4.5 5.0 5.5 1. 3 Output voltage (VOUT) vs. Input voltage (VIN) VOUT(S) = 1.2 V 1.230 2.0 1. 4 1.220 2.5 3.0 3.5 4.0 VIN [V] 4.5 5.0 5.5 Output voltage (VOUT) vs. Input voltage (VIN) VOUT(S) = 1.8 V 1.840 1.820 VOUT [V] 1.210 1.200 1.190 1.800 1.780 1.180 1.170 60 20 0 VOUT [V] Current consumption during shutdown (ISSS) vs. Input voltage (VIN) 500 ISSS [nA] 1. 1.760 2.0 2.5 3.0 3.5 4.0 VIN [V] 4.5 5.0 5.5 2.0 2.5 3.0 3.5 4.0 VIN [V] 4.5 5.0 5.5 1. 5 Output voltage (VOUT) vs. Input voltage (VIN) VOUT(S) = 2.5 V 2.600 VOUT [V] 2.400 2.200 2.000 1.800 2.0 1. 6 2.5 3.0 3.5 4.0 VIN [V] 4.5 5.0 5.5 ON time (tON) vs. Input voltage (VIN) VOUT(S) = 1.8 V 1.0 1. 7 fSW [MHz] tON [s] 0.8 0.6 0.4 0.2 1.2 1.0 0.8 0.6 0.0 2.0 16 Switching frequency (fSW) vs. Input voltage (VIN) VOUT(S) = 1.8 V 1.4 2.5 3.0 3.5 4.0 VIN [V] 4.5 5.0 5.5 2.0 2.5 3.0 3.5 4.0 VIN [V] 4.5 5.0 5.5 5.5 V INPUT, 50 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR WITH 260 nA QUIESCENT CURRENT Rev.1.2_00 S-85S0A Series Soft-start wait time (tSSW) vs. Input voltage (VIN) 1. 9 2.50 2.00 2.00 1.50 1.00 0.50 3.0 3.5 4.0 VIN [V] 4.5 5.0 5.5 2.0 800 700 600 500 400 300 200 100 0 RHFET [m] RHFET [m] 2.5 High side power MOS FET on-resistance (RHFET) 1. 11 vs. Input voltage (VIN) 2.0 2.5 3.0 3.5 4.0 VIN [V] 4.5 5.0 2.0 80 ILSW [nA] 80 20 4.5 5.0 5.5 2.5 3.0 3.5 4.0 VIN [V] 4.5 5.0 5.5 60 40 20 0 0 2.0 2.5 3.0 3.5 4.0 VIN [V] 4.5 5.0 5.5 1. 14 High level input voltage (VSH) vs. Input voltage (VIN) 2.0 1.0 1.0 0.8 0.8 VSL [V] 1.2 0.6 0.4 0.2 2.5 3.0 3.5 4.0 VIN [V] 4.5 5.0 5.5 1. 15 Low level input voltage (VSL) vs. Input voltage (VIN) 1.2 0.0 3.5 4.0 VIN [V] 1. 13 Low side power MOS FET leakage current (ILSW) vs. Input voltage (VIN) 100 40 3.0 800 700 600 500 400 300 200 100 0 100 60 2.5 Low side power MOS FET on-resistance (RLFET) vs. Input voltage (VIN) 5.5 1. 12 High side power MOS FET leakage current (IHSW) vs. Input voltage (VIN) IHSW [nA] 1.00 0.00 2.0 1. 10 1.50 0.50 0.00 VSH [V] Soft-start time (tSS) vs. Input voltage (VIN) 2.50 tSS [ms] tSSW [ms] 1. 8 0.6 0.4 0.2 2.0 2.5 3.0 3.5 4.0 VIN [V] 4.5 5.0 5.5 0.0 2.0 2.5 3.0 3.5 4.0 VIN [V] 4.5 5.0 5.5 17 5.5 V INPUT, 50 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR WITH 260 nA QUIESCENT CURRENT Rev.1.2_00 S-85S0A Series 2. Example of major temperature characteristics (Ta = −40°C to +85°C) 2. 1 Current consumption during switching off (ISS1) vs. Temperature (Ta) 2. 2 500 200 VDD = 5.5 V VDD = 2.2 V 300 200 VDD = 3.6 V 100 2. 3 −40 −25 150 ISSS [nA] ISS1 [nA] 400 0 Current consumption during shutdown (ISSS) vs. Temperature (Ta) VDD = 2.2 V 100 25 Ta [C] 50 75 85 Output voltage (VOUT) vs. Temperature (Ta) VDD = 5.5 V 50 0 0 VDD = 3.6 V 2. 4 −40 −25 0 25 Ta [C] VOUT(S) = 1.8 V 1.840 1.210 1.200 1.190 VDD = 3.6 V 2. 5 −40 −25 1.800 1.760 0 25 Ta [C] 50 VDD = 5.5 V 1.780 1.180 1.170 VDD = 2.2 V VDD = 3.6 V 1.820 VOUT [V] VOUT [V] VDD = 2.2 V VDD = 5.5 V 75 85 Output voltage (VOUT) vs. Temperature (Ta) VOUT(S) = 1.2 V 1.230 1.220 50 75 85 −40 −25 0 25 Ta [C] 50 75 85 Output voltage (VOUT) vs. Temperature (Ta) VOUT(S) = 2.5 V 2.560 VOUT [V] 2.540 VDD = 5.5 V 2.520 2.500 2.480 VDD = 3.6 V 2.460 2.440 2. 6 40 25 0 25 Ta [C] 50 75 85 ON time (tON) vs. Temperature (Ta) 2. 7 1.2 1.4 0.8 VDD = 3.6 V 0.6 VDD = 2.2 V 0.4 0.2 18 fSW [MHz] tON [s] 1.0 0.0 Switching frequency (fSW) vs. Temperature (Ta) VDD = 5.5 V −40 −25 0 25 Ta [C] 1.2 1.0 0.8 0.6 50 75 85 VDD = 3.6 V VDD = 5.5 V −40 −25 0 VDD = 2.2 V 25 Ta [C] 50 75 85 5.5 V INPUT, 50 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR WITH 260 nA QUIESCENT CURRENT Rev.1.2_00 S-85S0A Series Soft-start wait time (tSSW) vs. Temperature (Ta) 2.00 2.00 1.50 VDD = 5.5 V 1.00 VDD = 3.6 V 40 25 VDD = 2.2 V 25 Ta [C] 50 2. 11 RLFET [m] RHFET [m] 0.50 VDD = 2.2 V VDD = 5.5 V 40 25 1.00 75 85 VDD = 3.6 V 0 25 Ta [C] 50 250 200 200 100 50 0 −40 −25 0 25 Ta [C] 50 0.6 0.2 0.0 VDD = 2.2 V −40 −25 VDD = 3.6 V 25 Ta [C] 25 0 VDD = 3.6 V 25 Ta [C] 50 75 85 VDD = 5.5 V VDD = 3.6 V 100 VDD = 2.2 V 50 0 25 Ta [C] 50 75 85 VDD = 5.5 V 1.0 0.8 0.6 0.4 0.2 75 85 −40 −25 1.2 0.0 0 75 85 2. 15 Low level input voltage (VSL) vs. Temperature (Ta) VSL [V] 0.8 0.4 VDD = 5.5 V 150 0 75 85 VDD = 5.5 V 1.0 50 50 2. 14 High level input voltage (VSH) vs. Temperature (Ta) 1.2 25 Ta [C] 2. 13 Low side power MOS FET leakage current (ILSW) vs. Temperature (Ta) 250 VDD = 5.5 V 0 VDD = 2.2 V 40 300 VDD = 3.6 V VDD = 2.2 V 40 25 800 700 600 500 400 300 200 100 0 300 150 VDD = 3.6 V VDD = 5.5 V Low side power MOS FET on-resistance (RLFET) vs. Temperature (Ta) 75 85 2. 12 High side power MOS FET leakage current (IHSW) vs. Temperature (Ta) VDD = 2.2 V 1.50 0.00 0 2. 10 High side power MOS FET on-resistance (RHFET) vs. Temperature (Ta) 800 700 600 500 400 300 200 100 0 tSS [ms] 2.50 0.00 IHSW [nA] Soft-start time (tSS) vs. Temperature (Ta) 2.50 0.50 VSH [V] 2. 9 ILSW [nA] tSSW [ms] 2. 8 VDD = 2.2 V 40 25 0 VDD = 3.6 V 25 Ta [C] 50 75 85 19 5.5 V INPUT, 50 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR WITH 260 nA QUIESCENT CURRENT Rev.1.2_00 S-85S0A Series 2.2 2.2 2.1 2.1 2.0 2.0 1.9 1.8 1.7 1.6 20 2. 17 UVLO release voltage (VUVLO+) vs. Temperature (Ta) VUVLO [V] VUVLO [V] 2. 16 UVLO detection voltage (VUVLO−) vs. Temperature (Ta) 1.9 1.8 1.7 40 25 0 25 Ta [C] 50 75 85 1.6 40 25 0 25 Ta [C] 50 75 85 5.5 V INPUT, 50 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR WITH 260 nA QUIESCENT CURRENT Rev.1.2_00 S-85S0A Series Transient response characteristics The external parts shown in Table 14 are used in "3. Transient response characteristics". Table 14 Element Name Inductor Input capacitor Output capacitor Part Number DFE201210S-2R2M=P2 C1005X5R0J106M050BC C1005X5R0J106M050BC Power-on (VOUT = 1.8 V, VIN = 0 V → 3.6 V, Ta = +25°C) 4 5 3. 1. 2 4 3 2 1 0 −1 −2 −3 −4 IOUT = 50 mA VIN VOUT IL 0 1 2 3 Time [ms] 4 1,400 1,200 1,000 800 600 400 200 0 −200 IL [mA] 1,400 1,200 1,000 800 600 400 200 0 −200 VIN [V], VOUT [V] 3. 1. 1 IOUT = 0.1 mA 4 3 2 1 0 −1 −2 −3 −4 0 1 2 3 Time [ms] 3. 2 Manufacturer Murata Manufacturing Co., Ltd. TDK Corporation TDK Corporation IL [mA] VIN [V], VOUT [V] 3. 1 Constant 2.2 μH 10 μF 10 μF 5 Transient response characteristics of EN pin IL 4 5 IOUT = 50 mA VEN IL [mA] VOUT IL 0 1 2 3 Time [ms] 4 1,400 1,200 1,000 800 600 400 200 0 −200 5 Power supply fluctuation (VOUT = 1.8 V, Ta = +25°C) IOUT = 0.1 mA 5 3. 3. 2 VIN = 3.6 V → 4.2 V → 3.6 V 2.10 5 4 4 VIN 2.00 3 VOUT 1.90 2 1 0 10 20 30 Time [ms] 40 50 IOUT = 50 mA VIN = 3.6 V → 4.2 V → 3.6 V 2.10 3 1.80 2 1.70 1 2.00 VIN VOUT 1.90 VOUT [V] 3. 3. 1 VIN [V] VOUT 3. 2. 2 4 3 2 1 0 −1 −2 −3 −4 VIN [V] 3. 3 VEN 1,400 1,200 1,000 800 600 400 200 0 −200 VEN [V], VOUT [V] 3. 2. 1 IOUT = 0.1 mA 4 3 2 1 0 −1 −2 −3 −4 0 1 2 3 Time [ms] IL [mA] VEN [V], VOUT [V] (VOUT = 1.8 V, VIN = 3.6 V, VEN = 0 V → 3.6 V, Ta = +25°C) VOUT [V] 3. 1.80 1.70 0 10 20 30 Time [ms] 40 50 21 5.5 V INPUT, 50 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR WITH 260 nA QUIESCENT CURRENT Rev.1.2_00 S-85S0A Series Load fluctuation (VOUT = 1.8 V, VIN = 3.6 V, Ta = +25°C) 50 IOUT [mA] 0 IOUT −50 3. 4. 2 100 1.95 50 1.90 0 1.85 −100 1.80 VOUT −150 −200 2.00 0 10 20 Time [ms] 30 2.00 1.95 IOUT −50 −100 1.75 −150 1.70 −200 40 IOUT = 0.1 mA → 50 mA → 0.1 mA 1.90 1.85 1.80 VOUT 1.75 0 10 20 Time [ms] VOUT [V] IOUT = 0.1 mA → 10 mA → 0.1 mA IOUT [mA] 3. 4. 1 100 VOUT [V] 3. 4 1.70 40 30  Reference Data The external parts shown in Table 15 are used in " Reference Data". Table 15 Condition η [%] 1. 1 Efficiency (η) vs. Output current (IOUT) 1. 2 1.5 80 1.4 60 40 0 0.001 VIN = 3.6 V VIN = 5.5 V VIN = 3.6 V 1.3 1.2 1.1 0.01 0.1 1 IOUT [mA] 10 1.0 0.001 100 VIN = 5.5 V 0.01 0.1 1 IOUT [mA] 10 100 VOUT = 1.8 V (External parts: Condition) Efficiency (η) vs. Output current (IOUT) 2. 2 Output voltage (VOUT) vs. Output current (IOUT) 100 2.0 80 1.9 60 40 VOUT [V] η [%] 2. 1 VIN = 3.6 V VIN = 5.5 V 20 0 0.001 22 Output voltage (VOUT) vs. Output current (IOUT) 100 20 2. Output Capacitor (COUT) GRM035R60J475ME15 (4.7 μF) Murata Manufacturing Co., Ltd. C1005X5R0J106M050BC (10 μF) TDK Corporation VOUT = 1.2 V (External parts: Condition) VOUT [V] 1. Input Capacitor (CIN) GRM035R60J475ME15 (4.7 μF) Murata Manufacturing Co., Ltd. C1005X5R0J106M050BC (10 μF) TDK Corporation Inductor (L) MBKK1608T2R2M (2.2 μH) TAIYO YUDEN CO.,LTD. DFE201210S-2R2M=P2 (2.2 μH) Murata Manufacturing Co., Ltd. VIN = 3.6 V 1.8 1.7 VIN = 5.5 V 1.6 0.01 0.1 1 IOUT [mA] 10 100 1.5 0.001 0.01 0.1 1 IOUT [mA] 10 100 5.5 V INPUT, 50 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR WITH 260 nA QUIESCENT CURRENT Rev.1.2_00 S-85S0A Series VOUT = 1.2 V (External parts: Condition) η [%] 3. 1 Efficiency (η) vs. Output current (IOUT) 3. 2 1.5 80 1.4 60 40 VIN = 3.6 V VIN = 5.5 V 20 0 0.001 VIN = 5.5 V 1.3 1.2 1.1 0.01 0.1 1 IOUT [mA] 10 1.0 0.001 100 VIN = 3.6 V 0.01 0.1 1 IOUT [mA] 10 100 VOUT = 1.8 V (External parts: Condition) Efficiency (η) vs. Output current (IOUT) 4. 2 Output voltage (VOUT) vs. Output current (IOUT) 100 2.0 80 1.9 60 40 VOUT [V] 4. 1 η [%] 4. Output voltage (VOUT) vs. Output current (IOUT) 100 VOUT [V] 3. VIN = 3.6 V VIN = 5.5 V 20 0 0.001 VIN = 5.5 V 1.8 1.7 VIN = 3.6 V 1.6 0.01 0.1 1 IOUT [mA] 10 100 1.5 0.001 0.01 0.1 1 IOUT [mA] 10 100 23 5.5 V INPUT, 50 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR WITH 260 nA QUIESCENT CURRENT Rev.1.2_00 S-85S0A Series  Power Dissipation SNT-6A Tj = 125C max. Power dissipation (PD) [W] 1.0 0.8 B 0.6 A 0.4 0.2 0.0 0 25 50 75 100 125 150 Ambient temperature (Ta) [C] 24 Board Power Dissipation (PD) A 0.45 W B C 0.57 W − D − E − 175 SNT-6A Test Board (1) Board A IC Mount Area Item Size [mm] Material Number of copper foil layer Copper foil layer [mm] 1 2 3 4 Thermal via Specification 114.3 x 76.2 x t1.6 FR-4 2 Land pattern and wiring for testing: t0.070 74.2 x 74.2 x t0.070 - (2) Board B Item Size [mm] Material Number of copper foil layer Copper foil layer [mm] Thermal via 1 2 3 4 Specification 114.3 x 76.2 x t1.6 FR-4 4 Land pattern and wiring for testing: t0.070 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.070 - No. SNT6A-A-Board-SD-1.0 ABLIC Inc. 1.57±0.03 6 1 5 4 2 3 +0.05 0.08 -0.02 0.5 0.48±0.02 0.2±0.05 No. PG006-A-P-SD-2.1 TITLE SNT-6A-A-PKG Dimensions No. PG006-A-P-SD-2.1 ANGLE UNIT mm ABLIC Inc. +0.1 ø1.5 -0 4.0±0.1 2.0±0.05 0.25±0.05 +0.1 1.85±0.05 ø0.5 -0 4.0±0.1 0.65±0.05 3 2 1 4 5 6 Feed direction No. PG006-A-C-SD-2.0 TITLE SNT-6A-A-Carrier Tape No. PG006-A-C-SD-2.0 ANGLE UNIT mm ABLIC Inc. 12.5max. 9.0±0.3 Enlarged drawing in the central part ø13±0.2 (60°) (60°) No. PG006-A-R-SD-1.0 SNT-6A-A-Reel TITLE No. PG006-A-R-SD-1.0 ANGLE QTY. UNIT mm ABLIC Inc. 5,000 0.52 1.36 2 0.52 0.2 0.3 1. 2. 1 (0.25 mm min. / 0.30 mm typ.) (1.30 mm ~ 1.40 mm) 0.03 mm SNT 1. Pay attention to the land pattern width (0.25 mm min. / 0.30 mm typ.). 2. Do not widen the land pattern to the center of the package ( 1.30 mm ~ 1.40 mm ). Caution 1. Do not do silkscreen printing and solder printing under the mold resin of the package. 2. The thickness of the solder resist on the wire pattern under the package should be 0.03 mm or less from the land pattern surface. 3. Match the mask aperture size and aperture position with the land pattern. 4. Refer to "SNT Package User's Guide" for details. 1. 2. (0.25 mm min. / 0.30 mm typ.) (1.30 mm ~ 1.40 mm) No. PG006-A-L-SD-4.1 TITLE SNT-6A-A -Land Recommendation No. PG006-A-L-SD-4.1 ANGLE UNIT mm ABLIC Inc. Disclaimers (Handling Precautions) 1. All the information described herein (product data, specifications, figures, tables, programs, algorithms and application circuit examples, etc.) is current as of publishing date of this document and is subject to change without notice. 2. The circuit examples and the usages described herein are for reference only, and do not guarantee the success of any specific mass-production design. ABLIC Inc. is not liable for any losses, damages, claims or demands caused by the reasons other than the products described herein (hereinafter "the products") or infringement of third-party intellectual property right and any other right due to the use of the information described herein. 3. ABLIC Inc. is not liable for any losses, damages, claims or demands caused by the incorrect information described herein. 4. Be careful to use the products within their ranges described herein. Pay special attention for use to the absolute maximum ratings, operation voltage range and electrical characteristics, etc. ABLIC Inc. is not liable for any losses, damages, claims or demands caused by failures and / or accidents, etc. due to the use of the products outside their specified ranges. 5. Before using the products, confirm their applications, and the laws and regulations of the region or country where they are used and verify suitability, safety and other factors for the intended use. 6. When exporting the products, comply with the Foreign Exchange and Foreign Trade Act and all other export-related laws, and follow the required procedures. 7. The products are strictly prohibited from using, providing or exporting for the purposes of the development of weapons of mass destruction or military use. ABLIC Inc. is not liable for any losses, damages, claims or demands caused by any provision or export to the person or entity who intends to develop, manufacture, use or store nuclear, biological or chemical weapons or missiles, or use any other military purposes. 8. The products are not designed to be used as part of any device or equipment that may affect the human body, human life, or assets (such as medical equipment, disaster prevention systems, security systems, combustion control systems, infrastructure control systems, vehicle equipment, traffic systems, in-vehicle equipment, aviation equipment, aerospace equipment, and nuclear-related equipment), excluding when specified for in-vehicle use or other uses by ABLIC, Inc. Do not apply the products to the above listed devices and equipments. ABLIC Inc. is not liable for any losses, damages, claims or demands caused by unauthorized or unspecified use of the products. 9. In general, semiconductor products may fail or malfunction with some probability. The user of the products should therefore take responsibility to give thorough consideration to safety design including redundancy, fire spread prevention measures, and malfunction prevention to prevent accidents causing injury or death, fires and social damage, etc. that may ensue from the products' failure or malfunction. The entire system in which the products are used must be sufficiently evaluated and judged whether the products are allowed to apply for the system on customer's own responsibility. 10. The products are not designed to be radiation-proof. The necessary radiation measures should be taken in the product design by the customer depending on the intended use. 11. The products do not affect human health under normal use. However, they contain chemical substances and heavy metals and should therefore not be put in the mouth. The fracture surfaces of wafers and chips may be sharp. Be careful when handling these with the bare hands to prevent injuries, etc. 12. When disposing of the products, comply with the laws and ordinances of the country or region where they are used. 13. The information described herein contains copyright information and know-how of ABLIC Inc. The information described herein does not convey any license under any intellectual property rights or any other rights belonging to ABLIC Inc. or a third party. Reproduction or copying of the information from this document or any part of this document described herein for the purpose of disclosing it to a third-party is strictly prohibited without the express permission of ABLIC Inc. 14. For more details on the information described herein or any other questions, please contact ABLIC Inc.'s sales representative. 15. This Disclaimers have been delivered in a text using the Japanese language, which text, despite any translations into the English language and the Chinese language, shall be controlling. 2.4-2019.07 www.ablic.com
S-85S0AB09-I6T1U 价格&库存

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S-85S0AB09-I6T1U
  •  国内价格 香港价格
  • 1+14.996991+1.81605
  • 10+13.4786110+1.63218
  • 25+12.7153725+1.53976
  • 100+10.83250100+1.31175
  • 250+10.17163250+1.23173
  • 500+8.90010500+1.07775
  • 1000+7.374321000+0.89299
  • 2500+6.865742500+0.83140

库存:5000

S-85S0AB09-I6T1U
  •  国内价格 香港价格
  • 5000+6.294235000+0.76220

库存:5000