11DQ03
11DQ04
Technical Data
Data Sheet N0652, Rev. A
11DQ03/11DQ04 SCHOTTKY RECTIFIER
Features
Low profile, axial leaded outline
High purity, high temperature epoxy encapsulation for
enhanced mechanical strength and moisture resistance
Very Low forward voltage drop
High frequency operation
Guard ring for enhanced ruggedness and long term
reliability
This is a Pb − Free Device
All SMC parts are traceable to the wafer lot
Additional testing can be offered upon request
DO-41
Circuit Diagram
Applications
Switching power supply
Converters
Free-Wheeling diodes
Reverse battery protection
Maximum Ratings:
Characteristics
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Forward Current
Peak One Cycle Non-Repetitive Surge
Current
Symbol
VRRM
VRWM
VR
Condition
-
Max.
Units
30(11DQ03)
40(11DQ04)
V
IF(AV)
50% duty cycle @TL =75°C,
rectangular wave form
On PC board 9mm2 island
1.1
A
IFSM
8.3 ms, half Sine pulse
40
A
Electrical Characteristics:
Characteristics
Forward Voltage Drop*
Symbol
VF1
VF2
Reverse Current*
IR1
IR2
Junction Capacitance
CT
Typical Series Inductance
LS
Voltage Rate of Change
* Pulse width < 300 µs, duty cycle < 2%
dv/dt
Condition
@ 1 A, Pulse, TJ = 25 °C
@ 2 A, Pulse, TJ = 25 °C
@ 1 A, Pulse, TJ = 125 °C
@ 2 A, Pulse, TJ = 125 °C
@VR = Rated VR, Pulse,
TJ = 25 °C
@VR = Rated VR, Pulse,
TJ = 125 °C
@VR = 5V, TC = 25 °C
fSIG = 1MHz
Measured lead to lead 5 mm from
package body
-
Typ.
0.45
0.35
-
Max.
0.55
0.71
0.50
0.61
Units
0.007
1
mA
1.0
6
mA
55
60
PF
8.0
-
nH
-
10,000
V/s
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V
V
11DQ03
11DQ04
Technical Data
Data Sheet N0652, Rev. A
Thermal-Mechanical Specifications:
Characteristics
Junction Temperature
Storage Temperature
Typical Thermal Resistance Junction to
Ambient
Typical Thermal Resistance Junction to
Lead
Approximate Weight
Symbol
Condition
Specification
Units
TJ
Tstg
-
-40 to +150
-40 to +150
C
C
RJA
-
100
C/W
RJL
-
81
C/W
wt
-
0.34
g
Ratings and Characteristics Curves
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11DQ03
11DQ04
Technical Data
Data Sheet N0652, Rev. A
Mechanical Dimensions DO-41
Millimeters
SYMBOL
Ordering Information
Device
11DQ03
11DQ04
Inches
Min.
Max.
Min.
Max.
A
25.4
-
1.000
-
B
4.06
5.21
0.160
0.205
C
0.71
0.864
0.028
0.034
D
2.00
2.72
0.079
0.107
Marking Diagram
Package
Shipping
DO-41 (Pb-Free)
5000pcs /reel
Where XXXXX is YYWWL
11DQ03
SSG
YY
WW
L
For information on tape and reel specifications, including part
orientation and tape sizes, please refer to our tape and reel
packaging specification.
= Part Name
= SSG
= Year
= Week
= Lot Number
Cautions:Molding resin
Epoxy resin UL:94V-0
Carrier Tape Specification DO-41
SYMBOL
Millimeters
Min.
Max.
A
4.50
5.50
B
50.9
53.9
Z
-
1.20
T
5.60
6.40
E
-
0.80
IL1-L2I
-
1.0
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11DQ03
11DQ04
Technical Data
Data Sheet N0652, Rev. A
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales
department for the latest version of the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or
any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd
assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information,
products or circuits described in the datasheets.
4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any
secondary damage resulting from use at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics
(Nanjing) Co., Ltd.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC
- Sangdest Microelectronics (Nanjing) Co., Ltd.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations..
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