BAS316WS
Taiwan Semiconductor
250mA, 100V High-Speed Switching SMD Diode
FEATURES
KEY PARAMETERS
●
●
●
●
Low power loss, high efficiency
Ideal for automated placement
High surge current capability
Compliance to RoHS directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
● Halogen-free according to IEC 61249-2-21
PARAMETER
VALUE
UNIT
IF(AV)
250
mA
VRRM
100
V
VF at IF=150mA
1.25
V
TJ Max.
150
°C
APPLICATIONS
●
●
●
●
Switching mode power supply (SMPS)
Adapters
Lighting application
On-board DC/DC converter
Package
SOD-323F
Configuration
Single dice
MECHANICAL DATA
●
●
●
●
●
●
●
●
Case: SOD-323F
Molding compound meets UL 94 V-0 flammability rating
Moisture sensitivity level: level 1, per J-STD-020
Packing code with suffix "G" means green compound
(halogen-free)
Terminal: Matte tin plated leads, solderable per J-STD-002
Meet JESD 201 class 1A whisker test
Polarity: Indicated by cathode band
Weight: 4.6 ± 0.5mg (approximately)
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
Marking code on the device
SYMBOL
BAS316WS
UNIT
W2
Repetitive peak reverse voltage
VRRM
IF(AV)
Forward current
Non-repetitive peak forward surge Pulse Width = 1 μs
current
Pulse Width = 1 ms
IFRM
100
250
4.0
1.0
V
mA
A
Junction temperature range
TJ
-65 to +150
°C
Storage temperature range
TSTG
-65 to +150
°C
1
Version:D1709
BAS316WS
Taiwan Semiconductor
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)
PARAMETER
CONDITIONS
SYMBOL
MIN
MAX
-
0.715
-
0.855
-
1.000
-
1.250
100
0.03
CJ
-
1.5
pF
trr
-
4.0
ns
IF = 1.0mA, TJ = 25°C
Forward voltage per diode
IF = 10mA, TJ = 25°C
(1)
IF = 50mA, TJ = 25°C
VF
IF = 150mA, TJ = 25°C
Reverse voltage
IR=100µA, TJ = 25°C
Reverse current @ rated VR per
VR=20V TJ = 25°C
diode
(2)
IR
VR=75V TJ = 25°C
1 MHz, VR=0V
Junction capacitance
IF=10mA, IR=10mA,
Reverse recovery time
VR
Irr=0.1x IR
UNIT
1.00
V
V
µA
Notes:
1. Pulse test with PW=0.3 ms
2. Pulse test with PW=30 ms
ORDERING INFORMATION
PART NO.
PACKING
PACKING CODE
CODE
SUFFIX(*)
PACKAGE
PACKING
3K / 7" Reel
RR
G
BAS316WS
SOD-323F
10K / 13" Reel
R9
Notes:
*: optional available
EXAMPLE
EXAMPLE P/N
PART NO.
PACKING CODE
BAS316WS RRG
BAS316WS
RR
PACKING CODE
SUFFIX
G
2
DESCRIPTION
Green compound
Version:D1709
BAS316WS
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.1 Typical Forward Characteristics
Fig.2 Reverse Current As A Function of
Junction Temperature
100
VR=75V
250
Reverse Current (uA)
Instantaneous Forward Current (mA)
300
200
150
100
VR=75V
10
Max
VR=25V
1
0.1
typ
50
typ
0.01
0
0
0.4
0.8
1.2
0
1.6
20
40
60
100 120 140 160 180 200
Junction Temperature (oC)
Instantaneous Forward Voltage (V)
Fig.3 Admissible Power Dissipation Curve
Fig.4 Typical Junction Capacitance
250
0.8
Junction Capacitance (pF)
200
Power Dissipation (mW)
80
150
100
50
0.6
0.4
0.2
0
0
0
25
50
75
100
125
150
Ambient Temperature (oC)
0
175
3
2
4
6
8
10
12
Reverse Voltage (V)
14
16
Version:D1709
BAS316WS
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSION
SOD-323F
DIM.
Unit (mm)
Unit (inch)
Min
Max
Min
Max
A
1.15
1.35
0.045
0.053
B
2.30
2.80
0.091
0.110
C
0.25
0.40
0.010
0.016
D
1.60
1.80
0.063
0.071
E
0.80
1.10
0.031
0.043
F
0.05
0.25
0.002
0.010
SUGGEST PAD LAYOUT
DIM.
4
Unit (mm)
Unit (inch)
Typ.
Typ.
A
0.63
0.025
B
0.83
0.033
C
1.60
0.063
D
2.86
0.113
Version:D1709
BAS316WS
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
5
Version:D1709
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