TH58BYG2S3HBAI4

SLC NAND & BENAND NAND FLASH MEMORY Reliability and Performance Toshiba’s SLC NAND advanced flash memory products provide cutting-edge endurance and data retention for sensitive or frequently used system data. For long-lasting products or systems working with extremely high data throughput between the host and the memory, Toshiba's SLC is a suitable solution. Toshiba’s new BENAND™ removes the burden of error correction code (ECC) from the host processor by embedding ECC directly in the hardware while maintaining the same specifications, reliability and performance as raw SLC NAND. APPLICATIONS • • • • FLASH INVENTOR OF Industrial Consumer Electronics Multimedia Smart Metering & Intelligent Lighting M FEATURES • • • • • • ADVANTAGES SLC NAND 24nm • 1Gb – 128Gb • Extended temperature range • TSOP and BGA package BENAND 24nm Built-in ECC SLC NAND 1Gb – 8Gb On-chip H/W ECC Same reliability and performance as raw SLC Same hardware interface and package as raw SLC • • • • • • E M O R Y BENEFITS Broad lineup to meet customer demand for different densities 24nm technology for cost optimization Long data retention, extreme write/ erase performance Small package available to reduce board space No ECC operation is required on the host side (BENAND) Produced in Toshiba's cutting-edge technology flash factory • • • • A suitable solution for long-lasting storage of significant or frequently changed data Reduced BOM cost due to latest 24nm production technology Supports smaller board size (e.g. for mobile devices) Using Toshiba BENAND, it is possible to utilize the latest 24nm SLC NAND flash technology even if the existing platform cannot support higher bit ECC. No hardware change necessary. SPECIFICATIONS Product / Features SLC NAND BENAND™ (SLC+ECC) 1Gb – 128Gb Density Technology 1Gb – 8Gb 24nm Required on Host Side ECC (Error Correction Code) Embedded on Memory Chip -40°C to 85°C 0°C to 70°C Temperature Package TSOP and BGA BENAND – SLC WITH EMBEDDED ECC FOR BOM REDUCTION AND SYSTEM FLEXIBILITY BENAND Raw SLC NAND 24nm 8bit ECC Data read from the SLC is already error corrected HOST SYSTEM Main CPU Memory Controller Raw SLC NAND 43nm Data read from the SLC is not error corrected 1bit ECC www.toshiba.semicon-storage.com www.toshiba.semicon-storage.com SLC NAND – PRODUCT LIST Density 1Gb 2Gb 4Gb 8Gb 16Gb 32Gb 64Gb 128Gb Part Number TC58NVG0S3HTA00 TC58NYG0S3HBAI4 TC58NVG0S3HTAI0 TC58NVG0S3HBAI4 TC58NYG0S3HBAI6 TC58NVG0S3HBAI6 TC58NVG1S3HTA00 TC58NYG1S3HBAI4 TC58NVG1S3HTAI0 TC58NVG1S3HBAI4 TC58NYG1S3HBAI6 TC58NVG1S3HBAI6 TH58NVG2S3HTA00 TC58NVG2S0HTA00 TC58NVG2S0HTAI0 TH58NVG2S3HTAI0 TH58NVG2S3HBAI4 TH58NYG2S3HBAI4 TC58NVG2S0HBAI4 TC58NYG2S0HBAI4 TC58NVG2S0HBAI6 TC58NYG2S0HBAI6 TH58NVG3S0HTA00 TH58NVG3S0HBAI4 TH58NYG3S0HBAI4 TH58NVG3S0HTAI0 TH58NVG3S0HBAI6 TH58NYG3S0HBAI6 TH58NVG4S0FTA20 TH58NVG4S0FTAK0 TH58NVG4S0FBAID TH58NVG4S0HTA20 TH58NVG4S0HTAK0 TC58NVG5H2HTA00 TC58NVG5H2HTAI0 TH58NVG6H2HTAK0 TH58NVG7H2HTA20 Techn. 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 32nm 32nm 32nm 24nm 24nm 24nm 24nm 24nm 24nm Page Size (2048+128)x8 bit (2048+128)x8 bit (2048+128)x8 bit (2048+128)x8 bit (2048+128)x8 bit (2048+128)x8 bit (2048+128)x8 bit (2048+128)x8 bit (2048+128)x8 bit (2048+128)x8 bit (2048+128)x8 bit (2048+128)x8 bit (2048+128)x8 bit (4096+256)x8 bit (4096+256)x8 bit (2048+128)x8 bit (2048+128)x8 bit (2048+128)x8 bit (4096+256)x8 bit (4096+256)x8 bit (4096+256)x8 bit (4096+256)x8 bit (4096+256)x8 bit (4096+256)x8 bit (4096+256)x8 bit (4096+256)x8 bit (4096+256)x8 bit (4096+256)x8 bit (4096+256)x8 bit (4096+256)x8 bit (4096+256)x8 bit (4096+256)x8 bit (4096+256)x8 bit (8192+1024)x8 bit (8192+1024)x8 bit (8192+1024)x8 bit (8192+1024)x8 bit Vcc 3.3V 1.8V 3.3V 3.3V 1.8V 3.3V 3.3V 1.8V 3.3V 3.3V 1.8V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 1.8V 3.3V 1.8V 3.3V 1.8V 3.3V 3.3V 1.8V 3.3V 3.3V 1.8V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V ECC 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 4bit/512B 4bit/512B 4bit/512B 8bit/512B 8bit/512B 24bit/1024B 24bit/1024B 24bit/1024B 24bit/1024B Temperature 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 0°C to 70°C 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 0°C to 70°C -40°C to 85°C -40°C to 85°C 0°C to 70°C -40°C to 85°C 0°C to 70°C -40°C to 85°C -40°C to 85°C 0°C to 70°C Package 48TSOP 12x20 63BGA 9x11 48TSOP 12x20 63BGA 9x11 67BGA 6.5x8 67BGA 6.5x8 48TSOP 12x20 63BGA 9x11 48TSOP 12x20 63BGA 9x11 67BGA 6.5x8 67BGA 6.5x8 48TSOP 12x20 48TSOP 12x20 48TSOP 12x20 48TSOP 12x20 63BGA 9x11 63BGA 9x11 63BGA 9x11 63BGA 9x11 67BGA 6.5x8 67BGA 6.5x8 48TSOP 12x20 63BGA 9x11 63BGA 9x11 48TSOP 12x20 67BGA 6.5x8 67BGA 6.5x8 48TSOP 12x20 48TSOP 12x20 63BGA 10x11 48TSOP 12x20 48TSOP 12x20 48TSOP 12x20 48TSOP 12x20 48TSOP 12x20 48TSOP 12x20 Page Size (2048+64)x8 bit (2048+64)x8 bit (2048+64)x8 bit (2048+64)x8 bit (2048+64)x8 bit (2048+64)x8 bit (2048+64)x8 bit (2048+64)x8 bit (2048+64)x8 bit (2048+64)x8 bit (2048+64)x8 bit (2048+64)x8 bit (2048+64)x8 bit (4096+128)x8 bit (4096+128)x8 bit (2048+64)x8 bit (2048+64)x8 bit (2048+64)x8 bit (4096+128)x8 bit (4096+128)x8 bit (4096+128)x8 bit (4096+128)x8 bit (2048+64)x8 bit (4096+128)x8 bit (4096+128)x8 bit (4096+128)x8 bit (4096+128)x8 bit (4096+128)x8 bit (4096+128)x8 bit Vcc 3.3V 1.8V 3.3V 3.3V 1.8V 3.3V 3.3V 1.8V 3.3V 3.3V 1.8V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 1.8V 3.3V 1.8V 3.3V 1.8V 1.8V 3.3V 1.8V 3.3V 3.3V 3.3V 1.8V ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC Temperature 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 0°C to 70°C 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C Package 48TSOP 12x20 63BGA 9x11 48TSOP 12x20 63BGA 9x11 67BGA 6.5x8 67BGA 6.5x8 48TSOP 12x20 63BGA 9x11 48TSOP 12x20 63BGA 9x11 67BGA 6.5x8 67BGA 6.5x8 48TSOP 12x20 48TSOP 12x20 48TSOP 12x20 48TSOP 12x20 63BGA 9x11 63BGA 9x11 63BGA 9x11 63BGA 9x11 67BGA 6.5x8 67BGA 6.5x8 67BGA 6.5x8 48TSOP 12x20 63BGA 9x11 48TSOP 12x20 63BGA 9x11 67BGA 6.5x8 67BGA 6.5x8 BENAND™ – PRODUCT LIST Density 1Gb 2Gb 4Gb 8Gb Part Number TC58BVG0S3HTA00 TC58BYG0S3HBAI4 TC58BVG0S3HTAI0 TC58BVG0S3HBAI4 TC58BYG0S3HBAI6 TC58BVG0S3HBAI6 TC58BVG1S3HTA00 TC58BYG1S3HBAI4 TC58BVG1S3HTAI0 TC58BVG1S3HBAI4 TC58BYG1S3HBAI6 TC58BVG1S3HBAI6 TH58BVG2S3HTA00 TC58BVG2S0HTA00 TC58BVG2S0HTAI0 TH58BVG2S3HTAI0 TH58BVG2S3HBAI4 TH58BYG2S3HBAI4 TC58BVG2S0HBAI4 TC58BYG2S0HBAI4 TC58BVG2S0HBAI6 TC58BYG2S0HBAI6 TH58BYG2S3HBAI6 TH58BVG3S0HTA00 TH58BYG3S0HBAI4 TH58BVG3S0HTAI0 TH58BVG3S0HBAI4 TH58BVG3S0HBAI6 TH58BYG3S0HBAI6 Techn. 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm BENAND™ is the trademark of Toshiba Corporation. Product density is identified based on the maximum density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. Maximum read and write speed may vary depending on the host device, read and write conditions, and file size. Copyright August 2016 Toshiba America Electronic Components, Inc. (TAEC) - All Rights Reserved www.toshiba.semicon-storage.com Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Kioxia: TC58NVG1S3HTAI0 TC58NVG0S3HBAI4 TC58NVG2S0HTA00 TC58NVG1S3HBAI4 TC58NVG0S3HTAI0 TH58NVG2S3HTAI0 TH58BVG2S3HTAI0 TH58NVG3S0HTA00 TH58BYG2S3HBAI6 TH58NVG3S0HTAI0 TH58BVG2S3HTA00 TH58NVG2S3HTA00 TC58NVG2S0HBAI6 TC58NVG2S0HTAI0 TC58NYG2S0HBAI6 TC58NYG1S3HBAI4 TH58BYG2S3HBAI4 TH58NVG3S0HBAI4 TC58NYG2S0HBAI4 TH58BVG2S3HBAI4 TH58NYG2S3HBAI4 TC58NYG0S3HBAI6 TC58NYG1S3HBAI6 TC58NVG0S3HBAI6 TC58NVG1S3HBAI6 TC58NVG1S3HTA00 TH58NYG3S0HBAI6 TC58NVG0S3HTA00 TH58NYG3S0HBAI4 TH58NVG3S0HBAI6 TH58NVG2S3HBAI4 TC58NVG2S0HBAI4 TC58NYG0S3HBAI4