S-19932A/19932B/19933A/19933B Series
AUTOMOTIVE, 125°C OPERATION,
18 V INPUT, 600 mA SYNCHRONOUS
STEP-DOWN SWITCHING REGULATOR
www.ablic.com
Rev.2.3_00
© ABLIC Inc., 2019-2021
The S-19932/19933 Series is a step-down switching regulator developed using high withstand voltage CMOS process
technologies.
This IC has high maximum operation voltage of 18 V and maintains high-accuracy FB pin voltage at ±1.5%. As suitable
packages for high-density mounting, such as small-sized HSNT-6(2025), are adopted, this IC contributes to miniaturization
of electronic equipment.
PWM control (S-19932 Series) or PWM / PFM switching control (S-19933 Series) can be selected as an option.
Since the S-19933 Series, which features PWM / PFM switching control, operates with PWM control under heavy load and
automatically switches to PFM control under light load, it achieves high-efficiency operation in accordance with the
device's status. Furthermore, our distinctive PWM / PFM switching control technology suppresses the ripple voltage to be
generated in VOUT while PFM control is in operation.
Since the S-19932/19933 Series has the built-in synchronous circuit, it achieves high efficiency easier compared with
conventional step-down switching regulators. In addition, it has the built-in overcurrent protection circuit which protects the
IC and coils from excessive load current as well as a thermal shutdown circuit which prevents damage from heat
generation.
ABLIC Inc. offers FIT rate calculated based on actual customer usage conditions in order to support customer functional
safety design.
For more information regarding our FIT rate calculation, contact our sales representatives.
Caution This product can be used in vehicle equipment and in-vehicle equipment. Before using the product for
these purposes, it is imperative to contact our sales representatives.
Features
Applications
• Input voltage:
• Output voltage (externally set):
• Output current:
• FB pin voltage accuracy:
• Efficiency:
• Oscillation frequency:
• Overcurrent protection function:
• Thermal shutdown function:
• Short-circuit protection function:
• 100% duty cycle operation:
• Soft-start function:
• Under voltage lockout function (UVLO):
• Input and output capacitors:
• Operation temperature range:
• Lead-free (Sn 100%), halogen-free
• AEC-Q100 qualified*1
4.0 V to 18.0 V
1.0 V to 12.0 V
600 mA
±1.5%
91%
2.2 MHz typ.
1.2 A typ. (pulse-by-pulse method)
170°C typ. (detection temperature)
Hiccup control, Latch control
• Camera module
• For automotive use (engine, transmission,
suspension, ABS, related-devices for EV /
HEV / PHEV, etc.)
• Constant-voltage power supply for
electrical application for vehicle interior
• Constant-voltage power supply
for industrial equipment
• Constant-voltage power supply
for home electric appliance
5.8 ms typ.
3.35 V typ. (detection voltage)
Ceramic capacitor compatible
Ta = −40°C to +125°C
Packages
• HTMSOP-8
(4.0 mm × 2.9 mm × t0.8 mm max.)
• HSNT-8(2030)
(3.0 mm × 2.0 mm × t0.5 mm max.)
• HSNT-6(2025)
(2.46 mm × 1.96 mm × t0.5 mm max.)
*1. Contact our sales representatives for details.
Typical Application Circuit
VEN
EN
CIN
4.7 μF
SW
L
3.3 μH
VOUT
3.3 V
VREG
VSS
S-19933 Series
80
CFB
33 pF
FB
VIN = 8.0 V, VOUT = 3.3 V
100
CREG
1 μF
COUT
10 μF
RFB1
46.9 kΩ
RFB2
15 kΩ
η [%]
VIN
VIN
Efficiency
60
40
S-19932 Series
20
0
0.1
1
10
IOUT [mA]
100
1000
1
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
Block Diagrams
1.
S-19932 Series (PWM control)
VIN
*1
*1
EN
VIN
Enable
circuit
CIN
*1
VREG
Regulator
*1
UVLO circuit
Soft-start
circuit
VREG
*1
FB
*1
SW
+
Error
amplifier
−
*1
CREG
PWM
control
circuit
−
+
VOUT
L
COUT
*1
CFB
RFB1
RFB2
Oscillation circuit
VREF
Short-circuit
protection circuit
VSS
*1. Parasitic diode
Figure 1
2.
S-19933 Series (PWM / PFM switching control)
VIN
*1
VIN
*1
EN
CIN
Enable
circuit
*1
VREG
Regulator
*1
UVLO circuit
Soft-start
circuit
VREG
FB
*1
−
*1
Error
amplifier
+
*1
SW
+
−
VOUT
L
switching
*1
COUT
CFB
RFB1
RFB2
Oscillation circuit
VREF
Short-circuit
protection circuit
VSS
*1. Parasitic diode
Figure 2
2
CREG
Reverse
current
detection
circuit
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
AEC-Q100 Qualified
This IC supports AEC-Q100 for operation temperature grade 1.
Contact our sales representatives for details of AEC-Q100 reliability specification.
Product Name Structure
1.
Product name
S-1993 x
x A -
xxxx
U
7
Environmental code
U:
Lead-free (Sn 100%), halogen-free
Package name abbreviation and packing specification*1
S8T1: HTMSOP-8, Tape
A8T1: HSNT-8(2030), Tape
A6T8: HSNT-6(2025), Tape
Operation temperature
A:
Ta = −40°C to +125°C
Product type*2
A, B
Control method
2:
PWM control
3:
PWM / PFM switching control
*1.
*2.
2.
Refer to the tape drawing.
Refer to "2. Function list of product types".
Function list of product types
Table 1
3.
Product Type
Oscillation Frequency
A
B
2.2 MHz
2.2 MHz
Short-circuit Protection Function
Hiccup control
Latch control
Packages
Table 2
Package Name
HTMSOP-8
HSNT-8(2030)
HSNT-6(2025)
Dimension
FP008-A-P-SD
PP008-A-P-SD
PJ006-B-P-SD
Package Drawing Codes
Tape
FP008-A-C-SD
PP008-A-C-SD
PJ006-B-C-SD
Reel
FP008-A-R-SD
PP008-A-R-SD
PJ006-B-R-SD
Land
FP008-A-L-SD
PP008-A-L-SD
PJ006-B-LM-SD
Stencil Opening
−
−
PJ006-B-LM-SD
3
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
Pin Configurations
1.
HTMSOP-8
Table 3
Top view
Pin No.
1
2
3
4
8
7
6
5
Bottom view
1
2
3
4
8
7
6
5
1
2
3
4
5
6
7
8
Symbol
VIN
FB
EN
NC*2
NC*2
VREG*3
VSS
SW
Description
Power supply pin
Feedback pin
Enable pin (active "H")
No connection
No connection
Internal power supply pin
GND pin
External inductor connection pin
*1
Figure 3
*1.
*2.
*3.
2.
Connect the heat sink of backside at shadowed area to the board, and set electric potential GND.
However, do not use it as the function of electrode.
The NC pin is electrically open.
The NC pin can be connected to the VIN pin or the VSS pin.
The VREG pin cannot supply load current outside.
HSNT-8(2030)
Table 4
Pin No.
Top view
1
8
4
5
Bottom view
8
1
5
4
1
2
3
4
5
6
7
8
Symbol
VIN
FB
EN
NC*2
NC*2
VREG*3
VSS
SW
Description
Power supply pin
Feedback pin
Enable pin (active "H")
No connection
No connection
Internal power supply pin
GND pin
External inductor connection pin
*1
Figure 4
*1.
*2.
*3.
4
Connect the heat sink of backside at shadowed area to the board, and set electric potential GND.
However, do not use it as the function of electrode.
The NC pin is electrically open.
The NC pin can be connected to the VIN pin or the VSS pin.
The VREG pin cannot supply load current outside.
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
3.
HSNT-6(2025)
Table 5
Pin No.
Top view
1
2
3
6
5
4
Bottom view
6
5
4
1
2
3
1
2
3
4
5
6
Symbol
VIN
FB
EN
VREG*2
VSS
SW
Description
Power supply pin
Feedback pin
Enable pin (active "H")
Internal power supply pin
GND pin
External inductor connection pin
*1
Figure 5
*1.
*2.
Connect the heat sink of backside at shadowed area to the board, and set electric potential GND.
However, do not use it as the function of electrode.
The VREG pin cannot supply load current outside.
5
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
Absolute Maximum Ratings
Table 6
(Unless otherwise specified: Ta = +25°C, VSS = 0 V)
Item
Symbol
VIN pin voltage
EN pin voltage
FB pin voltage
VREG pin voltage
VIN
VEN
VFB
VREG
SW pin voltage
VSW
Junction temperature
Operation ambient temperature
Storage temperature
Tj
Topr
Tstg
Absolute Maximum Ratings
VSS − 0.3 to VSS + 22
VSS − 0.3 to VSS + 22
VSS − 0.3 to VREG + 0.3 ≤ VSS + 6.0
VSS − 0.3 to VIN + 0.3 ≤ VSS + 6.0
VSS − 2 to VIN + 2 ≤ VSS + 22 (< 20 ns)
VSS − 0.3 to VIN + 0.3 ≤ VSS + 22
−40 to +150
−40 to +125
−40 to +150
Unit
V
V
V
V
V
°C
°C
°C
Caution The absolute maximum ratings are rated values exceeding which the product could suffer physical
damage. These values must therefore not be exceeded under any conditions.
Thermal Resistance Value
Item
Symbol
Table 7
Condition
Board A
Board B
Board C
HTMSOP-8
Board D
Board E
Board A
Board B
*1
HSNT-8(2030)
Board C
Junction-to-ambient thermal resistance θJA
Board D
Board E
Board A
Board B
HSNT-6(2025)
Board C
Board D
Board E
*1. Test environment: compliance with JEDEC STANDARD JESD51-2A
Remark Refer to " Power Dissipation" and "Test Board" for details.
6
Min.
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
Typ.
159
113
39
40
30
181
135
40
42
32
180
128
43
44
36
Max.
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
Electrical Characteristics
Table 8
(VIN = 12 V, Tj = −40°C to +125°C unless otherwise specified)
Item
Operating input voltage
Current consumption
during shutdown
Current consumption
during switching off
UVLO detection voltage
UVLO release voltage
Symbol
Condition
Min.
Typ.
Max.
Unit
−
4.0
−
18.0
V
−
0
5
μA
−
−
3.1
3.2
175
68
3.35
3.45
260
120
3.6
3.7
μA
μA
V
V
VIN
ISSS
VEN = 0 V
ISS
VFB = 1.0 V
VUVLOVUVLO+
VREG pin voltage
VREG pin voltage
S-19932 Series
S-19933 Series
FB pin voltage
VFB
−
0.788
0.8
0.812
V
Oscillation frequency
fOSC
−
1.98
2.2
2.42
MHz
Minimum ON time
Maximum duty ratio
tON_MIN
MaxDuty
−
100
60
−
−
−
ns
%
Soft-start wait time
tSSW
0.30
0.58
0.90
ms
Soft-start time
tSS
3.0
5.8
8.5
ms
High side power
MOS FET on-resistance
Low side power
MOS FET on-resistance
High side power
MOS FET leakage current
Low side power
MOS FET leakage current
Limit current
Thermal shutdown
detection temperature
Thermal shutdown
release temperature
High level input voltage
Low level input voltage
−
−
Time until VOUT starts rising,
CREG = 1 μF
Time until VFB reaches 90% after it starts
rising
RHFET
ISW = 50 mA
−
0.85
1.75
Ω
RLFET
ISW = −50 mA
−
0.35
0.65
Ω
IHSW
VIN = 18.0 V, VEN = 0 V, VSW = 0 V
−
0.01
2
μA
ILSW
VIN = 18.0 V, VEN = 0 V, VSW = 18.0 V
−
0.01
4
μA
1.0
1.2
1.4
A
−
ILIM
TSD
Junction temperature
−
170
−
°C
TSR
Junction temperature
−
150
−
°C
VSH
VSL
EN pin
EN pin
2.0
−
−
−
−
0.8
V
V
High level input current
ISH
EN pin, VEN = 2.0 V
−
−
1
μA
Low level input current
FB pin current
ISL
IFB
EN pin, VEN = 0 V
FB pin, VFB = 1.0 V
−0.5
−0.06
−
−
0.5
0.06
μA
μA
7
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
Operation
1.
Overview of operation
The S-19932/19933 Series adopts the current mode control. By comparing the current feedback signal which has
slope compensation added to the current flows through high side power MOS FET with the output signal of error
amplifier, the Duty ratio of the SW pin is determined. Using the negative feedback loop configured, the error
amplifier output signal is maintained at the value that VREF and FB pin voltage (VFB) will be equalized.
2.
PWM control (S-19932 Series)
The S-19932 Series operates with the pulse width modulation method (PWM) regardless of the extent of load
current and allows the switching frequency to stabilize.
3.
PWM / PFM switching control (S-19933 Series)
The S-19933 Series automatically switches between PWM and pulse frequency modulation method (PFM)
according to the load current. PFM control is selected when under light load, and the pulse will skip according to the
load current. This reduces self-current consumption and improves efficiency when under light load.
In PFM control, the peak current, flows through an inductor, is set to 125 mA typ. in the IC. In addition, our
distinctive PWM / PFM switching control technology suppresses the ripple voltage to be generated in VOUT while
PFM control is in operation.
4.
Minimum ON time
ON time (tON) of the SW pin during current continuous mode can be calculated by the following expression.
VOUT
1
tON = V × f
IN
OSC
tON will be small when VIN is high and VOUT is low. Set the use conditions to realize tON > minimum ON time (tON_MIN).
Although the maximum value of tON_MIN varies according to inductance, load current, and the conditions of VIN and
VOUT, the value is 80 ns. When tON < tON_MIN, the ripple voltage (ΔVOUT) in VOUT may increase by skipping a pulse
during current continuous mode. In addition, when the S-19932/19933 Series changes to an overload status, the
limit current (ILIM) to protect the IC from overcurrent may increase. Sufficient evaluations under actual conditions are
required.
5.
100% duty cycle operation
The high side power MOS FET allows for 100% duty cycle operation. Even when the input voltage is lowered up to
the output voltage value set using the external output voltage setting resistor, the high side power MOS FET is kept
on and current can be supplied to the load. The output voltage at this time is the input voltage from which the
voltage drop due to the direct resistance of the inductor and the on-resistance of the high side power MOS FET are
subtracted.
6.
Under voltage lockout function (UVLO)
The S-19932/19933 Series has a built-in UVLO circuit to prevent the IC from malfunctioning due to a transient status
at power-on or a momentary drop in the supply voltage. When UVLO status is detected, the high side power MOS
FET and low side power MOS FET will turn off, and the SW pin will change to "High-Z". For this reason, switching
operation will stop. The soft-start function is reset if UVLO status is detected once and is restarted by releasing the
UVLO status.
Note that the other internal circuits operate normally, and the status is different from the disabled status.
Also, there is a hysteresis width for avoiding malfunctions due to generation of noise etc. in the input voltage.
8
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
7.
EN pin
This pin starts and stops switching operation. When the EN pin is set to "L", the operation of all internal circuits,
including the high side power MOS FET, is stopped, reducing current consumption. When not using the EN pin,
connect it to the VIN pin. Since the EN pin is neither pulled down nor pulled up internally, do not use it in the floating
status. The structure of the EN pin is shown in Figure 6, and the clamp circuit is internally connected. Refer to "3. 1
High level input current (ISH) vs. EN pin voltage (VEN)" in " Characteristics (Typical Data)" for the input current
of EN pin.
EN Pin
"H"
"L"
*1.
*2.
Table 9
Internal Circuit
Enable (normal operation)
Disable (standby)
VOUT
Constant value*1
Pulled down to VSS*2
The constant value is output due to the regulating based on the output voltage setting resistors
(RFB1 and RFB2).
VOUT is pulled down to VSS due to the output voltage setting resistors (RFB1 and RFB2) and a load.
EN
Clamp
circuit
Figure 6
8.
Thermal shutdown function
The S-19932/19933 Series has a built-in thermal shutdown circuit to limit overheating. When the junction
temperature increases to 170°C typ., the thermal shutdown circuit becomes the detection status, and the switching
operation is stopped. When the junction temperature decreases to 150°C typ., the thermal shutdown circuit
becomes the release status, and the switching operation is restarted.
If the thermal shutdown circuit becomes the detection status due to self-heating, the switching operation is stopped
and output voltage (VOUT) decreases. For this reason, the self-heating is limited and the temperature of the IC
decreases. The thermal shutdown circuit becomes release status when the temperature of the IC decreases, and
the switching operation is restarted, thus the self-heating is generated again. Repeating this procedure makes the
waveform of VOUT into a pulse-like form. Note that the product may suffer physical damage such as deterioration if
the above phenomenon occurs continuously. Switching operation stopping and starting can be stopped by either
setting the EN pin to "L", lowering the output current (IOUT) to reduce internal power consumption, or decreasing the
ambient temperature.
Table 10
Thermal Shutdown Circuit
VOUT
Release: 150°C typ.*1
Constant value*2
*1
Detection: 170°C typ.
Pulled down to VSS*3
*1. Junction temperature
*2. The constant value is output due to the regulating based on the output voltage setting resistors
(RFB1 and RFB2).
*3. VOUT is pulled down to VSS due to the output voltage setting resistors (RFB1 and RFB2) and a load.
9
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
9.
Overcurrent protection function
The overcurrent protection circuit monitors the current that flows through the high side power MOS FET and limits
current to prevent thermal destruction of the IC due to an overload, magnetic saturation in the inductor, etc.
When a current exceeding the limit current (ILIM) flows through the high side power MOS FET, the high side power
MOS FET is turned off. When the next switching cycle starts, the high side power MOS FET is turned on. If the
current value continues to remain at ILIM or higher, the high side power MOS FET is turned off again, repeating this
series of operation.
Meanwhile, when the current, which flows through the high side power MOS FET, falls to ILIM or lower, the
S-19932/19933 Series will return to the normal operation.
When the slope of inductor current is large, ILIM may appear to increase due to the delay time of overcurrent
protection circuit. This phenomenon tends to occur when low-inductance inductor is used or when the voltage
different between VIN and VOUT is large.
10.
Frequency foldback function
The frequency foldback function has FB pin voltage (VFB) and oscillation frequency (fOSC) to have a proportional
relation when VFB is 0.7 V typ. or lower. Refer to "11. Short-circuit protection function" for details.
The frequency foldback function in the S-19932 Series is set to invalid at start-up.
10
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
11.
Short-circuit protection function
11. 1 Hiccup control
The S-19932/19933 Series A type has a built-in short-circuit protection function for Hiccup control.
Hiccup control is a method for periodically carrying out automatic recovery when the IC detects overcurrent and
stops the switching operation.
11. 1. 1 When overload status is released
Overcurrent detection
After detection of the FB pin voltage (VFB) < 0.7 V typ., frequency foldback function becomes valid.
Detection of VFB < 0.5 V typ.
0.3 ms elapse
Switching operation stop (for 21 ms typ.)
Overload status release
The IC restarts, soft-start function starts.
In this case, it is unnecessary to input an external reset signal for restart.
VFB reaches 0.72 V typ. after 5.8 ms typ. elapses.
Overload status
Normal load status
1.2 A typ.
*1
IL
0.6 A
0A
VSW
VFB
0V
0.8 V typ.
0.7 V typ.
0.5 V typ.
0.3 ms typ. 21 ms typ. 5.8 ms typ.
*1.
0V
Inductor current
Figure 7
11. 1. 2 When overload status continues
Overcurrent detection
After detection of VFB < 0.7 V typ., frequency foldback function becomes valid.
Detection of VFB < 0.5 V typ.
0.3 ms elapse
Switching operation stop (for 21 ms typ.)
The IC restarts, soft-start function starts.
The status returns to when overload status continues after 8.6 ms typ. elapses.
*1.
Inductor current
Figure 8
11
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
11. 2
Latch control
The S-19932/19933 Series B type has a built-in short-circuit protection function for Latch control.
Latch control is a method for maintaining the Latch status when the IC detects overcurrent and stops the switching
operation.
Overcurrent detection
After detection of VFB < 0.7 V typ., frequency foldback function becomes valid.
Detection of VFB < 0.5 V typ.
0.3 ms elapse
Switching operation stop
Overload status
1.2 A typ.
*1
IL
0.6 A
0A
VSW
0V
0.8 V typ.
0.7 V typ.
VFB
0.5 V typ.
0.3 ms typ.
*1. Inductor current
Figure 9
In addition, Latch status is reset under the following conditions.
• At UVLO detection
• When the EN pin changes from "H" to "L".
12
0V
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
12.
Pre-bias compatible soft-start function
The S-19932/19933 Series has a built-in pre-bias compatible soft-start circuit.
If the pre-bias compatible soft-start circuit starts when electrical charge remains in the output voltage (VOUT) as a
result of power supply restart, etc., or when VOUT is biased beforehand (pre-bias status), switching operation is
stopped until the soft-start voltage exceeds the FB pin voltage (VFB), and then VOUT is maintained. If the soft-start
voltage exceeds VFB, switching operation will restart and VOUT will rise to the output voltage setting value (VOUT(S)).
This allows VOUT(S) to be reached without lowering the pre-biased VOUT.
In soft-start circuits which are not pre-bias compatible, a large current flows as a result of the discharge of the
residual electric charge through the low side power MOS FET when switching operation starts, which could cause
damage, however in a pre-bias compatible soft-start circuit, the IC is protected from the large current when switching
operation starts, and it makes power supply design for the application circuit simpler.
In the S-19932/19933 Series, VOUT reaches VOUT(S) gradually due to the soft-start circuit.
In the following cases, rush current and VOUT overshoot are reduced.
• When the EN pin changes from "L" to "H".
• When UVLO operation is released.*1
• When thermal shutdown is released.*1
• At short-circuit recovery*1
*1. In this case, the soft-start wait time is eliminated.
The soft-start circuit starts operating after "H" is input to the EN pin and the soft-start wait time (tSSW) = 0.58 ms typ.
elapses. The soft-start time (tSS) is set to 5.8 ms typ.
Soft-start
wait time
(tSSW)
Soft-start operation
during pre-bias
Soft-start time
(tSS)
VEN
VOUT
VSW
Figure 10
13.
Internal power supply (VREG)
Some of the circuits in the IC operate using the VREG pin voltage (VREG) as the power supply. To stabilize this
internal power supply, a ceramic capacitor with 1 μF needs to be connected between the VREG pin and the VSS pin.
To achieve low impedance, this capacitor should be placed as close to the IC as possible. Additionally, note that any
external parts other than CREG or any load must not connect to the VREG pin.
13
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
Typical Circuit
VIN
L
EN
VIN
CIN
VOUT
SW
CFB
FB
VREG
VSS
RFB1
COUT
CREG
RFB2
Figure 11
Caution The above connection diagram will not guarantee successful operation. Perform thorough evaluation
using an actual application to set the constants.
14
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
External Parts Selection
The recommended values for each external part are shown in Table 11, and the recommended parts are shown in
Table 12 to Table 16. When selecting an input capacitor (CIN), output capacitor (COUT), and internal power supply
stabilized capacitor (CREG), take into consideration the temperature range and DC bias characteristics of the capacitor
to be used.
VOUT
1.0 V
2.5 V
3.3 V
5.0 V
12.0 V
CIN
4.7 μF
4.7 μF
4.7 μF
4.7 μF
4.7 μF
COUT
10 μF
10 μF
10 μF
10 μF
10 μF
CFB
33 pF
33 pF
33 pF
33 pF
33 pF
Table 11
CREG
1 μF
1 μF
1 μF
1 μF
1 μF
L
2.2 μH
3.3, 4.7 μH
3.3, 4.7 μH
4.7, 6.8 μH
6.8, 10 μH
Recommended Capacitors (CIN) List
Withstanding
Part Number
Capacitance
Voltage
CGA4J1X7R1E475K125AC
25 V
4.7 μF
CGA4J1X7R1H475K125AC
50 V
4.7 μF
CGA5L3X7R1H475K160AB
50 V
4.7 μF
RFB1
3.75 kΩ
31.9 kΩ
46.9 kΩ
84 kΩ
210 kΩ
RFB2
15 kΩ
15 kΩ
15 kΩ
16 kΩ
15 kΩ
Table 12
Manufacturer
TDK Corporation
TDK Corporation
TDK Corporation
Murata Manufacturing
Co., Ltd.
GCM31CR71E475KA55
4.7 μF
25 V
Recommended Capacitors (COUT) List
Withstanding
Part Number
Capacitance
Voltage
CGA4J3X7S1A106K125AB
10 V
10 μF
CGA5L1X7R1C106K160AC
16 V
10 μF
CGA4J1X7S1E106K125AC
25 V
10 μF
Dimensions (L × W × H)
2.0 mm × 1.25 mm × 1.25 mm
2.0 mm × 1.25 mm × 1.25 mm
3.2 mm × 1.6 mm × 1.6 mm
3.2 mm × 1.6 mm × 1.6 mm
Table 13
Manufacturer
TDK Corporation
TDK Corporation
TDK Corporation
Murata Manufacturing
Co., Ltd.
GCM188D70J106ME36
10 μF
6.3 V
Recommended Capacitor (CFB) List
Withstanding
Part Number
Capacitance
Voltage
CGA1A2C0G1H330J030BA
33 pF
50 V
Dimensions (L × W × H)
2.0 mm × 1.25 mm × 1.25 mm
3.2 mm × 1.6 mm × 1.6 mm
2.0 mm × 1.25 mm × 1.25 mm
1.6 mm × 0.8 mm × 0.8 mm
Table 14
Manufacturer
TDK Corporation
0.6 mm × 0.3 mm × 0.3 mm
Table 15
Manufacturer
TDK Corporation
Murata Manufacturing
Co., Ltd.
Recommended Capacitors (CREG) List
Withstanding
Part Number
Capacitance
Voltage
CGA3E1X7R1C105K080AC
16 V
1 μF
Dimensions (L × W × H)
GCM155C71A105KE38
1 μF
10 V
1.6 mm × 0.8 mm × 0.8 mm
1.0 mm × 0.5 mm × 0.5 mm
Table 16
Manufacturer
TDK Corporation
TDK Corporation
TDK Corporation
TDK Corporation
TDK Corporation
TDK Corporation
TDK Corporation
Murata Manufacturing
Co., Ltd.
Murata Manufacturing
Co., Ltd.
Recommended Inductors (L) List
Withstanding
Part Number
Inductance
Voltage
TFM252012ALMA2R2MTAA
2.2 μH
20 V
TFM252012ALMA3R3MTAA
3.3 μH
20 V
CLF5030NIT-3R3N-D
3.3 μH
−
TFM252012ALMA4R7MTAA
4.7 μH
20 V
CLF5030NIT-4R7N-D
4.7 μH
−
CLF5030NIT-6R8N-D
6.8 μH
−
CLF5030NIT-100M-D
10 μH
−
Dimensions (L × W × H)
Dimensions (L × W × H)
2.5 mm × 2.0 mm × 1.2 mm
2.5 mm × 2.0 mm × 1.2 mm
5.0 mm × 5.3 mm × 2.7 mm
2.5 mm × 2.0 mm × 1.2 mm
5.0 mm × 5.3 mm × 2.7 mm
5.0 mm × 5.3 mm × 2.7 mm
5.0 mm × 5.3 mm × 2.7 mm
DFE2MCAH2R2MJ0
2.2 μH
−
2.0 mm × 1.6 mm × 1.2 mm
DFE252012PD-3R3M
3.3 μH
20 V
2.5 mm × 2.0 mm × 1.2 mm
15
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
1.
Input capacitor (CIN)
CIN, which has an effect to suppress the ripple voltage and switching noise to be generated in the power supply line,
is used for the stable operation of IC. A ceramic capacitor with 4.7 μF or higher is recommended.
2.
Output capacitor (COUT)
COUT is used to smooth output voltage. The ripple voltage (ΔVOUT) to be generated in VOUT is inversely proportional
to COUT. When selecting a capacitor whose ESR is sufficiently small, ΔVOUT during current continuous mode is
calculated by the following expression.
ΔVOUT =
ΔIL
8 × fOSC × COUT
In addition, since COUT contributes to the stability of feedback loop, a ceramic capacitor with 10 μF or higher is
recommended. When selecting a capacitor whose capacitance is extremely large, the overcurrent protection
function may start the operation and cause a start-up failure. Therefore, select a capacitor with 200 μF or lower.
3.
Inductor (L)
To suppress the intrinsic subharmonic oscillation in current mode control, the optimal L value needs to be selected.
Considering the slope compensation in the IC, select an inductor from the range of 2.2 μH to 10 μH depending on
VOUT.
When selecting L, note the allowable current. If a current exceeding the allowable current flows through the inductor,
magnetic saturation may occur, and there may be risks which substantially lower efficiency and damage the IC as a
result of large current.
The ripple current (ΔIL) and peak current (IPK) flow through the inductor during current continuous mode are
calculated by the following expressions respectively. Make sure IPK will not exceed the allowable current of inductor.
ΔIL =
VOUT × (VIN − VOUT)
fOSC × L × VIN
ΔIL
IPK = IOUT + 2
In order to maintain the allowable current of inductor even in cases VOUT shorts to VSS or other fault conditions occur,
an inductor with 1.4 A or higher, the maximum value of ILIM, needs to be selected.
4.
Internal power supply stabilized capacitor (CREG)
CREG is used to stabilize the operation of IC's internal power supply (VREG = 4.5 V typ.) A ceramic capacitor with
1 μF is recommended.
16
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
5.
Output voltage setting resistors (RFB1, RFB2), capacitor for phase compensation (CFB)
VOUT can be set to any value using RFB1 and RFB2. VOUT can be calculated by the following expression substituting
VFB = 0.8 V typ. Note that if the RFB1 and RFB2 values are increased, the FB pin will more likely to be affected by
noise. A resistor with approximately 15 kΩ is recommended for RFB2.
VOUT =
(RFB1 + RFB2)
× 0.8
RFB2
CFB connected in parallel with RFB1 is a capacitor for phase compensation. Using RFB1 and CFB to set the zero point
(the phase feedback) allows the feedback loop to gain larger phase margin.
When selecting CFB, refer to the following expressions. In addition, perform thorough evaluations with the actual
applications to set the constants.
First, calculate the zero point frequency (fz) by the following expression.
1
VFB
× V
fZ = 3.94 × C
OUT
OUT
Next, substitute RFB1 and fZ gained by the above expression into the below expression to calculate CFB value.
CFB =
1
2 × π× RFB1 × fZ
Caution Generally a switching regulator may cause oscillation depending on the selection of external parts.
Perform thorough evaluations including the temperature characteristics with actual applications to
confirm no oscillation occurs.
17
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
Board Layout Guidelines
Note the following cautions when determining the board layout for the S-19932/19933 Series.
• Place CIN as close to the VIN pin and the VSS pin as possible. Prioritize the layout of CIN.
• Place CREG as close to the VREG pin and the VSS pin as possible.
• Mount CIN and CREG on the same surface layer as the IC. If they are connected through thermal vias, the
impedance of the thermal vias may influence the operation, resulting in unstable condition.
• Make the wiring of the FB pin as short as possible. The parasitic capacitance of FB pin may affect the phase margin
of feedback loop.
• Do not place the FB pin close to noise sources such as the wiring of SW pin to avoid unstable operations.
• Make the GND pattern as wide as possible.
• Place thermal vias in the GND pattern to ensure sufficient heat dissipation.
• Large current flows through the SW pin. Make the wiring area of the pattern to be connected to the SW pin small to
minimize parasitic capacitance and emission noise.
• Make a short loop wiring of the SW pin → L → COUT → VSS pin. This is effective to reduce emission noise.
• Do not wire the SW pin pattern under the IC.
Total size
7.9 mm × 3.9 mm = 30.81 mm2
Figure 12
Reference Board Pattern
Caution The above pattern diagram does not guarantee successful operation. Perform thorough evaluation
using the actual application to determine the pattern.
18
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
Related Source
Refer to the following application note for recommended noise suppression parts and board layouts that help
reduce conductive noise and emission noise for the S-19932/19933 Series.
This application note also summarizes CISPR25 compliant measurement results.
S-19932/19933 Series NOISE COUNTERMEASURES AND CISPR25 MEASUREMENT RESULTS
Application Note
Precautions
•
Mount external capacitors and inductors as close as possible to the IC, and make single GND.
•
Characteristic ripple voltage and spike noise occur in the IC containing switching regulators. Moreover rush current
flows at the time of a power supply injection. Because these largely depend on the inductor, the capacitor and
impedance of power supply to be used, fully check them using an actually mounted model.
•
The 4.7 μF capacitor connected between the VIN pin and the VSS pin is a bypass capacitor. It stabilizes the power
supply in the IC, and thus effectively works for stable switching regulator operation. Allocate the bypass capacitor
as close to the IC as possible, prioritized over other parts.
•
Although the IC contains a static electricity protection circuit, static electricity or voltage that exceeds the limit of
the protection circuit should not be applied.
•
The power dissipation of the IC greatly varies depending on the size and material of the board to be connected.
Perform sufficient evaluation using an actual application before designing.
•
ABLIC Inc. assumes no responsibility for the way in which this IC is used on products created using this IC or for
the specifications of that product, nor does ABLIC Inc. assume any responsibility for any infringement of patents or
copyrights by products that include this IC either in Japan or in other countries.
19
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
Characteristics (Typical Data)
Example of major power supply dependence characteristics (Ta = +25°C)
1. 1
Current consumption during switching off (ISS) vs. Input voltage (VIN)
ISS [μA]
1. 1. 1
S-19932 Series
1. 1. 2
150
225
125
200
100
175
150
100
6
8
10 12
VIN [V]
14
16
18
Current consumption during shutdown (ISSS)
vs. Input voltage (VIN)
4
6
8
10 12
VIN [V]
14
16
18
1. 3 FB pin voltage (VFB) vs. Input voltage (VIN)
100
0.810
80
0.805
VFB [V]
ISSS [nA]
50
0
4
60
40
0.800
0.795
20
0
75
25
125
1. 2
S-19933 Series
250
ISS [μA]
1.
4
6
8
10 12
VIN [V]
14
16
0.790
18
4
6
8
10 12
VIN [V]
14
16
18
1. 4 Oscillation frequency (fOSC) vs. Input voltage (VIN)
2.3
2.2
2.1
2.0
tSSW [ms]
1. 5
4
10 12 14 16 18
VIN [V]
Soft-start wait time (tSSW) vs. Input voltage (VIN)
6
8
Soft-start time (tSS) vs. Input voltage (VIN)
1.0
10
0.8
8
0.6
0.4
0.2
6
4
2
0.0
0
4
20
1. 6
tSS [ms]
fOSC [MHz]
2.4
6
8
10 12
VIN [V]
14
16
18
4
6
8
10 12
VIN [V]
14
16
18
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
1. 7
High side power MOS FET on-resistance (RHFET) 1. 8
vs. Input voltage (VIN)
1.0
0.8
1.5
RLFET [Ω]
RHFET [Ω]
2.0
1.0
0.5
6
8
10 12
VIN [V]
14
16
18
High side power MOS FET leakage current (IHSW)
vs. Input voltage (VIN)
4
1. 10
1000
80
800
60
40
20
6
8
10 12
VIN [V]
14
16
18
Low side power MOS FET leakage current (ILSW)
vs. Input voltage (VIN)
100
ILSW [nA]
IHSW [nA]
0.4
0.0
4
600
400
200
0
0
4
1. 11
0.6
0.2
0.0
1. 9
Low side power MOS FET on-resistance (RLFET)
vs. Input voltage (VIN)
6
8
10 12
VIN [V]
14
16
18
4
6
8
10 12
VIN [V]
14
16
18
Limit current (ILIM) vs. Input voltage (VIN)
1.4
ILIM [A]
1.3
1.2
1.1
1.0
4
6
8
10 12
VIN [V]
14
16
18
1. 13 Low level input voltage (VSL) vs. Input voltage (VIN)
3.0
3.0
2.5
2.5
2.0
2.0
VSL [V]
VSH [V]
1. 12 High level input voltage (VSH) vs. Input voltage (VIN)
1.5
1.0
0.5
1.5
1.0
0.5
0.0
0.0
4
6
8
10 12
VIN [V]
14
16
18
4
6
8
10 12
VIN [V]
14
16
18
21
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
2.
Example of major temperature characteristics (Ta = −40°C to +125°C)
2. 1
Current consumption during switching off (ISS) vs. Temperature (Ta)
2. 1. 1
S-19932 Series
2. 1. 2
VIN = 12 V
225
125
200
100
175
150
2. 2
0
25
50
Ta [°C]
75
100
2. 3
0
25
50
Ta [°C]
75
100
125
FB pin voltage (VFB) vs. Temperature (Ta)
VIN = 12 V
0.810
80
0.805
60
VFB [V]
ISSS [nA]
50
0
−40 −25
125
Current consumption during shutdown (ISSS)
vs. Temperature (Ta)
VIN = 12 V
100
40
0.800
0.795
20
0
−40 −25
75
25
125
100
−40 −25
VIN = 12 V
150
ISS [μA]
ISS [μA]
250
S-19933 Series
0
25
50
Ta [°C]
75
100
0.790
−40 −25
125
0
25
50
Ta [°C]
75
100
125
2. 4 Oscillation frequency (fOSC) vs. Temperature (Ta)
VIN = 12 V
fOSC [MHz]
2.4
2.3
2.2
2.1
2.0
−40 −25
2. 6 UVLO release voltage (VUVLO+) vs. Temperature (Ta)
3.6
3.6
3.5
3.5
VUVLO+ [V]
VUVLO− [V]
25
50
75 100 125
Ta [°C]
2. 5 UVLO detection voltage (VUVLO−) vs. Temperature (Ta)
3.4
3.3
3.2
−40 −25
22
0
0
25
50
Ta [°C]
75
100
125
3.4
3.3
3.2
−40 −25
0
25
50
Ta [°C]
75
100
125
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
2. 7
Soft-start wait time (tSSW) vs. Temperature (Ta)
2. 8
VIN = 12 V
1.0
tSS [ms]
tSSW [ms]
8
0.6
0.4
0.0
−40 −25
0
25
50
Ta [°C]
75
100
2. 10
0
25
50
Ta [°C]
75
100
125
Low side power MOS FET on-resistance (RLFET)
vs. Temperature (Ta)
1.0
2.0
0.8
VIN = 4 V
RLFET [Ω]
RHFET [Ω]
4
0
−40 −25
125
2. 9 High side power MOS FET on-resistance (RHFET)
vs. Temperature (Ta)
1.0
0.5
0.0
−40 −25
VIN = 12 V
0
25
50
Ta [°C]
75
100
0.4
0.0
−40 −25
125
100
50
0
25
50
Ta [°C]
75
100
125
2. 12 Low side power MOS FET leakage current (ILSW)
vs. Temperature (Ta)
VIN = 12 V
200
ILSW [nA]
150
0
−40 −25
0.6
VIN = 12 V
VIN = 4 V
0.2
2. 11 High side power MOS FET leakage current (IHSW)
vs. Temperature (Ta)
VIN = 12 V
200
IHSW [nA]
6
2
0.2
2. 13
VIN = 12 V
10
0.8
1.5
Soft-start time (tSS) vs. Temperature (Ta)
150
100
50
0
25
50
Ta [°C]
75
100
125
0
−40 −25
0
25
50
Ta [°C]
75
100
125
Limit current (ILIM) vs. Temperature (Ta)
VIN = 12 V
1.4
ILIM [A]
1.3
1.2
1.1
1.0
−40 −25
0
25
50
Ta [°C]
75
100
125
23
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
2. 14 High level input voltage (VSH) vs. Temperature (Ta)
2. 15 Low level input voltage (VSL) vs. Temperature (Ta)
VIN = 12 V
3.0
2.5
2.5
2.0
2.0
VSL [V]
VSH [V]
VIN = 12 V
3.0
1.5
1.0
0.5
1.5
1.0
0.5
0.0
−40 −25
0
25
50
Ta [°C]
75
100
0.0
−40 −25
125
0
25
50
Ta [°C]
75
100
125
EN pin characteristics (Ta = +25°C)
3.
3. 1
High level input current (ISH) vs. EN pin voltage (VEN)
60
ISH [μA]
45
30
15
0
3
0
9
12
VEN [V]
15
18
Transient response characteristics
The external parts shown in Table 17 are used in "4.
Element Name
Constant
4.7 μH
4.7 μF
10 μF
Inductor
Input capacitor
Output capacitor
Table 17
Manufacturer
IOUT = 1 mA
4. 1. 2 IOUT = 600 mA
20
16
12
0
8
VIN
−10
4
−20
VOUT
0
5
10
Time [ms]
15
20
16
10
VIN [V]
10
VIN [V]
CLF5030NIT-4R7N-D
CGA5L3X7R1H475K160AB
CGA5L1X7R1C106K160AC
12
0
8
VIN
−10
0
−20
−4
−30
4
0
VOUT
0
5
10
Time [ms]
15
20
−4
VOUT [V]
4. 1. 1
20
24
Part Number
TDK Corporation
TDK Corporation
TDK Corporation
Power-on (VOUT = 5.0 V, VIN = VEN =0 V → 12 V, Ta = +25°C)
4. 1
−30
Transient response characteristics".
VOUT [V]
4.
6
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
4. 2
Transient response characteristics of EN pin
(VOUT = 5.0 V, VIN = 12 V, VEN = 0 V → 2 V, Ta = +25°C)
4. 2. 2 IOUT = 600 mA
3
25
2
20
1
15
1
15
0
−3
10
VEN
−1
5
VOUT
5
0
10
15
20
VEN [V]
20
−2
0
0
−2
−5
−3
10
VEN
−1
5
0
VOUT
5
0
10
Time [ms]
VIN [V]
IOUT = 1 mA
0.08
0.04
0.02
9
VOUT = 5 V
6
3
0.0
4. 3. 2 IOUT = 600 mA
18
0.06
VIN
12
0.2
0.4
0.6
0.8
1.0
0.06
12
VIN
0.04
0.02
9
0.00
6
−0.02
3
VOUT = 5 V
0.0
0.2
−800
−1200
0.4
0.6
0.8
1.0
−0.02
Time [ms]
IOUT = 10 mA → 200 mA → 10 mA
0.8
4. 4. 2 IOUT = 10 mA → 600 mA → 10 mA
800
0.6
IOUT
0.4
0.2
VOUT = 5 V
0.0
0.2
0.4
0.6
Time [ms]
0.8
1.0
0.8
0.6
400
IOUT [mA]
400
−400
0.00
Load fluctuation (VOUT = 5.0 V, Ta = +25°C)
4. 4. 1
800
0
−5
0.08
15
Time [ms]
4. 4
20
Power supply fluctuation (VOUT = 5.0 V, VIN = 12 V → 16 V → 12 V, Ta = +25°C)
4. 3. 1
18
15
15
Time [ms]
VIN [V]
4. 3
IOUT [mA]
25
2
VOUT [V]
IOUT = 1 mA
VOUT [V]
VEN [V]
4. 2. 1
3
0
−400
0.0
−800
−0.2
−1200
IOUT
0.4
0.2
VOUT = 5 V
0.0
0.2
0.0
0.4
0.6
0.8
1.0
−0.2
Time [ms]
25
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
Reference Data
The external parts shown in Table 18 are used in " Reference Data".
Condition
1.
Inductor (L)
CLF5030NIT-4R7N-D (4.7 μH)
TDK Corporation
CLF5030NIT-3R3N-D (3.3 μH)
TDK Corporation
Table 18
Input Capacitor (CIN)
CGA5L3X7R1H475K160AB (4.7 μF)
TDK Corporation
CGA5L3X7R1H475K160AB (4.7 μF)
TDK Corporation
VOUT = 5.0 V (External parts: Condition)
1. 1
Efficiency (η) vs. Output current (IOUT)
1. 1. 1
S-19932 Series
1. 1. 2
100
VIN = 8 V
40
1
10
IOUT [mA]
100
1000
0.1
1
10
IOUT [mA]
100
1000
Output voltage (VOUT) vs. Output current (IOUT)
1. 2. 1
S-19932 Series
1. 2. 2
5.20
S-19933 Series
5.20
VIN = 8 V
5.10
VOUT [V]
VOUT [V]
VIN = 16 V
VIN = 12 V
40
0
0.1
5.00
4.90
VIN = 8 V
5.10
5.00
4.90
VIN = 16 V
VIN = 12 V
4.80
VIN = 16 V
VIN = 12 V
4.80
0.1
1
10
IOUT [mA]
100
1000
0.1
1
10
IOUT [mA]
100
1000
Ripple voltage (ΔVOUT) vs. Output current (IOUT)
1. 3. 1
S-19932 Series
1. 3. 2
100
100
80
80
60
ΔVOUT [mV]
ΔVOUT [mV]
60
20
VIN = 16 V
0
1. 3
VIN = 8 V
80
η [%]
η [%]
60
20
1. 2
S-19933 Series
100
VIN = 12 V
80
VIN = 12 V
40
VIN = 8 V
20
VIN = 16 V
0
S-19933 Series
60
40
VIN = 8 V
VIN = 12 V
VIN = 16 V
20
0
0.1
26
Output Capacitor (COUT)
CGA5L1X7R1C106K160AC (10 μF)
TDK Corporation
CGA5L1X7R1C106K160AC (10 μF)
TDK Corporation
1
10
IOUT [mA]
100
1000
0.1
1
10
IOUT [mA]
100
1000
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
VOUT = 3.3 V (External parts: Condition)
2. 1
Efficiency (η) vs. Output current (IOUT)
2. 1. 1
S-19932 Series
2. 1. 2
100
VIN = 6 V
40
VIN = 16 V
VIN = 16 V
VIN = 12 V
VIN = 8 V
40
0
0.1
1
10
IOUT [mA]
100
1000
0.1
1
10
IOUT [mA]
100
1000
Output voltage (VOUT) vs. Output current (IOUT)
2. 2. 1
S-19932 Series
2. 2. 2
3.50
S-19933 Series
3.50
VIN = 6 V
3.40
VIN = 12 V
VOUT [V]
VOUT [V]
60
20
VIN = 12 V
0
3.30
3.20
VIN = 6 V
3.40
VIN = 12 V
3.30
3.20
VIN = 16 V
VIN = 8 V
3.10
VIN = 16 V
VIN = 8 V
3.10
0.1
1
10
IOUT [mA]
100
1000
0.1
1
10
IOUT [mA]
100
1000
Ripple voltage (ΔVOUT) vs. Output current (IOUT)
2. 3. 1
S-19932 Series
2. 3. 2
100
100
80
80
60
VIN = 16 V
VIN = 8 V
40
VIN = 6 V
20
ΔVOUT [mV]
2. 3
VIN = 6 V
80
η [%]
η [%]
60
20
2. 2
S-19933 Series
100
VIN = 8 V
80
ΔVOUT [mV]
2.
VIN = 12 V
0
S-19933 Series
60
VIN = 16 V
VIN = 8 V
40
VIN = 6 V
20
VIN = 12 V
0
0.1
1
10
IOUT [mA]
100
1000
0.1
1
10
IOUT [mA]
100
1000
27
AUTOMOTIVE, 125°C OPERATION, 18 V INPUT, 600 mA SYNCHRONOUS STEP-DOWN SWITCHING REGULATOR
Rev.2.3_00
S-19932A/19932B/19933A/19933B Series
Power Dissipation
HTMSOP-8
HSNT-8(2030)
Tj = +150°C max.
5
Tj = +150°C max.
5
Power dissipation (PD) [W]
Power dissipation (PD) [W]
E
4
C
3 D
2
B
1
E
4
C
3
D
2
B
1
A
0
0
A
25
50
75
100
125
150
175
0
0
25
Ambient temperature (Ta) [°C]
Board
A
B
C
D
E
Board
A
B
C
D
E
1.11 W
3.21 W
3.13 W
4.17 W
HSNT-6(2025)
Tj = +150°C max.
Power dissipation (PD) [W]
4
E
C
3
D
2
B
1
A
0
0
25
50
75
100
125
150
Ambient temperature (Ta) [°C]
28
Board
Power Dissipation (PD)
A
0.69 W
B
0.98 W
C
2.91 W
D
E
2.84 W
3.47 W
75
100
125
150
Ambient temperature (Ta) [°C]
Power Dissipation (PD)
0.79 W
5
50
175
Power Dissipation (PD)
0.69 W
0.93 W
3.13 W
2.98 W
3.91 W
175
HTMSOP-8 Test Board
IC Mount Area
(1) Board A
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
1
2
3
4
Thermal via
Specification
114.3 x 76.2 x t1.6
FR-4
2
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.070
-
(2) Board B
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
1
2
3
4
Thermal via
Specification
114.3 x 76.2 x t1.6
FR-4
4
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
-
(3) Board C
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
Thermal via
1
2
3
4
Specification
114.3 x 76.2 x t1.6
FR-4
4
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
Number: 4
Diameter: 0.3 mm
No. HTMSOP8-A-Board-SD-1.0
enlarged view
ABLIC Inc.
HTMSOP-8 Test Board
IC Mount Area
(4) Board D
Item
Size [mm]
Material
Number of copper foil layer
Specification
114.3 x 76.2 x t1.6
FR-4
4
Thermal via
2
Pattern for heat radiation: 2000mm t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
-
Item
Size [mm]
Material
Number of copper foil layer
Specification
114.3 x 76.2 x t1.6
FR-4
4
Copper foil layer [mm]
1
2
3
4
enlarged view
(5) Board E
Copper foil layer [mm]
Thermal via
1
2
3
4
2
Pattern for heat radiation: 2000mm t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
Number: 4
Diameter: 0.3 mm
enlarged view
No. HTMSOP8-A-Board-SD-1.0
ABLIC Inc.
HSNT-8(2030) Test Board
IC Mount Area
(1) Board A
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
1
2
3
4
Thermal via
Specification
114.3 x 76.2 x t1.6
FR-4
2
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.070
-
(2) Board B
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
1
2
3
4
Thermal via
Specification
114.3 x 76.2 x t1.6
FR-4
4
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
-
(3) Board C
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
Thermal via
1
2
3
4
Specification
114.3 x 76.2 x t1.6
FR-4
4
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
Number: 4
Diameter: 0.3 mm
enlarged view
No. HSNT8-A-Board-SD-2.0
ABLIC Inc.
HSNT-8(2030) Test Board
IC Mount Area
(4) Board D
Item
Size [mm]
Material
Number of copper foil layer
Specification
114.3 x 76.2 x t1.6
FR-4
4
Thermal via
2
Pattern for heat radiation: 2000mm t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
-
Item
Size [mm]
Material
Number of copper foil layer
Specification
114.3 x 76.2 x t1.6
FR-4
4
Copper foil layer [mm]
1
2
3
4
enlarged view
(5) Board E
Copper foil layer [mm]
Thermal via
1
2
3
4
2
Pattern for heat radiation: 2000mm t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
Number: 4
Diameter: 0.3 mm
enlarged view
No. HSNT8-A-Board-SD-2.0
ABLIC Inc.
HSNT-6(2025) Test Board
IC Mount Area
(1) Board A
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
1
2
3
4
Thermal via
Specification
114.3 x 76.2 x t1.6
FR-4
2
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.070
-
(2) Board B
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
1
2
3
4
Thermal via
Specification
114.3 x 76.2 x t1.6
FR-4
4
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
-
(3) Board C
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
Thermal via
1
2
3
4
Specification
114.3 x 76.2 x t1.6
FR-4
4
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
Number: 4
Diameter: 0.3 mm
No. HSNT6-B-Board-SD-1.0
enlarged view
ABLIC Inc.
HSNT-6(2025) Test Board
IC Mount Area
(4) Board D
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
1
2
3
4
Thermal via
Specification
114.3 x 76.2 x t1.6
FR-4
4
2
Pattern for heat radiation: 2000mm t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
-
enlarged view
(5) Board E
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
Thermal via
1
2
3
4
Specification
114.3 x 76.2 x t1.6
FR-4
4
2
Pattern for heat radiation: 2000mm t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
Number: 4
Diameter: 0.3 mm
enlarged view
No. HSNT6-B-Board-SD-1.0
ABLIC Inc.
2.90±0.2
1.85
8
5
1
4
0.13±0.1
0.2±0.1
0.65±0.1
No. FP008-A-P-SD-2.0
TITLE
HTMSOP8-A-PKG Dimensions
No.
FP008-A-P-SD-2.0
ANGLE
UNIT
mm
ABLIC Inc.
2.00±0.05
4.00±0.1
4.00±0.1
1.00±0.1
+0.1
1.5 -0
1.05±0.05
0.30±0.05
3.25±0.05
4
1
5
8
Feed direction
No. FP008-A-C-SD-1.0
TITLE
HTMSOP8-A-Carrier Tape
No.
FP008-A-C-SD-1.0
ANGLE
UNIT
mm
ABLIC Inc.
16.5max.
13.0±0.3
Enlarged drawing in the central part
13±0.2
(60°)
(60°)
No. FP008-A-R-SD-1.0
TITLE
HTMSOP8-A-Reel
No.
FP008-A-R-SD-1.0
ANGLE
QTY.
UNIT
mm
ABLIC Inc.
4,000
0.35
1.90
0.65
0.65
0.65
No. FP008-A-L-SD-2.0
TITLE
No.
HTMSOP8-A
-Land Recommendation
FP008-A-L-SD-2.0
ANGLE
UNIT
mm
ABLIC Inc.
2.0±0.1
8
5
(1.70)
1
4
+0.05
0.08 -0.02
0.5
0.23±0.1
The heat sink of back side has different electric
potential depending on the product.
Confirm specifications of each product.
Do not use it as the function of electrode.
No. PP008-A-P-SD-2.0
TITLE
HSNT-8-A-PKG Dimensions
No.
PP008-A-P-SD-2.0
ANGLE
UNIT
mm
ABLIC Inc.
+0.1
ø1.5 -0
2.0±0.05
4.0±0.1
0.25±0.05
+0.1
ø1.0 -0
0.60±0.05
4.0±0.1
2.3±0.05
4 321
5 6 78
Feed direction
No. PP008-A-C-SD-1.0
TITLE
HSNT-8-A-Carrier Tape
No.
PP008-A-C-SD-1.0
ANGLE
UNIT
mm
ABLIC Inc.
+1.0
9.0 - 0.0
11.4±1.0
Enlarged drawing in the central part
ø13±0.2
(60°)
(60°)
No. PP008-A-R-SD-1.0
HSNT-8-A-Reel
TITLE
No.
PP008-A-R-SD-1.0
ANGLE
QTY.
UNIT
mm
ABLIC Inc.
5,000
1.6
0.30
0.50
No. PP008-A-L-SD-1.0
TITLE
No.
HSNT-8-A
-Land Recommendation
PP008-A-L-SD-1.0
ANGLE
UNIT
mm
ABLIC Inc.
1.96±0.05
1.78±0.1
6
5
0.5
1
4
2
3
0.5
0.5
0.12±0.04
0.48±0.02
0.22±0.05
The heat sink of back side has different electric
potential depending on the product.
Confirm specifications of each product.
Do not use it as the function of electrode.
No. PJ006-B-P-SD-1.0
TITLE
HSNT-6-C-PKG Dimensions
No.
PJ006-B-P-SD-1.0
ANGLE
UNIT
mm
ABLIC Inc.
ø1.5
+0.1
-0
2.0±0.05
4.0±0.1
ø0.5±0.1
0.25±0.05
0.65±0.05
4.0±0.1
2.25±0.05
3 21
0.5
0.5
0.5
0.5
0.5
0.5
4 5 6
Feed direction
No. PJ006-B-C-SD-1.0
TITLE
HSNT-6-C-Carrier Tape
No.
PJ006-B-C-SD-1.0
ANGLE
UNIT
mm
ABLIC Inc.
9.0
+1.0
- 0.0
11.4±1.0
Enlarged drawing in the central part
ø13±0.2
(60°)
(60°)
No. PJ006-B-R-SD-1.0
TITLE
HSNT-6-C-Reel
No.
PJ006-B-R-SD-1.0
QTY.
ANGLE
UNIT
mm
ABLIC Inc.
5,000
Land Recommendation
0.50
0.35
0.50
1.44
1.78
2.10
Caution It is recommended to solder the heat sink to a board in order to ensure the heat radiation.
PKG
Stencil Opening
1.40
0.50
0.50
No. PJ006-B-LM-SD-1.0
0.35
Caution
Mask aperture ratio of the lead mounting part is 100~120%.
Mask aperture ratio of the heat sink mounting part is 30%.
Mask thickness: t0.12 mm
Reflow atmosphere: Nitrogen atmosphere is recommended.
(Oxygen concentration: 1000ppm or less)
100~120%
30%
t0.12 mm
TITLE
HSNT-6-C
-Land &Stencil Opening
PJ006-B-LM-SD-1.0
No.
ANGLE
UNIT
mm
1000ppm
ABLIC Inc.
Disclaimers (Handling Precautions)
1.
All the information described herein (product data, specifications, figures, tables, programs, algorithms and
application circuit examples, etc.) is current as of publishing date of this document and is subject to change without
notice.
2.
The circuit examples and the usages described herein are for reference only, and do not guarantee the success of
any specific mass-production design.
ABLIC Inc. is not liable for any losses, damages, claims or demands caused by the reasons other than the products
described herein (hereinafter "the products") or infringement of third-party intellectual property right and any other
right due to the use of the information described herein.
3.
ABLIC Inc. is not liable for any losses, damages, claims or demands caused by the incorrect information described
herein.
4.
Be careful to use the products within their ranges described herein. Pay special attention for use to the absolute
maximum ratings, operation voltage range and electrical characteristics, etc.
ABLIC Inc. is not liable for any losses, damages, claims or demands caused by failures and / or accidents, etc. due to
the use of the products outside their specified ranges.
5.
Before using the products, confirm their applications, and the laws and regulations of the region or country where they
are used and verify suitability, safety and other factors for the intended use.
6.
When exporting the products, comply with the Foreign Exchange and Foreign Trade Act and all other export-related
laws, and follow the required procedures.
7.
The products are strictly prohibited from using, providing or exporting for the purposes of the development of
weapons of mass destruction or military use. ABLIC Inc. is not liable for any losses, damages, claims or demands
caused by any provision or export to the person or entity who intends to develop, manufacture, use or store nuclear,
biological or chemical weapons or missiles, or use any other military purposes.
8.
The products are not designed to be used as part of any device or equipment that may affect the human body, human
life, or assets (such as medical equipment, disaster prevention systems, security systems, combustion control
systems, infrastructure control systems, vehicle equipment, traffic systems, in-vehicle equipment, aviation equipment,
aerospace equipment, and nuclear-related equipment), excluding when specified for in-vehicle use or other uses by
ABLIC, Inc. Do not apply the products to the above listed devices and equipments.
ABLIC Inc. is not liable for any losses, damages, claims or demands caused by unauthorized or unspecified use of
the products.
9.
In general, semiconductor products may fail or malfunction with some probability. The user of the products should
therefore take responsibility to give thorough consideration to safety design including redundancy, fire spread
prevention measures, and malfunction prevention to prevent accidents causing injury or death, fires and social
damage, etc. that may ensue from the products' failure or malfunction.
The entire system in which the products are used must be sufficiently evaluated and judged whether the products are
allowed to apply for the system on customer's own responsibility.
10. The products are not designed to be radiation-proof. The necessary radiation measures should be taken in the
product design by the customer depending on the intended use.
11. The products do not affect human health under normal use. However, they contain chemical substances and heavy
metals and should therefore not be put in the mouth. The fracture surfaces of wafers and chips may be sharp. Be
careful when handling these with the bare hands to prevent injuries, etc.
12. When disposing of the products, comply with the laws and ordinances of the country or region where they are used.
13. The information described herein contains copyright information and know-how of ABLIC Inc. The information
described herein does not convey any license under any intellectual property rights or any other rights belonging to
ABLIC Inc. or a third party. Reproduction or copying of the information from this document or any part of this
document described herein for the purpose of disclosing it to a third-party is strictly prohibited without the express
permission of ABLIC Inc.
14. For more details on the information described herein or any other questions, please contact ABLIC Inc.'s sales
representative.
15. This Disclaimers have been delivered in a text using the Japanese language, which text, despite any translations into
the English language and the Chinese language, shall be controlling.
2.4-2019.07
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