TSPB10U45S S1G

TSPB10U45S Taiwan Semiconductor 10A, 45V Low VF Trench Schottky Surface Mount Rectifier FEATURES ● ● ● ● ● ● ● ● ● KEY PARAMETERS Patented Trench Schottky technology Excellent high temperature stability Low forward voltage Lower power loss/ high efficiency High forward surge capability Ideal for automated placement Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 PARAMETER VALUE UNIT IF 10 A VRRM 45 V IFSM 275 A TJ MAX 150 °C Package SMPC4.0 Configuration Single die APPLICATIONS ● Switching mode power supply (SMPS) ● Adapters ● DC to DC converter MECHANICAL DATA ● ● ● ● ● ● Case: SMPC4.0 Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.095g (approximately) SMPC4.0 ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL Marking code on the device TSPB10U45S UNIT B10U45 Repetitive peak reverse voltage VRRM 45 V Reverse voltage, total rms value VR(RMS) 31 V Forward current Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load Junction temperature IF 10 A IFSM 275 A TJ - 55 to +150 °C Storage temperature TSTG - 55 to +150 °C 1 Version: H2103 TSPB10U45S Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT RӨJL 25 °C/W Junction-to-lead thermal resistance ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER CONDITIONS SYMBOL IF = 5A, TJ = 25°C Forward voltage IF = 10A, TJ = 25°C (1) IF = 5A, TJ = 125°C VF IF = 10A, TJ = 125°C Reverse current @ rated VR (2) TJ = 25°C TJ = 125°C IR TYP MAX UNIT 0.37 - V 0.42 0.46 V 0.28 - V 0.37 0.41 V - 300 μA - 140 mA Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms ORDERING INFORMATION ORDERING CODE PACKAGE PACKING TSPB10U45S SMPC4.0 6,000 / Tape & Reel 2 Version: H2103 TSPB10U45S Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 10000 10 CAPACITANCE (pF) 8 6 4 1000 2 0 f=1.0MHz Vsig=50mVp-p 100 25 50 75 100 125 150 0.1 1 LEAD TEMPERATURE (°C) INSTANTANEOUS FORWARD CURRENT (A) INSTANTANEOUS REVERSE CURRENT (mA) Fig.4 Typical Forward Characteristics 100 TJ=125°C 10 TJ=100°C 1 0.1 TJ=25°C 0.01 20 30 40 50 60 70 80 100 REVERSE VOLTAGE (V) Fig.3 Typical Reverse Characteristics 10 10 90 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 100 10 10 1 UF1DLW TJ=150°C TJ=125°CT =125°C J TJ=25°C 0.1 1 0.01 (A) AVERAGE FORWARD CURRENT (A) 12 TJ=100°C TJ=25°C Pulse width 300μs 1% duty cycle Pulse width 0.1 0.001 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.8 1 1.1 FORWARD VOLTAGE (V) 3 Version: H2103 1.2 TSPB10U45S Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS SMPC4.0 SUGGESTED PAD LAYOUT MARKING DIAGRAM P/N = Marking Code 4 YW = Date Code F = Factory Code Version: H2103 TSPB10U45S Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 5 Version: H2103