RS2259XTSS16

RS2259 0.6Ω Quad SPST Analog Switch 4-Channel 1:1 Multiplexer – Demultiplexer FEATURES DESCRIPTION • Bandwidth: 30MHz • High Speed, Typically 50ns • Supply Range: +1.8V to +5.5V • Low ON-State Resistance, 0.6Ω(TYP) • Break-Before-Make Switching • Rail-to-Rail Operation • TTL/CMOS Compatible • Extended Industrial Temperature Range: -40°C to +125°C The RS2259 is a bidirectional 4-channel single-pole single -throw (SPST) analog switch, which is designed to operate from 1.8V to 5.5V. The RS2259 device can handle both analog and digital signals. It features bandwidth(30MHz) and low onresistance (0.6Ω TYP). Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems. APPLICATIONS • Video Switching • Relay Replacements • USB Switching • Battery-Operated Equipment • Cell Phones PIN CONFIGURATIONS (TOP VIEW) SELx 0 1 STATE All Channels ON All Channels OFF 1 16 SEL4 D1 2 15 D4 S1 3 N.C 4 GND 5 S2 6 D2 7 10 D3 SEL2 8 9 RS2259 FUNCTION TABLE SEL1 14 S4 13 VDD 12 N.C 11 S3 SEL3 TSSOP-16 PIN DESCRIPTION NAME VDD GND SEL1~SEL4 D1~D4 S1~S4 N.C REV C.1 PIN 13 5 1,8,9,16 2,7,10,15 3,6,11,14 4,12 FUNCTION Power Supply Ground Logic Control Pin Drain pin. Can be an input or output. Source pin. Can be an input or output No internet connection 1 www.run-ic.com RS2259 BLOCK DIAGRAM SEL1 D1 S1 D2 S2 SEL2 SEL3 D3 S3 D4 S4 SEL4 2 www.run-ic.com RS2259 ABSOLUTE MAXIMUM RATINGS (1) V+, IN to GND..................................................-0.3V to 6.0V Analog, Digital Voltage Range (2) …......– 0.3 to (V+) + 0.3V Source or drain Continuous Current .................. ... ±500mA Source or drain Peak Current...……........…........... ±800mA Storage Temperature ……….…………… −65°C to +150°C Operating Temperature ……….........…… −40°C to +125°C Junction Temperature.................................................150°C Package Thermal Resistance @ TA = +25°C TSSOP-16……….………….................................. 110°C/W Lead Temperature (Soldering, 10s) …………….......260°C ESD Susceptibility HBM …......................................................................1000V MM ……………………….........………………...……….100V ESD SENSITIVITY CAUTION ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should be current-limited to 10mA or less. PACKAGE/ORDERING INFORMATION PRODUCT RS2259 ORDERING NUMBER RS2259XTSS16 TEMPERATURE RANGE PACKAGE LEAD PACKAGE MARKING PACKAGE OPTION -40°C ~125°C TSSOP-16 RS2259 Tape and Reel,3000 3 www.run-ic.com RS2259 ELECTRICAL CHARACTERISTICS V+ = 5.0 V, TA= –40°C to 125°C (unless otherwise noted)) PARAMETER SYMBOL CONDITIONS VDD TA MIN FULL 0 TYP MAX UNITS ANALOG SWITCH Analog Signal Range VS, VD On-Resistance On-Resistance Match Between Channels On-Resistance Flatness Source, Drain OFF Leakage Current Channel ON Leakage Current RON ΔRON RFLAT(ON) ID(OFF), IS(OFF) ID(ON), IS(ON) VS = V+/2, ISD= -10mA, Switch ON, See Figure 1 VS = V+/2, ISD = -10mA, Switch ON, See Figure 1 0 ≤ (VS) ≤V+/2, ISD = -10mA, Switch ON, See Figure 1 5V 3.3V 5V 3.3V 5V 3.3V VDD V 1.0 Ω 1.2 Ω 1.5 Ω 1.7 Ω 0.1 Ω 0.12 Ω 0.1 Ω 0.12 Ω 0.3 Ω 0.4 Ω 0.7 Ω FULL 0.8 Ω 0.6 +25℃ FULL 1.0 +25℃ FULL 0.04 +25℃ FULL 0.04 +25℃ FULL 0.18 +25℃ FULL 0.54 +25℃ VD = 0.3V, V+/2 VS = V+/2, 0.3V See Figure 2 1.8 to 5.5V FULL 1 μA VD = 0.3V, Open VS = Open, 0.3V See Figure 3 1.8 to 5.5V FULL 1 μA 5V FULL 1.5 V 3.3V FULL 1.3 V 5V FULL 0.6 V 3.3V FULL 0.5 V 1.8 to 5.5V FULL 1 μA DIGITAL CONTROL INPUTS(1) Input High Voltage VIH Input Low Voltage VIL Input Leakage Current IIN VIN = VIO or 0 (1) All unused digital inputs of the device must be held at VIO or GND to ensure proper device operation. 4 www.run-ic.com RS2259 ELECTRICAL CHARACTERISTICS (continued) V+ = 5.0 V, TEMP= –40°C to 125°C (unless otherwise noted)) PARAMETER SYMBOL CONDITIONS V+ TEMP MIN TYP MAX UNITS DYNAMIC CHARACTERISTICS Turn-On Time tON VS = V+, RL = 300Ω, CL = 35pF, See Figure 4 Turn-Off Time tOFF VS = V+, RL = 300Ω, CL = 35pF, See Figure 4 Break-Before-Make Time Delay tBBM VS = 3V, RL = 300Ω, CL = 35pF, See Figure 5 Off Isolation OISO RL = 50Ω, Switch OFF, f = 10MHz See Figure 7 f = 1MHz -3dB Bandwidth Source, Drain OFF Capacitance Source, Drain ON Capacitance BW 5V 3.3V 5V 3.3V 5V 3.3V Switch ON, RL = 50Ω See Figure 6 CS(OFF), CD(OFF) VS=V+/2 or GND, Switch OFF CS(ON), CD(ON) VS=V+/2 or GND, Switch ON 50 50 15 17 10 11 +25℃ +25℃ +25℃ ns ns ns +25℃ -68 dB +25℃ -86 dB +25℃ 30 MHz +25℃ 80 pF +25℃ 350 pF POWER REQUIREMENTS Power Supply Range VDD Power Supply Current IDD FULL VIN = GND or VDD 5.5V 5 FULL 1.8 5.5 V 1 μA www.run-ic.com RS2259 TYPICAL CHARACTERISTICS BANDWIDTH 3 3 0 0 Gain(dB) Gain(dB) BANDWIDTH -3 -3 -6 -6 -9 -9 0 1 10 100 0 1 Frequency(MHz) V+=3V 10 100 Frequency(MHz) V+=5V Typical ron as a Function of Input Voltage (VI ) for VI = 0 to V+ Ron(Ω) 10 1 0.1 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VI(V) V+=5.5V V+=4V V+=3.3V 6 V+=2.5V V+=1.8V www.run-ic.com RS2259 Parameter Measurement Information V ISD Sx Dx RON =V/I SD VS Figure 1.ON-State Resistance (RON) V DD VDD VDD ID (OFF) D1 S1 A A VD A A S4 D4 VS VD VS D1 IS (OFF) ID (OFF) D4 S4 S1 VS VD VS VDD IS (OFF) VD GND GND Figure 2.OFF-State Leakage Current (ID(OFF), IS(OFF)) VDD VDD VDD N.C. D1 S1 VDD IS (ON) ID (ON) A A S1 D1 N.C. S4 D4 N.C. VD VS IS (ON) ID (ON) N.C. D4 S4 A A VD VS GND GND Figure 3.ON-State Leakage Current (ID(ON), IS(ON)) 7 www.run-ic.com RS2259 VDD 0.1μF VDD ADDRESS DRIVE tr < 5ns (VSEL ) VDD tf < 5ns VIH VIL 0V S1 VS D1 OUTPUT CL RL tON tOFF S4 VS D4 OUTPUT 90% RL CL SEL1 - SEL4 OUTPUT VSEL 10% GND 0V Figure 4. Turn-On (tON) and Turn-Off Time (tOFF) VDD 0.1μ F VDD VDD VIH VSEL VIL 0V S1, S4 VS 90% OUTPUT 1 D1, D4 90% RL OUTPUT 2 0V OUTPUT 1 90% S2, S3 VS 90% OUTPUT 2 D2, D3 tBBM2 tBBM1 RL 0V CL SEL1 - SEL4 GND VSEL tBBM=min(tBBM1,tBBM2) CL Figure 5. Break-Before-Make Time (tBBM) V DD 0.1µF VDD VS NETWORK ANALYZER 50Ω S VSIG D VOUT RL 50Ω GND Figure 6.Bandwidth (BW) 8 www.run-ic.com RS2259 0.1µF VDD NETWORK ANALYZER VS 50 Ω S VSIG D VOUT RL 50 Ω SX/DX GND RL 50Ω Off Isolation=20*Log(VOUT/VS) Figure 7.OFF Isolation (OISO) VDD NETWORK ANALYZER 0.1µF VDD VOUT S1 D1 S2 D2 RL 50Ω RL 50Ω VS RL 50Ω 50Ω SX/ DX VSIG= 200mVpp VBIAS = VDD / 2 RL 50Ω GND Figure 8. Crosstalk (XTALK) VDD 0.1μ F VDD VDD VSEL VS D1 OUTPUTV OUT S1 0V CL Output VS QC= C L × VOUT VS VOUT D4 OUTPUTV OUT S4 SEL1 - SEL4 VSEL CL GND Figure 9.Charge Injection (QC) 9 www.run-ic.com RS2259 PACKAGE OUTLINE DIMENSIONS TSSOP-16 e b 5.94 E1 E 1.78 D 0.65 0.42 RECOMMENDED LAND PATTERN (Unit: mm) A2 A1 Symbol H C A θ L Dimensions In Millimeters Min Max A Dimensions In Inches Min Max 1.200 0.047 A1 0.050 0.150 0.002 0.006 A2 0.800 1.050 0.031 0.041 b 0.190 0.300 0.007 0.012 c 0.090 0.200 0.004 0.008 D 4.860 5.100 0.191 0.201 E 4.300 4.500 0.169 0.177 E1 6.200 6.600 0.244 0.260 e L 0.650(BSC) 0.500 H θ 0.026(BSC) 0.700 0.02 0.25TYP 1° 0.028 0.01TYP 7° 10 1° 7° www.run-ic.com