GD25LQ16CSIGR

1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C DATASHEET 1 GD25LQ16C 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C Contents 1 FEATURES .........................................................................................................................................................4 2 GENERAL DESCRIPTION ................................................................................................................................5 3 MEMORY ORGANIZATION ...............................................................................................................................7 4 DEVICE OPERATION ........................................................................................................................................8 5 DATA PROTECTION ..........................................................................................................................................9 6 STATUS REGISTER......................................................................................................................................... 11 7 COMMANDS DESCRIPTION .......................................................................................................................... 13 7.1 WRITE ENABLE (WREN) (06H) ................................................................................................................................ 16 7.2 WRITE DISABLE (WRDI) (04H) ................................................................................................................................ 16 7.3 WRITE ENABLE FOR VOLATILE STATUS REGISTER (50H) ................................................................................................. 17 7.4 READ STATUS REGISTER (RDSR) (05H OR 35H) .......................................................................................................... 17 7.5 WRITE STATUS REGISTER (WRSR) (01H) ................................................................................................................... 18 7.6 READ DATA BYTES (READ) (03H) ............................................................................................................................ 19 7.7 READ DATA BYTES AT HIGHER SPEED (FAST READ) (0BH) .............................................................................................. 19 7.8 DUAL OUTPUT FAST READ (3BH) .............................................................................................................................. 20 7.9 QUAD OUTPUT FAST READ (6BH) ............................................................................................................................. 21 7.10 DUAL I/O FAST READ (BBH) .................................................................................................................................... 21 7.11 QUAD I/O FAST READ (EBH) ................................................................................................................................... 23 7.12 SET BURST WITH WRAP (77H) ................................................................................................................................. 24 7.13 PAGE PROGRAM (PP) (02H) .................................................................................................................................... 25 7.14 QUAD PAGE PROGRAM (32H) .................................................................................................................................. 26 7.15 SECTOR ERASE (SE) (20H) ....................................................................................................................................... 27 7.16 32KB BLOCK ERASE (BE) (52H) ............................................................................................................................... 27 7.17 64KB BLOCK ERASE (BE) (D8H)............................................................................................................................... 28 7.18 CHIP ERASE (CE) (60/C7H) ..................................................................................................................................... 28 7.19 ENABLE/DISABLE SO TO OUTPUT RY/BY# (ESRY/DSRY) (70H/80H) ........................................................................... 29 7.20 DEEP POWER-DOWN (DP) (B9H) ............................................................................................................................. 30 7.21 RELEASE FROM DEEP POWER-DOWN AND READ DEVICE ID (RDI) (ABH) ......................................................................... 31 7.22 READ MANUFACTURE ID/ DEVICE ID (REMS) (90H) .................................................................................................... 32 7.23 READ MANUFACTURE ID/ DEVICE ID DUAL I/O (92H) ................................................................................................. 33 7.24 READ MANUFACTURE ID/ DEVICE ID QUAD I/O (94H) ................................................................................................ 34 7.25 READ IDENTIFICATION (RDID) (9FH) ......................................................................................................................... 35 7.26 PROGRAM/ERASE SUSPEND (PES) (75H) ................................................................................................................... 36 7.27 PROGRAM/ERASE RESUME (PER) (7AH) ................................................................................................................... 36 7.28 READ UNIQUE ID (4BH) .......................................................................................................................................... 37 7.29 ERASE SECURITY REGISTERS (44H) ............................................................................................................................ 37 7.30 PROGRAM SECURITY REGISTERS (42H) ....................................................................................................................... 38 2 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.31 READ SECURITY REGISTERS (48H) ............................................................................................................................. 39 7.32 ENABLE RESET (66H) AND RESET (99H) ..................................................................................................................... 40 7.33 READ SERIAL FLASH DISCOVERABLE PARAMETER (5AH)................................................................................................. 40 ELECTRICAL CHARACTERISTICS .............................................................................................................. 45 8 8.1 POWER-ON TIMING ........................................................................................................................................... 45 8.2 INITIAL DELIVERY STATE ........................................................................................................................................... 45 8.3 ABSOLUTE MAXIMUM RATINGS ................................................................................................................................ 45 8.4 CAPACITANCE MEASUREMENT CONDITIONS ................................................................................................................ 46 8.5 DC CHARACTERISTICS ........................................................................................................................................ 47 8.6 AC CHARACTERISTICS ......................................................................................................................................... 50 ORDERING INFORMATION ............................................................................................................................ 57 9 9.1 10 VALID PART NUMBERS ............................................................................................................................................ 58 PACKAGE INFORMATION ......................................................................................................................... 60 10.1 PACKAGE SOP8 150MIL ........................................................................................................................................ 60 10.2 PACKAGE SOP8 208MIL ........................................................................................................................................ 61 10.3 PACKAGE VSOP8 150MIL ...................................................................................................................................... 62 10.4 PACKAGE VSOP8 208MIL ...................................................................................................................................... 63 10.5 PACKAGE USON8 (3*3MM) ................................................................................................................................... 64 10.6 PACKAGE USON8 (3*4MM) ................................................................................................................................... 65 10.7 PACKAGE USON8 (4*4MM, 0.45 THICKNESS) ............................................................................................................ 66 10.8 PACKAGE WSON8 (6*5MM) .................................................................................................................................. 67 10.9 PACKAGE LGA8 3*2MM ......................................................................................................................................... 68 10.10 PACKAGE WLCSP .................................................................................................................................................. 69 11 REVISION HISTORY .................................................................................................................................... 70 3 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 1 FEATURES ◆ ◆ 16M-bit Serial Flash Fast Program/Erase Speed -2048K-byte -Page Program time: 0.7ms typical -256 bytes per programmable page -Sector Erase time: 40ms typical -Block Erase time: 0.15/0.18s typical ◆ Standard, Dual, Quad SPI -Chip Erase time: 5s typical -Standard SPI: SCLK, CS#, SI, SO, WP#, HOLD# ◆ -Dual SPI: SCLK, CS#, IO0, IO1, WP#, HOLD# -Quad SPI: SCLK, CS#, IO0, IO1, IO2, IO3 Flexible Architecture -Uniform Sector of 4K-byte -Uniform Block of 32/64K-byte ◆ High Speed Clock Frequency -Erase/Program Suspend/Resume -104MHz for fast read with 30PF load ◆ -Dual I/O Data transfer up to 208Mbits/s -Quad I/O Data transfer up to 416Mbits/s Low Power Consumption -9uA typical stand-by current -1uA typical power down current ◆ Allows XIP(execute in place) Operation ◆ -Continuous Read With 8/16/32/64-byte Wrap Advanced security Features -128-bit Unique ID for each device ◆ Software/Hardware Write Protection -3x512-Byte Security Registers With OTP Lock -Write protect all/portion of memory via software ◆ -Enable/Disable protection with WP# Pin -Top/Bottom Block protection ◆ Single Power Supply Voltage -Full voltage range: 1.65~2.1V ◆ Minimum 100,000 Program/Erase Cycles Data retention -20-year data retention typical 4 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 2 GENERAL DESCRIPTION The GD25LQ16C (16M-bit) Serial flash supports the standard Serial Peripheral Interface (SPI), and supports the Dual/Quad SPI: Serial Clock, Chip Select, Serial Data I/O0 (SI), I/O1 (SO), I/O2 (WP#), and I/O3 (HOLD#). The Dual I/O data is transferred with speed of 208Mbits/s, the Quad I/O & Quad output data is transferred with speed of 416Mbits/s. CONNECTION DIAGRAM CS# 1 8 VCC CS# 1 8 VCC SO (IO1) 2 7 HOLD# (IO3) SO (IO1) 2 7 HOLD# (IO3) 3 6 SCLK 4 5 SI (IO0) Top View WP# (IO2) 3 6 SCLK WP# (IO2) VSS 4 5 SI (IO0) VSS Top View 8–LEAD VSOP/SOP TOP VIEW 8–LEAD WSON/USON/LGA BOTTEOM VIEW A1 A2 A2 A1 VC C CS# CS# VCC B1 B2 B2 B1 SO/IO1 HOLD#/ IO3 HOLD#/ IO3 SO/IO1 C1 C2 C2 C1 SCLK WP#/ IO2 WP#/ IO2 SCLK D1 D2 D2 D1 SI/IO0 VSS VSS SI/IO0 WLCSP PIN DESCRIPTION Pin Name Ball Name I/O Description CS# A2 I Chip Select Input SO (IO1) B2 I/O Data Output (Data Input Output 1) WP# (IO2) C2 I/O Write Protect Input (Data Input Output 2) VSS D2 SI (IO0) D1 I/O Data Input (Data Input Output 0) SCLK C1 I Serial Clock Input HOLD# (IO3) B1 I/O Hold Input (Data Input Output 3) VCC A1 Ground Power Supply Note: CS# must be driven high if chip is not selected. Please don’t leave CS# floating any time after power is on. 5 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C BLOCK DIAGRAM Write Control Logic Status Register HOLD#(IO3) SCLK CS# SPI Command & Control Logic High Voltage Generators Page Address Latch/Counter Write Protect Logic and Row Decode WP#(IO2) Flash Memory Column Decode And 256-Byte Page Buffer SI(IO0) SO(IO1) Byte Address Latch/Counter 6 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 3 MEMORY ORGANIZATION GD25LQ16C Each device has Each block has Each sector has Each page has 2M 64/32K 4K 256 bytes 8K 256/128 16 - pages 512 16/8 - - sectors 32/64 - - - blocks UNIFORM BLOCK SECTOR ARCHITECTURE GD25LQ16C 64K Bytes Block Sector Architecture Block 31 30 …… …… 2 1 0 Sector Address range 511 1FF000H 1FFFFFH …… …… …… 496 1F0000H 1F0FFFH 495 1EF000H 1EFFFFH …… …… …… 480 1E0000H 1E0FFFH …… …… …… …… …… …… …… …… …… …… …… …… …… …… …… …… …… …… 47 02F000H 02FFFFH …… …… …… 32 020000H 020FFFH 31 01F000H 01FFFFH …… …… …… 16 010000H 010FFFH 15 00F000H 00FFFFH …… …… …… 0 000000H 000FFFH 7 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 4 DEVICE OPERATION SPI Mode Standard SPI The GD25LQ16C features a serial peripheral interface on 4 signals bus: Serial Clock (SCLK), Chip Select (CS#), Serial Data Input (SI) and Serial Data Output (SO). Both SPI bus mode 0 and 3 are supported. Input data is latched on the rising edge of SCLK and data shifts out on the falling edge of SCLK. Dual SPI The GD25LQ16C supports Dual SPI operation when using the “Dual Output Fast Read” and “Dual I/O Fast Read” (3BH and BBH) commands. These commands allow data to be transferred to or from the device at twice the rate of the standard SPI. When using the Dual SPI command the SI and SO pins become bidirectional I/O pins: IO0 and IO1. Quad SPI The GD25LQ16C supports Quad SPI operation when using the “Quad Output Fast Read”,” Quad I/O Fast Read”, (6BH, EBH) commands. These commands allow data to be transferred to or from the device at four times the rate of the standard SPI. When using the Quad SPI command the SI and SO pins become bidirectional I/O pins: IO0 and IO1, and WP# and HOLD# pins become IO2 and IO3. Quad SPI commands require the non-volatile Quad Enable bit (QE) in Status Register to be set. Hold The HOLD# signal goes low to stop any serial communications with the device, but doesn’t stop the operation of write status register, programming, or erasing in progress. The operation of HOLD, need CS# keep low, and starts on falling edge of the HOLD# signal, with SCLK signal being low (if SCLK is not being low, HOLD operation will not start until SCLK being low). The HOLD condition ends on rising edge of HOLD# signal with SCLK being low (If SCLK is not being low, HOLD operation will not end until SCLK being low). The SO is high impedance, both SI and SCLK don’t care during the HOLD operation, if CS# drives high during HOLD operation, it will reset the internal logic of the device. To re-start communication with chip, the HOLD# must be at high and then CS# must be at low. Figure1. Hold Condition CS# SCLK HOLD# HOLD HOLD 8 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 5 Data Protection The GD25LQ16C provide the following data protection methods: ◆ Write Enable (WREN) command: The WREN command is set the Write Enable Latch bit (WEL). The WEL bit will return to reset by the following situation: -Power-Up/ Software reset (66H+99H) -Write Disable (WRDI) -Write Status Register (WRSR) -Page Program (PP) -Sector Erase (SE) / Block Erase (BE) / Chip Erase (CE) ◆ Software Protection Mode: The Block Protect (BP4, BP3, BP2, BP1, and BP0) bits define the section of the memory array that can be read but not change. ◆ Hardware Protection Mode: WP# goes low to protect the BP0~BP4 bits and SRP0~1 bits. ◆ Deep Power-Down Mode: In Deep Power-Down Mode, all commands are ignored except the Release from Deep Power-Down Mode command and software reset (66H+99H). Table1. GD25LQ16C Protected area size (CMP=0) Status Register Content Memory Content BP4 BP3 BP2 BP1 BP0 Blocks Addresses Density Portion X X 0 0 0 NONE NONE NONE NONE 0 0 0 0 1 31 1F0000H-1FFFFFH 64KB Upper 1/32 0 0 0 1 0 30 to 31 1E0000H-1FFFFFH 128KB Upper 1/16 0 0 0 1 1 28 to 31 1C0000H-1FFFFFH 256KB Upper 1/8 0 0 1 0 0 24 to 31 180000H-1FFFFFH 512KB Upper 1/4 0 0 1 0 1 16 to 31 100000H-1FFFFFH 1M Upper 1/2 0 1 0 0 1 0 000000H-00FFFFH 64KB Lower 1/32 0 1 0 1 0 0 to 1 000000H-01FFFFH 128KB Lower 1/16 0 1 0 1 1 0 to 3 000000H-03FFFFH 256KB Lower 1/8 0 1 1 0 0 0 to 7 000000H-07FFFFH 512KB Lower 1/4 0 1 1 0 1 0 to 15 000000H-0FFFFFH 1M Lower 1/2 X X 1 1 X 0 to 31 000000H-1FFFFFH 2M ALL 1 0 0 0 1 31 1FF000H-1FFFFFH 4KB Top Block 1 0 0 1 0 31 1FE000H-1FFFFFH 8KB Top Block 1 0 0 1 1 31 1FC000H-1FFFFFH 16KB Top Block 1 0 1 0 X 31 1F8000H-1FFFFFH 32KB Top Block 1 1 0 0 1 0 000000H-000FFFH 4KB Bottom Block 1 1 0 1 0 0 000000H-001FFFH 8KB Bottom Block 1 1 0 1 1 0 000000H-003FFFH 16KB Bottom Block 1 1 1 0 X 0 000000H-007FFFH 32KB Bottom Block 9 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C Table1a. GD25LQ16C Protected area size (CMP=1) Status Register Content Memory Content BP4 BP3 BP2 BP1 BP0 Blocks Addresses Density Portion X X 0 0 0 0 to 31 000000H-1FFFFFH 2M ALL 0 0 0 0 1 0 to 30 000000H-1EFFFFH 1984KB Lower 31/32 0 0 0 1 0 0 to 29 000000H-1DFFFFH 1920KB Lower 15/16 0 0 0 1 1 0 to 27 000000H-1BFFFFH 1792KB Lower 7/8 0 0 1 0 0 0 to 23 000000H-17FFFFH 1536KB Lower 3/4 0 0 1 0 1 0 to 15 000000H-0FFFFFH 1M Lower 1/2 0 1 0 0 1 1 to 31 010000H-1FFFFFH 1984KB Upper 31/32 0 1 0 1 0 2 to 31 020000H-1FFFFFH 1920KB Upper 15/16 0 1 0 1 1 4 to 31 040000H-1FFFFFH 1792KB Upper 7/8 0 1 1 0 0 8 to 31 080000H-1FFFFFH 1536KB Upper 3/4 0 1 1 0 1 16 to 31 100000H-1FFFFFH 1M Upper 1/2 X X 1 1 X NONE NONE NONE NONE 1 0 0 0 1 0 to 31 000000H-1FEFFFH 2044KB L - 511/512 1 0 0 1 0 0 to 31 000000H-1FDFFFH 2040KB L - 255/256 1 0 0 1 1 0 to 31 000000H-1FBFFFH 2032KB L - 127/128 1 0 1 0 X 0 to 31 000000H-1F7FFFH 2016KB L - 63/64 1 1 0 0 1 0 to 31 001000H-1FFFFFH 2044KB U - 511/512 1 1 0 1 0 0 to 31 002000H-1FFFFFH 2040KB U - 255/256 1 1 0 1 1 0 to 31 004000H-1FFFFFH 2032KB U - 127/128 1 1 1 0 X 0 to 31 008000H-1FFFFFH 2016KB U - 63/64 10 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 6 Status Register S15 S14 S13 S12 S11 S10 S9 S8 SUS1 CMP LB3 LB2 LB1 SUS2 QE SRP1 S7 S6 S5 S4 S3 S2 S1 S0 SRP0 BP4 BP3 BP2 BP1 BP0 WEL WIP The status and control bits of the Status Register are as follows: WIP bit The Write in Progress (WIP) bit indicates whether the memory is busy in program/erase/write status register progress. When WIP bit sets to 1, means the device is busy in program/erase/write status register progress, when WIP bit sets 0, means the device is not in program/erase/write status register progress. WEL bit The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch. When set to 1 the internal Write Enable Latch is set, when set to 0 the internal Write Enable Latch is reset and no Write Status Register, Program or Erase command is accepted. BP4, BP3, BP2, BP1, BP0 bits The Block Protect (BP4, BP3, BP2, BP1, and BP0) bits are non-volatile. They define the size of the area to be software protected against Program and Erase commands. These bits are written with the Write Status Register (WRSR) command. When the Block Protect (BP4, BP3, BP2, BP1, BP0) bits are set to 1, the relevant memory area (as defined in Table1).becomes protected against Page Program (PP), Sector Erase (SE) and Block Erase (BE) commands. The Block Protect (BP4, BP3, BP2, BP1, and BP0) bits can be written provided that the Hardware Protected mode has not been set. The Chip Erase (CE) command is executed, if the Block Protect (BP2, BP1, and BP0) bits are 0 and CMP=0 or the Block Protect (BP2, BP1, and BP0) bits are 1 and CMP=1. SRP1, SRP0 bits The Status Register Protect (SRP1 and SRP0) bits are non-volatile Read/Write bits in the status register. The SRP bits control the method of write protection: software protection, hardware protection, power supply lock-down or one time programmable protection. SRP1 SRP0 #WP Status Register 0 0 X Software Protected 0 1 0 Hardware Protected 0 1 1 Hardware Unprotected 1 0 X 1 1 X Description The Status Register can be written to after a Write Enable command, WEL=1.(Default) WP#=0, the Status Register locked and cannot be written to. WP#=1, the Status Register is unlocked and can be written to after a Write Enable command, WEL=1. Power Supply Lock- Status Register is protected and cannot be written to again Down(1)(2) until the next Power-Down, Power-Up cycle. One Time Program(2) Status Register is permanently protected and cannot be written to. NOTE: 1. When SRP1, SRP0= (1, 0), a Power-Down, Power-Up cycle will change SRP1, SRP0 to (0, 0) state. 2. This feature is available on special order. Please contact GigaDevice for details. 11 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C QE bit The Quad Enable (QE) bit is a non-volatile Read/Write bit in the Status Register that allows Quad operation. When the QE bit is set to 0 (Default) the WP# pin and HOLD# pin are enable. When the QE pin is set to 1, the Quad IO2 and IO3 pins are enabled. (It is best to set the QE bit to 0 to avoid short issues if the WP# or HOLD# pin is tied directly to the power supply or ground.) LB3, LB2, LB1 bits The LB3, LB2, LB1 bits are non-volatile One Time Program (OTP) bits in Status Register (S13-S11) that provide the write protect control and status to the Security Registers. The default state of LB3-LB1 are 0, the security registers are unlocked. The LB3-LB1 bits can be set to 1 individually using the Write Register instruction. The LB3-LB1 bits are One Time Programmable, once they are set to 1, the Security Registers will become read-only permanently. CMP bit The CMP bit is a non-volatile Read/Write bit in the Status Register (S14). It is used in conjunction with the BP4-BP0 bits to provide more flexibility for the array protection. Please see the Status registers Memory Protection table for details. The default setting is CMP=0. SUS1, SUS2 bits The SUS1 and SUS2 bits are read only bits in the status register (S15 and S10) that are set to 1 after executing an Program/Erase Suspend (75H) command (The Erase Suspend will set the SUS1 to 1,and the Program Suspend will set the SUS2 to 1). The SUS1 and SUS2 bits are cleared to 0 by Program/Erase Resume (7AH) command as well as a powerdown, power-up cycle. 12 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7 COMMANDS DESCRIPTION All commands, addresses and data are shifted in and out of the device, beginning with the most significant bit on the first rising edge of SCLK after CS# is driven low. Then, the one-byte command code must be shifted in to the device, with most significant bit first on SI, and each bit is latched on the rising edges of SCLK. See Table2, every command sequence starts with a one-byte command code. Depending on the command, this might be followed by address bytes, or by data bytes, or by both or none. CS# must be driven high after the last bit of the command sequence has been completed. For the command of Read, Fast Read, Read Status Register or Release from Deep PowerDown, and Read Device ID, the shifted-in command sequence is followed by a data-out sequence. All read instruction can be completed after any bit of the data-out sequence is being shifted out, and then CS# must be driven high to return to deselected status. For the command of Page Program, Sector Erase, Block Erase, Chip Erase, Write Status Register, Write Enable, Write Disable or Deep Power-Down command, CS# must be driven high exactly at a byte boundary, otherwise the command is rejected, and is not executed. That is CS# must be driven high when the number of clock pulses after CS# being driven low is an exact multiple of eight. For Page Program, if at any time the input byte is not a full byte, nothing will happen and WEL will not be reset. Table2. Commands (Standard/Dual/Quad SPI) Command Name Byte 1 Write Enable 06H Write Disable 04H Volatile SR 50H Byte 2 Byte 3 Byte 4 Byte 5 Byte 6 n-Bytes Write Enable Read Status Register 05H (S7-S0) (continuous) Read Status Register-1 35H (S15-S8) (continuous) Write Status Register 01H S7-S0 S15-S8 Read Data 03H A23-A16 A15-A8 A7-A0 (D7-D0) (Next (continuous) byte) Fast Read Dual Output 0BH A23-A16 A15-A8 A7-A0 3BH A23-A16 A15-A8 A7-A0 BBH A23-A8(2) A7-A0 (D7-D0)(1) dummy dummy (D7-D0) (D7-D0) (continuous) (1) (continuous) Fast Read Dual I/O Fast Read Quad Output (continuous) M7-M0(2) 6BH A23-A16 A15-A8 A7-A0 EBH A23-A0 dummy(5) (D7-D0)(3) dummy (D7-D0)(3) (continuous) Fast Read Quad I/O (continuous) M7-M0(4) Fast Read Page Program 02H A23-A16 A15-A8 A7-A0 D7-D0 Quad Page Program 32H A23-A16 A15-A8 A7-A0 D7-D0 Sector Erase 20H A23-A16 A15-A8 A7-A0 Block Erase(32K) 52H A23-A16 A15-A8 A7-A0 Block Erase(64K) D8H A23-A16 A15-A8 A7-A0 Chip Erase C7/60H Enable Reset 66H 13 Next byte 1.8V Uniform Sector Dual and Quad Serial Flash Reset 99H Set Burst with Wrap 77H Program/Erase 75H GD25LQ16C W6-W4 Suspend Program/Erase Resume Enable SO to output RY/BY# Disable SO to output RY/BY# 7AH 70H 80H Deep Power-Down B9H Release From Deep ABH dummy dummy dummy (ID7-ID0) 90H 00H 00H 00H (M7-M0) 92H A23-A8 A7-A0, (M7-M0) M[7:0] (ID7-ID0) (continuous) Power-Down, And Read Device ID Release From Deep ABH Power-Down Manufacturer/ (ID7-ID0) (continuous) Device ID Manufacturer/ Device ID by Dual I/O Manufacturer/ Device ID by Quad I/O Read Serial Flash Discoverable Parameter Read Unique ID 94H A23-A0, M[7:0] dummy (continuous) (M7-M0) (continuous) (ID7-ID0) 5AH A23-A16 A15-A8 A7-A0 dummy (D7-D0) (continuous) 4BH 00H 00H 00H dummy (UID7- (continuous) Read Identification 9FH (M7-M0) (ID15-ID8) (ID7-ID0) Erase Security 44H A23-A16 A15-A8 A7-A0 42H A23-A16 A15-A8 A7-A0 D7-D0 D7-D0 48H A23-A16 A15-A8 A7-A0 dummy (D7-D0) UID0) (continuous) Registers(6) Program Security Registers(6) Read Security Registers(6) NOTE: 1. Dual Output data IO0 = (D6, D4, D2, D0) IO1 = (D7, D5, D3, D1) 2. Dual Input Address IO0 = A22, A20, A18, A16, A14, A12, A10, A8 A6, A4, A2, A0, M6, M4, M2, M0 IO1 = A23, A21, A19, A17, A15, A13, A11, A9 A7, A5, A3, A1, M7, M5, M3, M1 3. Quad Output Data IO0 = (D4, D0, …..) IO1 = (D5, D1, …..) 14 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C IO2 = (D6, D2, …..) IO3 = (D7, D3,…..) 4. Quad Input Address IO0 = A20, A16, A12, A8, A4, A0, M4, M0 IO1 = A21, A17, A13, A9, A5, A1, M5, M1 IO2 = A22, A18, A14, A10, A6, A2, M6, M2 IO3 = A23, A19, A15, A11, A7, A3, M7, M3 5. Fast Read Quad I/O Data IO0 = (x, x, x, x, D4, D0,…) IO1 = (x, x, x, x, D5, D1,…) IO2 = (x, x, x, x, D6, D2,…) IO3 = (x, x, x, x, D7, D3,…) 6. Security Registers Address: Security Register1: A23-A16=00H, A15-A9=0001000b, A8-A0= Byte Address; Security Register2: A23-A16=00H, A15-A9=0010000b, A8-A0= Byte Address; Security Register3: A23-A16=00H, A15-A9=0011000b, A8-A0= Byte Address. TABLE OF ID DEFINITIONS GD25LQ16C Operation Code M7-M0 ID15-ID8 ID7-ID0 9FH C8 60 15 90H C8 14 ABH 14 15 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.1 Write Enable (WREN) (06H) The Write Enable (WREN) command is for setting the Write Enable Latch (WEL) bit. The Write Enable Latch (WEL) bit must be set prior to every Page Program (PP), Sector Erase (SE), Block Erase (BE), Chip Erase (CE), Write Status Register (WRSR) and Erase/Program Security Registers command. The Write Enable (WREN) command sequence: CS# goes low  sending the Write Enable command  CS# goes high. Figure2. Write Enable Sequence Diagram CS# SCLK 0 1 2 3 4 5 6 7 Command SI 06H High-Z SO 7.2 Write Disable (WRDI) (04H) The Write Disable command is for resetting the Write Enable Latch (WEL) bit. The Write Disable command sequence: CS# goes low Sending the Write Disable command CS# goes high. The WEL bit is reset by following condition: Power-up and upon completion of the Write Status Register, Page Program, Sector Erase, Block Erase, Chip Erase, Erase/Program Security Registers and Reset commands. Figure3. Write Disable Sequence Diagram CS# SCLK SI SO 0 1 2 3 4 5 Command 04H High-Z 16 6 7 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.3 Write Enable for Volatile Status Register (50H) The non-volatile Status Register bits can also be written to as volatile bits. This gives more flexibility to change the system configuration and memory protection schemes quickly without waiting for the typical non-volatile bit write cycles or affecting the endurance of the Status Register non-volatile bits. The Write Enable for Volatile Status Register command must be issued prior to a Write Status Register command and any other commands can’t be inserted between them. Otherwise, Write Enable for Volatile Status Register will be cleared. The Write Enable for Volatile Status Register command will not set the Write Enable Latch bit, it is only valid for the Write Status Register command to change the volatile Status Register bit values. Figure4. Write Enable for Volatile Status Register Sequence Diagram CS# SCLK 0 1 2 3 4 5 6 7 Command(50H) SI SO High-Z 7.4 Read Status Register (RDSR) (05H or 35H) The Read Status Register (RDSR) command is for reading the Status Register. The Status Register may be read at any time, even while a Program, Erase or Write Status Register cycle is in progress. When one of these cycles is in progress, it is recommended to check the Write in Progress (WIP) bit before sending a new command to the device. It is also possible to read the Status Register continuously. For command code “05H”, the SO will output Status Register bits S7~S0. The command code “35H”, the SO will output Status Register bits S15~S8. Figure5. Read Status Register Sequence Diagram CS# SCLK SI SO 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Command 05H or 35H High-Z S7~S0 or S15~S8 out S7~S0 or S15~S8 out 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 MSB MSB 17 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.5 Write Status Register (WRSR) (01H) The Write Status Register (WRSR) command allows new values to be written to the Status Register. Before it can be accepted, a Write Enable (WREN) command must previously have been executed. After the Write Enable (WREN) command has been decoded and executed, the device sets the Write Enable Latch (WEL). The Write Status Register (WRSR) command has no effect on S15, S10, S1 and S0 of the Status Register. CS# must be driven high after the eighth or sixteen bit of the data byte has been latched in. If not, the Write Status Register (WRSR) command is not executed. If CS# is driven high after eighth bit of the data byte, the CMP and QE and SRP1 bits will be cleared to 0. As soon as CS# is driven high, the self-timed Write Status Register cycle (whose duration is tW) is initiated. While the Write Status Register cycle is in progress, the Status Register may still be read to check the value of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Write Status Register cycle, and is 0 when it is completed. When the cycle is completed, the Write Enable Latch (WEL) is reset. The Write Status Register (WRSR) command allows the user to change the values of the Block Protect (BP4, BP3, BP2, BP1, and BP0) bits, to define the size of the area that is to be treated as read-only, as defined in Table1. The Write Status Register (WRSR) command also allows the user to set or reset the Status Register Protect (SRP1 and SRP0) bits in accordance with the Write Protect (WP#) signal. The Status Register Protect (SRP1 and SRP0) bits and Write Protect (WP#) signal allow the device to be put in the Hardware Protected Mode. The Write Status Register (WRSR) command is not executed once the Hardware Protected Mode is entered. Figure6. Write Status Register Sequence Diagram CS# SCLK 0 1 2 3 4 5 6 7 8 Command SI SO 01H 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 Status Register in 7 MSB 6 5 4 3 High-Z 18 2 1 0 15 14 13 12 11 10 9 8 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.6 Read Data Bytes (READ) (03H) The Read Data Bytes (READ) command is followed by a 3-byte address (A23-A0), and each bit is latched-in on the rising edge of SCLK. Then the memory content, at that address, is shifted out on SO, and each bit is shifted out, at a Max frequency fR, on the falling edge of SCLK. The first byte addressed can be at any location. The address is automatically incremented to the next higher address after each byte of data is shifted out. The whole memory can, therefore, be read with a single Read Data Bytes (READ) command. Any Read Data Bytes (READ) command, while an Erase, Program or Write cycle is in progress, is rejected without having any effects on the cycle that is in progress. Figure7. Read Data Bytes Sequence Diagram CS# 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 32 33 34 35 36 37 38 39 SCLK Command SI 24-bit address 03H 23 22 21 2 1 0 MSB High-Z SO 3 MSB 7 6 5 Data Out1 4 3 2 1 Data Out2 0 7.7 Read Data Bytes at Higher Speed (Fast Read) (0BH) The Read Data Bytes at Higher Speed (Fast Read) command is for quickly reading data out. It is followed by a 3-byte address (A23-A0) and a dummy byte, and each bit is latched-in on the rising edge of SCLK. Then the memory content, at that address, is shifted out on SO, and each bit is shifted out, at a Max frequency fC, on the falling edge of SCLK. The first byte addressed can be at any location. The address is automatically incremented to the next higher address after each byte of data is shifted out. Figure8. Read Data Bytes at Higher Speed Sequence Diagram CS# 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 SCLK Command SI 24-bit address 0BH 23 22 21 3 2 1 0 High-Z SO CS# 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 SCLK Dummy Byte SI SO 7 6 5 4 3 2 1 0 7 6 MSB 19 Data Out1 5 4 3 2 1 0 Data Out2 7 6 5 MSB 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.8 Dual Output Fast Read (3BH) The Dual Output Fast Read command is followed by 3-byte address (A23-A0) and a dummy byte, and each bit is latched in on the rising edge of SCLK, then the memory contents are shifted out 2-bit per clock cycle from SI and SO. The command sequence is shown in followed Figure9. The first byte addressed can be at any location. The address is automatically incremented to the next higher address after each byte of data is shifted out. Figure9. Dual Output Fast Read Sequence Diagram CS# 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 SCLK Command SI SO 24-bit address 3BH 23 22 21 3 2 1 High-Z CS# 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 SCLK Dummy Clocks SI SO 6 4 2 0 6 4 2 0 6 Data Out1 Data Out2 7 5 3 1 7 5 3 1 MSB MSB 7 20 0 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.9 Quad Output Fast Read (6BH) The Quad Output Fast Read command is followed by 3-byte address (A23-A0) and a dummy byte, and each bit is latched in on the rising edge of SCLK, then the memory contents are shifted out 4-bit per clock cycle from IO3, IO2, IO1 and IO0. The command sequence is shown in followed Figure10. The first byte addressed can be at any location. The address is automatically incremented to the next higher address after each byte of data is shifted out. The Quad Enable bit (QE) of Status Register (S9) must be set to enable for the Quad Output Fast Read command. Figure10. Quad Output Fast Read Sequence Diagram CS# 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 SCLK Command SI(IO0) 24-bit address 6BH 23 22 21 SO(IO1) High-Z WP#(IO2) High-Z HOLD#(IO3) High-Z 3 2 1 0 CS# 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 SCLK Dummy Clocks SI(IO0) 4 0 4 0 4 0 4 0 4 SO(IO1) 5 1 5 1 5 1 5 1 5 WP#(IO2) 6 2 6 2 6 2 6 2 6 HOLD#(IO3) 7 3 7 3 7 3 7 3 7 Byte1 Byte2 Byte3 Byte4 7.10 Dual I/O Fast Read (BBH) The Dual I/O Fast Read command is similar to the Dual Output Fast Read command but with the capability to input the 3byte address (A23-0) and a “Continuous Read Mode” byte 2-bit per clock by SI and SO, and each bit is latched in on the rising edge of SCLK, then the memory contents are shifted out 2-bit per clock cycle from SI and SO. The command sequence is shown in followed Figure11. The first byte addressed can be at any location. The address is automatically incremented to the next higher address after each byte of data is shifted out. Dual I/O Fast Read with “Continuous Read Mode” The Dual I/O Fast Read command can further reduce command overhead through setting the “Continuous Read Mode” bits (M7-0) after the input 3-byte address (A23-A0). If the “Continuous Read Mode” bits (M5-4) = (1, 0), then the next Dual I/O Fast Read command (after CS# is raised and then lowered) does not require the BBH command code. The command sequence is shown in followed Figure11. If the “Continuous Read Mode” bits (M5-4) do not equal (1, 0), the next command requires the command code, thus returning to normal operation. A “Continuous Read Mode” Reset command can be used to reset (M5-4) before issuing normal command. 21 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C Figure11. Dual I/O Fast Read Sequence Diagram (M5-4≠ (1, 0)) CS# 0 SCLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 6 4 2 0 6 4 2 0 6 4 2 0 6 4 2 0 7 5 3 1 7 5 3 1 7 5 3 1 7 5 3 1 Command SI(IO0) BBH SO(IO1) A23-16 A15-8 A7-0 CS# SCLK 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 SI(IO0) 6 4 2 0 6 4 2 0 6 4 2 0 6 4 2 0 6 SO(IO1) 7 5 3 1 7 5 3 1 7 5 3 1 7 5 3 1 7 Byte1 Byte2 Byte3 Byte4 Figure11a. Dual I/O Fast Read Sequence Diagram (M5-4= (1, 0)) CS# SCLK 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 6 4 2 0 6 4 2 0 6 4 2 0 6 4 2 0 7 5 3 1 7 5 3 1 7 5 3 1 7 5 3 1 A23-16 A15-8 A7-0 M7-0 CS# SCLK 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 SI(IO0) 6 4 2 0 6 4 2 0 6 4 2 0 6 4 2 0 6 SO(IO1) 7 5 3 1 7 5 3 1 7 5 3 1 7 5 3 1 7 Byte1 Byte2 Byte3 22 Byte4 M7-0 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.11 Quad I/O Fast Read (EBH) The Quad I/O Fast Read command is similar to the Dual I/O Fast Read command but with the capability to input the 3-byte address (A23-0) and a “Continuous Read Mode” byte and 4-dummy clock 4-bit per clock by IO0, IO1, IO3, IO4, and each bit is latched in on the rising edge of SCLK, then the memory contents are shifted out 4-bit per clock cycle from IO0, IO1, IO2, IO3. The command sequence is shown in followed Figure12. The first byte addressed can be at any location. The address is automatically incremented to the next higher address after each byte of data is shifted out. The Quad Enable bit (QE) of Status Register (S9) must be set to enable for the Quad I/O Fast read command. Quad I/O Fast Read with “Continuous Read Mode” The Quad I/O Fast Read command can further reduce command overhead through setting the “Continuous Read Mode” bits (M7-0) after the input 3-byte address (A23-A0). If the “Continuous Read Mode” bits (M5-4) = (1, 0), then the next Quad I/O Fast Read command (after CS# is raised and then lowered) does not require the EBH command code. The command sequence is shown in followed Figure12a. If the “Continuous Read Mode” bits (M5-4) do not equal to (1, 0), the next command requires the command code, thus returning to normal operation. A “Continuous Read Mode” Reset command can be used to reset (M5-4) before issuing normal command. Figure12. Quad I/O Fast Read Sequence Diagram (M5-4≠ (1, 0)) CS# 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 4 0 4 0 4 0 4 0 4 0 4 0 4 SO(IO1) 5 1 5 1 5 1 5 1 5 1 5 1 5 WP#(IO2) 6 2 6 2 6 2 6 2 6 2 6 2 6 HOLD#(IO3) 7 3 7 3 7 3 7 3 7 3 7 3 7 SCLK Command SI(IO0) EBH A23-16 A15-8 A7-0 M7-0 Dummy Byte1 Byte2 Figure12a. Quad I/O Fast Read Sequence Diagram (M5-4= (1, 0)) CS# 0 1 2 3 4 5 6 7 SI(IO0) 4 0 4 0 4 0 4 0 4 0 4 0 4 SO(IO1) 5 1 5 1 5 1 5 1 5 1 5 1 5 WP#(IO2) 6 2 6 2 6 2 6 2 6 2 6 2 6 HOLD#(IO3) 7 3 7 3 7 3 7 3 7 3 7 3 7 SCLK A23-16 A15-8 A7-0 M7-0 23 8 9 10 11 12 13 14 15 Dummy Byte1 Byte2 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C Quad I/O Fast Read with “8/16/32/64-Byte Wrap Around” in Standard SPI mode The Quad I/O Fast Read command can be used to access a specific portion within a page by issuing “Set Burst with Wrap” (77H) commands prior to EBH. The “Set Burst with Wrap” (77H) command can either enable or disable the “Wrap Around” feature for the following EBH commands. When “Wrap Around” is enabled, the data being accessed can be limited to either an 8/16/32/64-byte section of a 256-byte page. The output data starts at the initial address specified in the command, once it reaches the ending boundary of the 8/16/32/64-byte section, the output will wrap around the beginning boundary automatically until CS# is pulled high to terminate the command. The Burst with Wrap feature allows applications that use cache to quickly fetch a critical address and then fill the cache afterwards within a fixed length (8/16/32/64-byte) of data without issuing multiple read commands. The “Set Burst with Wrap” command allows three “Wrap Bits” W6-W4 to be set. The W4 bit is used to enable or disable the “Wrap Around” operation while W6-W5 is used to specify the length of the wrap around section within a page. 7.12 Set Burst with Wrap (77H) The Set Burst with Wrap command is used in conjunction with “Quad I/O Fast Read” command to access a fixed length of 8/16/32/64-byte section within a 256-byte page, in standard SPI mode. The Set Burst with Wrap command sequence: CS# goes low  Send Set Burst with Wrap command  Send 24 dummy bits  Send 8 bits “Wrap bits”  CS# goes high. W6,W5 W4=0 W4=1 (default) Wrap Around Wrap Length Wrap Around Wrap Length 0, 0 Yes 8-byte No N/A 0, 1 Yes 16-byte No N/A 1, 0 Yes 32-byte No N/A 1, 1 Yes 64-byte No N/A If the W6-W4 bits are set by the Set Burst with Wrap command, all the following “Quad I/O Fast Read” command will use the W6-W4 setting to access the 8/16/32/64-byte section within any page. To exit the “Wrap Around” function and return to normal read operation, another Set Burst with Wrap command should be issued to set W4=1. Figure16. Set Burst with Wrap Sequence Diagram CS# 8 9 10 11 12 13 14 15 x x x x x x 4 x SO(IO1) x x x x x x 5 x WP#(IO2) x x x x x x 6 x HOLD#(IO3) x x x x x x x x SCLK 0 1 2 3 4 5 6 7 Command SI(IO0) 77H W6-W4 24 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.13 Page Program (PP) (02H) The Page Program (PP) command is for programming the memory. A Write Enable (WREN) command must previously have been executed to set the Write Enable Latch (WEL) bit before sending the Page Program command. The Page Program (PP) command is entered by driving CS# Low, followed by the command code, three address bytes and at least one data byte on SI. If the 8 least significant address bits (A7-A0) are not all zero, all transmitted data that goes beyond the end of the current page are programmed from the start address of the same page (from the address whose 8 least significant bits (A7-A0) are all zero). CS# must be driven low for the entire duration of the sequence. The Page Program command sequence: CS# goes low  sending Page Program command  3-byte address on SI  at least 1 byte data on SI  CS# goes high. The command sequence is shown in Figure17. If more than 256 bytes are sent to the device, previously latched data are discarded and the last 256 data bytes are guaranteed to be programmed correctly within the same page. If less than 256 data bytes are sent to device, they are correctly programmed at the requested addresses without having any effects on the other bytes of the same page. CS# must be driven high after the eighth bit of the last data byte has been latched in; otherwise the Page Program (PP) command is not executed. As soon as CS# is driven high, the self-timed Page Program cycle (whose duration is t PP) is initiated. While the Page Program cycle is in progress, the Status Register may be read to check the value of the Write in Progress (WIP) bit. The Write in Progress (WIP) bit is 1 during the self-timed Page Program cycle, and is 0 when it is completed. At some unspecified time before the cycle is completed, the Write Enable Latch (WEL) bit is reset. A Page Program (PP) command applied to a page which is protected by the Block Protect (BP4, BP3, BP2, BP1, and BP0) is not executed. Figure17. Page Program Sequence Diagram CS# 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 32 33 34 35 36 37 38 39 SCLK Command 24-bit address 23 22 21 3 2 1 0 7 MSB 6 5 4 3 2 1 2078 2079 2076 2077 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 2075 CS# 2072 MSB 2074 02H Data Byte 1 2073 SI 1 0 SCLK Data Byte 2 SI 7 MSB 6 5 4 3 2 Data Byte 3 1 0 7 6 5 4 3 MSB 2 Data Byte 256 1 0 7 MSB 25 6 5 4 3 2 0 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.14 Quad Page Program (32H) The Quad Page Program command is for programming the memory using four pins: IO0, IO1, IO2, and IO3. To use Quad Page Program the Quad enable in status register Bit9 must be set (QE=1). A Write Enable (WREN) command must previously have been executed to set the Write Enable Latch (WEL) bit before sending the Page Program command. The quad Page Program command is entered by driving CS# Low, followed by the command code (32H), three address bytes and at least one data byte on IO pins. The command sequence is shown in Figure18. If more than 256 bytes are sent to the device, previously latched data are discarded and the last 256 data bytes are guaranteed to be programmed correctly within the same page. If less than 256 data bytes are sent to device, they are correctly programmed at the requested addresses without having any effects on the other bytes of the same page. CS# must be driven high after the eighth bit of the last data byte has been latched in; otherwise the Quad Page Program (PP) command is not executed. As soon as CS# is driven high, the self-timed Quad Page Program cycle (whose duration is tPP) is initiated. While the Quad Page Program cycle is in progress, the Status Register may be read to check the value of the Write In Progress (WIP) bit. The Write in Progress (WIP) bit is 1 during the self-timed Quad Page Program cycle, and is 0 when it is completed. At some unspecified time before the cycle is completed, the Write Enable Latch (WEL) bit is reset. A Quad Page Program command applied to a page which is protected by the Block Protect (BP4, BP3, BP2, BP1, and BP0) is not executed. Figure18.Quad Page Program Sequence Diagram CS# 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 32 33 34 35 36 37 38 39 SCLK Command 24-bit address 0 4 0 4 0 4 0 SO(IO1) 5 1 5 1 5 1 5 1 WP#(IO2) 6 2 6 2 6 2 6 2 HOLD#(IO3) 7 3 7 3 7 3 7 3 538 539 540 541 542 543 32H 23 22 21 3 2 Byte1 Byte2 0 4 537 SI(IO0) 1 0 4 0 MSB 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 536 CS# SCLK Byte11Byte12 Byte253 Byte256 SI(IO0) 4 SO(IO1) 5 1 5 1 5 1 5 1 5 1 5 1 5 1 5 1 5 1 5 1 5 1 5 1 WP#(IO2) 6 2 6 2 6 2 6 2 6 2 6 2 6 2 6 2 6 2 6 2 6 2 6 2 HOLD#(IO3) 7 3 7 3 7 3 7 3 7 3 7 3 7 3 7 3 7 3 7 3 7 3 7 3 0 4 0 4 0 4 0 4 0 4 0 4 26 0 4 0 4 0 4 4 0 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.15 Sector Erase (SE) (20H) The Sector Erase (SE) command is for erasing the all data of the chosen sector. A Write Enable (WREN) command must previously have been executed to set the Write Enable Latch (WEL) bit. The Sector Erase (SE) command is entered by driving CS# low, followed by the command code, and 3-address byte on SI. Any address inside the sector is a valid address for the Sector Erase (SE) command. CS# must be driven low for the entire duration of the sequence. The Sector Erase command sequence: CS# goes low  sending Sector Erase command  3-byte address on SI  CS# goes high. The command sequence is shown in Figure19. CS# must be driven high after the eighth bit of the last address byte has been latched in; otherwise the Sector Erase (SE) command is not executed. As soon as CS# is driven high, the self-timed Sector Erase cycle (whose duration is tSE) is initiated. While the Sector Erase cycle is in progress, the Status Register may be read to check the value of the Write in Progress (WIP) bit. The Write in Progress (WIP) bit is 1 during the self-timed Sector Erase cycle, and is 0 when it is completed. At some unspecified time before the cycle is completed, the Write Enable Latch (WEL) bit is reset. A Sector Erase (SE) command applied to a sector which is protected by the Block Protect (BP4, BP3, BP2, BP1, and BP0) bit (see Table1&1a) is not executed. Figure19. Sector Erase Sequence Diagram CS# SCLK SI 0 1 2 3 4 5 6 7 8 9 Command 20H 29 30 31 24 Bits Address 23 22 MSB 2 1 0 7.16 32KB Block Erase (BE) (52H) The 32KB Block Erase (BE) command is for erasing the all data of the chosen block. A Write Enable (WREN) command must previously have been executed to set the Write Enable Latch (WEL) bit. The 32KB Block Erase (BE) command is entered by driving CS# low, followed by the command code, and three address bytes on SI. Any address inside the block is a valid address for the 32KB Block Erase (BE) command. CS# must be driven low for the entire duration of the sequence. The 32KB Block Erase command sequence: CS# goes low  sending 32KB Block Erase command  3-byte address on SI  CS# goes high. The command sequence is shown in Figure 20. CS# must be driven high after the eighth bit of the last address byte has been latched in; otherwise the 32KB Block Erase (BE) command is not executed. As soon as CS# is driven high, the self-timed Block Erase cycle (whose duration is tSE) is initiated. While the Block Erase cycle is in progress, the Status Register may be read to check the value of the Write in Progress (WIP) bit. The Write in Progress (WIP) bit is 1 during the self-timed Block Erase cycle, and is 0 when it is completed. At some unspecified time before the cycle is completed, the Write Enable Latch (WEL) bit is reset. A 32KB Block Erase (BE) command applied to a block which is protected by the Block Protect (BP4, BP3, BP2, BP1, and BP0) bits (see Table1&1a) is not executed. Figure 20. 32KB Block Erase Sequence Diagram CS# SCLK SI 0 1 2 3 4 5 6 7 8 9 Command 52H 29 30 31 24 Bits Address 23 22 MSB 27 2 1 0 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.17 64KB Block Erase (BE) (D8H) The 64KB Block Erase (BE) command is for erasing the all data of the chosen block. A Write Enable (WREN) command must previously have been executed to set the Write Enable Latch (WEL) bit. The 64KB Block Erase (BE) command is entered by driving CS# low, followed by the command code, and three address bytes on SI. Any address inside the block is a valid address for the 64KB Block Erase (BE) command. CS# must be driven low for the entire duration of the sequence. The 64KB Block Erase command sequence: CS# goes low  sending 64KB Block Erase command  3-byte address on SI  CS# goes high. The command sequence is shown in Figure 21. CS# must be driven high after the eighth bit of the last address byte has been latched in; otherwise the 64KB Block Erase (BE) command is not executed. As soon as CS# is driven high, the self-timed Block Erase cycle (whose duration is tSE) is initiated. While the Block Erase cycle is in progress, the Status Register may be read to check the value of the Write in Progress (WIP) bit. The Write in Progress (WIP) bit is 1 during the self-timed Block Erase cycle, and is 0 when it is completed. At some unspecified time before the cycle is completed, the Write Enable Latch (WEL) bit is reset. A 64KB Block Erase (BE) command applied to a block which is protected by the Block Protect (BP4, BP3, BP2, BP1, and BP0) bits (see Table1&1a) is not executed. Figure21. 64KB Block Erase Sequence Diagram CS# SCLK 0 1 2 3 4 5 6 7 8 9 Command SI 29 30 31 24 Bits Address D8H 23 22 MSB 2 1 0 7.18 Chip Erase (CE) (60/C7H) The Chip Erase (CE) command is for erasing the all data of the chip. A Write Enable (WREN) command must previously have been executed to set the Write Enable Latch (WEL) bit .The Chip Erase (CE) command is entered by driving CS# Low, followed by the command code on Serial Data Input (SI). CS# must be driven Low for the entire duration of the sequence. The Chip Erase command sequence: CS# goes low  sending Chip Erase command  CS# goes high. The command sequence is shown in Figure 22. CS# must be driven high after the eighth bit of the command code has been latched in; otherwise the Chip Erase command is not executed. As soon as CS# is driven high, the self-timed Chip Erase cycle (whose duration is tCE) is initiated. While the Chip Erase cycle is in progress, the Status Register may be read to check the value of the Write in Progress (WIP) bit. The Write in Progress (WIP) bit is 1 during the self-timed Chip Erase cycle, and is 0 when it is completed. At some unspecified time before the cycle is completed, the Write Enable Latch (WEL) bit is reset. The Chip Erase (CE) command is executed, if the Block Protect (BP2, BP1, and BP0) bits are 0 and CMP=0 or the Block Protect (BP2, BP1, and BP0) bits are 1 and CMP=1. Figure22. Chip Erase Sequence Diagram CS# SCLK SI 0 1 2 3 4 5 Command 60H or C7H 28 6 7 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.19 Enable/Disable SO to Output RY/BY# (ESRY/DSRY) (70H/80H) Besides SO pin is used to output data, it also can be used as the status pin of ready/busy. The ESRY command is for outputting the ready/busy status to SO. When the device is in the process of power on, enter or exit deep power down mode and erase/program, its status is busy, and the SO output 0. When the device is in the standby mode, the status of device is ready, then SO output 1. The DSRY command is for resetting ESRY. The ready/busy status will not output to SO after DSRY issued. The Enable/Disable SO to Output RY/BY# command sequence: CS# goes low → sending ESRY command code → CS# goes high. The command sequence is shown in Figure23. CS# must be driven high after the eighth bit of the command code has been latched in; otherwise the Enable/Disable SO to Output RY/BY# command is not executed. Figure23. Enable/Disable SO to Output RY/BY# Diagram CS# 0 1 2 3 4 5 SCLK Command SI 70H or 80H 29 6 7 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.20 Deep Power-Down (DP) (B9H) Executing the Deep Power-Down (DP) command is the only way to put the device in the lowest consumption mode (the Deep Power-Down Mode). It can also be used as an extra software protection mechanism, while the device is not in active use, since in this mode, the device ignores all Write, Program and Erase commands. Driving CS# high deselects the device, and puts the device in the Standby Mode (if there is no internal cycle currently in progress). But this mode is not the Deep Power-Down Mode. The Deep Power-Down Mode can only be entered by executing the Deep Power-Down (DP) command. Once the device has entered the Deep Power-Down Mode, all commands are ignored except the Release from Deep Power-Down and Read Device ID (RDI) command or software reset command. The Release from Deep Power-Down and Read Device ID (RDI) command releases the device from Deep Power-Down mode, also allows the Device ID of the device to be output on SO. The Deep Power-Down Mode automatically stops at Power-Down, and the device always in the Standby Mode after PowerUp. The Deep Power-Down command sequence: CS# goes low  sending Deep Power-Down command  CS# goes high. The command sequence is shown in Figure24. CS# must be driven high after the eighth bit of the command code has been latched in; otherwise the Deep Power-Down (DP) command is not executed. As soon as CS# is driven high, it requires a delay of tDP before the supply current is reduced to ICC2 and the Deep Power-Down Mode is entered. Any Deep PowerDown (DP) command, while an Erase, Program or Write cycle is in progress, is rejected without having any effects on the cycle that is in progress. Figure24. Deep Power-Down Sequence Diagram CS# SCLK SI 0 1 2 3 4 5 6 7 Command tDP Stand-by mode Deep Power-down mode B9H 30 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.21 Release from Deep Power-Down and Read Device ID (RDI) (ABH) The Release from Power-Down and Read Device ID command is a multi-purpose command. It can be used to release the device from the Power-Down state or obtain the devices electronic identification (ID) number. To release the device from the Power-Down state, the command is issued by driving the CS# pin low, shifting the instruction code “ABH” and driving CS# high as shown in Figure25. Release from Power-Down will take the time duration of tRES1 (See AC Characteristics) before the device will resume normal operation and other command are accepted. The CS# pin must remain high during the tRES1 time duration. When used only to obtain the Device ID while not in the Power-Down state, the command is initiated by driving the CS# pin low and shifting the instruction code “ABH” followed by 3-dummy byte. The Device ID bits are then shifted out on the falling edge of SCLK with most significant bit (MSB) first as shown in Figure26. The Device ID value is listed in Manufacturer and Device Identification table. The Device ID can be read continuously. The command is completed by driving CS# high. When used to release the device from the Power-Down state and obtain the Device ID, the command is the same as previously described, and shown in Figure26, except that after CS# is driven high it must remain high for a time duration of tRES2 (See AC Characteristics). After this time duration the device will resume normal operation and other command will be accepted. If the Release from Power-Down / Device ID command is issued while an Erase, Program or Write cycle is in process (when WIP equal 1) the command is ignored and will not have any effects on the current cycle. Figure25. Release Power-Down Sequence Diagram CS# 0 SCLK 1 2 3 4 5 6 t RES1 7 Command SI ABH Deep Power-down mode Stand-by mode Figure26. Release Power-Down/Read Device ID Sequence Diagram CS# 0 1 2 3 4 5 6 7 8 9 29 30 31 32 33 34 35 36 37 38 SCLK Command SI SO ABH High-Z t RES2 3 Dummy Bytes 23 22 2 1 0 MSB 7 MSB 31 6 Device ID 5 4 3 2 1 0 Deep Power-down Mode Stand-by Mode 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.22 Read Manufacture ID/ Device ID (REMS) (90H) The Read Manufacturer/Device ID command is an alternative to the Release from Power-Down / Device ID command that provides both the JEDEC assigned Manufacturer ID and the specific Device ID. The command is initiated by driving the CS# pin low and shifting the command code “90H” followed by a 24-bit address (A23-A0) of 000000H. After which, the Manufacturer ID and the Device ID are shifted out on the falling edge of SCLK with most significant bit (MSB) first as shown in Figure27. If the 24-bit address is initially set to 000001H, the Device ID will be read first. Figure27. Read Manufacture ID/ Device ID Sequence Diagram CS# 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 SCLK Command SI 90H 23 22 21 3 2 High-Z SO CS# 24-bit address 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 SCLK SI SO 7 MSB Manufacturer ID 6 5 4 3 2 1 Device ID 0 7 MSB 32 6 5 4 3 2 1 0 1 0 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.23 Read Manufacture ID/ Device ID Dual I/O (92H) The Read Manufacturer/Device ID Dual I/O command is an alternative to the Release from Power-Down / Device ID command that provides both the JEDEC assigned Manufacturer ID and the specific Device ID by dual I/O. The command is initiated by driving the CS# pin low and shifting the command code “92H” followed by a 24-bit address (A23-A0) of 000000H. After which, the Manufacturer ID and the Device ID are shifted out on the falling edge of SCLK with most significant bit (MSB) first as shown in Figure28. If the 24-bit address is initially set to 000001H, the Device ID will be read first. Figure28. Read Manufacture ID/ Device ID Dual I/O Sequence Diagram CS# 0 SCLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 6 4 2 0 6 5 3 1 7 Command SI(IO0) 92H SO(IO1) 7 A23-16 4 2 0 6 5 3 1 7 A15-8 4 2 0 6 5 3 1 7 A7-0 4 2 0 5 3 1 M7-0 CS# SCLK 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 SI(IO0) 6 SO(IO1) 7 4 2 0 6 4 2 0 6 5 3 1 7 5 3 1 7 MFR ID Device ID 4 2 0 6 4 2 0 6 5 3 1 7 5 3 1 7 MFR ID (Repeat) 33 Device ID (Repeat) 4 2 0 6 4 2 0 5 3 1 7 5 3 1 MFR ID (Repeat) Device ID (Repeat) 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.24 Read Manufacture ID/ Device ID Quad I/O (94H) The Read Manufacturer/Device ID Quad I/O command is an alternative to the Release from Power-Down / Device ID command that provides both the JEDEC assigned Manufacturer ID and the specific Device ID by quad I/O. The command is initiated by driving the CS# pin low and shifting the command code “94H” followed by a 24-bit address (A23-A0) of 000000H. After which, the Manufacturer ID and the Device ID are shifted out on the falling edge of SCLK with most significant bit (MSB) first as shown in Figure29. If the 24-bit address is initially set to 000001H, the Device ID will be read first. Figure29. Read Manufacture ID/ Device ID Quad I/O Sequence Diagram CS# 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 4 0 4 0 4 0 4 0 4 0 4 0 SO(IO1) 5 1 5 1 5 1 5 1 5 1 5 1 WP#(IO2) 6 2 6 2 6 2 6 2 6 2 6 2 HOLD#(IO3) 7 3 7 3 7 3 7 3 7 3 7 3 SCLK Command SI(IO0) 94H A23-16 A15-8 A7-0 M7-0 CS# 24 25 26 27 28 29 30 31 SCLK SI(IO0) 4 0 4 0 4 0 4 0 SO(IO1) 5 1 5 1 5 1 5 1 WP#(IO2) 6 2 6 2 6 2 6 2 HOLD#(IO3) 7 3 7 3 7 3 7 3 MFR ID DID MFR ID DID (Repeat)(Repeat)(Repeat)(Repeat) 34 Dummy MFR ID DID 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.25 Read Identification (RDID) (9FH) The Read Identification (RDID) command allows the 8-bit manufacturer identification to be read, followed by two bytes of device identification. The device identification indicates the memory type in the first byte, and the memory capacity of the device in the second byte. The Read Identification (RDID) command while an Erase or Program cycle is in progress, is not decoded, and has no effect on the cycle that is in progress. The Read Identification (RDID) command should not be issued while the device is in Deep Power-Down Mode. The device is first selected by driving CS# low. Then, the 8-bit command code for the command is shifted in. This is followed by the 24-bit device identification, stored in the memory. Each bit is shifted out on the falling edge of Serial Clock. The command sequence is shown in Figure 30. The Read Identification (RDID) command is terminated by driving CS# high at any time during data output. When CS# is driven high, the device is in the Standby Mode. Once in the Standby Mode, the device waits to be selected, so that it can receive, decode and execute commands. Figure30. Read Identification ID Sequence Diagram CS# 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 7 6 SCLK SI 9FH SO CS# Manufacturer ID 5 4 3 2 1 MSB 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 SCLK SI SO 7 Memory Type ID15-ID8 6 5 4 3 2 1 0 MSB 7 MSB 35 Capacity ID7-ID0 6 5 4 3 2 1 0 0 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.26 Program/Erase Suspend (PES) (75H) The Program/Erase Suspend command “75H”, allows the system to interrupt a page program or sector/block erase operation and then read data from any other sector or block. The Write Status Register command (01H) and Erase/Program Security Registers command (44H,42H) and Erase commands (20H, 52H, D8H, C7H, 60H) and Page Program command (02H/32H) are not allowed during Program suspend. The Write Status Register command (01H) and Erase Security Registers command (44H) and Erase commands (20H, 52H, D8H, C7H, 60H) are not allowed during Erase suspend. Program/Erase Suspend is valid only during the page program or sector/block erase operation. A maximum of time of “tsus” (See AC Characteristics) is required to suspend the program/erase operation. The Program/Erase Suspend command will be accepted by the device only if the SUS2/SUS1 bit in the Status Register equal to 0 and WIP bit equal to 1 while a Page Program or a Sector or Block Erase operation is on-going. If the SUS2/SUS1 bit equal to 1 or WIP bit equal to 0, the Suspend command will be ignored by the device. The WIP bit will be cleared form 1 to 0 within “tsus” and the SUS2/SUS1 bit will be set from 0 to 1 immediately after Program/Erase Suspend. A power-off during the suspend period will reset the device and release the suspend state. The command sequence is show in Figure31. Figure31. Program/Erase Suspend Sequence Diagram CS# SCLK 0 1 2 3 4 5 6 7 tSUS Command SI 75H High-Z SO Accept read command 7.27 Program/Erase Resume (PER) (7AH) The Program/Erase Resume command must be written to resume the program or sector/block erase operation after a Program/Erase Suspend command. The Program/Erase Resume command will be accepted by the device only if the SUS2/SUS1 bit equal to 1 and the WIP bit equal to 0. After issued the SUS2/SUS1 bit in the status register will be cleared from 1 to 0 immediately, the WIP bit will be set from 0 to 1 within 200ns and the Sector or Block will complete the erase operation or the page will complete the program operation. The Program/Erase Resume command will be ignored unless a Program/Erase Suspend is active. The command sequence is show in Figure32. Figure32. Program/Erase Resume Sequence Diagram CS# SCLK SI 0 1 2 3 4 5 6 7 Command 7AH SO Resume Erase/Program 36 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.28 Read Unique ID (4BH) The Read Unique ID command accesses a factory-set read-only 128bit number that is unique to each device. The Unique ID can be used in conjunction with user software methods to help prevent copying or cloning of a system. The Read Unique ID command sequence: CS# goes low  sending Read Unique ID command  3-Byte Address (000000H) Dummy Byte128bit Unique ID Out CS# goes high. Figure33. Read Unique ID Sequence Diagram CS# 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 SCLK 24-bit address (000000H) 23 22 21 3 2 Command SI 4BH 1 0 High-Z SO CS# 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 SCLK Dummy Byte SI 7 6 5 4 3 2 1 SO 0 7 6 MSB Data Out1 5 4 3 2 1 0 Data Out2 7 6 5 MSB 7.29 Erase Security Registers (44H) The GD25LQ16C provides three 512-byte Security Registers which can be erased and programmed individually. These registers may be used by the system manufacturers to store security and other important information separately from the main memory array. The Erase Security Registers command is similar to Sector/Block Erase command. A Write Enable (WREN) command must previously have been executed to set the Write Enable Latch (WEL) bit. The Erase Security Registers command sequence: CS# goes low  sending Erase Security Registers command  The Erase Security Registers command sequence: CS# goes low  sending Erase Security Registers command  3-byte address on SI  CS# goes high. The command sequence is shown below. CS# must be driven high after the eighth bit of the last address byte has been latched in; otherwise the Erase Security Registers command is not executed. As soon as CS# is driven high, the self-timed Erase Security Registers cycle (whose duration is tSE) is initiated. While the Erase Security Registers cycle is in progress, the Status Register may be read to check the value of the Write in Progress (WIP) bit. The Write in Progress (WIP) bit is 1 during the self-timed Erase Security Registers cycle, and is 0 when it is completed. At some unspecified time before the cycle is completed, the Write Enable Latch (WEL) bit is reset. The Security Registers Lock Bit (LB3-1) in the Status Register can be used to OTP protect the security registers. Once the LB bit is set to 1, the Security Registers will be permanently locked; the Erase Security Registers command will be ignored. Address Security Register #1 Security Register #2 Security Register #3 A23-16 00H 00H 00H A15-12 0001 0010 0011 37 A11-9 000 000 000 A8-0 Don‘t care Don‘t care Don‘t care 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C Figure34. Erase Security Registers command Sequence Diagram CS# 0 SCLK 1 2 3 4 5 6 7 8 9 Command SI 29 30 31 24 Bits Address 23 22 MSB 44H 2 1 0 7.30 Program Security Registers (42H) The Program Security Registers command is similar to the Page Program command. Each security register contains four pages content. A Write Enable (WREN) command must previously have been executed to set the Write Enable Latch (WEL) bit before sending the Program Security Registers command. The Program Security Registers command is entered by driving CS# Low, followed by the command code (42H), three address bytes and at least one data byte on SI. As soon as CS# is driven high, the self-timed Program Security Registers cycle (whose duration is t PP) is initiated. While the Program Security Registers cycle is in progress, the Status Register may be read to check the value of the Write in Progress (WIP) bit. The Write in Progress (WIP) bit is 1 during the self-timed Program Security Registers cycle, and is 0 when it is completed. At some unspecified time before the cycle is completed, the Write Enable Latch (WEL) bit is reset. If the Security Registers Lock Bit (LB3-1) is set to 1, the Security Registers will be permanently locked. Program Security Registers command will be ignored. Address Security Register #1 Security Register #2 Security Register #3 A23-16 00H 00H 00H A15-12 0001 0010 0011 A11-9 000 000 000 A8-0 Byte Address Byte Address Byte Address Figure35. Program Security Registers command Sequence Diagram CS# 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 32 33 34 35 36 37 38 39 SCLK Command 23 22 21 3 2 Data Byte 1 1 0 7 5 4 3 2 1 2078 2079 6 2077 7 2076 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 2073 MSB 2072 MSB CS# 6 2075 42H 2074 SI 24-bit address 1 0 SCLK Data Byte 2 SI 7 6 MSB 5 4 3 2 Data Byte 3 1 0 7 6 5 4 3 MSB 2 Data Byte 256 1 0 MSB 38 5 4 3 2 0 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.31 Read Security Registers (48H) The Read Security Registers command is similar to Fast Read command. The command is followed by a 3-byte address (A23-A0) and a dummy byte, and each bit is latched-in on the rising edge of SCLK. Then the memory content, at that address, is shifted out on SO, and each bit is shifted out, at a Max frequency fC, on the falling edge of SCLK. The first byte addressed can be at any location. The address is automatically incremented to the next higher address after each byte of data is shifted out. Once the A8-A0 address reaches the last byte of the register (Byte 1FFH), it will reset to 000H, the command is completed by driving CS# high. Address Security Register #1 Security Register #2 Security Register #3 A23-16 00H 00H 00H A15-12 0001 0010 0011 A11-9 000 000 000 A8-0 Byte Address Byte Address Byte Address Figure36. Read Security Registers command Sequence Diagram CS# 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 SCLK Command SI 24-bit address 48H 23 22 21 3 2 1 0 High-Z SO CS# 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 SCLK Dummy Byte SI SO 7 6 5 4 3 2 1 0 7 6 MSB 39 Data Out1 5 4 3 2 1 0 Data Out2 7 6 5 MSB 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 7.32 Enable Reset (66H) and Reset (99H) If the Reset command is accepted, any on-going internal operation will be terminated and the device will return to its default power-on state and lose all the current volatile settings, such as Volatile Status Register bits, Write Enable Latch status (WEL), Program/Erase Suspend status, Read Parameter setting (P7-P0), Deep Power Down Mode, Continuous Read Mode bit setting (M7-M0) and Wrap Bit Setting (W6-W4). The “Enable Reset (66H)” and the “Reset (99H)” commands can be issued in either SPI mode. The “Reset (99H)” command sequence as follow: CS# goes low  Sending Enable Reset command  CS# goes high  CS# goes low  Sending Reset command  CS# goes high. Once the Reset command is accepted by the device, the device will take approximately tRST / tRST_E to reset. During this period, no command will be accepted. Data corruption may happen if there is an on-going or suspended internal Erase or Program operation when Reset command sequence is accepted by the device. It is recommended to check the BUSY bit and the SUS bit in Status Register before issuing the Reset command sequence. Figure37. Enable Reset and Reset command Sequence Diagram CS# 0 SCLK 1 2 SI 3 4 5 6 7 0 1 2 3 4 5 Command Command 66H 99H 6 7 High-Z SO 7.33 Read Serial Flash Discoverable Parameter (5AH) The Serial Flash Discoverable Parameter (SFDP) standard provides a consistent method of describing the functional and feature capabilities of serial flash devices in a standard set of internal parameter tables. These parameter tables can be interrogated by host system software to enable adjustments needed to accommodate divergent features from multiple vendors. The concept is similar to the one found in the Introduction of JEDEC Standard, JESD68 on CFI. SFDP is a standard of JEDEC Standard No.216. Figure38. Read Serial Flash Discoverable Parameter command Sequence Diagram CS# 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 SCLK Command SI 24-bit address 5AH 23 22 21 3 2 1 0 High-Z SO CS# 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 SCLK Dummy Byte SI SO 7 6 5 4 3 2 1 0 7 6 MSB 40 Data Out1 5 4 3 2 1 0 Data Out2 7 6 5 MSB 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C Table3. Signature and Parameter Identification Data Values Description SFDP Signature Comment Fixed:50444653H Add(H) DW Add Data Data (Byte) (Bit) 00H 07:00 53H 53H 01H 15:08 46H 46H 02H 23:16 44H 44H 03H 31:24 50H 50H SFDP Minor Revision Number Start from 00H 04H 07:00 00H 00H SFDP Major Revision Number Start from 01H 05H 15:08 01H 01H Number of Parameters Headers Start from 00H 06H 23:16 01H 01H Unused Contains 0xFFH and can never be 07H 31:24 FFH FFH 08H 07:00 00H 00H Start from 0x00H 09H 15:08 00H 00H Start from 0x01H 0AH 23:16 01H 01H Parameter Table Length How many DWORDs in the 0BH 31:24 09H 09H (in double word) Parameter table Parameter Table Pointer (PTP) First address of JEDEC Flash 0CH 07:00 30H 30H Parameter table 0DH 15:08 00H 00H 0EH 23:16 00H 00H 0FH 31:24 FFH FFH 10H 07:00 C8H C8H changed ID number (JEDEC) 00H: It indicates a JEDEC specified header Parameter Table Minor Revision Number Parameter Table Major Revision Number Unused Contains 0xFFH and can never be changed ID Number LSB It is indicates GigaDevice (GigaDevice Manufacturer ID) manufacturer ID Parameter Table Minor Revision Start from 0x00H 11H 15:08 00H 00H Start from 0x01H 12H 23:16 01H 01H Parameter Table Length How many DWORDs in the 13H 31:24 03H 03H (in double word) Parameter table Parameter Table Pointer (PTP) First address of GigaDevice Flash 14H 07:00 60H 60H Parameter table 15H 15:08 00H 00H 16H 23:16 00H 00H 17H 31:24 FFH FFH Number Parameter Table Major Revision Number Unused Contains 0xFFH and can never be changed 41 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C Table4. Parameter Table (0): JEDEC Flash Parameter Tables Description Comment Add(H) DW Add (Byte) (Bit) Data Data 00: Reserved; 01: 4KB erase; Block/Sector Erase Size 10: Reserved; 01:00 01b 02 1b 03 0b 11: not support 4KB erase Write Granularity 0: 1Byte, 1: 64Byte or larger Write Enable Instruction 0: Nonvolatile status bit Requested for Writing to Volatile 1: Volatile status bit Status Registers (BP status register bit) 30H E5H 0: Use 50H Opcode, Write Enable Opcode Select for 1: Use 06H Opcode, Writing to Volatile Status Note: If target flash status register Registers is Nonvolatile, then bits 3 and 4 04 0b 07:05 111b 15:08 20H 16 1b 18:17 00b 19 0b must be set to 00b. Unused Contains 111b and can never be changed 4KB Erase Opcode 31H (1-1-2) Fast Read 0=Not support, 1=Support Address Bytes Number used in 00: 3Byte only, 01: 3 or 4Byte, addressing flash array 10: 4Byte only, 11: Reserved Double Transfer Rate (DTR) clocking 0=Not support, 1=Support 32H F1H (1-2-2) Fast Read 0=Not support, 1=Support 20 1b (1-4-4) Fast Read 0=Not support, 1=Support 21 1b (1-1-4) Fast Read 0=Not support, 1=Support 22 1b 23 1b 33H 31:24 FFH 37H:34H 31:00 Unused Unused Flash Memory Density (1-4-4) Fast Read Number of 0 0000b: Wait states (Dummy Wait states Clocks) not support (1-4-4) Fast Read Number of Mode Bits 39H (1-1-4) Fast Read Number of 0 0000b: Wait states (Dummy Wait states Clocks) not support Mode Bits 00100b 44H 07:05 010b 15:08 EBH 20:16 01000b 3AH 000b:Mode Bits not support (1-1-4) Fast Read Opcode 3BH (1-1-2) Fast Read Number of 0 0000b: Wait states (Dummy Wait states Clocks) not support (1-1-2) Fast Read Number 000b: Mode Bits not support EBH 08H 23:21 000b 31:24 6BH 04:00 01000b 3CH 42 FFH 00FFFFFFH 38H (1-4-4) Fast Read Opcode (1-1-4) Fast Read Number of 04:00 000b:Mode Bits not support 20H 6BH 08H 07:05 000b 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C of Mode Bits (1-1-2) Fast Read Opcode 3DH (1-2-2) Fast Read Number 0 0000b: Wait states (Dummy of Wait states Clocks) not support (1-2-2) Fast Read Number of Mode Bits 000b: Mode Bits not support 3FH 0=not support 3BH 20:16 00010b 3EH (1-2-2) Fast Read Opcode (2-2-2) Fast Read 15:08 1=support Unused 42H 23:21 010b 31:24 BBH 00 0b 03:01 111b 04 0b 07:05 111b 40H (4-4-4) Fast Read 0=not support 1=support Unused 3BH BBH EEH Unused 43H:41H 31:08 0xFFH 0xFFH Unused 45H:44H 15:00 0xFFH 0xFFH 20:16 00000b (2-2-2) Fast Read Number 0 0000b: Wait states (Dummy of Wait states Clocks) not support (2-2-2) Fast Read Number of Mode Bits 46H 000b: Mode Bits not support (2-2-2) Fast Read Opcode Unused (4-4-4) Fast Read Number of 0 0000b: Wait states (Dummy Wait states Clocks) not support (4-4-4) Fast Read Number of Mode Bits Sector/block size=2^N bytes 0x00b: this sector type don’t exist Sector/block size=2^N bytes 0x00b: this sector type don’t exist Sector Type 2 erase Opcode Sector Type 3 Size Sector/block size=2^N bytes 0x00b: this sector type don’t exist Sector Type 3 erase Opcode Sector Type 4 Size 000b 47H 31:24 FFH FFH 49H:48H 15:00 0xFFH 0xFFH 20:16 00000b 000b: Mode Bits not support Sector Type 1 erase Opcode Sector Type 2 Size 23:21 4AH (4-4-4) Fast Read Opcode Sector Type 1 Size 00H Sector/block size=2^N bytes 0x00b: this sector type don’t exist Sector Type 4 erase Opcode 43 00H 23:21 000b 4BH 31:24 FFH FFH 4CH 07:00 0CH 0CH 4DH 15:08 20H 20H 4EH 23:16 0FH 0FH 4FH 31:24 52H 52H 50H 07:00 10H 10H 51H 15:08 D8H D8H 52H 23:16 00H 00H 53H 31:24 FFH FFH 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C Table5. Parameter Table (1): GigaDevice Flash Parameter Tables Description Comment Add(H) DW Add (Byte) (Bit) 61H:60H 63H:62H Data Data 15:00 2100H 2100H 31:16 1650H 1650H 2000H=2.000V Vcc Supply Maximum Voltage 2100H=2.100V 2700H=2.700V 3600H=3.600V 1650H=1.650V Vcc Supply Minimum Voltage 2250H=2.250V 2350H=2.350V 2700H=2.700V HW Reset# pin 0=not support 1=support 00 0b HW Hold# pin 0=not support 1=support 01 1b Deep Power Down Mode 0=not support 1=support 02 1b SW Reset 0=not support 1=support 03 1b 11:04 99H Should SW Reset Opcode be issue Reset Enable(66H) 65H:64H F99EH before Reset cmd. Program Suspend/Resume 0=not support 1=support 12 1b Erase Suspend/Resume 0=not support 1=support 13 1b 14 1b 15 1b 66H 23:16 77H 77H 67H 31:24 64H 64H 00 0b 01 0b 09:02 FFH 10 0b Unused Wrap-Around Read mode Wrap-Around Read 0=not support 1=support mode Opcode 08H:support 8B wrap-around read Wrap-Around Read data length 16H:8B&16B 32H:8B&16B&32B 64H:8B&16B&32B&64B Individual block lock Individual block lock bit (Volatile/Nonvolatile) 0=not support 0=Volatile 1=support 1=Nonvolatile Individual block lock Opcode Individual block lock Volatile protect bit default protect status 0=protect 1=unprotect Secured OTP 0=not support 1=support Read Lock 0=not support Permanent Lock 0=not support 6BH:68 H H 11 1b 1=support 12 0b 1=support 13 1b Unused 15:14 11b Unused 31:16 FFFFH 44 EBFC FFFFH 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C 8 ELECTRICAL CHARACTERISTICS 8.1 POWER-ON TIMING Figure39. Power-On Timing Sequence Diagram Vcc(max) Chip Selection is not allowed Vcc(min) tVSL Device is fully accessible VWI Time Table 8. Power-Up Timing and Write Inhibit Threshold Symbol Parameter tVSL VCC (min) To CS# Low VWI Write Inhibit Voltage VCC (min) Min. Max. Unit 1.8 1 ms 1.4 V 8.2 Initial Delivery State The device is delivered with the memory array erased: all bits are set to 1(each byte contains FFH).The Status Register contains 00H (all Status Register bits are 0). 8.3 Absolute Maximum Ratings Parameter Value Ambient Operating Temperature -40 to 85 Unit ℃ -40 to 105 -40 to 125 ℃ Storage Temperature -65 to 150 Transient Input/Output Voltage (note: overshoot) -2.0 to VCC+2.0 V Applied Input/Output Voltage -0.6 to VCC+0.5 V -0.6 to 2.5 V VCC 45 1.8V Uniform Sector Dual and Quad Serial Flash GD25LQ16C Figure 40. Absolute Maximum Ratings Diagram Maximum Negative Overshoot Waveform 20ns Maximum Positive Overshoot Waveform 20ns 20ns Vss Vcc + 2.0V Vss-2.0V Vcc 20ns 20ns 20ns 8.4 Capacitance Measurement Conditions Symbol Parameter Min. Typ. Max. Unit Conditions CIN Input Capacitance 6 pF VIN=0V COUT Output Capacitance 8 pF VOUT=0V CL Load Capacitance 30 pF Input Rise And Fall time 5 ns Input Pause Voltage 0.1VCC to 0.8VCC V Input Timing Reference Voltage 0.2VCC to 0.7VCC V Output Timing Reference Voltage 0.5VCC V Figure41. Input Test Waveform and Measurement Level Input timing reference level 0.8VCC 0.7VCC 0.1VCC 0.2VCC Output timing reference level AC Measurement Level Note: Input pulse rise and fall time are