HIN232, HIN236, HIN237, HIN238,
HIN239, HIN240, HIN241
®
Data Sheet
September 26, 2008
FN3138.16
+5V Powered RS-232
Transmitters/Receivers
Features
The HIN232-HIN241 family of RS-232 transmitters/receivers
interface circuits meet all ElA RS-232E and V.28 specifications,
and are particularly suited for those applications where ±12V is
not available. They require a single +5V power supply (except
HIN239) and feature onboard charge pump voltage converters
which generate +10V and -10V supplies from the 5V supply.
The family of devices offer a wide variety of RS-232
transmitter/receiver combinations to accommodate various
applications (see “Selection Table” on page 1).
• Requires Only Single +5V Power Supply
- (+5V and +12V - HIN239)
The drivers feature true TTL/CMOS input compatibility,
slew-rate-limited output, and 300Ω power-off source
impedance. The receivers can handle up to ±30V, and have
a 3kΩ to 7kΩ input impedance. The receivers also feature
hysteresis to greatly improve noise rejection.
• Multiple Drivers
- ±10V Output Swing for 5V lnput
- 300Ω Power-Off Source Impedance
- Output Current Limiting
- TTL/CMOS Compatible
- 30V/µs Maximum Slew Rate
• Meets All RS-232E and V.28 Specifications
• High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . 120kbps
• Onboard Voltage Doubler/Inverter
• Low Power Consumption
• Low Power Shutdown Function
• Three-State TTL/CMOS Receiver Outputs
• Multiple Receivers
- ±30V Input Voltage Range
- 3kΩ to 7kΩ Input Impedance
- 0.5V Hysteresis to Improve Noise Rejection
• Pb-free Available (RoHS compliant)
Applications
• Any System Requiring RS-232 Communication Ports
- Computer - Portable, Mainframe, Laptop
- Peripheral - Printers and Terminals
- Instrumentation
- Modems
Selection Table
POWER SUPPLY
VOLTAGE
NUMBER OF
RS-232
DRIVERS
NUMBER OF
RS-232
RECEIVERS
EXTERNAL
COMPONENTS
LOW POWER
SHUTDOWN/TTL
THREE-STATE
NUMBER OF
LEADS
HIN232
+5V
2
2
4 Capacitors
No/No
16
HIN236
+5V
4
3
4 Capacitors
Yes/Yes
24
HIN237
+5V
5
3
4 Capacitors
No/No
24
HIN238
+5V
4
4
4 Capacitors
No/No
24
HIN239
+5V and +7.5V to 13.2V
3
5
2 Capacitors
No/Yes
24
HIN240
+5V
5
5
4 Capacitors
Yes/Yes
44
HIN241
+5V
4
5
4 Capacitors
Yes/Yes
28
PART
NUMBER
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2004, 2005, 2008. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pin Descriptions
PIN
VCC
FUNCTION
Power Supply Input 5V ±10%.
V+
Internally generated positive supply (+10V nominal), HIN239 requires +7.5V to +13.2V.
V-
Internally generated negative supply (-10V nominal).
GND
Ground lead. Connect to 0V.
C1+
External capacitor (+ terminal) is connected to this lead.
C1-
External capacitor (- terminal) is connected to this lead.
C2+
External capacitor (+ terminal) is connected to this lead.
C2-
External capacitor (- terminal) is connected to this lead.
TIN
Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kΩ pull-up resistor to VCC is connected to each lead.
TOUT
RIN
ROUT
Transmitter Outputs. These are RS-232 levels (nominally ±10V).
Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kΩ pull-down resistor to GND is connected to each input.
Receiver Outputs. These are TTL/CMOS levels.
EN
Enable input. This is an active low input which enables the receiver outputs. With EN = 5V, the receiver outputs are placed
in a high impedance state.
SD
Shutdown Input. With SD = 5V, the charge pump is disabled, the receiver outputs are in a high impedance state and the
transmitters are shut off.
NC
No Connect. No connections are made to these leads.
2
FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Ordering Information
PART
NUMBER
PART
MARKING
TEMP. RANGE
(°C)
PKG.
DWG. #
PACKAGE
HIN232CB*
232CB
0 to +70
16 Ld SOIC
M16.3
HIN232CBZ*
(Note)
HIN232CBZ
0 to +70
16 Ld SOIC
(Pb-free)
M16.3
HIN232CP
HIN232CP
0 to +70
16 Ld PDIP
E16.3
HIN232CPZ
(Note)
HIN232CPZ
0 to +70
16 Ld PDIP**
(Pb-free)
E16.3
HIN232IB*
HIN232IB
-40 to +85
16 Ld SOIC
M16.3
HIN232IBZ*
(Note)
HIN232IBZ
-40 to +85
16 Ld SOIC
(Pb-free)
M16.3
HIN232IP
HIN232IP
-40 to +85
16 Ld PDIP
E16.3
HIN232IPZ
(Note)
HIN232IPZ
-40 to +85
16 Ld PDIP**
(Pb-free)
E16.3
HIN236CB
HIN236CB
0 to +70
24 Ld SOIC
M24.3
HIN236CBZ
(Note)
HIN236CBZ
0 to +70
24 Ld SOIC
(Pb-free)
M24.3
HIN237CB*
HIN237CB
0 to +70
24 Ld SOIC
M24.3
HIN237CBZ*
(Note)
HIN237CBZ
0 to +70
24 Ld SOIC
(Pb-free)
M24.3
HIN238CB*
HIN238CB
0 to +70
24 Ld SOIC
M24.3
HIN238CBZ*(Note)
HIN238CBZ
0 to +70
24 Ld SOIC
(Pb-free)
M24.3
HIN238CP
HIN238CP
0 to +70
24 Ld PDIP
E24.3
HIN238IB
HIN238IB
-40 to +85
24 Ld SOIC
M24.3
HIN238IBZ
(Note)
HIN238IBZ
-40 to +85
24 Ld SOIC
(Pb-free)
M24.3
HIN239CB*
HIN239CB
0 to +70
24 Ld SOIC
M24.3
HIN239CBZ*
(Note)
HIN239CBZ
0 to +70
24 Ld SOIC
(Pb-free)
M24.3
HIN239CP
HIN239CP
0 to +70
24 Ld PDIP
E24.3
HIN239CPZ
(Note)
HIN239CPZ
0 to +70
24 Ld PDIP**
(Pb-free)
E24.3
HIN240CN
HIN240CN
0 to +70
44 Ld MQFP
Q44.10X10
HIN240CNZ*
(Note)
HIN240CNZ
0 to +70
44 Ld MQFP
(Pb-free)
Q44.10X10
HIN241CA
HIN241CA
0 to +70
28 Ld SSOP
M28.209
HIN241CAZ
(Note)
HIN241CAZ
0 to +70
28 Ld SSOP
(Pb-free)
M28.209
HIN241CB*
HIN241CB
0 to +70
28 Ld SOIC
M28.3
HIN241CBZ*
(Note)
HIN241CBZ
0 to +70
28 Ld SOIC
(Pb-free)
M28.3
HIN241IB
HIN241IB
-40 to +85
28 Ld SOIC
M28.3
HIN241IBZ
(Note)
HIN241IBZ
-40 to +85
28 Ld SOIC
(Pb-free)
M28.3
*Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations).
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
3
FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pinouts
HIN236
(24 LD SOIC)
TOP VIEW
HIN232
(16 LD PDIP, SOIC)
TOP VIEW
16 VCC
C1+ 1
15 GND
V+ 2
C1- 3
14 T1OUT
C2+ 4
13 R1IN
C2- 5
12 R1OUT
6
11 T1IN
T2OUT 7
10 T2IN
V-
T3OUT
1
24 T4OUT
T1OUT
2
23 R2IN
T2OUT
3
22 R2OUT
R1IN
4
21 SD
R1OUT
5
20 EN
T2IN
6
19 T4IN
T1IN
7
18 T3IN
GND
8
17 R3OUT
VCC
9
16 R3IN
9 R2OUT
R2IN 8
C1+ 10
14 C2-
C1- 12
13 C2+
+5V
1µF
+5V
+
16
1µF
1
NOTE 1
+
3
4
NOTE 1
T1IN
T2IN
R1OUT
+
5
11
10
VCC
C1+
C1C2+
C2-
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
+5V
400kΩ
+5V
400kΩ
V+
2
+
NOTE 1
T1
14
1µF
T1IN
V- 6
+
T2
7
12
13
9
10
VCC
C1+
+
+5V TO 10V
12
C1- VOLTAGE DOUBLER
13
C2+
+
+10V TO -10V
14
VOLTAGE INVERTER
C2+5V
400kΩ
7
T1
6
+5V
400kΩ
T2
18
+5V
400kΩ
T3
19
+5V
400kΩ
T4
NOTE 1
T2IN
T1OUT
T3IN
T2OUT
R1IN
T4IN
R1OUT
9
8
R2IN
15
EN
NOTE:
4
1µF
1µF
T1OUT
T2OUT
T3OUT
T4OUT
R1IN
5kΩ
23
R2IN
5kΩ
17
20
+
24
R2
R3OUT
+
V- 15
1
22
5kΩ
R2
11
3
R1
R2OUT
V+
2
5
5kΩ
R1
R2OUT
15 V-
V+ 11
16
5kΩ
R3
R3IN
21
SD
8
1. Either 0.1µF or 1µF capacitors may be used.
4
FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pinouts
(Continued)
HIN238
(24 LD PDIP, SOIC)
TOP VIEW
HIN237
(24 LD SOIC)
TOP VIEW
T3OUT 1
24 T4OUT
T2OUT 1
24 T3OUT
T1OUT 2
23 R2IN
T1OUT 2
23 R3IN
T2OUT 3
22 R2OUT
R1IN
21 T5IN
4
R1OUT 5
T2IN
R2IN
20 T5OUT
T1IN
R1OUT 6
19 T3IN
T1IN
7
18 T3IN
R1IN
7
18 T2IN
GND
8
17 R3OUT
GND
8
17 R4OUT
VCC
9
16 R3IN
VCC
9
16 R4IN
15 V-
C1+ 10
T2IN
T3IN
T4IN
T5IN
10
C1+
+
12
C113
C2+
+
14
C2-
14 C2-
V+ 11
14 C2-
C1- 12
13 C2+
C1- 12
13 C2+
+5V
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
V- 15
+5V
400kΩ
6
T2
+5V
400kΩ
T3
+5V
400kΩ
19
21
11
V+
T1
+5V
400kΩ
9
1µF
VCC
+5V
400kΩ
7
18
15 V-
V+ 11
9
T1IN
20 T4OUT
19 T4IN
+5V
1µF
21 T4IN
5
6
C1+ 10
1µF
22 R3OUT
3
R2OUT 4
+
1µF
1µF
1µF
+
2
3
1
T1OUT
T1IN
T2OUT
T2IN
T3OUT
T3IN
T4OUT
T4IN
10
C1+
+
12
C113
C2+
+
14
C2-
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
V- 15
+
T1
+5V
400kΩ
T2
18
19
+5V
400kΩ
T3
+5V
400kΩ
T4
21
2
20
5
T5OUT
20
22
R1IN
4
3
R2IN
5kΩ
R2
23
R2IN
22
23
R3IN
R3OUT
5kΩ
R2
5kΩ
R3
17
T4OUT
5kΩ
R2OUT
R2OUT
T3OUT
7
R1
R1IN
5kΩ
R1
1µF
T2OUT
24
R1OUT
4
R1OUT
1µF
T1OUT
1
6
T5
+
11
V+
+5V
400kΩ
5
T4
24
VCC
16
R3IN
R3OUT
5kΩ
R3
17
16
R4IN
R4OUT
5kΩ
R4
8
5
8
FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
(Continued)
NC
NC
R5IN
R5OUT
T3IN
T4IN
R4OUT
21 R2IN
R4IN
22 R2OUT
VCC 4
EN
23 T2IN
GND 3
SD
24 T1IN
R1IN 2
NC
R1OUT 1
T5OUT
HIN240
(44 LD MQFP)
TOP VIEW
HIN239
(24 LD PDIP, SOIC)
TOP VIEW
44 43 42 41 40 39 38 37 36 35 34
33
2
32
1
NC
V+ 5
20 T2OUT
T5IN
C1+ 6
19 T1OUT
R3OUT
3
31
NC
C1- 7
18 R3IN
R3IN
4
30
V-
17 R3OUT
T4OUT
5
29
C2-
16 T3IN
T3OUT
6
28
C2+
T1OUT
7
27
C1-
T2OUT
8
26
V+
NC
9
25
C1+
6
NC
NC
NC
NC
NC
24
10
11
23
12 13 14 15 16 17 18 19 20 21 22
NC
NC
NC
R2IN
VCC
13 T3OUT
R4IN 12
GND
14 EN
R1IN
R4OUT 11
R1OUT
15 NC
T1IN
R5IN 9
R5OUT 10
T2IN
V- 8
R2OUT
Pinouts
FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pinouts
(Continued)
+5V
+7.5V TO +13.2V (NOTE)
+5V
4
6
1µF
+
7
(NOTE)
T1IN
T2IN
T3IN
R1OUT
C1-
+10V TO -10V
VOLTAGE INVERTER
+5V
400kΩ
24
23
+5V
400kΩ
T2
16
+5V
400kΩ
T3
13
2
1
EN
21
T1IN
T2OUT
T2IN
T3OUT
T3IN
R1IN
T4IN
R2IN
+5V
400kΩ
14
T2
+5V
400kΩ
T3
+5V
400kΩ
38
T4
+5V
400kΩ
2
T5
37
T5IN
R1OUT
R3IN
5kΩ
11
R4IN
5kΩ
9
R5IN
R4OUT
3
EN
T3OUT
T4OUT
T5OUT
R1IN
R2IN
5kΩ
4
R3IN
5kΩ
39
40
R4IN
5kΩ
36
NOTE: For V+ > 11V, use C1 ≤ 0.1µF.
T2OUT
5kΩ
3
42
T1OUT
10
R4
R5OUT
7
17
13
5kΩ
1µF
41
R3
35
R5
1µF
30
5
16
R3OUT
V-
+
6
R2
12
10
R2OUT
V+
26
8
R1
18
R5
T1OUT
5kΩ
17
14
1µF
1µF
5kΩ
22
R4
R5OUT
V- 8
20
R3
R4OUT
5
19
R2
R3OUT
V+
+
T1
R1
R2OUT
1µF
VCC
C1+
19
25
V
CC
C1+
+
+5V TO 10V
27
C1- VOLTAGE DOUBLER
28
C2+
+10V TO -10V
+
29
VOLTAGE INVERTER
C2+5V
T1
400kΩ
15
5kΩ
43
R5IN
SD
18
HIN241
(28 SOIC, SSOP)
TOP VIEW
7
T3OUT 1
28 T4OUT
T1OUT 2
27 R3IN
T2OUT 3
26 R3OUT
R2IN 4
25 SD
R2OUT 5
24 EN
T2IN 6
23 R4IN
T1IN 7
22 R4OUT
R1OUT 8
21 T4IN
R1IN 9
20 T3IN
GND 10
19 R5OUT
VCC 11
18 R5IN
C1+ 12
17 V-
V+ 13
16 C2-
C1- 14
15 C2+
FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Pinouts
(Continued)
+5V
1µF
1µF
T1IN
T2IN
T3IN
T4IN
R1OUT
11
12
VCC
C1+
+
+5V TO 10V
14
C1- VOLTAGE DOUBLER
15
C2+
+
+10V TO -10V
16
VOLTAGE INVERTER
C2+5V
400kΩ
7
T1
6
+5V
400kΩ
T2
20
+5V
400kΩ
T3
21
+5V
400kΩ
T4
EN
+ 1µF
T1OUT
T2OUT
T3OUT
T4OUT
9
R1IN
5kΩ
5
4
R2IN
5kΩ
26
27
R3IN
5kΩ
22
23
R4IN
5kΩ
19
24
V- 17
28
8
R4
R5OUT
1µF
1
R3
R4OUT
+
3
R2
R3OUT
13
2
R1
R2OUT
V+
18
5kΩ
R5
25
R5IN
SD
10
8
FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < VCC < 6V
V+ to Ground (Note 2. . . . . . . . . . . . . . . . (VCC -0.3V) < V+ < 13.2V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24V
Input Voltages
TIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < VIN < (V+ +0.3V)
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < VTXOUT < (V+ +0.3V)
ROUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V)
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Thermal Resistance (Typical, Note 3)
θJC (°C/W)
16 Ld PDIP Package*
90
24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
70
16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
100
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
75
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
70
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
95
44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . .
80
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
Operating Conditions
Temperature Range
HIN2xxcx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
HIN2xxIx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
2. Only HIN239. For V+ > 11V, C1 must be ≤0.1µF.
3. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: VCC = +5V ±10%, TA = Operating Temperature Range
PARAMETER
MIN
(Note 5)
TYP
MAX
(Note 5)
UNITS
HIN232
-
5
10
mA
HIN236-HIN238, HIN240-HIN241
-
7
15
mA
HIN239
-
0.4
1
mA
HIN239
-
5.0
15
mA
-
1
10
µA
-
-
0.8
V
TEST CONDITIONS
SUPPLY CURRENTS
No Load,
TA = +25°C
Power Supply Current, ICC
V+ Power Supply Current, ICC
No Load, TA = +25°C
No Load,
TA = +25°C
Shutdown Supply Current, ICC(SD)
TA = +25°C
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, VlL
TIN, EN, Shutdown
Input Logic High, VlH
TIN
2.0
-
-
V
EN, Shutdown
2.4
-
-
V
Transmitter Input Pull-up Current, IP
TIN = 0V
-
15
200
µA
TTL/CMOS Receiver Output Voltage Low, VOL
IOUT = 1.6mA
-
0.1
0.4
V
TTL/CMOS Receiver Output Voltage High, VOH
IOUT = -1.0mA
3.5
4.6
-
V
-30
-
+30
V
RECEIVER INPUTS
RS-232 Input Voltage Range VIN
Receiver Input Impedance RIN
VIN = ±3V
3.0
5.0
7.0
kΩ
Receiver Input Low Threshold, VlN (H-L)
VCC = 5V, TA = +25°C
0.8
1.2
-
V
Receiver Input High Threshold, VIN (L-H)
VCC = 5V, TA = +25°C
-
1.7
2.4
V
0.2
0.5
1.0
V
Receiver Input Hysteresis VHYST
9
FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Electrical Specifications
Test Conditions: VCC = +5V ±10%, TA = Operating Temperature Range (Continued)
PARAMETER
TEST CONDITIONS
MIN
(Note 5)
TYP
MAX
(Note 5)
UNITS
120
-
-
kbps
TIMING CHARACTERISTICS
Baud Rate (1 Transmitter Switching)
RL = 3kΩ
Output Enable Time, tEN
HIN236, HIN239, HIN240, HIN241
-
400
-
ns
Output Disable Time, tDIS
HIN236, HIN239, HIN240, HIN241
-
250
-
ns
Propagation Delay, tPD
RS-232 to TTL
-
0.5
-
µs
Instantaneous Slew Rate SR
CL = 10pF, RL = 3kΩ, TA = +25°C (Note 4)
-
-
30
V/µs
Transition Region Slew Rate, SRT
RL = 3kΩ, CL = 2500pF Measured from +3V to -3V
or -3V to +3V, 1 Transmitter Switching
-
3
-
V/µs
TRANSMITTER OUTPUTS
Output Voltage Swing, TOUT
Transmitter Outputs, 3kΩ to Ground
±5
±9
±10
V
Output Resistance, TOUT
VCC = V+ = V- = 0V, VOUT = ±2V
300
-
-
Ω
RS-232 Output Short Circuit Current, ISC
TOUT shorted to GND
-
±10
-
mA
NOTE:
4. Limits established by characterization and are not production tested.
5. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
VOLTAGE DOUBLER
C1+
S1
VOLTAGE INVERTER
S2
V+ = 2VCC
VCC
+
GND
C1-
S3
+
C1
S4
S5
C2+
GND
+
C3
VCC
S6
GND
S7
C2-
+
C2
S8
C4
V- = -(V+)
RC
OSCILLATOR
FIGURE 1. CHARGE PUMP
Detailed Description
The HIN232 thru HIN241 family of RS-232
transmitters/receivers are powered by a single +5V power
supply (except HIN239), feature low power consumption, and
meet all ElA RS-232C and V.28 specifications. The circuit is
divided into three sections: The charge pump, transmitter, and
receiver.
Charge Pump
An equivalent circuit of the charge pump is illustrated in
Figure 1. The charge pump contains two sections: the voltage
doubler and the voltage inverter. Each section is driven by a
two-phase, internally generated clock to generate +10V and
-10V. The nominal clock frequency is 16kHz. During phase
one of the clock, capacitor C1 is charged to VCC . During
phase two, the voltage on C1 is added to VCC , producing a
signal across C3 equal to twice VCC . During phase one, C2 is
also charged to 2VCC , and then during phase two, it is
10
inverted with respect to ground to produce a signal across C4
equal to -2VCC . The charge pump accepts input voltages up
to 5.5V. The output impedance of the voltage doubler section
(V+) is approximately 200Ω, and the output impedance of the
voltage inverter section (V-) is approximately 450Ω. A typical
application uses 1µF capacitors for C1-C4, however, the value
is not critical. Increasing the values of C1 and C2 will lower the
output impedance of the voltage doubler and inverter,
increasing the values of the reservoir capacitors, C3 and C4,
lowers the ripple on the V+ and V- supplies.
During shutdown mode (HIN236, HIN240 and HIN241),
SHUTDOWN control line set to logic “1”, the charge pump is
turned off, V+ is pulled down to VCC , V- is pulled up to GND,
and the supply current is reduced to less than 10µA. The
transmitter outputs are disabled and the receiver outputs are
placed in the high impedance state.
FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Transmitters
Receivers
The transmitters are TTL/CMOS compatible inverters which
translate the inputs to RS-232 outputs. The input logic threshold
is about 26% of VCC , or 1.3V for VCC = 5V. A logic 1 at the
input results in a voltage of between -5V and V- at the output,
and a logic 0 results in a voltage between +5V and (V+ -0.6V).
Each transmitter input has an internal 400kΩ pullup resistor so
any unused input can be left unconnected and its output
remains in its low state. The output voltage swing meets the
RS-232C specifications of ±5V minimum with the worst case
conditions of: all transmitters driving 3kΩ minimum load
impedance, VCC = 4.5V, and maximum allowable operating
temperature. The transmitters have an internally limited output
slew rate which is less than 30V/µs. The outputs are short
circuit protected and can be shorted to ground indefinitely. The
powered down output impedance is a minimum of 300Ω with
±2V applied to the outputs and VCC = 0V.
The receiver inputs accept up to ±30V while presenting the
required 3kΩ to 7kΩ input impedance even if the power is off
(VCC = 0V). The receivers have a typical input threshold of
1.3V which is within the ±3V limits, known as the transition
region, of the RS-232 specifications. The receiver output is
0V to VCC . The output will be low whenever the input is
greater than 2.4V and high whenever the input is floating or
driven between +0.8V and -30V. The receivers feature 0.5V
hysteresis to improve noise rejection. The receiver Enable
line EN, when set to logic “1”, (HIN236, HIN239, HIN240,
and HIN241) disables the receiver outputs, placing them in
the high impedance mode. The receiver outputs are also
placed in the high impedance state when in shutdown mode.
V+
VCC
VCC
400kΩ
300Ω
RXIN
TXIN
TOUT
GND < TXIN < VCC
V- < VTOUT < V+
-30V < RXIN < +30V
ROUT
5kΩ
GND < VROUT < VCC
GND
V-
FIGURE 3. RECEIVER
FIGURE 2. TRANSMITTER
TIN
OR
RIN
TOUT
OR
ROUT
VOL
VOL
tPHL
AVERAGE PROPAGATION DELAY =
tPLH
tPHL + tPLH
2
FIGURE 4. PROPAGATION DELAY DEFINITION
11
FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Typical Performance Curves
1µF
SUPPLY VOLTAGE (|V|)
V- SUPPLY VOLTAGE
TA = +25°C
12
12
10
0.47µF
8
0.10µF
6
4
TRANSMITTER OUTPUTS
OPEN CIRCUIT
10
V+ (VCC = 5V)
8
6
V+ (VCC = 4.5V)
V- (VCC = 4.5V)
4
V- (VCC = 5V)
2
2
0
0
3.0
4.0
3.5
4.5
VCC
5.0
5.5
6.0
0
5
10
15
20
25
30
35
|ILOAD| (mA)
FIGURE 5. V- SUPPLY VOLTAGE vs VCC , VARYING
CAPACITORS
FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD (HIN232)
Test Circuits (HIN232)
+4.5V TO
+5.5V INPUT
1µF
C1
1 C1+
-
1µF
C3
2 V+
+
+
-
1µF +
C2 -
-
+
3kΩ
1µF C4
T2
OUTPUT
1 C1+
VCC 16
2 V+
GND 15
3 C13kΩ
3 C1-
T1OUT 14
4 C2+
R1IN 13
RS-232 ±30V INPUT
5 C2-
R1OUT 12
TTL/CMOS OUTPUT
T1 OUTPUT
6 V-
T1IN 11
TTL/CMOS INPUT
7 T2OUT
T2IN 10
TTL/CMOS INPUT
8 R2IN
R2OUT 9
TTL/CMOS OUTPUT
VCC 16
GND 15
T1OUT 14
4 C2+
R1IN 13
5 C2-
R1OUT 12
6 V-
T1IN 11
7 T2OUT
T2IN 10
8 R2IN
R2OUT 9
ROUT = VIN/1 T2OUT
T1OUT
VIN = ±2V
RS-232
±30V INPUT
FIGURE 7. GENERAL TEST CIRCUIT
12
A
FIGURE 8. POWER-OFF SOURCE RESISTANCE
CONFIGURATION
FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Applications
+5V
The HIN2xx may be used for all RS-232 data terminal and
communication links. It is particularly useful in applications
where ±12V power supplies are not available for
conventional RS-232 interface circuits. The applications
presented represent typical interface configurations.
C2 +
1µF TD
RTS
6
5
11
-
RS-232
INPUTS AND OUTPUTS
+
T1
14
T2
7
13
R1
15
8
TD (2) TRANSMIT DATA
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
CTS (5) CLEAR TO SEND
SIGNAL GROUND (7)
FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS
HANDSHAKING
4
14
T2
10
+ C2
1µF
-
5
T1
11
12
TD (2) TRANSMIT DATA
7
RTS (4) REQUEST TO SEND
13
RD (3) RECEIVE DATA
RD
9
HIN232
TTL/CMOS RTS
INPUTS AND
12
RD
OUTPUTS
R2
9
CTS
HIN232
3
CTS
3
10
1
TTL/CMOS
INPUTS AND
OUTPUTS
DTR (20) DATA
TERMINAL READY
DSRS (24) DATA
SIGNALING RATE
SELECT
2
4
In applications requiring four RS-232 inputs and outputs
(Figure 10), note that each circuit requires two charge pump
capacitors (C1 and C2) but can share common reservoir
capacitors (C3 and C4). The benefit of sharing common
reservoir capacitors is the elimination of two capacitors and
the reduction of the charge pump source impedance which
effectively increases the output swing of the transmitters.
TD
16
1
C1 +
1µF -
A simple duplex RS-232 port with CTS/RTS handshaking is
illustrated in Figure 9. Fixed output signals such as DTR
(data terminal ready) and DSRS (data signaling rate select)
is generated by driving them through a 5kΩ resistor
connected to V+.
C1 +
1µF -
+
R2
R1
8
CTS (5) CLEAR TO SEND
15
16
2
-
C3
+
+
C4
6
V- V+
2µF
6
-
2µF
2
16
+5V
RS-232
INPUTS AND OUTPUTS
HIN232
C1 +
1µF DTR
TTL/CMOS
INPUTS AND
OUTPUTS
DSRS
1
4
3
5
T1
11
14
T2
10
12
7
13
DCD
R1
9
R2
R1
15
8
+ C2
1µF
-
DTR (20) DATA TERMINAL READY
DSRS (24) DATA SIGNALING RATE SELECT
DCD (8) DATA CARRIER DETECT
R1 (22) RING INDICATOR
SIGNAL GROUND (7)
FIGURE 10. COMBINING TWO HIN232s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
13
FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Die Characteristics
SUBSTRATE POTENTIAL
TRANSISTOR COUNT
V+
238
Metallization Mask Layout
HIN240
T2OUT T1OUT
T3OUT T4OUT
R3OUT
R3IN
T5IN
R2IN
SHUTDOWN
R2OUT
EN
T2IN
T5OUT
T1IN
R4IN
R1OUT
R4OUT
R1IN
T4IN
GND
T3IN
R5OUT
VCC
R5IN
C1+
14
V+
C1-
C2+
C2-
V-
FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Dual-In-Line Plastic Packages (PDIP)
E16.3 (JEDEC MS-001-BB ISSUE D)
N
E1
INDEX
AREA
1 2 3
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
N/2
INCHES
-B-
SYMBOL
-AE
D
BASE
PLANE
-C-
A2
SEATING
PLANE
A
L
D1
e
B1
D1
eA
A1
eC
B
0.010 (0.25) M
C
L
C A B S
C
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
MILLIMETERS
MIN
MAX
MIN
MAX
A
-
A1
0.015
NOTES
0.210
-
5.33
4
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.15
1.77
8, 10
C
0.008
0.014
0.204
0.355
-
D
0.735
0.775
18.66
19.68
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
eA
0.300 BSC
7.62 BSC
6
eB
-
0.430
-
10.92
7
4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3.
L
0.115
0.150
2.93
3.81
4
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
N
16
16
9
Rev. 0 12/93
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
15
FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Dual-In-Line Plastic Packages (PDIP)
N
E24.3 (JEDEC MS-001-AF ISSUE D)
E1
INDEX
AREA
1 2 3
24 LEAD NARROW BODY DUAL-IN-LINE PLASTIC
PACKAGE
N/2
INCHES
-B-AD
E
BASE
PLANE
-C-
A2
SEATING
PLANE
A
L
D1
e
B1
D1
eA
A1
eC
B
0.010 (0.25) M
C
L
C A B S
C
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.15
1.77
8
C
0.008
0.014
D
1.230
1.280
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.204
31.24
0.100 BSC
eA
0.300 BSC
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
eB
-
L
0.115
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
N
0.430
0.150
24
0.355
32.51
2.54 BSC
7.62 BSC
10.92
2.93
3.81
24
5
6
7
4
9
Rev. 0 12/93
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
16
FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Small Outline Plastic Packages (SOIC)
M16.3 (JEDEC MS-013-AA ISSUE C)
N
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
H
0.25(0.010) M
B M
INCHES
E
-B1
2
3
L
SEATING PLANE
-A-
A
D
h x 45°
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.3977
0.4133
10.10
10.50
3
E
0.2914
0.2992
7.40
7.60
4
e
α
B S
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
0.050 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N
α
NOTES:
MILLIMETERS
16
0°
16
8°
0°
7
8°
Rev. 1 6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
17
FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Small Outline Plastic Packages (SOIC)
M24.3 (JEDEC MS-013-AD ISSUE C)
N
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
H
0.25(0.010) M
B M
INCHES
E
SYMBOL
-B1
2
3
L
SEATING PLANE
-A-
A
D
h x 45°
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
MIN
MAX
MIN
MAX
NOTES
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.020
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.5985
0.6141
15.20
15.60
3
E
0.2914
0.2992
7.40
7.60
4
e
α
B S
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
0.05 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N
α
NOTES:
MILLIMETERS
24
0°
24
8°
0°
7
8°
Rev. 1 4/06
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
18
FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Small Outline Plastic Packages (SOIC)
M28.3 (JEDEC MS-013-AE ISSUE C)
N
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010) M
H
B M
INCHES
E
SYMBOL
-B-
1
2
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
B S
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
MILLIMETERS
MIN
MAX
NOTES
A
0.0926
0.1043
2.35
2.65
-
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.6969
0.7125
17.70
18.10
3
E
0.2914
0.2992
7.40
7.60
4
0.05 BSC
0.394
h
0.01
0.029
L
0.016
0.050
8o
0o
N
0.419
1.27 BSC
H
α
NOTES:
MAX
A1
e
µα
MIN
10.00
-
0.25
0.75
5
0.40
1.27
6
28
0o
-
10.65
28
7
8o
Rev. 0 12/93
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
19
FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Shrink Small Outline Plastic Packages (SSOP)
M28.209 (JEDEC MO-150-AH ISSUE B)
N
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
H
0.25(0.010) M
B M
INCHES
E
GAUGE
PLANE
-B1
2
3
L
0.25
0.010
SEATING PLANE
-A-
A
D
-C-
α
e
B
0.25(0.010) M
C
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.390
0.413
9.90
10.50
3
E
0.197
0.220
5.00
5.60
4
e
A2
A1
B S
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
0.026 BSC
H
0.292
L
0.022
N
α
NOTES:
MILLIMETERS
0.65 BSC
0.322
7.40
0.037
0.55
28
0°
-
8.20
-
0.95
6
28
8°
0°
7
8°
Rev. 2 6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess of
“B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
20
FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Metric Plastic Quad Flatpack Packages (MQFP)
D
Q44.10x10 (JEDEC MS-022AB ISSUE B)
44 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE
D1
-D-
INCHES
SYMBOL
-A-
-B-
E E1
e
PIN 1
SEATING
A PLANE
-H-
0.076
0.003
12o-16o
-C-
0.40
0.016 MIN
0.20
M
0.008
C A-B S
0o MIN
D S
b
A2 A1
0o-7o
L
b1
MILLIMETERS
MIN
MAX
NOTES
A
-
0.096
-
2.45
-
A1
0.004
0.010
0.10
0.25
-
A2
0.077
0.083
1.95
2.10
-
b
0.012
0.018
0.30
0.45
6
b1
0.012
0.016
0.30
0.40
-
D
0.515
0.524
13.08
13.32
3
D1
0.389
0.399
9.88
10.12
4, 5
E
0.516
0.523
13.10
13.30
3
E1
0.390
0.398
9.90
10.10
4, 5
L
0.029
0.040
0.73
1.03
-
N
44
44
7
e
0.032 BSC
0.80 BSC
Rev. 2 4/99
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane -C- .
4. Dimensions D1 and E1 to be determined at datum plane
-H- .
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total.
BASE METAL
WITH PLATING
MAX
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
0.13/0.17
0.005/0.007
12o-16o
MIN
7. “N” is the number of terminal positions.
0.13/0.23
0.005/0.009
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
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21
FN3138.16
September 26, 2008
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