BYG23M M2G

BYG23M Taiwan Semiconductor 1.5A, 1000V High Efficient Surface Mount Rectifier FEATURES ● ● ● ● ● ● ● KEY PARAMETERS Glass passivated chip junction Ideal for automated placement Fast switching for high efficiency High surge current capability Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 APPLICATIONS PARAMETER VALUE UNIT IF 1.5 A VRRM 1000 V IFSM 50 A TJ MAX 150 °C Package DO-214AC (SMA) Configuration Single die ● The superior avalanche capability of BYG23M is specially suited for free-wheeling, clamping, snubber, demagnetization in power supplies and other power switching applications. MECHANICAL DATA ● ● ● ● ● ● Case: DO-214AC (SMA) Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.064g (approximately) DO-214AC (SMA) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL Marking code on the device BYG23M UNIT BYG23M Repetitive peak reverse voltage VRRM 1000 V Reverse voltage, total rms value VR(RMS) 700 V IF 1.5 A IFSM 50 A ERSM 30 mJ TJ - 55 to +150 °C TSTG - 55 to +150 °C Forward current Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load Pulse energy in avalanche mode, non-repetitive (Inductive load switch off ), I(BR)R = 1.23A Junction temperature Storage temperature 1 Version: C2102 BYG23M Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT RӨJA 70 °C/W Junction-to-ambient thermal resistance ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER Forward voltage CONDITIONS (1) IF = 1A, TJ = 25°C SYMBOL TYP MAX UNIT VF - 1.7 V - 1 µA - 15 µA - 50 µA CJ 15 - pF trr - 65 ns TJ = 25°C Reverse current @ rated VR (2) TJ = 100°C IR TJ = 125°C Junction capacitance Reverse recovery time 1MHz, VR = 4.0V IF = 0.5A, IR = 1.0A, Irr = 0.25A Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms ORDERING INFORMATION ORDERING CODE PACKAGE PACKING BYG23M DO-214AC (SMA) 7,500 / Tape & Reel 2 Version: C2102 BYG23M Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 30 1.5 CAPACITANCE (pF) 1 0.5 0 20 10 f=1.0MHz Vsig=50mVp-p 0 25 50 75 100 125 150 0.1 1 AMBIENT TEMPERATURE (°C) INSTANTANEOUS FORWARD CURRENT (A) TJ=125°C 10 1 TJ=25°C 0.1 30 40 50 60 70 80 90 100 10 10 UF1DLW 1 TJ=125°C 1 0.1 0.01 TJ=25°C Pulse width 300μs 1% duty cycle Pulse width 0.1 0.001 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 1.1 FORWARD VOLTAGE (V) Fig.5 Maximum Non-Repetitive Forward Surge Current 50 PEAK FORWARD SURGE CURRENT (A) INSTANTANEOUS REVERSE CURRENT (μA) Fig.4 Typical Forward Characteristics 100 20 100 REVERSE VOLTAGE (V) Fig.3 Typical Reverse Characteristics 10 10 (A) AVERAGE FORWARD CURRENT (A) 2 8.3ms single half sine wave 40 30 20 10 0 1 10 100 NUMBER OF CYCLES AT 60 Hz 3 Version: C2102 1.2 BYG23M Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.6 Reverse Recovery Time Characteristic and Test Circuit Diagram 4 Version: C2102 BYG23M Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DO-214AC (SMA) SUGGESTED PAD LAYOUT MARKING DIAGRAM 5 P/N = Marking Code G = Green Compound YW = Date Code F = Factory Code Version: C2102 BYG23M Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 6 Version: C2102