$ $
Preferred Device
Silicon Bidirectional Thyristors
Designed primarily for full-wave ac control applications, such as
light dimmers, motor controls, heating controls and power supplies; or
wherever full-wave silicon gate controlled solid-state devices are
needed. Triac type thyristors switch from a blocking to a conducting
state for either polarity of applied anode voltage with positive or
negative gate triggering.
• Blocking Voltage to 800 Volts
• All Diffused and Glass Passivated Junctions for Greater Parameter
Uniformity and Stability
• Small, Rugged, Thermowatt Construction for Low Thermal
Resistance, High Heat Dissipation and Durability
• Gate Triggering Guaranteed in Four Modes
• Device Marking: Logo, Device Type, e.g., MAC212A8, Date Code
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TRIACS
12 AMPERES RMS
600 thru 800 VOLTS
MT2
MT1
G
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
4
Rating
Symbol
Peak Repetitive Off−State Voltage(1)
(TJ = −40 to +125°C, Sine Wave 50 to
60 Hz, Gate Open)
MAC212A8
MAC212A10
VDRM,
VRRM
On-State RMS Current (TC = +85°C)
Full Cycle Sine Wave 50 to 60 Hz
IT(RMS)
12
Amp
ITSM
100
Amp
I2t
40
A2s
Peak Non−repetitive Surge Current
(One Full Cycle Sine Wave,
60 Hz, TC = +25°C)
Preceded and followed by rated current
Circuit Fusing Considerations
(t = 8.3 ms)
Peak Gate Power (TC = +85°C,
Pulse Width = 10 µs)
Average Gate Power
(TC = +85°C, t = 8.3 ms)
Peak Gate Current
(TC = +85°C, Pulse Width = 10 µs)
Operating Junction Temperature Range
Storage Temperature Range
PGM
Value
Unit
Volts
600
800
20
Watts
PG(AV)
0.35
Watt
IGM
2.0
Amp
TJ
−40 to
+125
°C
Tstg
−40 to
+150
°C
March, 2000 − Rev. 1
2
3
TO−220AB
CASE 221A
STYLE 4
PIN ASSIGNMENT
1
Main Terminal 1
2
Main Terminal 2
3
Gate
4
Main Terminal 2
ORDERING INFORMATION
(1) VDRM and VRRM for all types can be applied on a continuous basis. Blocking
voltages shall not be tested with a constant current source such that the
voltage ratings of the devices are exceeded.
Semiconductor Components Industries, LLC, 1999
1
127
Device
Package
Shipping
MAC212A8
TO220AB
500/Box
MAC212A10
TO220AB
500/Box
Preferred devices are recommended choices for future use
and best overall value.
Publication Order Number:
MAC212A8/D
MAC212A8, MAC212A10
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance — Junction to Case
Thermal Resistance — Junction to Ambient
Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds
Symbol
Value
Unit
RθJC
RθJA
2.0
62.5
°C/W
TL
260
°C
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted; Electricals apply in both directions)
Characteristic
Symbol
Min
Typ
Max
Unit
—
—
—
—
10
2.0
µA
mA
—
1.3
1.75
Volts
OFF CHARACTERISTICS
Peak Repetitive Blocking Current
(VD = Rated VDRM, VRRM; Gate Open)
IDRM,
IRRM
TJ = 25°C
TJ = +125°C
ON CHARACTERISTICS
Peak On-State Voltage
ITM = "17 A Peak; Pulse Width = 1 to 2 ms, Duty Cycle p 2%
VTM
Gate Trigger Current (Continuous dc)
(Main Terminal Voltage = 12 Vdc, RL = 100 Ohms)
MT2(+), G(+)
MT2(+), G(−)
MT2(−), G(−)
MT2(−), G(+)
IGT
Gate Trigger Voltage (Continuous dc)
(Main Terminal Voltage = 12 Vdc, RL = 100 Ohms)
MT2(+), G(+)
MT2(+), G(−)
MT2(−), G(−)
MT2(−), G(+)
VGT
Gate Non−Trigger Voltage (Continuous dc)
(Main Terminal Voltage = 12 V, RL = 100 Ω, TJ = +125°C)
All Four Quadrants
VGD
mA
—
—
—
—
12
12
20
35
50
50
50
75
Volts
—
—
—
—
0.9
0.9
1.1
1.4
2.0
2.0
2.0
2.5
Volts
0.2
—
—
Holding Current
(Main Terminal Voltage = 12 Vdc, Gate Open,
Initiating Current = "200 mA)
IH
—
6.0
50
mA
Turn-On Time
(VD = Rated VDRM, ITM = 17 A, IGT = 120 mA,
Rise Time = 0.1 µs, Pulse Width = 2 µs)
tgt
—
1.5
—
µs
dv/dt(c)
—
5.0
—
V/µs
dv/dt
—
100
—
V/µs
DYNAMIC CHARACTERISTICS
Critical Rate of Rise of Commutation Voltage
(VD = Rated VDRM, ITM = 17 A, Commutating di/dt = 6.1 A/ms,
Gate Unenergized, TC = +85°C)
Critical Rate of Rise of Off-State Voltage
(VD = Rated VDRM, Exponential Voltage Rise, Gate Open,
TC = +85°C)
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128
MAC212A8, MAC212A10
Voltage Current Characteristic of Triacs
(Bidirectional Device)
+ Current
Symbol
Parameter
VDRM
IDRM
Peak Repetitive Forward Off State Voltage
VRRM
IRRM
Peak Repetitive Reverse Off State Voltage
VTM
IH
Maximum On State Voltage
VTM
Quadrant 1
MainTerminal 2 +
on state
Peak Forward Blocking Current
IH
IRRM at VRRM
Peak Reverse Blocking Current
off state
IH
Holding Current
Quadrant 3
VTM
MainTerminal 2 −
Quadrant Definitions for a Triac
MT2 POSITIVE
(Positive Half Cycle)
+
(+) MT2
Quadrant II
(+) MT2
Quadrant I
(+) IGT
GATE
(−) IGT
GATE
MT1
MT1
REF
REF
IGT −
+ IGT
(−) MT2
Quadrant III
(−) MT2
Quadrant IV
(+) IGT
GATE
(−) IGT
GATE
MT1
MT1
REF
REF
−
MT2 NEGATIVE
(Negative Half Cycle)
All polarities are referenced to MT1.
With in−phase signals (using standard AC lines) quadrants I and III are used.
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129
+ Voltage
IDRM at VDRM
++++5!+,.+ +"!++++
°
α $°
)
°
)°
α
#°
α
#
#
α
&'
α
α #°
)°
°
$°
α !
#
! "
! "
Figure 1. Current Derating
Figure 2. Power Dissipation
+++++++++"8+!+ !+"
+!++ !+"
#
#
&'
α !
"+++++++++++",+"+,
MAC212A8, MAC212A10
( °
( °
#
/
°
3
?@;A >7 B@A'A&A& *C& 31DD1EA& FG @*0A& '?@@AC0
Figure 4. Maximum Non−Repetitive Surge Current
Figure 3. Maximum On−State Voltage
Characteristics
+++++++++-
!
!. % /
# # $ $
$
&'
:!
#
"! °
Figure 5. Typical Gate Trigger Voltage
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130
#
@0+++ -
#
+++++ !+-
++++++++ !+-
MAC212A8, MAC212A10
&'
:!
#
&'
:!
#
#
"! °
"! °
Figure 6. Typical Gate Trigger Current
Figure 7. Typical Holding Current
#
-θ( 0 @0 • θ(
0 67
Figure 8. Thermal Response
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131
4
4
4
4