TSP3H150S S1G

TSP3H150S Taiwan Semiconductor 3A, 150V Trench Schottky Surface Mount Rectifier FEATURES ● ● ● ● ● ● KEY PARAMETERS Low power loss, high efficiency Ideal for automated placement High surge current capability Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 APPLICATIONS ● Switching mode power supply (SMPS) PARAMETER VALUE UNIT IF 3 A VRRM 150 V IFSM 90 A TJ MAX 150 °C Package TO-277A (SMPC) Configuration Single die ● Adapters ● DC to DC converter MECHANICAL DATA ● ● ● ● ● ● Case: TO-277A (SMPC) Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 1A whisker test Polarity: Indicated by cathode band Weight: 0.095g (approximately) TO-277A (SMPC) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL Marking code on the device TSP3H150S UNIT 3H150 Repetitive peak reverse voltage VRRM 150 V Reverse voltage, total rms value VR(RMS) 105 V IF 3 A Forward current Surge peak forward current, 8.3ms single half sine wave superimposed on rated load (1) Non-repetitive peak reverse current IFSM 90 A IRSM 2 A Critical rate of rise of off-state voltage dv/dt 10,000 V/µs TJ -55 to +175 °C TSTG -55 to +175 °C Junction temperature Storage temperature Notes: 1. Pulse width: 5µs / pulse No.: 10 times 1 Version: B2103 TSP3H150S Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT Junction-to-lead thermal resistance RӨJL 16.0 °C/W Junction-to-ambient thermal resistance RӨJA 58.5 °C/W Junction-to-case thermal resistance RӨJC 21.5 °C/W Thermal Performance Note: Units mounted on recommended PCB (16mm x 16mm Cu test board) ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER CONDITIONS SYMBOL TYP MAX UNIT 0.65 0.74 V 0.77 0.86 V 0.53 0.62 V 0.62 0.71 V - 10 µA - 10 mA CJ 150 - pF trr 20 - ns IF = 1A, TJ = 25°C Forward voltage IF = 3A, TJ = 25°C (1) IF = 1A, TJ = 125°C VF IF = 3A, TJ = 125°C Reverse current @ rated VR (2) Junction capacitance Reverse recovery time TJ = 25°C IR TJ = 125°C 1MHz, VR = 4.0V IF = 0.5A, IR = 1.0A Irr = 0.25A Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms ORDERING INFORMATION ORDERING CODE PACKAGE PACKING TSP3H150S TO-277A (SMPC) 6,000 / Tape & Reel 2 Version: B2103 TSP3H150S Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 1000 3 CAPACITANCE (pF) 2 1 0 100 10 f=1.0MHz Vsig=50mVp-p 1 25 50 75 100 125 150 0 20 40 LEAD TEMPERATURE (°C) INSTANTANEOUS FORWARD CURRENT (A) INSTANTANEOUS REVERSE CURRENT (μA) 100 TJ=125°C 1 0.1 TJ=25°C 0.001 10 20 30 40 50 60 70 80 100 Fig.4 Typical Forward Characteristics 1000 0.01 80 REVERSE VOLTAGE (V) Fig.3 Typical Reverse Characteristics 10 60 90 100 12 10 10 8 UF1DLW 1 T =125°C TJJ=125°C 6 0.1 4 TJ=25°C 0.01 2 0 0.3 0.001 0.4 0.3 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) TJ=25°C (A) AVERAGE FORWARD CURRENT (A) 4 0.5 0.4 0.6 0.5 0.7 0.6 0.8 0.7 Pulse width 300μs 1% duty cycle Pulse width 0.9 1.0 1.1 1.2 0.8 0.9 1 1.1 FORWARD VOLTAGE (V) 3 Version: B2103 1.2 TSP3H150S Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS TO-277A (SMPC) SUGGESTED PAD LAYOUT MARKING DIAGRAM P/N YW F 4 = Marking Code = Date Code = Factory Code Version: B2103 TSP3H150S Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 5 Version: B2103