BYG21M
Taiwan Semiconductor
1.5A, 1000V Fast Avalanche Surface Mount Rectifier
FEATURES
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KEY PARAMETERS
Glass passivated chip junction
Ideal for automated placement
Fast switching for high efficiency
High surge current capability
Moisture sensitivity level: level 1, per J-STD-020
RoHS Compliant
Halogen-free according to IEC 61249-2-21
APPLICATIONS
PARAMETER
VALUE
UNIT
IF
1.5
A
VRRM
1000
V
IFSM
50
A
TJ MAX
150
°C
Package
DO-214AC (SMA)
Configuration
Single die
● The superior avalanche capability of BYG21M is specially
suited for free-wheeling, clamping, snubber, demagnetization in
power supplies and other power switching applications.
MECHANICAL DATA
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Case: DO-214AC (SMA)
Molding compound meets UL 94V-0 flammability rating
Terminal: Matte tin plated leads, solderable per J-STD-002
Meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 0.064g (approximately)
DO-214AC (SMA)
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
SYMBOL
Marking code on the device
BYG21M
UNIT
BYG21M
Repetitive peak reverse voltage
VRRM
1000
V
Reverse voltage, total rms value
VR(RMS)
700
V
IF
1.5
A
IFSM
50
A
ERSM
30
mJ
TJ
- 55 to +150
°C
TSTG
- 55 to +150
°C
Forward current
Peak forward surge current, 8.3ms single half
sine-wave superimposed on rated load
Pulse energy in avalanche mode, non-repetitive
(Inductive load switch off ), I(BR)R = 1.23A
Junction temperature
Storage temperature
1
Version: B2102
BYG21M
Taiwan Semiconductor
THERMAL PERFORMANCE
PARAMETER
SYMBOL
TYP
UNIT
Junction-to-lead thermal resistance
RӨJL
20
°C/W
Junction-to-ambient thermal resistance
RӨJA
70
°C/W
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)
PARAMETER
Forward voltage
CONDITIONS
IF = 1.0A, TJ = 25°C
(1)
IF = 1.5A, TJ = 25°C
SYMBOL
TYP
MAX
UNIT
-
1.5
V
-
1.6
V
-
1
µA
-
10
µA
-
50
µA
CJ
13
-
pF
trr
-
120
ns
VF
TJ = 25°C
Reverse current @ rated VR
(2)
TJ = 100°C
IR
TJ = 125°C
Junction capacitance
Reverse recovery time
1MHz, VR = 4.0V
IF = 0.5A, IR = 1.0A,
Irr = 0.25A
Notes:
1. Pulse test with PW = 0.3ms
2. Pulse test with PW = 30ms
ORDERING INFORMATION
ORDERING CODE
PACKAGE
PACKING
BYG21M
DO-214AC (SMA)
7,500 / Tape & Reel
2
Version: B2102
BYG21M
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.2 Typical Junction Capacitance
2
40
1.5
30
CAPACITANCE (pF)
1
0.5
0
20
10
f=1.0MHz
Vsig=50mVp-p
0
25
50
75
100
125
150
0.1
1
LEAD TEMPERATURE (°C)
INSTANTANEOUS FORWARD CURRENT (A)
TJ=125°C
10
1
0.1
TJ=25°C
0.01
30
40
50
60
70
80
90
100
10 10
UF1DLW
1
TJ=125°C
TJ=125°C
1
0.1
TJ=25°C
TJ=25°C
0.01
Pulse width 300μs
1% duty cycle
Pulse width
0.1
0.001
0.4 0.6 0.8 1.0 1.2 1.4 1.6
0.3
0.4
0.5
0.6
0.7
0.8
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
1.8
0.9
2.0
1
1.1
FORWARD VOLTAGE (V)
Fig.5 Maximum Non-Repetitive Forward Surge Current
50
PEAK FORWARD SURGE CURRENT (A)
INSTANTANEOUS REVERSE CURRENT (μA)
Fig.4 Typical Forward Characteristics
100
20
100
REVERSE VOLTAGE (V)
Fig.3 Typical Reverse Characteristics
10
10
(A)
AVERAGE FORWARD CURRENT (A)
Fig.1 Forward Current Derating Curve
8.3ms single half sine wave
40
30
20
10
0
1
10
100
NUMBER OF CYCLES AT 60 Hz
3
Version: B2102
1.2
BYG21M
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DO-214AC (SMA)
SUGGESTED PAD LAYOUT
MARKING DIAGRAM
4
P/N
= Marking Code
G
= Green Compound
YW
= Date Code
F
= Factory Code
Version: B2102
BYG21M
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability
for application assistance or the design of Purchasers’ products.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
5
Version: B2102
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