HS2F R5G

HS2A – HS2M Taiwan Semiconductor 2A, 50V - 1000V High Efficient Surface Mount Rectifier FEATURES ● ● ● ● ● ● KEY PARAMETERS Low power loss, high efficiency Ideal for automated placement Glass passivated chip junction Fast switching for high efficiency RoHS Compliant Halogen-free according to IEC 61249-2-21 PARAMETER VALUE UNIT IF 2 A VRRM 50 - 1000 V IFSM 50 A TJ MAX 150 °C APPLICATIONS ● ● ● ● Switching mode power supply (SMPS) Adapters Lighting application Converter Package DO-214AA (SMB) Configuration Single die MECHANICAL DATA ● ● ● ● ● ● Case: DO-214AA (SMB) Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.090g (approximately) DO-214AA (SMB) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL HS2A HS2B HS2D HS2F HS2G HS2J HS2K HS2M UNIT Marking code on the device HS2A HS2B HS2D HS2F HS2G HS2J HS2K HS2M Repetitive peak reverse voltage VRRM 50 100 200 300 400 600 800 1000 V Reverse voltage, total rms value VR(RMS) 35 70 140 210 280 420 560 700 V Forward current Surge peak forward current, 8.3ms single half sine-wave superimposed on rated load Junction temperature IF 2 A IFSM 50 A TJ - 55 to +150 °C Storage temperature TSTG - 55 to +150 °C 1 Version: L2102 HS2A – HS2M Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT RӨJA 80 °C/W Junction-to-ambient thermal resistance ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER CONDITIONS SYMBOL TYP MAX UNIT - 1.0 V - 1.3 V - 1.7 V - 5 µA - 150 µA 50 - pF 30 - pF - 50 ns - 75 ns HS2A HS2B HS2D Forward voltage HS2F (1) HS2G IF = 2A, TJ = 25°C VF HS2J HS2K HS2M Reverse current @ rated VR TJ = 25°C (2) IR TJ = 125°C HS2A HS2B HS2D Junction capacitance HS2F HS2G 1MHz, VR = 4.0V CJ HS2J HS2K HS2M HS2A HS2B HS2D Reverse recovery time IF = 0.5A, IR = 1.0A, HS2F HS2G Irr = 0.25A trr HS2J HS2K HS2M Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms ORDERING INFORMATION ORDERING CODE(1) PACKAGE PACKING HS2x DO-214AA (SMB) 3,000 / Tape & Reel Notes: 1. "x" defines voltage from 50V(HS2A) to 1000V(HS2M) 2 Version: L2102 HS2A – HS2M Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 175 f=1.0MHz Vsig=50mVp-p 150 CAPACITANCE (pF) 2 1 125 100 HS2A-HS2G 75 50 25 0 HS2J-HS2M 0 0 25 50 75 100 125 150 0.1 1 10 LEAD TEMPERATURE (°C) INSTANTANEOUS FORWARD CURRENT (A) INSTANTANEOUS REVERSE CURRENT (μA) Fig.4 Typical Forward Characteristics 1000 100 TJ=100°C 10 TJ=25°C 0.1 0 20 40 60 1000 REVERSE VOLTAGE (V) Fig.3 Typical Reverse Characteristics 1 100 80 100 10 10 TJ=125°C 1 0.1 TJ=25°C HS2G 0.01 Pulse width HS2J-HS2M 0.001 0.3 0.1 0.6 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) UF1DLW HS2A-HS2D 1 (A) AVERAGE FORWARD CURRENT (A) 3 0.4 0.5 0.8 0.6 0.7 1 0.8 0.9 1.2 1 1.1 1.4 FORWARD VOLTAGE (V) 3 Version: L2102 1.2 HS2A – HS2M Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.5 Maximum Non-Repetitive Forward Surge Current PEAK FORWARD SURGE CURRENT (A) 60 8.3ms single half sine wave 50 40 30 20 10 0 1 10 100 NUMBER OF CYCLES AT 60 Hz Fig.6 Reverse Recovery Time Characteristic and Test Circuit Diagram 4 Version: L2102 HS2A – HS2M Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DO-214AA (SMB) SUGGESTED PAD LAYOUT MARKING DIAGRAM 5 P/N = Marking Code G = Green Compound YW = Date Code F = Factory Code Version: L2102 HS2A – HS2M Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 6 Version: L2102