NJU77240/NJU77241/NJU77242
Excellent EMI Immunity Rail-to-Rail Input,
Open-Drain Output Low power CMOS Comparators
+
-
■ FEATURES (V =3V, V =0V, Ta=25°C)
●Rail-to-Rail Input
●Open-Drain Output
●Supply Current
●Propagation Delay
●Operating Voltage
●Input Offset Voltage
●Operating Temperature
●Integrated EMI filter
●Package
NJU77240
NJU77241
NJU77242
■ GENERAL DESCRIPTION
The NJU77240/NJU77241/NJU77242 are rail-to-rail input
CMOS comparators featuring low-power and opendrain output.
6µA/ch typ.
840ns typ.
1.8 to 5.5V
6mV max.
-40 to 125°C
These comparators operate from 1.8V to 5.5V and low
supply current of 6µA/ch. typ. This feature is suitable for
battery powered application.
EMIRR=62dB typ. @f=900MHz
The NJU77241/NJU77242 are available in small size
package, DFN6-G1 (1616), DFN8-U1 (2020), significantly
reducing the required portable application's board area.
SOT-23-5, SC88A
SOT-23-5, SC88A,
DFN6-G1 (ESON6-G1)
MSOP8 (TVSP8)*
*meet JEDEC MO-187-DA / thin type,
DFN8-U1 (ESON8-U1)
■ APPLICATIONS
■ RELATED PRODUCTS
●Portable and Battery-Powered Applications
●Alarm and Surveillance Circuits
●Industrial Instruments
●Sensor Applications
Features
Rail-to-Rail Input
Push-Pull Output, Low power
CMOS Comparators
Single
Dual
NJU77230
NJU77231
NJU77232
■ PIN CONFIGURATIONS
PRODUCT NAME
NJU77240F
NJU77240F3
NJU77241F
NJU77241F3
Package
SOT-23-5
SC-88A
SOT-23-5
SC-88A
(Top View)
Pin Functions
+INPUT
1
V-
2
-INPUT
3
(Top View)
5
V+
4 OUTPUT
-INPUT
1
V-
2
+INPUT
3
5 V+
4 OUTPUT
PRODUCT NAME
NJU77241KG1
NJU77242RB1
NJU77242KU1
Package
DFN6-G1 (ESON6-G1)*
MSOP8 (TVSP8)
DFN8-U1 (ESON8-U1) *
V+ 1
Pin Functions
NC
2
OUTPUT 3
Exposed
Pad on
Underside
(Top View)
(Top View)
(Top View)
6
V-
5
-INPUT
4
+INPUT
A OUTPUT
1
8
V+
A -INPUT
2
7
B OUTPUT
A +INPUT
V-
3
4
6
5
A OUTPUT
1
A -INPUT
2
B -INPUT
A +INPUT
3
B +INPUT
V-
4
Exposed
Pad on
Underside
8
V+
7
B OUTPUT
6
B -INPUT
5
B +INPUT
-
*Connect to exposed pad to V
Ver.6
http://www.njr.com/
-1-
NJU77240/NJU77241/NJU77242
■ BLOCK DIAGRAM
V+
-INPUT
OUTPUT
+INPUT
V-
■ PRODUCT NAME INFORMATION
NJU77240 F (TE1)
Package
Part Number
Taping Form
■ ORDERING INFORMATION
PACKAGE
RoHS
HALOGENFREE
TERMINAL
FINISH
MARKING
NJU77240F
SOT-23-5
Yes
Yes
Sn2Bi
1K
15
3000
NJU77240F3
SC-88A
Yes
Yes
Sn2Bi
F3
7.5
3000
NJU77241F
SOT-23-5
Yes
Yes
Sn2Bi
1L
15
3000
NJU77241F3
SC-88A
Yes
Yes
Sn2Bi
F4
7.5
3000
NJU77241KG1
DFN6-G1
Yes
Yes
Sn2Bi
77241
3.5
3000
NJU77242RB1
MSOP8 (TVSP8)
Yes
Yes
Sn2Bi
77242
18
2000
NJU77242KU1
DFN8-U1
Yes
Yes
Sn2Bi
77242
5.3
3000
PART NUMBER
WEIGHT
(mg)
MOQ
(pcs)
■ ABSOLUTE MAXIMUM RATINGS
PARAMETER
+
Supply Voltage
Input Voltage
(1,2)
Input Current
(2)
Differential Input Voltage
SYMBOL
(3)
RATING
-
UNIT
V -V
7
VIN
V - 0.3 to V + 0.3
V
IIN
10
mA
-
V
+
VID
±7
Output Terminal Input Voltage
Power Dissipation (Ta=25°C)
(5)
SOT-23-5
(5)
SC-88A
(6)
DFN6-G1
(5)
MSOP8 (TVSP8)
(6)
DFN8-U1
Vo
V - 0.3 to V +7
2-Layer / 4-Layer
480 / 650
360 / 490
330 / 1200
510 / 680
450 / 1200
Junction Temperature Range
Tjmax
150
°C
Storage Temperature Range
Tstg
- 55 to 150
°C
(4)
PD
-
V
-
V
mW
(1) The absolute maximum input voltage is limited at 7V.
(2) Input voltages outside the supply voltage will be clamped by ESD protection diodes. If the input voltage exceeds the supply voltage,
the input current must be limited 10 mA or less by using a restriction resistance.
(3) Differential voltage is the voltage difference between +INPUT and - INPUT.
For supply voltage less than +7V, the absolute maximum rating is equal to the supply voltage.
(4) The absolute maximum of Output Terminal Input Voltage is limited at 7V.
(5) 2-Layer:Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 2-layer FR-4)
4-Layer:Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 4-layer FR-4), internal Cu area: 74.2 x 74.2mm
(6) 2-Layer:Mounted on glass epoxy board. (101.5×114.5×1.6mm: based on EIA/JEDEC standard, 2-layer FR-4, with Exposed Pad)
4-Layer:Mounted on glass epoxy board. (101.5×114.5×1.6mm: based on EIA/JEDEC standard, 4-layer FR-4, with Exposed Pad)
*For 4-layer: Applying 99.5×99.5mm inner Cu area and a thermal via hole to a board based on JEDEC standard JESD51-5
Ver.6
http://www.njr.com/
-2-
NJU77240/NJU77241/NJU77242
■ THERMAL CHARACTERISTICS
PARAMETER
SYMBOL
Junction-to-Ambient Thermal Resistance
(7)
SOT-23-5
(7)
SC-88A
(8)
DFN6-G1
(7)
MSOP8 (TVSP8)
(8)
DFN8-U1
Junction-to-Top of Package Characterization Parameter
(7)
SOT-23-5
(7)
SC-88A
(8)
DFN6-G1
(7)
MSOP8 (TVSP8)
(8)
DFN8-U1
VALUE
UNIT
θja
2-Layer / 4-Layer
259 / 193
352 / 256
381 / 106
244 / 185
278 / 107
°C /W
ψjt
2-Layer / 4-Layer
67 / 58
91 / 73
64 / 26
51 / 45
42 / 25
°C /W
(7) 2-Layer:Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 2-layer FR-4)
4-Layer:Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 4-layer FR-4), internal Cu area: 74.2 x 74.2mm
(8) 2-Layer:Mounted on glass epoxy board. (101.5×114.5×1.6mm: based on EIA/JEDEC standard, 2-layer FR-4, with Exposed Pad)
4-Layer:Mounted on glass epoxy board. (101.5×114.5×1.6mm: based on EIA/JEDEC standard, 4-layer FR-4, with Exposed Pad)
*For 4-Layer: Applying 99.5×99.5mm inner Cu area and a thermal via hole to a board based on JEDEC standard JESD51-5)
■ POWER DISSIPATION vs. AMBIENT TEMPERATURE
Power Dissipation vs. Temperature
Power Dissipation vs. Temperature
2-Layer
700
4-Layer
1400
Power Dissipation PD [mW]
Power Dissipation PD [mW]
MSOP8(TVSP8)
600
SOT-23-5
500
DFN8-U1(ESON8-U1)
400
SC-88A
300
200
DFN6-G1(ESON6-G1)
100
0
1200
DFN6-G1(ESON6-G1)
DFN8-U1(ESON8-U1)
1000
MSOP8(TVSP8)
800
SOT-23-5
600
400
SC-88A
200
0
0
25
50
75
100
125
Ambient Temperature Ta [ºC]
150
0
25
50
75
100
125
Ambient Temperature Ta [ºC]
150
■ RECOMMENDED OPERATING CONDITIONS
PARAMETER
Supply Voltage
Single Supply
Dual Supply
Operating Temperature Range
Output Terminal Input Voltage
Ver.6
SYMBOL
+
-
V -V
+
V /V
Topr
Vo
http://www.njr.com/
VALUE
UNIT
1.8 to 5.5
±0.9 to ±2.75
- 40 to 125
V
-
-
V to V +5.5
°C
V
-3-
NJU77240/NJU77241/NJU77242
■ ELECTRICAL CHARACTERISTICS
● DC CHARACTERISTICS
+
-
(Unless otherwise specified, V =3V, V =0V, Ta=25°C) °C
PARAMETER
SYMBOL
Supply Current (per comparator)
ISUPPLY
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VID=100mV,VCOM=0V, RL=∞
-
6
10
µA
VID=100mV,VCOM=3V, RL=∞
-
9
14
µA
VCOM=0V
-
1
6
mV
Input Offset Voltage
VIO
-
1
7
mV
Input Offset Current
IIO
-
1
-
pA
Input Bias Current
IB
-
1
-
pA
Common Mode Input Voltage Range
Open-Loop Voltage Gain
VCOM=3V
VICM
Av
Common Mode Rejection Ratio
CMR
CMR≥50dB
0
-
3
V
RL=5.1kΩ
-
100
-
dB
50
70
-
dB
65
85
-
dB
VICM=0V to 3V
+
Supply Voltage Rejection Ratio
SVR
VCOM=0V, V =1.8V to 5.5V,
Output Leakage Current
ILEAK
VO=3.0V
-
0.001
500
nA
Low-level Output Voltage
VOL
ISINK=3mA
-
0.2
0.3
V
● SWITCHING CHARACTERISTICS
+
-
(Unless otherwise specified, V =+3V, V =0V, Ta=25°C, CL=15pF, RL=5.1kΩ)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Propagation Delay Low to High
tPLH
Overdrive=100mV
-
840
-
ns
Propagation Delay High to Low
tPHL
Overdrive =100mV
-
450
-
ns
Output Signal Rising Time
tTLH
Overdrive =100mV
-
260
-
ns
Output Signal Falling Time
tTHL
Overdrive =100mV
-
7
-
ns
■ TIMING WAVEFORM
Over Drive
INPUT
Over Drive
V IN
V OH
OUTPUT
V OL
90%
90%
50%
50%
10%
10%
tTHL
tTLH
tPLH
Ver.6
tPHL
http://www.njr.com/
-4-
NJU77240/NJU77241/NJU77242
■ TYPICAL CHARACTERISTICS
Supply Current per Comparator
vs. Supply Voltage
Supply Current per Comparator [μA]
20
VCOM=0V, VID=100mV, RL=∞
18
16
14
12
Ta=125ºC
Ta=25ºC
10
8
6
4
Ta=-40ºC
2
Supply Current per Comparator
vs. Supply Voltage
V- =0V, VCOM=V+, VID=100mV, RL=∞
20
Supply Current per Comparator [μA]
V- =0V,
0
18
16
Ta=25ºC
14
12
10
8
6
Ta=-40ºC
4
2
0
0
1
2
3
4
5
Supply Voltage V+ [V]
6
7
0
V- =0V, VCOM=0V, VID=100mV, RL=∞
18
16
14
V+=1.8V
12
V+=3V
V+=5.5V
10
8
6
4
2
0
6
7
V- =0V, VCOM=V+, VID=100mV, RL=∞
18
16
V+=1.8V
V+=3V
V+=5.5V
14
12
10
8
6
4
2
0
-50
-25
0
25
50 75 100 125 150
Ambient Temperature [ºC]
-50
Supply Current per Comparator
vs. Common-Mode Input Voltage
Supply Current per Comparator [μA]
16
14
12
Ta=125ºC
10
8
6
4
Ta=-40ºC
2
0
25
50 75 100 125 150
Ambient Temperature [ºC]
V+=3V, V- =0V, VID=100mV, RL=∞
20
18
Ta=25ºC
-25
Supply Current per Comparator
vs. Common-Mode Input Voltage
V+=3V, V- =0V, VID=100mV, RL=∞
20
Supply Current per Comparator [μA]
2
3
4
5
Supply Voltage V+ [V]
20
Supply Current per Comparator [μA]
Supply Current per Comparator [μA]
20
1
Supply Current per Comparator
vs. Temperature
Supply Current per Comparator
vs. Temperature
0
18
16
14
Ta=25ºC
12
Ta=125ºC
10
8
6
4
Ta=-40ºC
2
0
0
Ver.6
Ta=125ºC
0.5
1
1.5
2
Input Voltage [V]
2.5
3
0
http://www.njr.com/
0.5
1
1.5
2
Input Voltage [V]
2.5
3
-5-
NJU77240/NJU77241/NJU77242
■ TYPICAL CHARACTERISTICS
Input Offset Voltage vs. Temperature
4
4
3
3
2
V+=1.8V
1
0
-1
-2
V+=5.5V
V+=3V
-3
V- =0V , VCOM=V+
5
Input Offset Voltage [mV]
Input Offset Voltage [mV]
Input Offset Voltage vs. Temperature
V- =0V , VCOM=0V
5
-4
2
V+=1.8V
1
0
-1
-2
-4
-5
-5
-50
-25
0
25 50 75 100 125 150
Ambient Temperature [ºC]
-50
-25
Input Offset Voltage vs. Temperature
2
Input Offset Voltage [mV]
Input Offset Voltage [mV]
V+=3V, V-=0V, VCOM=V+
3
1
0
-1
-2
-3
2
1
0
-1
-2
-3
-50
-25
0
25 50 75 100 125 150
Ambient Temperature [ºC]
-50
Input Offset Voltage vs. Supply Voltage
-25
0
25 50 75 100 125 150
Ambient Temperature [ºC]
Input Offset Voltage vs. Supply Voltage
V- =0V, VCOM=0V
5
V- =0V, VCOM=V+
5
4
4
3
Ta=25ºC
2
Input Offset Voltage [mV]
Input Offset Voltage [mV]
0
25 50 75 100 125 150
Ambient Temperature [ºC]
Input Offset Voltage vs. Temperature
V+=3V, V-=0V, VCOM=0V
3
Ta=125ºC
1
0
-1
-2
Ta=-40ºC
-3
-4
3
Ta=125ºC
2
1
0
-1
Ta=-40ºC
-2
Ta=25ºC
-3
-4
-5
-5
1
Ver.6
V+=5.5V
V+=3V
-3
2
3
4
Supply Voltage V+ [V]
5
6
1
http://www.njr.com/
2
3
4
Supply Voltage V+ [V]
5
6
-6-
NJU77240/NJU77241/NJU77242
■ TYPICAL CHARACTERISTICS
Input Offset Voltage
vs. Common-Mode Input Voltage
Input Offset Voltage
vs. Common-Mode Input Voltage
V+=1.8V, V- =0V
5
4
4
3
Input Offset Voltage [mV]
Input Offset Voltage [mV]
V+=3V, V- =0V
5
Ta=-40ºC
2
1
0
-1
-2
Ta=25ºC
Ta=125ºC
-3
3
2
Ta=-40ºC
1
0
-1
-2
Ta=25ºC
Ta=125ºC
-3
-4
-4
-5
-5
0
0.3
0.6
0.9
1.2
1.5
Common-Mode Input Voltage [V]
1.8
0
0.5
1
1.5
2
2.5
Common-Mode Input Voltage [V]
3
Input Offset Voltage
vs. Common-Mode Input Voltage
5
V+=5.5V, V- =0V
Input Offset Voltage [mV]
4
3
2
Ta=-40ºC
1
0
-1
-2
Ta=25ºC
Ta=125ºC
-3
-4
-5
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Common-Mode Input Voltage [V]
Ver.6
http://www.njr.com/
-7-
NJU77240/NJU77241/NJU77242
■ TYPICAL CHARACTERISTICS
Input Bias Current vs. Temperature
Open-Loop Voltage Gain vs. Temperature
VCOM=V+/2, V- =0V
Input Bias Current [nA]
10
V+=5.5V
1
V+=3V
0.1
V+=3V, V- =0V, RL=5.1kΩ
140
Open-Loop Voltage Gain [dB]
100
V+=1.8V
0.01
0.001
120
100
80
60
40
20
0
25
50
75
100
125
Ambient Temperature [ºC]
150
-50
-25
SVR vs. Temperature
V+=3V, V- =0V, VICM=0 to 3V
120
Common-Mode Rejection Ratio [dB]
Supply Voltage Rejection Ratio [dB]
CMR vs. Temperature
V+=1.8V to 5.5V, V- =0V, VCOM=V+
140
0
25 50 75 100 125 150
Ambient Temperature [ºC]
120
100
80
60
40
20
0
100
80
60
40
20
0
-50
-25
0
25 50 75 100 125 150
Ambient Temperature [ºC]
-50
-25
0
25 50 75 100 125 150
Ambient Temperature [ºC]
Output Leakage Current vs. Temperature
V- =0V, VO=V+
Output Leakage Current [nA]
100
V+=5.5V
10
V+=3V
1
V+=1.8V
0.1
0.01
0.001
25
Ver.6
50
75
100
125
Ambient Temperature [ºC]
150
http://www.njr.com/
-8-
NJU77240/NJU77241/NJU77242
■ TYPICAL CHARACTERISTICS
Low-level Output Voltage vs. Output Current
0.9
1.6
Ta=125ºC
1.4
1.2
Ta=25ºC
1
Ta=-40ºC
0.8
0.6
0.4
0.2
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
0
3
6
9
12
Output Current [mA]
15
-50
V+=3V, V- =0V, VID=100mV
0.9
Low-level Output Voltage [V]
Low-level Output Voltage [V]
1.6
Ta=25ºC
1.4
1.2
Ta=-40ºC
1
0.8
0.6
0.4
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.2
0
0
0
3
6
9 12 15 18 21 24 27 30
Output Current [mA]
-50
Low-level Output Voltage vs. Output Current
-25
0
25 50 75 100 125 150
Ambient Temperature [ºC]
Low-level Output Voltage vs. Temperature
V+=5.5V, V- =0V, VID=100mV
2
V+=5.5V, V- =0V, VID=100mV, Iout=3mA
1
0.9
Low-level Output Voltage [V]
1.8
Low-level Output Voltage [V]
0
25 50 75 100 125 150
Ambient Temperature [ºC]
V+=3V, V- =0V, VID=100mV, Iout=3mA
1
Ta=125ºC
1.8
-25
Low-level Output Voltage vs. Temperature
Low-level Output Voltage vs. Output Current
2
Ta=125ºC
1.6
1.4
Ta=25ºC
1.2
Ta=-40ºC
1
0.8
0.6
0.4
0.2
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
0
Ver.6
V+=1.8V, V- =0V, VID=100mV, Iout=3mA
1
Low-level Output Voltage [V]
Low-level Output Voltage [V]
Low-level Output Voltage vs. Temperature
V+=1.8V, V- =0V, VID=100mV
1.8
3
6
9 12 15 18 21 24 27 30
Output Current [mA]
-50
http://www.njr.com/
-25
0
25 50 75 100 125 150
Ambient Temperature [ºC]
-9-
NJU77240/NJU77241/NJU77242
■ TYPICAL CHARACTERISTICS
Propagation Delay Low to High
vs. Temperature
V- =0V,
overdrive=100mV, RL=5.1kΩ, CL=15pF
0.7
V+=5.5V
1.4
Propagation Delay High to Low
[μs]
Propagation Delay Low to High [μs]
1.6
Propagation Delay High to Low
vs. Temperature
1.2
V+=3V
1
0.8
V+=1.8V
0.6
0.4
0.2
0
0.6
V+=5.5V
0.5
0.4
0.3
V+=1.8V
-25
0.1
0
25 50 75 100 125 150
Ambient Temperature [ºC]
-50
Output Signal Falling Time [ns]
V+=3V
V+=5.5V
V+=1.8V
150
100
50
0
14
V+=1.8V
12
10
8
6
V+=5.5V
4
V+=3V
2
0
-50
-25
0
25 50 75 100 125 150
Ambient Temperature [ºC]
-50
-25
V+=3V,V- =0V, RL=5.1kΩ, CL=15pF
V+=3V,V- =0V, RL=5.1kΩ, CL=15pF
INPUT:0.2V/div
Overdrive=20mV
Overdrive=100mV
Overdrive=50mV
4
3.5
Overdrive=100mV
2.5
2
Overdrive=50mV
1.5
Overdrive=20mV
5
0.4
4.5
0.2
4
OUTPUT:0.5V/div
0
-0.5
0
0.5
1
1.5
500ns/div
2
2.5
3
0.6
INPUT:0.2V/div
0.4
Overdrive=100mV
Overdrive=50mV
0.2
Overdrive=20mV
3.5
-0.2
3
-0.4
2.5
-0.6
2
-0.8
1.5
-1
0.5
Ver.6
0.6
0
3
0
25 50 75 100 125 150
Ambient Temperature [ºC]
Response time(Fall)
Response time(Rise)
1
0
25 50 75 100 125 150
Ambient Temperature [ºC]
V- =0V, overdrive=100mV, RL=5.1kΩ, CL=15pF
16
250
200
-25
Output Signal Falling Time vs. Temperature
V- =0V, overdrive=100mV, RL=5.1kΩ, CL=15pF
300
5
V+=3V
0.2
Output Signal Rising Time vs. Temperature
4.5
overdrive=100mV, RL=5.1kΩ, CL=15pF
0
-50
Output Signal Rising Time [ns]
V- =0V,
0
-0.2
Overdrive=100mV
Overdrive=50mV
-0.4
Overdrive=20mV
-0.6
-0.8
-1
1
-1.2
0.5
-1.4
0
-1.2
OUTPUT:0.5V/div
-1.4
-0.5
http://www.njr.com/
0
0.5
1
1.5
500ns/div
2
2.5
3
- 10 -
NJU77240/NJU77241/NJU77242
■ TYPICAL TEST CIRCUIT
●Supply Current (ISUPPLY)
+
・V =3V,V－=0V,Vcom=0V, VID=100m V
+
・V =3V,V－=0V,Vcom=3V, VID=100mV
V+
A
V ID
V COM
●Output Leakage Current (ILEAK)
●Low-level Output Voltage (VOL)
+
・V =3V,V－=0V, VID=100m V, Vo=3V
+
・V =3V,V－=0V,ISINK=3mA,VID=100mV
V+
V+
A
V
VID
VID
ISINK
●Propagation Delay (tPLH, tPHL), Output Signal Rising Time (tTLH), Output Signal Falling Time (tTHL)
+
・V =3V,V－=0V,VCOM=0V,RL=5.1kΩ,CL=15pF,Over drive=100mV
V+
Input Wave Form
(Rise Measurement)
Over
Drive
RL
VCOM
100mV
V IN
Input Wave Form
(Fall Measurement)
CL
VCOM
100mV
VCOM
Over
Drive
Ver.6
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- 11 -
NJU77240/NJU77241/NJU77242
■ APPLICATION NOTE
・ Input Voltage Exceeding the Supply Voltage
Inputs of the NJU77240/NJU77241/NJU77242 are protected by ESD diodes (shown in Figure1) that will conduct if the input voltages
exceed the power supplies by more than approximately 300mV. Momentary voltages greater than 300mV beyond the power supply, inputs
can be tolerated if the current is limited to 10mA. Figure2 is easily accomplished with an input resistor. If the input voltage exceeds the
supply voltage, the input current must be limited 10mA or less by using a restriction resistance (RLIMIT) as shown in figure2.
V+
+INPUT
OUTPUT
-INPUT
V-
Figure1. Simplified Schematic
Current Limit
10mA
V+
Vin
Vout
RLIMIT
VFigure2. Input Current Protection for Voltages
exceeding the Supply Voltage.
・ Bypass Capacitor
It is advised to add a bypass capacitor between the supply voltage and ground as close as possible to device.
Ver.6
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- 12 -
NJU77240/NJU77241/NJU77242
・ EMIRR (EMI Rejection Ratio) Definition
EMIRR is a parameter indicating the EMI robustness of an OP-Amp. The definition of EMIRR is given by the following a
formula (1). We can grasp the tolerance of the RF signal by measuring an RF signal and offset voltage shift quantity.
EMIRR=20∙log ቆ
VRF_PEAK
ቇ
|∆VIO |
… (1)
VRF_PEAK ：RF Signal Amplitude [ VP ]
ΔVIO ：Input offset voltage shift quantity [ V ]
Offset voltage shift is small so that a value of EMIRR is big. And it understands that the tolerance for the RF signal is high. In
addition, about the input offset voltage shift with the RF signal, there is the thinking that influence applied to the input terminal is
dominant. Therefore, generally the EMIRR becomes value that applied an RF signal to +INPUT terminal.
EMIRR vs. Frequency
120
V+=3V, V-=0V, VREF=1.5V, VRF_PEAK=100mVPP
EMIRR [dB]
100
80
60
40
20
0
100M
1G
Frequency [Hz]
10G
Figure3. EMIRR vs. Frequency
*For details, refer to " Application Note for EMI Immunity" in our HP: http://www.njr.com/
Ver.6
http://www.njr.com/
- 13 -
NJU77240/NJU77241/NJU77242
SOT-23-5
Unit: mm
■ PACKAGE DIMENSIONS
2.9 ±0.2
0 ～ 15 °
1.9 ±0.2
4
0.6
2. 8 ± 0 .2
1 .6
+0.2
-0.1
0 .2
5
2
1
3
0.1
0.95 ± 0.1
+0.1
-0.03
0.4 ±0.1
0.1
0 .1 m ax
1 .1 ± 0 .1
0.6max
■ EXAMPLE OF SOLDER PADS DIMENSIONS
2. 4
1 .0
0 .7
0 .95
Ver.6
0 .95
http://www.njr.com/
- 14 -
NJU77240/NJU77241/NJU77242
SC-88A
Unit: mm
0. 4 25 ± 0. 2
■ PACKAGE DIMENSIONS
2.0 ±0.2
1.3 ±0.2
5
2
(0 .2 45 )
2. 1 ± 0. 2
1 . 25 ± 0 .1
0.23
+0.1
-0.03
4
3
0 .4 25 ± 0 .2
1
0.13
+0.1
-0.05
0 ～ 10 °
+0.05
-0.15
0 .9 5
0. 05 ±0 .0 5
0 . 9 ±0 . 1
+0.2
0. 2 -0.1
0.65 ±0.07
0.1
■ EXAMPLE OF SOLDER PADS DIMENSIONS
1 .9
0 .8
0.3
0.65
Ver.6
0.65
http://www.njr.com/
- 15 -
NJU77240/NJU77241/NJU77242
DFN6-G1 (ESON6-G1)
Unit: mm
■ EXAMPLE OF SOLDER PADS DIMENSIONS
■ PACKAGE DIMENSIONS
0.10
M
1.28
A
S
0.28
0.397 ± 0.030
1.8
0.62
0.10
1.14
S
0.075
+0.01
0.01 -0.008
S
M
1.60 ± 0.05
S
B
0.31
1.60 ±0.05
0.05
S
A
1.20 +0.06
-0.04
C0
.2
0.5
0.5
0.26 +0.06
-0.04
Ver.6
0.21+0.06
-0.04
3-
R0
.2
+0.06
0.68 -0.04
B
φ 0.05
M
S
AB
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- 16 -
NJU77240/NJU77241/NJU77242
MSOP8 (TVSP8)
MEET JEDEC MO-187-DA/thin type
Unit: mm
■ PACKAGE DIMENSIONS
2.9 ±0.1
1
0.55 ± 0.1
4.0 ± 0.2
5
2.8 ± 0.1
8
0 ～10ﾟ
4
0.127 +0.05
-0.03
0.65
0.08
0.2 ±0.05
0.05 M
0.1 ± 0.05
1.0max
0.475 ±0.1
■ EXAMPLE OF SOLDER PADS DIMENSIONS
0.65
3. 5
1 .0
0.23
1.95
Ver.6
http://www.njr.com/
- 17 -
NJU77240/NJU77241/NJU77242
DFN8-U1 (ESON8-U1)
Unit: mm
■ PACKAGE DIMENSIONS
■ EXAMPLE OF SOLDER PADS DIMENSIONS
0.28
0.5
2. 20
1 .0 2
2.0 ±0.05
0. 31
2.0 ±0.05
0.075
+0.010
-0.008
S
0.397 ± 0.03
1.54
1.78
S
S
0.01
0.05
A
0.21 -0.04
+0.06
1.6 +0.06
-0.04
0.25
C0
.3
3-
R0
.3
1.08 -0.04
+0.06
B
0.5
0.26 +0.06
-0.04
Ver.6
φ0.05
M
S
AB
http://www.njr.com/
- 18 -
NJU77240/NJU77241/NJU77242
SOT-23-5
■ PACKING SPEC
Unit: mm
TAPING DIMENSIONS
SYMBOL
A
B
D0
D1
E
F
P0
P1
P2
T
T2
K0
W
W1
Feed direction
P0
φ D0
T
B
W1
W
F
E
P2
A
P1
K0
φD1
T2
DIMENSION
3.3±0.1
3.2±0.1
1.55
1.05
1.75±0.1
3.5±0.05
4.0±0.1
4.0±0.1
2.0±0.05
0.25±0.05
1.82
1.5±0.1
8.0±0.3
5.5
REMARKS
BOTTOM DIMENSION
BOTTOM DIMENSION
THICKNESS 0.1MAX
REEL DIMENSIONS
W1
SYMBOL
A
B
C
D
E
W
W1
E
A
D
B
C
DIMENSION
φ180±1
φ 60±1
φ 13±0.2
φ 21±0.8
2±0.5
9±0.5
1.2±0.2
W
TAPING STATE
Insert direction
Sealing with covering tape
(TE1)
Drawing direction
Empty tape
Device attaching tape
more than 20pitch
3000pcs/reel
Empty tape
Covering tape
more than 20pitch reel more than 1 round
PACKING STATE
Label
Label
Put a reel into a box
Ver.6
http://www.njr.com/
- 19 -
NJU77240/NJU77241/NJU77242
SC-88A
Unit: mm
■ PACKING SPEC
TAPING DIMENSIONS
Feed direction
P0
φD0
SYMBOL
A
B
D0
D1
E
F
P0
P1
P2
T
T2
W
W1
T
B
W1
W
F
E
P2
A
P1
T2
φ D1
DIMENSION
2.3±0.1
2.5±0.1
1.55±0.05
1.05±0.05
1.75±0.1
3.5±0.05
4.0±0.1
4.0±0.1
2.0±0.05
0.25±0.05
1.3±0.1
8.0±0.2
5.5
REMARKS
BOTTOM DIMENSION
BOTTOM DIMENSION
THICKNESS 0.1max
REEL DIMENSIONS
W1
SYMBOL
A
B
C
D
E
W
W1
E
B
A
D
C
DIMENSION
φ180±1
φ 60±1
φ 13±0.2
φ 21±0.8
2±0.5
9±0.5
1.2±0.2
W
TAPING STATE
Insert direction
Sealing with covering tape
(TE1)
Drawing direction
Empty tape
Device attaching tape
more than 20pitch
3000pcs/reel
Empty tape
Covering tape
more than 20pitch reel more than 1 round
PACKING STATE
Label
Label
Put a reel into a box
Ver.6
http://www.njr.com/
- 20 -
NJU77240/NJU77241/NJU77242
DFN6-G1 (ESON6-G1)
■ PACKING SPEC
Unit: mm
TAPING DIMENSIONS
Fe ed d ire c tio n
φ D0
P0
SYMBOL
A
B
D0
D1
E
F
P0
P1
P2
T
T2
W
W1
T
B
W1
W
F
E
P2
A
φD1
P1
T2
DIMENSION
1.85±0.05
1.85±0.05
1.5 +0.1
0
0.5±0.1
1.75±0.1
3.5±0.05
4.0±0.1
4.0±0.1
2.0±0.05
0.25±0.05
0.65±0.05
8.0±0.2
5.5
REMARKS
BOTTOM DIMENSION
BOTTOM DIMENSION
THICKNESS 0.1max
REEL DIMENSIONS
W1
SYMBOL
A
B
C
D
E
W
W1
E
B
A
D
C
DIMENSION
0
φ180 -1.5
φ 60 +10
φ 13±0.2
φ 21±0.8
2±0.5
9 +0.3
0
1.2
W
TAPING STATE
Insert direction
Sealing with covering tape
(TE3)
Feed direction
Empty tape
Devices
more than 40 pitch
3000pcs/reel
Empty tape
Covering tape
more than 25 pitch reel more than 1 round
PACKING STATE
Label
Label
Put a reel into a box
Ver.6
http://www.njr.com/
- 21 -
NJU77240/NJU77241/NJU77242
MSOP8 (TVSP8)
MEET JEDEC MO-187-DA/THIN TYPE
Unit: mm
■ PACKING SPEC
TAPING DIMENSIONS
Fe ed d irec tio n
P2
P0
φD0
SYMBOL
A
B
D0
D1
E
F
P0
P1
P2
T
T2
W
W1
B
W1
W
F
E
T
A
P1
φD1
T2
DIMENSION
4.4
3.2
1.5 +0.1
0
1.5 +0.1
0
1.75±0.1
5.5±0.05
4.0±0.1
8.0±0.1
2.0±0.05
0.30±0.05
1.75 (MAX.)
12.0±0.3
9.5
REMARKS
BOTTOM DIMENSION
BOTTOM DIMENSION
THICKNESS 0.1max
REEL DIMENSIONS
W1
C
SYMBOL
A
B
C
D
E
W
W1
B
A
D
E
DIMENSION
φ254±2
φ100±1
φ 13±0.2
φ 21±0.8
2±0.5
13.5±0.5
2.0±0.2
W
TAPING STATE
Insert direction
Sealing with covering tape
(TE1)
Empty tape
Feed direction
more than 20pitch
Devices
2000pcs/reel
Empty tape
Covering tape
more than 20pitch reel more than 1round
PACKING STATE
Label
Label
Put a reel into a box
Ver.6
http://www.njr.com/
- 22 -
NJU77240/NJU77241/NJU77242
DFN8-U1 (ESON8-U1)
Unit: mm
■ PACKING SPEC
TAPING DIMENSIONS
Fe ed dire ct io n
P0
φ D0
SYMBOL
A
B
D0
D1
E
F
P0
P1
P2
T
T2
K0
W
W1
T
B
W1
W
F
E
P2
K0
A
T2
φD1
P1
DIMENSION
2.25±0.05
2.25±0.05
1.5 +0.1
0
0.5±0.1
1.75±0.1
3.5±0.05
4.0±0.1
4.0±0.1
2.0±0.05
0.25±0.05
1.00±0.07
0.65±0.05
8.0±0.2
5.5
REMARKS
BOTTOM DIMENSION
BOTTOM DIMENSION
THICKNESS 0.1max
REEL DIMENSIONS
W1
SYMBOL
A
B
C
D
E
W
W1
E
B
A
D
C
DIMENSION
0
φ180 -1.5
+1
φ 60 0
φ 13±0.2
φ 21±0.8
2±0.5
9 +0.3
0
1.2
W
TAPING STATE
Insert direction
Sealing with covering tape
(TE3)
Feed direction
Empty tape
Devices
more than 40 pitch
3000pcs/reel
Empty tape
Covering tape
more than 25 pitch reel more than 1 round
PACKING STATE
Label
Label
Put a reel into a box
Ver.6
http://www.njr.com/
- 23 -
NJU77240/NJU77241/NJU77242
■ RECOMMENDED MOUNTING METHOD
*Recommended reflow soldering procedure
f
260℃
e
230℃
220℃
d
180℃
150℃
Room Temp.
a
b
a：Temperature ramping rate
b：Pre-heating temperature
time
c：Temperature ramp rate
d：220℃ or higher time
e：230℃ or higher time
f：Peak temperature
g：Temperature ramping rate
c
g
: 1 to 4℃/s
: 150 to 180℃
: 60 to 120s
: 1 to 4℃/s
: Shorter than 60s
: Shorter than 40s
: Lower than 260℃
: 1 to 6℃/s
*The temperature indicates at the surface of mold package.
■ REVISION HISTORY
Date
Ver.6
Revision
Changes
2016/11/30
Ver.0
First edition
2017/5/24
Ver.1
Added information of NJU77242.
2017/6/6
Ver.2
Corrected BLOCK DIAGRAM.
2017/10/12
Ver.3
Changed GENERAL DESCRIPTION and APPLICATION
Corrected ELECTRICAL CHARACTERISTICS
2017/12/1
Ver.4
Changed TITLE
Corrected ELECTRICAL CHARACTERISTICS
2018/8/7
Ver.5
2019/3/29
Ver.6
Changed TEST CONDITION in ELECTRICAL CHARACTERISTICS
Changed RECOMMENDED OPERATING CONDITIONS
Changed TEST CONDITION in TYPICAL CHARACTERISTICS
Changed PARAMETER in RECOMMENDED OPERATING CONDITIONS
Changed TIMING WAVEFORM
Changed TEST CONDITION in TYPICAL CHARACTERISTICS
http://www.njr.com/
- 24 -
NJU77240/NJU77241/NJU77242
[ CAUTION ]
1.
NJR strives to produce reliable and high quality semiconductors. NJR’s semiconductors are intended for specific applications
and require proper maintenance and handling. To enhance the performance and service of NJR's semiconductors, the devices,
machinery or equipment into which they are integrated should undergo preventative maintenance and inspection at regularly
scheduled intervals. Failure to properly maintain equipment and machinery incorporating these products can result in
catastrophic system failures
2.
The specifications on this datasheet are only given for information without any guarantee as regards either mistakes or
omissions. The application circuits in this datasheet are described only to show representative usages of the product and not
intended for the guarantee or permission of any right including the industrial property rights.
All other trademarks mentioned herein are the property of their respective companies.
3.
To ensure the highest levels of reliability, NJR products must always be properly handled.
The introduction of external contaminants (e.g. dust, oil or cosmetics) can result in failures of semiconductor products.
4.
NJR offers a variety of semiconductor products intended for particular applications. It is important that you select the proper
component for your intended application. You may contact NJR's Sale's Office if you are uncertain about the products listed in
this datasheet.
5.
Special care is required in designing devices, machinery or equipment which demand high levels of reliability. This is
particularly important when designing critical components or systems whose failure can foreseeably result in situations that
could adversely affect health or safety. In designing such critical devices, equipment or machinery, careful consideration
should be given to amongst other things, their safety design, fail-safe design, back-up and redundancy systems, and diffusion
design.
6.
The products listed in this datasheet may not be appropriate for use in certain equipment where reliability is critical or where
the products may be subjected to extreme conditions. You should consult our sales office before using the products in any of
the following types of equipment.
7.
8.
9.
Ver.6
Aerospace Equipment
Equipment Used in the Deep Sea
Power Generator Control Equipment (Nuclear, steam, hydraulic, etc.)
Life Maintenance Medical Equipment
Fire Alarms / Intruder Detectors
Vehicle Control Equipment (Airplane, railroad, ship, etc.)
Various Safety Devices
NJR's products have been designed and tested to function within controlled environmental conditions. Do not use products
under conditions that deviate from methods or applications specified in this datasheet. Failure to employ the products in the
proper applications can lead to deterioration, destruction or failure of the products. NJR shall not be responsible for any bodily
injury, fires or accident, property damage or any consequential damages resulting from misuse or misapplication of the
products. The products are sold without warranty of any kind, either express or implied, including but not limited to any implied
warranty of merchantability or fitness for a particular purpose.
Warning for handling Gallium and Arsenic (GaAs) Products (Applying to GaAs MMIC, Photo Reflector). These products use
Gallium (Ga) and Arsenic (As) which are specified as poisonous chemicals by law. For the prevention of a hazard, do not burn,
destroy, or process chemically to make them as gas or power. When the product is disposed of, please follow the related
regulation and do not mix this with general industrial waste or household waste.
The product specifications and descriptions listed in this datasheet are subject to change at any time, without notice.
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