MCL1608V2-151-R

厂商：
EATON(伊顿)
封装：
0603
描述：
固定电感器 0603 150nH ±5% 200mA 1.6Ω 500MHz 8@100MHz

数据手册：

下载MCL1608V2-151-R.pdf

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详情介绍
数据手册
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MCL1608V2-151-R 数据手册

Technical Data 10927 Effective June 2019 MCL1608V2 Multilayer chip inductor Applications Product features • Industrial connectivity (IoT) • Wireless communiations • Bluetooth • WiFi • Antenna • Machine-to-machine (M2M) • Mobile phones • Wearable devices • Wireless LAN • Computing/gaming consoles • 0603 (1608 metric) package • High self resonant frequency (SRF) Broadband components • • Multilayer monolithic construction yields high reliability RF transciever modules • • Suitable for wave and reflow soldering • Inductance range from 1.0 nH to 470 nH Environmental data • Moisture sensitivity level (MSL): 1 • Operating temperature range: -40 °C to +85 °C (ambient plus self-temperature rise) • Solder reflow temperature: J-STD-020 (latest revision) compliant HALOGEN Pb HF FREE MCL1608V2 Multilayer chip inductor Technical Data 10927 Effective June 2019 Product specifications Part number OCL (nH) ±5% I Rated (mA) maximum DCR (Ω) maximum @ +25°C SRF (MHz) minimum Q mimimum Test frequency (MHz) Test voltage (mV) MCL1608V2-1R0-R 1.0 ±0.3nH 500 0.05 10000 8 100 50 MCL1608V2-1R2-R 1.2 ±0.3nH 500 0.05 10000 8 100 50 MCL1608V2-1R5-R 1.5 ±0.3nH 500 0.10 6000 8 100 50 MCL1608V2-1R8-R 1.8 ±0.3nH 500 0.10 6000 8 100 50 MCL1608V2-2R2-R 2.2 ±0.3nH 500 0.10 6000 8 100 50 MCL1608V2-2R7-R 2.7 ±0.3nH 500 0.12 6000 10 100 50 MCL1608V2-3R3-R 3.3± 0.3nH 500 0.15 6000 10 100 50 MCL1608V2-3R9-R 3.9 ±0.3nH 500 0.16 6000 10 100 50 MCL1608V2-4R7-R 4.7 ±0.3nH 500 0.20 6000 10 100 50 MCL1608V2-5R6-R 5.6 ±0.3nH 500 0.25 5000 10 100 50 MCL1608V2-6R8-R 6.8 500 0.30 5000 10 100 50 MCL1608V2-8R2-R 8.2 500 0.35 4500 10 100 50 MCL1608V2-100-R 10.0 300 0.40 3500 12 100 50 MCL1608V2-120-R 12.0 300 0.45 3000 12 100 50 MCL1608V2-150-R 15.0 300 0.50 2300 12 100 50 MCL1608V2-180-R 18.0 300 0.55 2200 12 100 50 MCL1608V2-220-R 22.0 300 0.60 2000 12 100 50 MCL1608V2-270-R 27.0 300 0.65 1700 12 100 50 MCL1608V2-330-R 33.0 300 0.70 1500 12 100 50 MCL1608V2-390-R 39.0 300 0.70 1400 12 100 50 MCL1608V2-470-R 47.0 300 0.70 1200 12 100 50 MCL1608V2-560-R 56.0 300 0.75 1100 12 100 50 MCL1608V2-680-R 68.0 300 0.85 900 12 100 50 MCL1608V2-820-R 82.0 300 1.00 800 8 100 50 MCL1608V2-101-R 100 300 1.20 700 8 100 50 MCL1608V2-121-R 120 200 1.40 600 8 100 50 MCL1608V2-151-R 150 200 1.60 500 8 100 50 MCL1608V2-181-R 180 200 1.90 400 8 100 50 MCL1608V2-221-R 220 200 2.40 350 8 100 50 MCL1608V2-271-R 270 150 2.60 350 8 100 50 MCL1608V2-331-R 330 150 2.80 350 8 100 50 MCL1608V2-391-R 390 150 3.20 300 8 100 50 MCL1608V2-431-R 430 150 3.40 280 8 50 50 MCL1608V2-471-R 470 150 3.60 250 8 50 50 1. Test frequency and voltage are for OCL and Q at +25 °C 2. Resistance to soldering heat: +260 ±5 °C for 10 ± 1 second 3. At low temperature resistance (-40 ±2°C) the inductance change is within ±10% and the Q within ±20% 4. At high temperature resistance (+85 ±2°C) the inductance change is within ±10% and the Q within ±20% 2 www.eaton.com/electronics 5 At high temperature load (+85 ±2°C) the inductance change is within ±10% and the Q within ±20% 6. Rated I: When rated I is applied to the product, self-temperature rise will be 40 °C or less. 7. Part Number Definition: MCL1608V2-xxx-R MCL1608 = Product code and size V2= Version indicator xxx= inductance value in nH, R= decimal point, If no R is present then last character equals number of zeros -R suffix = RoHS compliant Technical Data 10927 MCL1608V2 Multilayer chip inductor Effective June 2019 Dimensions (mm) Schematic Recommended pad layout B L C Part Number L W T a A B C MCL1608V2-xxx-R 1.6 ±0.20 0.80 ±0.20 0.80 ±0.20 0.30 ±0.20 1.2 ±0.10 0.9 ±0.10 04 ±0.10 No part marking All soldering surfaces to be coplanar within 0.1 millimeters Tolerances are ±0.2 millimeters unless stated otherwise Pad layout tolerances are ±0.1 millimeters unless stated otherwise Do not route traces or vias underneath the inductor Packaging information (mm) Drawing not to scale Supplied in tape and reel packaging, 4000 parts per 7” diameter reel W ±0.3 F±0.05 E1±0.10 E2 Min P0±0.10 P1±0.2 P2±0.1 D0+0.10/-0 A0 B0 T Max T1 Max 8.00 3.50 1.75 6.25 4.00 4.00 2.00 1.50 1.1±0.20 1.9±0.20 1.10 na www.eaton.com/electronics 3 MCL1608V2 Multilayer chip inductor Technical Data 10927 Effective June 2019 Inductance vs frequency 500 450 Inductance（nH） 400 MCL1608V2-331-R 350 MCL1608V2-560-R 300 250 200 150 100 MCL1608V2-3R3-R 50 0 100 1000 10000 Frequency（MHz） Q vs frequency 70 60 MCL1608V2-3R3-R 50 Q 40 30 20 10 0 MCL1608V2-560-R MCL1608V2-331-R 100 1000 Frequency（MHz） 4 www.eaton.com/electronics 10000 Technical Data 10927 MCL1608V2 Multilayer chip inductor Effective June 2019 Solder reflow profile TP TC -5 °C tP Max. ramp up rate = 3° C/s Max. ramp down rate = 6 °C/s Temperature TL Preheat A T smax Package Thickness Volume mm3

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MCL1608V2-151-R

1. 物料型号：MCL1608V2系列，包括多种不同的电感值，如1.0 nH至470 nH。

2. 器件简介： - 采用0603 (1608公制)封装。 - 高自谐振频率(SRF)。 - 多层单体结构，高可靠性。 - 适用于波峰焊和回流焊。 - 湿度敏感度等级(MSL)：1。

3. 引脚分配：文档中未明确提供引脚分配信息，但通常这类器件为无引脚的表面贴装元件。

4. 参数特性： - 工作温度范围：-40°C至+85°C。 - 符合J-STD-020标准的焊接回流温度。 - 符合RoHS标准，无卤素。

5. 功能详解： - 适用于多种应用，包括工业连接(物联网)、无线通信、蓝牙、Wi-Fi、天线、机器对机器(M2M)、移动电话、可穿戴设备、无线局域网、计算/游戏控制台、宽带组件、射频收发器模块等。

6. 应用信息：如上所述，涵盖广泛的电子设备和系统。

7. 封装信息： - 提供了详细的尺寸图和推荐的焊盘布局。 - 强调了所有焊接表面必须在0.1毫米内共面，焊盘布局公差为±0.1毫米。 - 建议不要在电感器下方布线或放置过孔。

8. 环境数据：包括操作温度范围和焊接回流温度等信息。

9. 产品规格：列出了不同型号的电感值、额定电流、直流电阻、自谐振频率、最小Q值、测试频率和测试电压等参数。

10. 图表：提供了电感值与频率、Q值与频率的图表，以及焊接回流温度曲线。