DRAP124-820-R

Technical Data 11040 Effective March 2020 DRAP124 Automotive grade high power density, shielded drum core power inductors Applications • • Product features Body electronics • LED lighting (interior and exterior) • Central body control module • Vehicle access control module • Headlamps, tail lamps and interior lighting • Heating ventilation and air conditioning controllers (HVAC) • Doors, window lift and seat control Advanced driver assistance systems • Adaptive cruise control (ACC) AEC-Q200 qualified • Automatic parking control • Secure four terminal mounting ideal for severe vibration environments up to 30 g. • Collision avoidance system/ Car black box system • Rugged construction for high shock conditions • Magnetically shielded-reduces EMI • Inductance range from 0.42 μH to 1001 μH • Digital instrument cluster • Current range from 0.38 A to 30.8 A • In-vehicle infotainment (IVI) and navigation • 12.5 mm x 12.5 mm x 4.6 mm surface mount package • • • Infotainment and cluster electronics • Audio subsystem: head unit and trunk amp Chassis and safety electronics • Electronic stability control system (ESC) Electric parking brake Electronic power steering (EPS) / Anti-locking braking system (ABS) • Ferrite core material • • Weight: 2.32 grams typical • • Moisture Sensitivity Level: 1 • Engine and powertrain systems • Electric pumps, motor control and auxiliaries • Powertrain control module (PCU)/ Engine control unit (ECU) • Transmission control unit (TCU) Environmental compliance and general specifications • Storage temperature range (Component): -40 °C to +165 °C • Operating temperature range: -40 °C to +165 °C (ambient plus self-temperature rise) • Solder reflow temperature: J-STD-020 (latest revision) compliant HALOGEN Pb HF FREE DRAP124 Automotive grade high power density, shielded drum core power inductors Technical Data 11040 Effective March 2020 Product specifications Part number6 OCL1 (µH) ±20% Irms2 (A) Isat13 (A) Isat24 (A) DCR (Ω) typical @ +25 °C DCR (Ω) maximum @ +25 °C K Factor5 DRAP124-R47-R 0.42 13.5 30.8 24.6 0.0024 0.0028 196.9 DRAP124-1R0-R 0.82 11.65 22.0 17.6 0.0031 0.0038 140.7 DRAP124-1R5-R 1.36 9.36 17.1 13.7 0.0049 0.0058 109.4 DRAP124-2R2-R 2.04 7.64 14.0 11.2 0.0070 0.0090 89.5 DRAP124-3R3-R 2.79 6.94 11.9 9.48 0.0090 0.011 75.7 DRAP124-4R7-R 4.74 5.47 9.06 7.25 0.014 0.017 57.9 DRAP124-6R8-R 7.28 4.46 7.33 5.87 0.021 0.026 46.9 DRAP124-8R2-R 8.88 3.87 6.70 5.36 0.028 0.034 42.8 DRAP124-100-R 10.4 3.67 6.16 4.93 0.031 0.038 39.4 DRAP124-150-R 14.1 3.10 5.31 4.25 0.044 0.053 34.0 DRAP124-220-R 23.0 2.44 4.16 3.33 0.071 0.086 26.6 DRAP124-330-R 34.1 1.98 3.42 2.74 0.108 0.130 21.9 DRAP124-470-R 46.3 1.78 2.91 2.33 0.134 0.160 18.6 DRAP124-680-R 69.8 1.45 2.37 1.90 0.201 0.241 15.1 DRAP124-820-R 80.6 1.29 2.23 1.79 0.257 0.309 14.3 DRAP124-101-R 98.8 1.20 2.00 1.60 0.296 0.355 12.8 DRAP124-151-R 152 0.967 1.62 1.30 0.454 0.550 10.4 DRAP124-221-R 209 0.865 1.36 1.09 0.568 0.680 8.7 DRAP124-331-R 326 0.690 1.09 0.874 0.892 1.070 7.0 DRAP124-471-R 473 0.568 0.911 0.729 1.32 1.58 5.8 DRAP124-681-R 682 0.466 0.759 0.607 1.96 2.35 4.9 DRAP124-821-R 826 0.406 0.697 0.557 2.57 3.09 4.5 DRAP124-102-R 1001 0.380 0.629 0.503 2.94 3.52 4.0 1. Open circuit inductance (OCL) test parameters: 100 kHz, 0.25 Vrms, 0.0 Adc, +25 °C 2. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +165 °C under worst case operating conditions verified in the end application. 3. Isat1: Peak current for approximately 30% rolloff @ +25 °C 4. Isat2: Peak current for approximately 40% rolloff @ +125 °C 2 www.eaton.com/electronics 5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in μH), ΔI (Peak-to-peak ripple current in Amps). 6. Part Number Definition: DRAP124-xxx-R DRAP124= Product code and size xxx= Inductance value in μH, R= decimal point, If no R is present last character equals number of zeros -R suffix = RoHS compliant DRAP124 Automotive grade high power density, shielded drum core power inductors Dimensions (mm) Technical Data 11040 Effective March 2020 Recommended pad layout Epoxy 2.00±0.10 0.20±0.10 DRAP124 xxx xxxx R Schematic 1 dummy 12.50 Max 5.40±0.10 #2 #1 CL 13.00±0.10 2 6.80±0.10 Epoxy 12.5 Max dummy 0.20±0.10 CL 4.60 Max 6.80±0.10 13.00±0.10 Refer to the notes for epoxy/flashing protrusion specification Epoxy 1.60 2.50 5.00 Epoxy #2 #1 12.00 7.00 Ref. Pin1 Indicator 7.00 Ref. 2.50 12.00 Part marking: DRAP124, xxx= inductance value in uH, R= decimal point, if no R is present last character equals number of zeros, xxxx=lot code, R= Revision level All soldering surface to be coplanar within 0.1 millimeters Tolerances are ±0.2 millimeters unless stated otherwise Special Characteristic epoxy protrusion or any flashing from the plastic on the header/base can be below the terminal surface and must not exceed 0.08 mm beyond the bottom surface of the terminal. Terminal pads shall protrude the plastic base 0.00~0.08 mm Traces or vias underneath the inductor is not recommended Packaging information (mm) Supplied in tape and reel packaging , 750 parts per 13” diameter reel www.eaton.com/electronics 3 DRAP124 Automotive grade high power density, shielded drum core power inductors Technical Data 11040 Effective March 2020 Temperature rise vs. total loss 70 Temperature rise (°C) 60 50 40 30 20 10 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 Total loss (W) Core loss vs. Bp-p 1 10 Hz M 0 kH z z z 50 30 0 kH 20 0 kH z 0 10 kH Core loss (W) 1 0.1 0.01 0.001 100 1000 10000 Bp-p (Gauss) Inductance characteristics 120% 110% 100% % of OCL 90% 80% -40 °C 70% 60% +25 °C 50% 40% +85 °C 30% +125 °C 20% 10% 0% 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 120% 130% 140% 150%160% % of Isat1 4 www.eaton.com/electronics DRAP124 Automotive grade high power density, shielded drum core power inductors Technical Data 11040 Effective March 2020 Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb solder (Tc) Package thickness Volume mm3