SD7030-680-R

Technical Data 4330 Effective August 2017 Supersedes October 2011 SD7030 Low profile shielded drum core power inductors Applications • • • • • • • • • Product features • • • • • Low profile 7.0 mm x 7.0 mm x 3.0 mm surface mount package Ferrite material shielded drum core Inductance range from 1.5 µH to 680 µH Current range from 0.21A to 5.5 A Frequency range up to 1 MHz Notebook, laptop computers Digital cameras LED Drivers TFT LCD Bias supplies Wireless handsets Handheld instruments Gaming consoles GPS devices Battery power, Li-lon, 2-cell Environmental data • • • Storage temperature range (component): -40 °C to +125 °C Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HF FREE HALOGEN  Technical Data 4330 Effective August 2017 Product specifications Part Number5 SD7030-1R5-R SD7030-3R3-R SD7030-3R9-R SD7030-5R0-R SD7030-6R0-R SD7030-7R3-R SD7030-8R0-R SD7030-100-R SD7030-120-R SD7030-150-R SD7030-180-R SD7030-220-R SD7030-260-R SD7030-300-R SD7030-390-R SD7030-440-R SD7030-560-R SD7030-680-R SD7030-820-R SD7030-101-R SD7030-121-R SD7030-151-R SD7030-181-R SD7030-221-R SD7030-271-R SD7030-331-R SD7030-391-R SD7030-471-R SD7030-561-R SD7030-681-R OCL1 μH ± 30% 1.5 3.3 4.1 4.9 5.8 7.0 7.8 10.0 11.5 14.6 17.3 21.0 24.9 30.0 39.7 43.4 54.4 66.6 81.4 95.5 115.2 145 174 211 264 317 381 460 561.0 677.2 Irms2 (A) 5.5 3.7 3.4 3.2 2.8 2.3 2.2 2.1 1.9 1.7 1.7 1.4 1.3 1.2 1.1 1.1 0.99 0.85 0.82 0.70 0.67 0.57 0.54 0.51 0.44 0.38 0.36 0.34 0.29 0.28 1 Open Circuit Inductance Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc. 2 Irms: DC current for an approximate ΔT of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 3 Isat Amps peak for approximately 35% rolloff (@ +25 °C) Typ. DCR mΩ @ +25 °C 10 20 22 26 29 45 48 54 58 70 79 107 118 138 175 198 231 253 325 446 629 715 805 1102 1259 1438 1857 2150 2857 3206 Isat3 (A) 4.5 3.00 2.60 2.40 2.25 2.10 1.85 1.70 1.55 1.40 1.32 1.20 1.05 0.97 0.86 0.80 0.73 0.65 0.60 0.54 0.50 0.44 0.40 0.36 0.33 0.30 0.27 0.25 0.23 0.21 Max DCR mΩ @ +25 °C 12 24 27 31 35 54 58 65 70 84 95 128 142 165 210 238 277 304 390 535 755 858 966 1322 1475 1725 2228 2581 3428 3847 K-factor 4 32 22 19 17 16 13 12 11 10 9.3 8.8 7.6 6.9 6.4 5.7 5.3 4.9 4.3 4.0 3.6 3.3 2.9 2.7 2.4 2.2 2.0 1.8 1.7 1.5 1.4 4 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K*L*ΔI, Bp-p(mT), K: (K factor from table), L: (Inductance in μH), ΔI (Peak-to-peak ripple current in Amps). 5 Part Number Definition: SD7030-xxx-R SD7030 = Product code and size; -xxx = Inductance R = decimal point; If no R is present, third character equals number of zeros. -R suffix = RoHS compliant value in μH; Dimensions-mm Top View Bottom View Front View Recommended Pad Layout Schematic Left View Part Marking: xxx = inductance value in μH. R = decimal point. If no “R” is present, third character = # of zeros. wwlly or wwllyy = date code. R = revision level Do not route traces or vias underneath the inductor Packaging information-mm Supplied in tape-and-reel packaging, 1500 parts per reel, 13” diameter reel. 2 www.eaton.com/electronics SD7030 Low profile shielded drum core power inductors Technical Data 4330 Effective August 2017 Core loss vs Bp-p 1MHz 500kHz 300kHz 200kHz 100kHz Temperature rise vs total loss Inductance characteristics -40°C +25°C +85°C www.eaton.com/electronics 3 SD7030 Low profile shielded drum core power inductors Technical Data 4330 Effective August 2017 Solder Reflow Profile TP tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL 25°C Preheat A T smax t TC -5°C Table 1 - Standard SnPb Solder (Tc) Volume mm3 220°C 220°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin ts Package Thickness 2.5mm Time 25°C to Peak Volume mm3 2000 260°C 245°C 245°C Time Reference JDEC J-STD-020 Profile Feature Preheat and Soak • Temperature min. (Tsmin) • Temperature max. (Tsmax) • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C 150°C 200°C 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4330 BU-SB111167 August 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners.