FP1308-R21-R

Effective June 2017 Supersedes Sepetember 2011 Technical Data DS4313 FP1308 High frequency, high current power inductors Applications Voltage regulator modules (VRMs) for servers and microprocessors • Multi-phase buck inductors • High frequency, high current switching power RE F CO P1 30 M NE M 8R W EN 3DE DE R SI D F GN O S R • supplies SMD Device Environmental data • Product features • • • • • • • 13.7 x 12.9 x 8.0mm surface mount package High current handling capability, compact footprint Ferrite core material Inductance range from 0.110µH to 0.440µH Current range from 32 to 120 amps Frequency range up to 2MHz Halogen free, lead free, RoHS compliant • • Storage temperature range (component): -40 °C to +125 °C Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HF FREE HALOGEN Product Specifications Part Rated 5 Number Inductance (μH) FP1308-R11-R 0.110 FP1308-R21-R 0.210 FP1308-R26-R 0.260 FP1308-R32-R 0.320 FP1308-R44-R 0.440 OCL1 Irms2 Isat3 DCR (mΩ) @ DCR (mΩ) @ K-factor4 ± 10% (μH) 0.110 0.210 0.260 0.320 0.440 (Amps) 68 68 68 68 68 (Amps) 120 72 60 45 32 25°C Typical 0.20 0.20 0.20 0.20 0.20 25°C Max 0.24 0.24 0.24 0.24 0.24 21.330 21.333 21.335 21.340 21.366 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc 2 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application. 3 Isat: Peak current for approximately 20% rolloff at +25°C. 4 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p (mT): (Gauss), K: (K-factor from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps). 5 Part Number Definition: FP1308-xxx-R • FP1308 = Product code and size • xxx= Inductance value in μH, R = decimal point. If no “R” is present, then third character = # of zeros. • “-R” suffix = RoHS compliant  Technical Data DS4313 Effective June 2017  Dimensions - mm 1 7.62 2.54 (2plcs) 12.95 max. Schematic Recommended Pad Layout Front View Bottom View Top View 1 RE F CO P1 3 M NE M 08 W EN R3 DE DE -R SI D GN FO S R 3.18 5.4 7.2 8.0 13.70 max. FP1308-XXX wwllyy R 2 Left View 2 8.0 max. Part Marking: FP1308 xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # 0f zeros Packaging Information - mm 1.5 dia. +0.1/-0.0 wwllyy = Date code 4.0 1.5 diia. min 2.0 R = Revision level A 1.75 Section A-A 13.9 FP1308-XXX wwllyy R 13.2 8.2 A User direction of feed Supplied in tape-and-reel packaging, 400 parts per reel, 13” diameter reel. Temperature Rise vs. Total Loss Temperature Rise (°C) 100 80 60 40 20 0 0 0.5 1 1.5 Total Loss (W) 2 www.eaton.com/electronics 2 2.5 3 11.5 24.0 ±0.3 Technical Data DS4313 FP1308 High frequency, high current power inductors Effective June 2017 Core Loss Core Loss vs B p-p 1MHz 10 500kHz 100kHz 300kHz 50kHz C o r e L o s s (W ) RE F CO P1 3 M NE M 08 W EN R3 DE DE -R SI D GN FO S R 1 0.1 0.01 0.001 0.0001 1 10 100 1000 B p-p (mT) Inductance Characteristics OCL vs I sat 120% 100% % of OCL 80% 60% -40 °C 40% +25 °C 20% +125 °C 0% 0% 20% 40% 60% 80% 100% 120% 140% 160% % of Isat www.eaton.com/electronics 3 FP1308 High frequency, high current power inductors Technical Data DS4313 Effective June 2017 Solder Reflow Profile TP TC -5°C 25°C Preheat A t Volume mm3 220°C 220°C RE F CO P1 3 M NE M 08 W EN R3 DE DE -R SI D GN FO S R Temperature TL T smax Table 1 - Standard SnPb Solder (Tc) tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Table 2 - Lead (Pb) Free Solder (T c) Tsmin Package Thickness 2.5mm ts Time 25°C to Peak Volume mm3 2000 260°C 245°C 245°C Time Reference JDEC J-STD-020 Profile Feature Preheat and Soak • Temperature min. (Tsmin) • Temperature max. (Tsmax) • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C 150°C 200°C 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Compan . Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant inju y to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. DS4313 BU-SB111090 June 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners.