Technical Data 4112
Effective July 2017
Supersedes March 2007
MP2A
MICRO-PAC PLUS™ Low profile toroid power inductors
Applications
•
•
•
•
•
•
•
SMD Device
Environmental data
•
Product features
•
•
•
•
•
High performance, low profile, surface
mount power inductors
Small footprint and closed magnetic field
construction ensure low EMI
Low DCR and high efficiency
Frequency range up to 500 kHz
Molybdenum permalloy (MPP) core material
Mobile phones
Tablets and e-readers
GPS systems
Battery power devices
Notebook and laptop power
Hand held devices
Media players
•
•
Storage temperature range (component):
-40 °C to +125 °C
Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
Solder reflow temperature:
J-STD-020 (latest revision) compliant
Pb
Technical Data 4112
Effective July 2017
Product specifications
Part
Number
Inductance
µH
(rated)
0.47
0.68
1.00
1.50
2.20
3.30
4.70
6.80
8.20
10.00
15.00
22.00
33.00
47.00
68.00
82.00
100.00
MP2A-R47-R
MP2A-R68-R
MP2A-1R0-R
MP2A-1R5-R
MP2A-2R2-R
MP2A-3R3-R
MP2A-4R7-R
MP2A-6R8-R
MP2A-8R2-R
MP2A-100-R
MP2A-150-R
MP2A-220-R
MP2A-330-R
MP2A-470-R
MP2A-680-R
MP2A-820-R
MP2A-101-R
OCL(1)
µH±20%
DCR(2)
typ.
Ω
0.024
0.027
0.067
0.073
0.086
0.098
0.117
0.136
0.167
0.179
0.217
0.311
0.476
0.727
1.108
1.463
2.015
0.47
0.68
1.21
1.54
2.30
3.21
4.86
6.85
8.54
10.02
15.18
21.40
32.74
46.48
68.53
81.15
99.65
Notes: (1) Open Circuit Inductance Test Parameters: 100 kHz, .25 Vrms, 0.0 Adc.
(2) DCR limits +20 °C.
(3) RMS current for an approximate ∆T of 40 °C without core loss. It is
recommended that the temperature of the part not exceed +125 °C.
I RMS(3)
(A)
I SAT(4)
(A)
Volt(5)
µsec
3.52
3.31
2.11
2.02
1.87
1.75
1.60
1.49
1.34
1.29
1.18
0.98
0.79
0.64
0.52
0.45
0.39
5.80
4.83
3.63
3.22
2.64
2.23
1.81
1.53
1.54
1.42
1.16
0.97
0.79
0.66
0.54
0.50
0.45
1.20
1.27
2.00
2.09
2.26
2.42
2.64
2.84
3.15
3.26
3.59
4.30
5.32
6.57
8.11
9.32
10.94
(4) Peak current for approximately 30% rolloff at +20 °C.
(5) Applied Volt-Time product (V-µs) across the inductor. This value
represents the applied V-µs at 300 kHz necessary to generate a core
loss equal to 10% of the total losses for 40 °C temperature rise.
Dimensions- mm
TOP VIEW
1
PCB PAD LAYOUT
SIDE VIEW
5.88
YWW
XXX
7.5
MAX
5.2
MAX
SCHEMATIC
1.05
1.8
MAX
1
5.40
7.50
2
2.00
2
yww = Date Code
xxx = Inductance value per family chart
Do not route traces or vias underneath the inductor
Packaging information- mm
Parts packaged on 13" Diameter reel,
3,900 parts per reel.
ACTUAL SIZE
MICRO-PAC PLUS
Ao=5.6mm
A1=2.3mm
Bo=8.5mm
B1=6.3mm
Ko=2.1mm
2
www.eaton.com/electronics
MP2A
MICRO-PAC PLUS™ Low profile toroid power inductors
Technical Data 4112
Effective July 2017
Core loss
I RMS DERATING WITH CORE LOSS
0
40
50
60
70
Hz
0K
10
0K
4 0 Hz
0K
Hz
30
0K
Hz
20
0K
Hz
80
50
% of Losses from Irms (maximum)
20
90
92
94
95
96
97
98
99
10
20
30
40
50 60
80
100
200
300
400 500 600
800 1000
% of Applied Volt-µ-seconds
Inductance characteristics
OCL vs. Isat
100%
90%
80%
% of OCL
70%
60%
50%
40%
30%
20%
10%
0%
0%
10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 120% 130% 140% 150% 160%
% of I sat
www.eaton.com/electronics
3
MP2A
MICRO-PAC PLUS™ Low profile toroid power inductors
Technical Data 4112
Effective July 2017
Solder Reflow Profile
TP
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Temperature
TL
25°C
Preheat
A
T smax
t
TC -5°C
Table 1 - Standard SnPb Solder (Tc)
Volume
mm3
220°C
220°C
Table 2 - Lead (Pb) Free Solder (T c)
Tsmin
ts
Package
Thickness
2.5mm
Time 25°C to Peak
Volume
mm3
2000
260°C
245°C
245°C
Time
Reference JDEC J-STD-020
Profile Feature
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Standard SnPb Solder
100°C
Lead (Pb) Free Solder
150°C
150°C
200°C
60-120 Seconds
60-120 Seconds
3°C/ Second Max.
3°C/ Second Max.
183°C
60-150 Seconds
217°C
60-150 Seconds
Table 1
Table 2
20 Seconds**
30 Seconds**
6°C/ Second Max.
6°C/ Second Max.
6 Minutes Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Compan . Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant inju y to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No. 4112
July 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
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