MCL2012V2-8R2-R

Technical Data 10929 Effective June 2019 MCL2012V2 Multilayer chip inductor Applications Product features • Industrial connectivity (IoT) • Wireless communiations • Bluetooth • WiFi • Antenna • Machine-to-machine (M2M) • Mobile phones • Wearable devices • Wireless LAN • Computing/gaming consoles • 0805 (2012 metric) package • High self resonant frequency (SRF) Broadband components • • Multilayer monolithic construction yields high reliability RF transciever modules • • Suitable for wave and reflow soldering • Inductance range from 1.5 nH to 470 nH Environmental data • Moisture sensitivity level (MSL): 1 • Operating temperature range: -40 °C to +85 °C (ambient plus self-temperature rise) • Solder reflow temperature: J-STD-020 (latest revision) compliant HALOGEN Pb HF FREE MCL2012V2 Multilayer chip inductor  Technical Data 10929 Effective June 2019 Product specifications Part number OCL (nH) ±5% I Rated (mA) maximum DCR (Ω) maximum @ +25°C SRF (MHz) minimum Q minimimum Test frequency (MHz) Test voltage (mV) MCL2012V2-1R5-R 1.5 ± 0.3nH 500 0.10 6000 10 100 50 MCL2012V2-1R8-R 1.8 ± 0.3nH 500 0.10 6000 10 100 50 MCL2012V2-2R2-R 2.2 ±0.3nH 500 0.10 6000 10 100 50 MCL2012V2-2R7-R 2.7 ±0.3nH 500 0.10 5500 12 100 50 MCL2012V2-3R0-R 3.0 ±0.3nH 500 0.13 5000 12 100 50 MCL2012V2-3R3-R 3.3± 0.3nH 500 0.13 5000 12 100 50 MCL2012V2-3R9-R 3.9 ±0.3nH 500 0.15 4500 12 100 50 MCL2012V2-4R7-R 4.7 ± 0.3nH 500 0.20 4000 12 100 50 MCL2012V2-5R6-R 5.6 ± 0.3nH 500 0.23 3500 15 100 50 MCL2012V2-6R8-R 6.8 500 0.25 3000 15 100 50 MCL2012V2-8R2-R 8.2 500 0.28 2500 15 100 50 MCL2012V2-100-R 10 500 0.30 2200 15 100 50 MCL2012V2-120-R 12 500 0.35 2000 15 100 50 MCL2012V2-150-R 15 500 0.40 1800 15 100 50 MCL2012V2-180-R 18 300 0.45 1600 15 100 50 MCL2012V2-220-R 22 300 0.50 1500 15 100 50 MCL2012V2-270-R 27 300 0.55 1400 15 100 50 MCL2012V2-330-R 33 300 0.60 1300 15 100 50 MCL2012V2-390-R 39 300 0.65 1100 15 100 50 MCL2012V2-470-R 47 300 0.70 1000 18 100 50 MCL2012V2-560-R 56 300 0.75 900 18 100 50 MCL2012V2-680-R 68 300 0.80 850 18 100 50 MCL2012V2-820-R 82 300 0.90 800 18 100 50 MCL2012V2-101-R 100 300 0.90 700 18 100 50 MCL2012V2-121-R 120 300 0.95 600 13 100 50 MCL2012V2-151-R 150 300 1.20 550 13 100 50 MCL2012V2-181-R 180 300 1.30 500 13 100 50 MCL2012V2-221-R 220 300 1.50 400 12 100 50 MCL2012V2-271-R 270 300 1.80 350 12 100 50 MCL2012V2-331-R 330 300 2.00 300 12 50 50 MCL2012V2-391-R 390 300 2.00 250 10 50 50 MCL2012V2-471-R 470 300 2.00 200 10 50 50 1. Test frequency and voltage is for OCL and Q at +25 °C 2. Resistance to soldering heat: +260 ±5 °C for 10 ± 1 second 3. At low temperature resistance (-40 ±2°C) the inductance change is within ±10% and the Q within ±20% 4. At high temperature rsistance (+85 ±2°C) the inductance change is within ±10% and the Q within ±20% 5. At high temperature load (+85 ±2°C) the inductance change is within ±10% and the Q within ±20% 2 www.eaton.com/electronics 6. Rated I: When rated I is applied to the product, self-temperature rise will be 40 °C or less. 7. Part Number Definition: MCL2012V2-xxx-R MCL2012 = Product code and size V2= Version indictaor xxx= inductance value in nH, R= decimal point, If no R is present then last character equals number of zeros -R suffix = RoHS compliant Technical Data 10929 MCL2012V2 Multilayer chip inductor Effective June 2019  Dimensions (mm) Schematic Recommended pad layout B L C Part Number L W T a A B C MCL2012V2-xxx-R 2.0 ±0.20 1.2 ±0.20 0.90 ±0.20 0.50 ±0.30 1.6 ±0.10 1.2 ±0.10 04 ±0.10 No part marking All soldering surfaces to be coplanar within 0.1 millimeters Tolerances are ±0.2 millimeters unless stated otherwise Pad layout tolerances are ±0.1 millimeters unless stated otherwise Do not route traces or vias underneath the inductor Packaging information (mm) Drawing not to scale Supplied in tape and reel packaging, 4000 parts per 7” diameter reel W ±0.3 F±0.05 E1±0.10 E2 Min P0±0.10 P1±0.2 P2±0.1 D0+0.10/-0 A0 B0 T Max T1 Max 8.00 3.50 1.75 6.25 4.00 4.00 2.00 1.50 1.5±0.20 2.3±0.20 1.10 na www.eaton.com/electronics 3 MCL2012V2 Multilayer chip inductor  Technical Data 10929 Effective June 2019 Inductance vs frequency 150 Inductance（nH） 125 100 MCL2012V2-101-R MCL2012V2-560-R 75 50 25 0 MCL2012V2-3R0-R 100 1000 10000 Frequency（MHz） Q vs frequency 80 MCL2012V2-3R0-R 70 60 Q 50 40 30 20 MCL2012V2-560-R MCL2012V2-101-R 10 0 100 1000 Frequency（MHz） 4 www.eaton.com/electronics 10000 Technical Data 10929 MCL2012V2 Multilayer chip inductor Effective June 2019  Solder reflow profile TP TC -5 °C tP Max. ramp up rate = 3° C/s Max. ramp down rate = 6 °C/s Temperature TL Preheat A T smax Package Thickness Volume mm3