FP1505R1-R25-R

Technical Data 4365 Effective July 2017 Supersedes April 2009 FP1505 High frequency, high current power inductors Applications • • • • • • • • SMD Device Environmental data • Product features • • • • • • • • 7.0 x 15.0 x 5.0mm surface mount package Ferrite core material High current handling capability, low core loss Designed for high speed, high current switch mode applications Tight DCR tolerance for sensing circuits Inductance range from 100 nH to 400 nH Current range from 24 A to 105 A Frequency range up to 1 MHz Multi-phase regulators Voltage Regulator Module (VRM) Desktop and server VRMs and EVRDs Data networking and storage systems Notebook regulators Graphics cards and battery power systems Point of load modules DCR current sensing • • Storage temperature range (component): -40 °C to +125 °C Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HF FREE HALOGEN  Technical Data 4365 Effective July 2017 Product specifications OCL1 FLL2 ± 10% (nH) 100 120 150 250 300 400 Min. (nH) 72 86 108 180 217 288 Part 7 Number FP1505R1-R10-R FP1505R1-R12-R FP1505R1-R15-R FP1505R1-R25-R FP1505R1-R30-R FP1505R1-R40-R Irms3 Isat14 (A) Isat25 (A) @+25 °C 105 87 72 42 35 24 53 1 Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 1.0 Vrms, 0.0 Adc 2 Full Load Inductance (FLL) Test Parameters: 100 kHz, 1.0 Vrms, Isat1 3 Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 4 Isat1: Peak current for approximately 20% rolloff at +25 °C. DCR (mΩ) (Amps) @+125 °C 90 75 60 32 26 19.5 K-factor6 356.3 356.3 356.3 356.3 356.3 356.3 @+20 °C 0.47 ± 7% 5 Isat2: Peak current for approximately 20% rolloff at +125 °C. 6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ΔI (Peak-to-peak ripple current in amps). 7 Part Number Definition: FP1505Rx-Rxx-R • FP1505 = Product code and size • Rx= DCR indicator • Rxx= Inductance value in uH, R = decimal point • -R suffix = RoHS compliant Dimensions- mm T o p V iew F ro n t V iew S id e V iew R e co m m ended P a d Layout a S ch em atic 1 2 .0 ref 1505Rx R xx w w llyy R 1 5 .0 0 M ax 1 4 .7 ± 0.3 15 1 .9 ref. (2x) 2 .8 ref. 2 .5 0 (2 x) 2 2 4 .5 0 (2 x) b 6 .7 ± 0.3 Part Marking: The nominal DCR is measured between points “a” and “b” 1505Rx Rx = DCR indicator Rxx = Inductance value in μH. (R = Decimal point). wwllyy = Date code R = Revision level Do not route traces or vias underneath the inductor Packaging information - mm 1.5 dia 2.0 4.0 1.75 A 1.5 dia 11.5 15.4 7.4 5.4 S ection A -A Supplied in tape-and-reel packaging, 744 parts per reel, 13” diameter reel. 2 www.eaton.com/electronics 24.0 ± 0.3 1505Rx Rxx wwllyy R 16.0 A User direction of feed FP1505 High frequency, high current power inductor Technical Data 4365 Effective July 2017 Temperature rise vs total loss 50 T e m p e ra tu re R is e (°C ) 45 40 35 30 25 20 15 10 5 0 0 0.4 0.8 1.2 1.6 2 T o ta l L o s s (W ) Core loss vs Bp-p 1 M Hz 10 500 kHz 100 kHz 300 200 kHz kHz C o re L o s s (W ) 1 0.1 0.01 0.001 0.0001 100 1000 10000 Bp - p (G a u s s ) Inductance characteristics % o f O C L v s . % o f Isat1 100% % of O C L 80% -40°C +25°C 60% +125°C 40% 20% 0% 0% 20% 40% 60% 80% 100% 120% 140% % o f I sa t 1 www.eaton.com/electronics 3 FP1505 High frequency, high current power inductor Technical Data 4365 Effective July 2017 Solder Reflow Profile TP TC -5°C Temperature TL 25°C Preheat A T smax Table 1 - Standard SnPb Solder (Tc) tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s t Volume mm3 220°C 220°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin Package Thickness 2.5mm ts Time 25°C to Peak Volume mm3 2000 260°C 245°C 245°C Time Reference JDEC J-STD-020 Profile Feature Preheat and Soak • Temperature min. (Tsmin) • Temperature max. (Tsmax) • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C 150°C 200°C 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4365 BU-SB09350 July 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners.