BZD27C10P MQG

BZD27C6V8P - BZD27C220P Taiwan Semiconductor 1W, 6.8V - 220V Voltage Regulator Diode FEATURES KEY PARAMETERS Silicon zener diodes Low profile surface-mount package Zener and surge current specification Low leakage current Excellent stability Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC Halogen-free according to IEC 61249-2-21 PARAMETER VALUE UNIT VZ 6.8 - 220 V Ptot 1.0 W TJ MAX 175 °C Package Sub SMA Configuration Single die APPLICATIONS Switching mode power supply (SMPS) Adapters Lighting application On-board DC/DC converter MECHANICAL DATA Case: Sub SMA Molding compound meets UL 94 V-0 flammability rating Part no. with suffix "H" means AEC-Q101 qualified Packing code with suffix "G" means green compound (halogen-free) Moisture sensitivity level: level 1, per J-STD-020 Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: As marked Weight: 19mg (approximately) Sub SMA ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL VALUE UNIT Forward voltage @ IF=0.2A VF 1.2 Volts Power dissipation at TL=73°C TA=25°C (Note 1) Ptot Non-repetitive peak pulse power dissipation Non-repetitive peak pulse power dissipation 6V8P to BZD27C100P) Non-repetitive peak pulse power dissipation 110P to BZD27C220P) Operating and storage temperature range Notes: 1. Mounted on Cu-Pad size 5mm x 5mm 2. TJ=25°C prior to surge 1 2.3 1.0 Watts PZSM 300 Watts PRSM 150 Watts PRSM 100 Watts T J ,TSTG -55 to +175 °C Version:Z1706 BZD27C6V8P - BZD27C220P Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL LIMIT UNIT Junction-to-lead thermal resistance R JL 44 °C/W Junction-to-ambient thermal resistance R JA 88 °C/W Junction-to-case thermal resistance R JC 48 °C/W Thermal Performance Note: Units mounted on recommended PCB (5mm x 5mm Cu pad test board) ORDERING INFORMATION PART NO. PARTNO. SUFFIX BZD27CxxP (Note 1) PACKING CODE PACKING CODE SUFFIX RU Sub SMA RV Sub SMA RT Sub SMA MT Sub SMA RQ Sub SMA MQ H PACKAGE Sub SMA G R3 Sub SMA RF Sub SMA R2 Sub SMA M2 Sub SMA RH Sub SMA MH Sub SMA PACKING 1,800 / 7" Plastic reel (8mm tape) 3,000 / 7" Plastic reel (8mm tape) 7,500 / 13" Paper reel (8mm tape) 7,500 / 13" Plastic reel (8mm tape) 10,000 / 13" Paper reel (8mm tape) 10,000 / 13" Plastic reel (8mm tape) 1,800 / 7" Plastic reel (12mm tape) 3,000 / 7" Plastic reel (12mm tape) 7,500 / 13" Paper reel (12mm tape) 7,500 / 13" Plastic reel (12mm tape) 10,000 / 13" Paper reel (12mm tape) 10,000 / 13" Plastic reel (12mm tape) Note : 1. "xx" defines voltage from 6.8V (BZD27C6V8P) to 220V (BZD27C220P) EXAMPLE EXAMPLE P/N PART NO. PART NO. SUFFIX PACKING CODE PACKING CODE SUFFIX DESCRIPTION BZD27C10PHRUG BZD27C10P H RU G AEC-Q101 qualified Green compound 2 Version:Z1706 BZD27C6V8P - BZD27C220P Taiwan Semiconductor ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) Working Voltage (Note 1) Part number Marking code Differential Resistance VZ @ IZT Temperature Coefficient rdif @ IZ Test current ALPHZ @ IZ IZT %/°C mA V Reverse Current@ Reverse Voltage IR VR V Min. Nom. Max. Typ. Max. BZD27C6V8P D7 6.4 6.8 7.2 1 3 0 0.07 100 10 3 BZD27C7V5P D8 7.0 7.45 7.9 1 2 0 0.07 100 50 3 BZD27C8V2P D9 7.7 8.2 8.7 1 2 0.03 0.08 100 10 3 BZD27C9V1P E0 8.5 9.05 9.6 2 4 0.03 0.08 50 10 5 BZD27C10P E1 9.4 10 10.6 2 4 0.05 0.09 50 7 7.5 BZD27C11P E2 10.4 11 11.6 4 7 0.05 0.10 50 4 8.2 BZD27C12P E3 11.4 12.05 12.7 4 7 0.05 0.10 50 3 9.1 BZD27C13P E4 12.4 13.25 14.1 5 10 0.05 0.10 50 2 10 BZD27C15P E5 13.8 14.7 15.6 5 10 0.05 0.10 25 1 11 BZD27C16P E6 15.3 16.2 17.1 6 15 0.06 0.11 25 1 12 BZD27C18P E7 16.8 17.95 19.1 6 15 0.06 0.11 25 1 13 BZD27C20P E8 18.8 20 21.2 6 15 0.06 0.11 25 1 15 BZD27C22P E9 20.8 22.05 23.3 6 15 0.06 0.11 25 1 16 BZD27C24P F0 22.8 24.2 25.6 7 15 0.06 0.11 25 1 18 BZD27C27P F1 25.1 27 28.9 7 15 0.06 0.11 25 1 20 BZD27C30P F2 28 30 32 8 15 0.06 0.11 25 1 22 BZD27C33P F3 31 33 35 8 15 0.06 0.11 25 1 24 BZD27C36P F4 34 36 38 21 40 0.06 0.11 10 1 27 BZD27C39P F5 37 39 41 21 40 0.06 0.11 10 1 30 BZD27C43P F6 40 43 46 24 45 0.07 0.12 10 1 33 BZD27C47P F7 44 47 50 24 45 0.07 0.12 10 1 36 BZD27C51P F8 48 51 54 25 60 0.07 0.12 10 1 39 BZD27C56P F9 52 56 60 25 60 0.07 0.12 10 1 43 BZD27C62P G0 58 62 66 25 80 0.08 0.13 10 1 47 BZD27C68P G1 64 68 72 25 80 0.08 0.13 10 1 51 BZD27C75P G2 70 74.5 79 30 100 0.08 0.13 10 1 56 BZD27C82P G3 77 82 87 60 200 0.08 0.13 10 1 62 Max. Max. Max. BZD27C91P G4 85 90.5 96 60 200 0.08 0.13 5 1 68 BZD27C100P G5 94 100 106 60 200 0.09 0.13 5 1 75 BZD27C110P G6 104 110 116 80 250 0.09 0.13 5 1 82 BZD27C120P G7 114 120.5 127 150 300 0.09 0.13 5 1 91 BZD27C130P G 124 132.5 141 150 300 0.09 0.13 5 1 100 BZD27C150P G9 138 147 156 150 300 0.09 0.13 5 1 110 BZD27C160P H0 153 162 171 150 350 0.09 0.13 5 1 120 BZD27C180P H1 168 179.5 191 280 450 0.09 0.13 5 1 130 BZD27C200P H2 188 200 212 350 750 0.09 0.13 5 1 150 BZD27C220P H3 208 220.5 233 430 900 0.09 0.13 5 1 160 Note 1: Pulse test: tp 5ms. 3 Version:Z1706 BZD27C6V8P - BZD27C220P Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 TYPICAL FORWARD CHARACTERISTICS Fig.2 TYP. DIODE CAPACITANCE vs REVERSE VOLTAGE 10000 10 C6V8P 1000 TYP. VF C12P MAX. VF 1 100 C27P C200P 10 0.1 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 0.0 1.6 FORWARD VOLTAGE (V) 0.5 1.0 1.5 2.0 2.5 3.0 REVERSE VOLTAGE Fig.3 POWER DISSIPATION v.s TEMPERATURE 3 2.5 RthjL=44 C/W 2 1.5 RthjA=88 C/W 1 Heat sink 5mm x 5mm Cu pad test board 0.5 0 25 50 75 100 125 150 175 TEMPERATURE ( C) 4 Version:Z1706 BZD27C6V8P - BZD27C220P Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS Sub SMA DIM. Unit (mm) Unit (inch) Min Max Min Max B 1.70 1.90 0.067 0.075 C 2.70 2.90 0.106 0.114 D 0.16 0.30 0.006 0.012 E 1.23 1.43 0.048 0.056 F 0.80 1.20 0.031 0.047 G 3.40 3.80 0.134 0.150 H 2.45 2.60 0.096 0.102 I 0.35 0.85 0.014 0.033 J 0.00 0.10 0.000 0.004 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 1.4 0.055 B 1.2 0.047 C 3.1 0.122 D 1.9 0.075 E 4.3 0.169 MARKING DIAGRAM P/N = Marking Code G = Green compound Code YW = Date Code F = Factory Code 5 Version:Z1706 BZD27C6V8P - BZD27C220P Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 6 Version:Z1706