AO3400-5.8A

PART CODE: SOT233400SA09T SPECIFICATION SHEET SPECIFICATION SHEET NO. N0909- SOT233400SA09T DATE Sept. 09, 2021 REVISION A1 DESCRIPITION SMD Plastic-Encapsulate MOSFETS, SOT-23 series, 3 pads AO3400 Type, 30V N-Channel enhancement Mode Field effect Transistor Continuous Drain Current: 5.8A, Maximum Power Dissipation: 1.5W Operating Temp. Range -50°C ~+150°C, Package in Tape/Reel, 3000pcs/Reel RoHS/RoHS III compliant CUSTOMER CUSTOMER PART NUMBER CROSS REF. PART NUMBER ORIGINAL PART NUMBER MDD AO3400 PART CODE SOT233400SA09T VENDOR APPROVE Issued/Checked/Approved DATE: Sept. 09, 2021 CUSTOMER APPROVE DATE: 1 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: SOT233400SA09T SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES MAIN FEATURE • High dense cell design for extremely low RDS(ON) • Exceptional on-resistance and maximum DC current capability APPLICATION • Load Switch for Portable Devices • DC/DC Converter RFQ PART CODE GUIDE Request For Quotation SOT23 3400 S A09T 1 2 3 4 1) SOT23: SMD Plastic-Encapsulate MOSFETS, SOT-23 series, 3 pads 2) 3400: Type code for Original part number AO3400 3) S: Package code, Package in Tape/Reel, 3000pcs/Reel 4) A09T: Marking code for “A09T” on the case surface, Different Marking for different specification. 2 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: SOT233400SA09T SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES DIMENSION (Unit: Inch/mm) Image for reference Marking: A09T Symbol Value ( mm) Min. A Typ. 1.0 1.4 A1 SOT-23 0.10 b 0.35 0.50 c 0.10 0.20 D 2.70 E 1.40 1.60 E1 2.40 2.80 e Recommend Pad Layout (Tol.: +/-0.05mm) 2.90 3.10 1.9 L 0.10 L1 0.40 Ɵ 0° 0.30 10° Equivalent Circuit Diagram 1. Gate 2. Source 3. Drain NextGen Components, Inc. Max. sales@NextGenComponent.com 3 www.NextGenComponent.com PART CODE: SOT233400SA09T SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES 30V N-CHANNEL MODE MOSFET V (BR)DSS 30V R DS(on) Typical I D MAX 27mΩ@4.5V 5.8A 29mΩ@3.3V 5.8A MECHANICAL DATA V(BR)DSS Terminals Polarity Mounting Position Weight per piece JEDEC SOT-23 molded plastic body Matte tin plated Polarity symbol marking on case Any 0.00019 Ounce, 0.00591 grams MAX. RATINGS & THERMAL CHARACTERISTICS AT Ta=25 °C (unless otherwise specified) Parameter SYMBOLS VALUE UNITS LIMIT Drain-Source Breakdown Voltage Gate-Source Voltage Continuous Drain Current V (BR)DSS 30 V V GS +/-12 V ID 5.8 A 4.6 Power Dissipation PD 1.5 W 0.9 Pulsed Drain Current Note 1 I DM 23 A TJ +150 °C Storage Temperature Range T STG -50 ~ +150 °C Thermal Resistance Junction-Ambient R ƟJA 100 °C/W Operating Junction Temperature Notes 1) Repeat rating : Pulse width limited by junction temperature. 2) Surface Mounted on FR4 Board, t ≤5 sec. 4 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com SOT233400SA09T PART CODE: SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES MOSFET ELECTRICAL CHARACTERISTICS AT Ta=25 °C (unless otherwise specified) Parameter SYMBOLS VALUE Min. Drain-source Breakdown Voltage V (BR) DSS Zero Gate Voltage Drain Current I DSS) Typ. UNIT Condition V V GS=0V I D= -250μA µA VDS=-24V, VGS=0V Max. 30 1 100 Gate-source Leakage Current I GSS Gate threshold voltage V GS(th) Drain-source on-resistance (note 1) R DS (on) Forward transconductance g FS 0.5 VDS=-24V, VGS=0V +/-100 nA VGS=+/-12V, VDS=0V 0.8 1.2 V VGS= 5V, ID=250µA 27 32 mΩ V GS=4.5V, ID= 5.8A 29 45 V GS=3.3V, ID=4.0A 35 50 V GS=2.5V, ID=2.0A 8 S V DS=5V, ID=5A UNIT Condition pF V DS= 15V V GS=0V f =1MHz nC V DS= 15V I D=5A V GS =4.5V DYNAMIC ELECTRICAL CHARACTERISTICS (See Note 2) Parameter SYMBOLS VALUE Min. Typ. Input Capacitance C iss 635 Output Capacitance C oss 135 Reverse Transfer Capacitance C rss 40 Total Gate Charge Qg 10.5 Gate Source Charge Qg 1.6 Gate Drain Charge Qg 2.7 Max. Note: 1) Pulse test: pulse width ≤ 300µs, duty cycle≤ 2% 2) Guaranteed by design, not subject to production testing. 5 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: SOT233400SA09T SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES SWITCHING CHARACTERISTIS (SEE NOTE 2) Parameter SYMBOLS VALUE Min. Turn on Delay Time Turn on Rise Time Turn Off Delay Time Turn Off Fall Time Typ. t d(on) 7.5 tr 18 t d (off) 36 tf 5 UNIT Condition ns V DD=-15V I D=5.0A R G = 3.3 Ω V GS =4.5V UNIT Condition 1.5 A T C= 25 °C 1.2 V I S= 3A V GS =0V Max. SOURCE DRAIN DIODE CHERACTERISTIC Parameter SYMBOLS VALUE Min. Source drain current(Body Diode) I SD Diode forward voltage (See note 1) V SD Typ. 0.82 Max. Note: 1) Pulse test: pulse width ≤ 300µs, duty cycle≤ 2% 2) Guaranteed by design, not subject to production testing. 6 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: SOT233400SA09T SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES RELIABILITY Number Experiment Items Experiment Method And Conditions Reference Documents 1 Solder Resistance Test Test 260°C± 5°C for 10 ± 2 sec. Immerse body into solder 1/16” ± 1/32" MIL-STD-750D METHOD-2031.2 2 Solderability Test 230°C ±5°C for 5 sec. MIL-STD-750D METHOD-2026.1 0 3 Pull Test 1 kg in axial lead direction for 10 sec. MIL-STD-750D METHOD-2036.4 4 Bend Test 0.5Kg Weight Applied To Each Lead, Bending Arcs 90 °C ± 5 °C For 3 Times MIL-STD-750D METHOD-2036.4 5 High Temperature Reverse Bias Test TA=100°C for 1000 Hours at VR=80% Rated VR MIL-STD-750D METHOD-1038.4 6 Forward Operation Life Test TA=25°C Rated Average Rectified Current MIL-STD-750D METHOD-1027.3 7 Intermittent Operation Life Test On state: 5 min with rated IRMS Power Off state: 5 min with Cool Forced Air. On and off for 1000 cycles. MIL-STD-750D METHOD-1036.3 8 Pressure Cooker Test 15 PSIG, TA=121°C, 4 hours MIL-S-19500 APPENOIXC 9 Temperature Cycling Test -55°C~+125°C; 30 Minutes For Dwelled Time 5 minutes for transferred time. Total: 10 cycles. MIL-STD-750D METHOD-1051.7 10 Thermal Shock Test 0°C for 5 minutes., 100°C for 5minutes, Total: 10 cycles MIL-STD-750D METHOD-1056.7 11 Forward Surge Test 8.3ms Single Sale Sine-wave One Surge. MIL-STD-750D METHOD-4066.4 12 Humidity Test TA=65°C, RH=98% for 1000 hours. MIL-STD-750D METHOD-1021.3 13 High Temperature Storage life Test 150°C for 1000 Hours MIL-STD-750D METHOD-1031.5 7 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: SOT233400SA09T SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES SUGGESTED REFLOW PROFILE (For Reference Only) • Recommended peak temperature is over 245℃, If peak temperature is below 245 ℃, you may adjust the following parameters; time length of peak temperature (longer), time length of soldering (longer), thickness of solder paste (thicker) • Welding shall not exceed 2 times • Remark: lead free solder paste (96.5 sn/3.0 Ag/0.5Cu) 8 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: SOT233400SA09T SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES RATINGS AND CHARACTERISTIC CURVES (For Reference Only) 9 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: SOT233400SA09T SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES RATINGS AND CHARACTERISTIC CURVES (For Reference Only) 10 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: SOT233400SA09T SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES RATINGS AND CHARACTERISTIC CURVES (For Reference Only) 11 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: SOT233400SA09T SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES TAPE/REEL (Unit: mm) All Devices are packed in accordance with EIA standard RS-481-A and specifications. Item Symbol Tolerance SOT-23 Carrier width A 0.1 3.15 Carrier Length B 0.1 2.77 Carrier Depth C 0.1 1.22 Sprocket hole d 0.05 1.55 7”Reel outside diameter D 2.0 178.00 7”Reel inner diameter D1 Min. 54.4 Feed hole diameter D2 0.5 13.00 Sprocket hole position E 0.1 1.75 Punch hole position F 0.1 3.50 Punch hole pitch P 0.1 4.00 Sprocket hole pitch P0 0.1 4.00 Embossment center P1 0.1 2.00 Overall tape thickness T 0.1 0.25 Tape width W 0.3 8.00 Reel width W1 1.0 19.50 12 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: SOT233400SA09T SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES PACKAGE Case Code Reel Size MPQ (pcs) SOT-23 7” 3,000 Component Spacing (mm) Qty. Per Box (pcs) Inner Box L*W*H (mm) Reel Size (mm) Carton size L*W*H (mm) Qty. Per Carton (pcs) G. W 45,000 212*207*207 178 430*430*230 180,000 6.5 (kg) DISCLAIMER NextGen Component, Inc. reserves the right to make changes to the product(s) and or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information 13 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com