HS1A – HS1M
Taiwan Semiconductor
1A, 50V - 1000V High Efficient Surface Mount Rectifier
FEATURES
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KEY PARAMETERS
Glass passivated chip junction
Ideal for automated placement
Fast switching for high efficiency
Moisture sensitivity level: level 1, per J-STD-020
RoHS Compliant
Halogen-free according to IEC 61249-2-21
APPLICATIONS
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DC to DC converter
Switching mode converters and inverters
Lighting application
Snubber
Freewheeling application
PARAMETER
VALUE
UNIT
IF
1
A
VRRM
50 - 1000
V
IFSM
30
A
TJ MAX
150
°C
Package
DO-214AC (SMA)
Configuration
Single die
MECHANICAL DATA
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Case: DO-214AC (SMA)
Molding compound meets UL 94V-0 flammability rating
Terminal: Matte tin plated leads, solderable per J-STD-002
Meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 0.060g (approximately)
DO-214AC (SMA)
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
Marking code on the device
Repetitive peak reverse
voltage
Reverse voltage, total rms
value
Forward current
Peak forward surge current,
8.3ms single half sine-wave
superimposed on rated load
Junction temperature
Storage temperature
SYMBOL HS1A HS1B HS1D HS1F HS1G HS1J HS1K HS1M UNIT
HS1A HS1B HS1D HS1F HS1G HS1J HS1K HS1M
VRRM
50
100
200
300
400
600
800
1000
V
VR(RMS)
35
70
140
210
280
420
560
700
V
IF
1
A
IFSM
30
A
TJ
- 55 to +150
°C
TSTG
- 55 to +150
°C
1
Version: L2102
HS1A – HS1M
Taiwan Semiconductor
THERMAL PERFORMANCE
PARAMETER
SYMBOL
TYP
UNIT
RӨJA
70
°C/W
Junction-to-ambient thermal resistance
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)
PARAMETER
Forward voltage
CONDITIONS
HS1A
HS1B
HS1D
HS1F
HS1G
HS1J
HS1K
HS1M
(1)
IF = 1A, TJ = 25°C
SYMBOL
VF
TJ = 25°C
Reverse current @ rated VR
(2)
TJ = 100°C
IR
TJ = 125°C
Junction capacitance
Reverse recovery time
HS1A
HS1B
HS1D
HS1F
HS1G
HS1J
HS1K
HS1M
HS1A
HS1B
HS1D
HS1F
HS1G
HS1J
HS1K
HS1M
1MHz, VR = 4.0V
IF = 0.5A, IR = 1.0A,
Irr = 0.25A
TYP
MAX
UNIT
-
1.0
V
-
1.3
V
-
1.7
V
-
5
µA
-
50
µA
-
150
µA
20
-
pF
15
-
pF
-
50
ns
-
75
ns
CJ
trr
Notes:
1. Pulse test with PW = 0.3ms
2. Pulse test with PW = 30ms
ORDERING INFORMATION
ORDERING CODE(1)
PACKAGE
PACKING
HS1x
DO-214AC (SMA)
7,500 / Tape & Reel
Notes:
1. “x” defines voltage from 50V(HS1A) to 1000V(HS1M)
2
Version: L2102
HS1A – HS1M
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.1 Forward Current Derating Curve
Fig.2 Typical Junction Capacitance
50
40
CAPACITANCE (pF)
1
30
HS1A - HS1G
20
HS1J - HS1M
10
f=1.0MHz
Vsig=50mVp-p
0
0
25
50
75
100
125
0.1
150
1
LEAD TEMPERATURE (°C)
INSTANTANEOUS FORWARD CURRENT (A)
100
TJ=125°C
10
TJ=25°C
1
30
40
50
60
70
80
90
100
10 10
UF1DLW
HS1A
- HS1D
1
TJ=125°C
TJ=25°C
HS1G
1
0.1
HS1J - HS1M
0.01
0.1
0.001
0.6
0.3
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Pulse width 300μs
1% duty cycle
Pulse width
0.8
0.4
0.5
1.0
0.6
1.2
0.7
0.8
1.4
0.9
1.6
1
1.1
FORWARD VOLTAGE (V)
Fig.5 Maximum Non-Repetitive Forward Surge Current
40
PEAK FORWARD SURGE CURRENT (A)
INSTANTANEOUS REVERSE CURRENT (μA)
Fig.4 Typical Forward Characteristics
1000
20
100
REVERSE VOLTAGE (V)
Fig.3 Typical Reverse Characteristics
10
10
(A)
AVERAGE FORWARD CURRENT (A)
2
8.3ms single half sine wave
30
20
10
0
1
10
100
NUMBER OF CYCLES AT 60 Hz
3
Version: L2102
1.2
HS1A – HS1M
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.6 Reverse Recovery Time Characteristic and Test Circuit Diagram
4
Version: L2102
HS1A – HS1M
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DO-214AC (SMA)
SUGGESTED PAD LAYOUT
MARKING DIAGRAM
5
P/N
= Marking Code
G
= Green Compound
YW
= Date Code
F
= Factory Code
Version: L2102
HS1A – HS1M
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability
for application assistance or the design of Purchasers’ products.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
6
Version: L2102
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