SSB44
Taiwan Semiconductor
4A, 40V Schottky Barrier Surface Mount Rectifier
FEATURES
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KEY PARAMETERS
Low power loss, high efficiency
Low profile package
Ideal for automated placement
High surge current capability
Moisture sensitivity level: level 1, per J-STD-020
RoHS Compliant
Halogen-free according to IEC 61249-2-21
APPLICATIONS
PARAMETER
VALUE
UNIT
IF
4
A
VRRM
40
V
IFSM
100
A
TJ MAX
150
°C
Package
DO-214AA (SMB)
Configuration
Single die
● Freewheeling
● Low voltage high frequency inverters
● On-board DC/DC converter
MECHANICAL DATA
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Case: DO-214AA (SMB)
Molding compound meets UL 94V-0 flammability rating
Terminal: Matte tin plated leads, solderable per J-STD-002
Meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 0.110g (approximately)
DO-214AA(SMB)
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
SYMBOL
Marking code on the device
SSB44
UNIT
SSB44
Repetitive peak reverse voltage
VRRM
40
V
Reverse voltage, total rms value
VR(RMS)
28
V
Forward current
Surge peak forward current, 8.3ms single half sine-wave
superimposed on rated load
Junction temperature
IF
4
A
IFSM
100
A
TJ
-55 to +150
°C
Storage temperature
TSTG
-55 to +150
°C
1
Version: B2102
SSB44
Taiwan Semiconductor
THERMAL PERFORMANCE
PARAMETER
SYMBOL
TYP
UNIT
Junction-to-lead thermal resistance
RӨJL
23
°C/W
Junction-to-ambient thermal resistance
RӨJA
82
°C/W
Junction-to-case thermal resistance
RӨJC
24
°C/W
Thermal Performance Note: Units mounted on PCB (10mm x 10mm Cu pad test board)
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)
PARAMETER
CONDITIONS
SYMBOL
IF = 2A, TJ = 25°C
Forward voltage
IF = 4A, TJ = 25°C
(1)
IF = 2A, TJ = 125°C
VF
IF = 4A, TJ = 125°C
Reverse current @ rated VR
(2)
Junction capacitance
Notes:
1. Pulse test with PW = 0.3ms
2. Pulse test with PW = 30ms
TJ = 25°C
IR
TJ = 125°C
1MHz, VR = 4.0V
CJ
TYP
MAX
UNIT
0.40
-
V
0.46
0.50
V
0.31
-
V
0.41
0.45
V
-
200
µA
-
40
mA
235
-
pF
ORDERING INFORMATION
ORDERING CODE
PACKAGE
PACKING
SSB44
DO-214AA (SMB)
3,000 / Tape & Reel
2
Version: B2102
SSB44
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.1 Forward Current Derating Curve
Fig.2 Typical Junction Capacitance
1000
4
CAPACITANCE (pF)
3
2
1
0
f=1.0MHz
Vsig=50mVp-p
10
25
50
75
100
125
150
1
100
REVERSE VOLTAGE (V)
Fig.3 Typical Reverse Characteristics
Fig.4 Typical Forward Characteristics
100
TJ=125°C
10
1
0.1
TJ=25°C
0.01
0.001
10
10
LEAD TEMPERATURE (°C)
INSTANTANEOUS FORWARD CURRENT (A)
INSTANTANEOUS REVERSE CURRENT (mA)
100
20
30
40
50
60
70
80
90
10
10
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
TJ=125°C
TJ=125°C
TJ=25°C
1 0.1
TJ=25°C
0.01
0.001
0.3
0.1
0.1
100
UF1DLW
1
(A)
AVERAGE FORWARD CURRENT (A)
5
0.4
0.2
0.5
0.3
0.6
0.7
0.4
Pulse width
Pulse width 300μs
1% duty cycle
0.8
0.9
1
1.1
0.5
0.6
0.7
FORWARD VOLTAGE (V)
3
Version: B2102
1.2
SSB44
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DO-214AA (SMB)
SUGGESTED PAD LAYOUT
MARKING DIAGRAM
4
P/N
= Marking Code
G
= Green Compound
YW
= Date Code
F
= Factory Code
Version: B2102
SSB44
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability
for application assistance or the design of Purchasers’ products.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
5
Version: B2102
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