BZD27C6V8P - BZD27C220P
Taiwan Semiconductor
1W, 6.8V - 220V Voltage Regulator Diode
FEATURES
KEY PARAMETERS
Silicon zener diodes
Low profile surface-mount package
Zener and surge current specification
Low leakage current
Excellent stability
Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
Halogen-free according to IEC 61249-2-21
PARAMETER
VALUE
UNIT
VZ
6.8 - 220
V
Ptot
1.0
W
TJ MAX
175
°C
Package
Sub SMA
Configuration
Single die
APPLICATIONS
Switching mode power supply (SMPS)
Adapters
Lighting application
On-board DC/DC converter
MECHANICAL DATA
Case: Sub SMA
Molding compound meets UL 94 V-0 flammability rating
Part no. with suffix "H" means AEC-Q101 qualified
Packing code with suffix "G" means green compound
(halogen-free)
Moisture sensitivity level: level 1, per J-STD-020
Terminal: Matte tin plated leads, solderable per J-STD-002
Meet JESD 201 class 2 whisker test
Polarity: As marked
Weight: 19mg (approximately)
Sub SMA
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
SYMBOL
VALUE
UNIT
Forward voltage @ IF=0.2A
VF
1.2
Volts
Power dissipation at TL=73°C
TA=25°C (Note 1)
Ptot
Non-repetitive peak pulse power dissipation
Non-repetitive peak pulse power dissipation
6V8P to BZD27C100P)
Non-repetitive peak pulse power dissipation
110P to BZD27C220P)
Operating and storage temperature range
Notes:
1. Mounted on Cu-Pad size 5mm x 5mm
2. TJ=25°C prior to surge
1
2.3
1.0
Watts
PZSM
300
Watts
PRSM
150
Watts
PRSM
100
Watts
T J ,TSTG
-55 to +175
°C
Version:Z1706
BZD27C6V8P - BZD27C220P
Taiwan Semiconductor
THERMAL PERFORMANCE
PARAMETER
SYMBOL
LIMIT
UNIT
Junction-to-lead thermal resistance
R
JL
44
°C/W
Junction-to-ambient thermal resistance
R
JA
88
°C/W
Junction-to-case thermal resistance
R
JC
48
°C/W
Thermal Performance Note: Units mounted on recommended PCB (5mm x 5mm Cu pad test board)
ORDERING INFORMATION
PART NO.
PARTNO.
SUFFIX
BZD27CxxP
(Note 1)
PACKING
CODE
PACKING CODE
SUFFIX
RU
Sub SMA
RV
Sub SMA
RT
Sub SMA
MT
Sub SMA
RQ
Sub SMA
MQ
H
PACKAGE
Sub SMA
G
R3
Sub SMA
RF
Sub SMA
R2
Sub SMA
M2
Sub SMA
RH
Sub SMA
MH
Sub SMA
PACKING
1,800 / 7" Plastic reel
(8mm tape)
3,000 / 7" Plastic reel
(8mm tape)
7,500 / 13" Paper reel
(8mm tape)
7,500 / 13" Plastic reel
(8mm tape)
10,000 / 13" Paper reel
(8mm tape)
10,000 / 13" Plastic reel
(8mm tape)
1,800 / 7" Plastic reel
(12mm tape)
3,000 / 7" Plastic reel
(12mm tape)
7,500 / 13" Paper reel
(12mm tape)
7,500 / 13" Plastic reel
(12mm tape)
10,000 / 13" Paper reel
(12mm tape)
10,000 / 13" Plastic reel
(12mm tape)
Note :
1. "xx" defines voltage from 6.8V (BZD27C6V8P) to 220V (BZD27C220P)
EXAMPLE
EXAMPLE P/N
PART NO.
PART NO.
SUFFIX
PACKING
CODE
PACKING CODE
SUFFIX
DESCRIPTION
BZD27C10PHRUG
BZD27C10P
H
RU
G
AEC-Q101 qualified
Green compound
2
Version:Z1706
BZD27C6V8P - BZD27C220P
Taiwan Semiconductor
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)
Working Voltage
(Note 1)
Part number
Marking
code
Differential
Resistance
VZ @ IZT
Temperature
Coefficient
rdif @ IZ
Test
current
ALPHZ @ IZ
IZT
%/°C
mA
V
Reverse Current@
Reverse Voltage
IR
VR
V
Min.
Nom.
Max.
Typ.
Max.
BZD27C6V8P
D7
6.4
6.8
7.2
1
3
0
0.07
100
10
3
BZD27C7V5P
D8
7.0
7.45
7.9
1
2
0
0.07
100
50
3
BZD27C8V2P
D9
7.7
8.2
8.7
1
2
0.03
0.08
100
10
3
BZD27C9V1P
E0
8.5
9.05
9.6
2
4
0.03
0.08
50
10
5
BZD27C10P
E1
9.4
10
10.6
2
4
0.05
0.09
50
7
7.5
BZD27C11P
E2
10.4
11
11.6
4
7
0.05
0.10
50
4
8.2
BZD27C12P
E3
11.4
12.05
12.7
4
7
0.05
0.10
50
3
9.1
BZD27C13P
E4
12.4
13.25
14.1
5
10
0.05
0.10
50
2
10
BZD27C15P
E5
13.8
14.7
15.6
5
10
0.05
0.10
25
1
11
BZD27C16P
E6
15.3
16.2
17.1
6
15
0.06
0.11
25
1
12
BZD27C18P
E7
16.8
17.95
19.1
6
15
0.06
0.11
25
1
13
BZD27C20P
E8
18.8
20
21.2
6
15
0.06
0.11
25
1
15
BZD27C22P
E9
20.8
22.05
23.3
6
15
0.06
0.11
25
1
16
BZD27C24P
F0
22.8
24.2
25.6
7
15
0.06
0.11
25
1
18
BZD27C27P
F1
25.1
27
28.9
7
15
0.06
0.11
25
1
20
BZD27C30P
F2
28
30
32
8
15
0.06
0.11
25
1
22
BZD27C33P
F3
31
33
35
8
15
0.06
0.11
25
1
24
BZD27C36P
F4
34
36
38
21
40
0.06
0.11
10
1
27
BZD27C39P
F5
37
39
41
21
40
0.06
0.11
10
1
30
BZD27C43P
F6
40
43
46
24
45
0.07
0.12
10
1
33
BZD27C47P
F7
44
47
50
24
45
0.07
0.12
10
1
36
BZD27C51P
F8
48
51
54
25
60
0.07
0.12
10
1
39
BZD27C56P
F9
52
56
60
25
60
0.07
0.12
10
1
43
BZD27C62P
G0
58
62
66
25
80
0.08
0.13
10
1
47
BZD27C68P
G1
64
68
72
25
80
0.08
0.13
10
1
51
BZD27C75P
G2
70
74.5
79
30
100
0.08
0.13
10
1
56
BZD27C82P
G3
77
82
87
60
200
0.08
0.13
10
1
62
Max.
Max.
Max.
BZD27C91P
G4
85
90.5
96
60
200
0.08
0.13
5
1
68
BZD27C100P
G5
94
100
106
60
200
0.09
0.13
5
1
75
BZD27C110P
G6
104
110
116
80
250
0.09
0.13
5
1
82
BZD27C120P
G7
114
120.5
127
150
300
0.09
0.13
5
1
91
BZD27C130P
G
124
132.5
141
150
300
0.09
0.13
5
1
100
BZD27C150P
G9
138
147
156
150
300
0.09
0.13
5
1
110
BZD27C160P
H0
153
162
171
150
350
0.09
0.13
5
1
120
BZD27C180P
H1
168
179.5
191
280
450
0.09
0.13
5
1
130
BZD27C200P
H2
188
200
212
350
750
0.09
0.13
5
1
150
BZD27C220P
H3
208
220.5
233
430
900
0.09
0.13
5
1
160
Note 1: Pulse test: tp
5ms.
3
Version:Z1706
BZD27C6V8P - BZD27C220P
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.1 TYPICAL FORWARD CHARACTERISTICS
Fig.2 TYP. DIODE CAPACITANCE vs REVERSE
VOLTAGE
10000
10
C6V8P
1000
TYP. VF
C12P
MAX. VF
1
100
C27P
C200P
10
0.1
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
0.0
1.6
FORWARD VOLTAGE (V)
0.5
1.0
1.5
2.0
2.5
3.0
REVERSE VOLTAGE
Fig.3 POWER DISSIPATION v.s TEMPERATURE
3
2.5
RthjL=44 C/W
2
1.5
RthjA=88 C/W
1
Heat sink
5mm x 5mm
Cu pad test board
0.5
0
25
50
75
100
125
150
175
TEMPERATURE ( C)
4
Version:Z1706
BZD27C6V8P - BZD27C220P
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
Sub SMA
DIM.
Unit (mm)
Unit (inch)
Min
Max
Min
Max
B
1.70
1.90
0.067
0.075
C
2.70
2.90
0.106
0.114
D
0.16
0.30
0.006
0.012
E
1.23
1.43
0.048
0.056
F
0.80
1.20
0.031
0.047
G
3.40
3.80
0.134
0.150
H
2.45
2.60
0.096
0.102
I
0.35
0.85
0.014
0.033
J
0.00
0.10
0.000
0.004
SUGGESTED PAD LAYOUT
Symbol
Unit (mm)
Unit (inch)
A
1.4
0.055
B
1.2
0.047
C
3.1
0.122
D
1.9
0.075
E
4.3
0.169
MARKING DIAGRAM
P/N
= Marking Code
G
= Green compound Code
YW
= Date Code
F
= Factory Code
5
Version:Z1706
BZD27C6V8P - BZD27C220P
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
6
Version:Z1706
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