ES3AB – ES3JB
Taiwan Semiconductor
3A, 50V - 600V Super Fast Surface Mount Rectifier
FEATURES
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KEY PARAMETERS
Glass passivated chip junction
Ideal for automated placement
Low profile package
Super fast recovery time for high efficiency
Moisture sensitivity level: level 1,per J-STD-020
RoHS Compliant
Halogen-free according to IEC 61249-2-21
APPLICATIONS
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PARAMETER
VALUE
UNIT
IF
3
A
VRRM
50 - 600
V
IFSM
100
A
TJ MAX
150
°C
Package
DO-214AA (SMB)
Configuration
Single die
Switching mode power supply (SMPS)
Adapters
Lighting application
Converter
MECHANICAL DATA
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Case: DO-214AA (SMB)
Molding compound meets UL 94V-0 flammability rating
Terminal: Matte tin plated leads, solderable per J-STD-002
Meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 0.110g (approximately)
DO-214AA (SMB)
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
SYMBOL
Marking code on the device
ES
ES
ES
ES
ES
ES
ES
ES
3AB 3BB 3CB 3DB 3FB 3GB 3HB 3JB
ES
ES
ES
ES
ES
ES
ES
ES
3AB
3BB
3CB
3DB
3FB
3GB
3HB
3JB
UNIT
Repetitive peak reverse voltage
VRRM
50
100
150
200
300
400
500
600
V
Reverse voltage, total rms value
VR(RMS)
35
70
105
140
210
280
350
420
V
Forward current
Surge peak forward current, 8.3ms
single half sine-wave superimposed
on rated load
Junction temperature
IF
3
A
IFSM
100
A
TJ
- 55 to +150
°C
Storage temperature
TSTG
- 55 to +150
°C
1
Version: C2102
ES3AB – ES3JB
Taiwan Semiconductor
THERMAL PERFORMANCE
PARAMETER
SYMBOL
TYP
UNIT
Junction-to-lead thermal resistance
RӨJL
24
°C/W
Junction-to-ambient thermal resistance
RӨJA
84
°C/W
Junction-to-case thermal resistance
RӨJC
26
Thermal Performance Note: Units mounted on PCB (10mm x 10mm Cu pad test board)
°C/W
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)
PARAMETER
Forward voltage
CONDITIONS
ES3AB
ES3BB
ES3CB
ES3DB
ES3FB
ES3GB
ES3HB
ES3JB
ES3AB
ES3BB
ES3CB
ES3DB
ES3FB
ES3GB
ES3HB
ES3JB
ES3AB
ES3BB
ES3CB
ES3DB
ES3FB
ES3GB
ES3HB
ES3JB
ES3AB
ES3BB
ES3CB
ES3DB
ES3FB
ES3GB
ES3HB
ES3JB
(1)
Reverse current @ rated VR
Reverse recovery time
IF = 3.0A, TJ = 25°C
IF = 1.5A, TJ = 125°C
IF = 3.0A,TJ = 125°C
TJ = 25°C
(2)
Junction capacitance
IF = 1.5A, TJ = 25°C
1MHz, VR = 4.0V
IF = 0.5A , IR = 1.0A
Irr = 0.25A
TYP
MAX
UNIT
0.80
0.92
V
0.90
1.04
V
1.11
1.30
V
0.86
1.00
V
0.98
1.13
V
1.24
1.45
V
0.66
0.75
V
0.73
0.85
V
0.85
0.98
V
0.73
0.84
V
0.83
0.95
V
0.99
1.13
V
-
10
µA
-
100
µA
46
-
pF
41
-
pF
34
-
pF
-
35
ns
VF
VF
VF
VF
IR
TJ = 125°C
ES3AB
ES3BB
ES3CB
ES3DB
ES3FB
ES3GB
ES3HB
ES3JB
SYMBOL
CJ
trr
Notes:
1. Pulse test with PW = 0.3ms
2. Pulse test with PW = 30ms
2
Version: C2102
ES3AB – ES3JB
Taiwan Semiconductor
ORDERING INFORMATION
ORDERING CODE(1)
PACKAGE
PACKING
ES3xB
DO-214AA (SMB)
3,000 / Tape & Reel
Notes:
1. "x" defines voltage from 50V(ES3AB) to 600V(ES3JB)
3
Version: C2102
ES3AB – ES3JB
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.1 Forward Current Derating Curve
Fig.2 Typical Junction Capacitance
1000
ES3AB - ES3DB
3
CAPACITANCE (pF)
2
1
100
10
f=1.0MHz
Vsig=50mVp-p
0
1
25
50
75
100
125
150
1
10
LEAD TEMPERATURE (°C)
REVERSE VOLTAGE (V)
Fig.4 Typical Forward Characteristics
10
INSTANTANEOUS FORWARD CURRENT (A)
INSTANTANEOUS REVERSE CURRENT (μA)
Fig.3 Typical Reverse Characteristics
ES3AB - ES3DB
TJ=125°C
1
0.1
0.01
TJ=25°C
0.001
10
20
30
40
50
60
70
100
80
90
100
10
ES3AB - ES3DB
10
TJ=125°C
0.1
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
TJ=25°C
TJ=125°C
TJ=25°C
10.01
Pulse width
0.001
0.3
0.1
0.4
100
UF1DLW
1
(A)
AVERAGE FORWARD CURRENT (A)
4
0.4
0.6
0.5
0.6
0.8
0.7
Pulse width 300μs
1% duty
0.8
0.9 cycle1
1.1
1.0
1.2
1.4
FORWARD VOLTAGE (V)
4
Version: C2102
1.2
ES3AB – ES3JB
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.5 Typical Junction Capacitance
Fig.6 Typical Reverse Characteristics
INSTANTANEOUS REVERSE CURRENT (μA)
1000
CAPACITANCE (pF)
ES3FB - ES3GB
100
10
f=1.0MHz
Vsig=50mVp-p
1
1
10
10
ES3FB - ES3GB
TJ=125°C
1
0.1
0.01
TJ=25°C
0.001
10
100
20
30
40
50
60
70
80
90
100
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
REVERSE VOLTAGE (V)
Fig.7 Typical Forward Characteristics
INSTANTANEOUS FORWARD CURRENT (A)
(A)
100
ES3FB - ES3GB
10
TJ=125°C
TJ=25°C
1
Pulse width 300μs
1% duty cycle
0.1
0.4
0.6
0.8
1.0
1.2
1.4
1.6
FORWARD VOLTAGE (V)
5
Version: C2102
ES3AB – ES3JB
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.8 Typical Junction Capacitance
Fig.9 Typical Reverse Characteristics
INSTANTANEOUS REVERSE CURRENT (μA)
1000
CAPACITANCE (pF)
ES3HB - ES3JB
100
10
f=1.0MHz
Vsig=50mVp-p
1
1
10
10
ES3HB - ES3JB
TJ=125°C
1
0.1
TJ=25°C
0.01
0.001
10
100
REVERSE VOLTAGE (V)
20
30
40
50
60
70
80
90
100
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
100
10
ES3HB - ES3JB
UF1DLW
1
10
TJ=125°C
TJ=125°C
0.1
TJ=25°C
(A)
INSTANTANEOUS FORWARD CURRENT (A)
Fig.10 Typical Forward Characteristics
TJ=25°C
1
0.01
Pulse width
0.001
0.1
0.3
0.4
0.4
0.6
0.5
0.8
1.0
0.6
1.2
0.7
1.4
Pulse width 300μs
0.81% duty
0.9 cycle
1
1.1
1.6
1.8
2.0
1.2
2.2
FORWARD VOLTAGE (V)
6
Version: C2102
ES3AB – ES3JB
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DO-214AA (SMB)
SUGGESTED PAD LAYOUT
MARKING DIAGRAM
7
P/N
= Marking Code
G
= Green Compound
YW
= Date Code
F
= Factory Code
Version: C2102
ES3AB – ES3JB
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability
for application assistance or the design of Purchasers’ products.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
8
Version: C2102
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