ESH1D M2G

ESH1B – ESH1D Taiwan Semiconductor 1A, 100V - 200V Ultra Fast Surface Mount Rectifier FEATURES ● ● ● ● ● ● ● KEY PARAMETERS Glass passivated chip junction Ideal for automated placement Low profile package Ultra Fast recovery time for high efficiency Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 PARAMETER VALUE UNIT IF 1 A VRRM 100 - 200 V IFSM 30 A TJ MAX 175 °C APPLICATIONS ● ● ● ● ● Package DO-214AC (SMA) Configuration Single die DC to DC converter Switching mode converters and inverters Lighting application Snubber Freewheeling application MECHANICAL DATA ● ● ● ● ● ● Case: DO-214AC (SMA) Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.060g (approximately) DO-214AC (SMA) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL Marking code on the device ESH1B ESH1C ESH1D ESH1B ESH1C ESH1D UNIT Repetitive peak reverse voltage VRRM 100 150 200 V Reverse voltage, total rms value VR(RMS) 70 105 140 V Forward current Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load Junction temperature IF 1 A IFSM 30 A TJ - 55 to +175 °C Storage temperature TSTG - 55 to +175 °C 1 Version: F2102 ESH1B – ESH1D Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT Junction-to-lead thermal resistance RӨJL 35 °C/W Junction-to-ambient thermal resistance RӨJA 85 °C/W ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER Forward voltage CONDITIONS (1) Reverse current @ rated VR IF = 1A, TJ = 25°C (2) Junction capacitance Reverse recovery time TJ = 25°C SYMBOL TYP MAX UNIT VF - 0.9 V - 1 µA - 25 µA CJ 16 - pF trr - 15 ns IR TJ = 125°C 1MHz, VR = 4.0V IF = 0.5A, IR = 1.0A, Irr = 0.25A Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms ORDERING INFORMATION ORDERING CODE(1) PACKAGE PACKING ESH1x DO-214AC (SMA) 7,500 / Tape & Reel Notes: 1. “x” defines voltage from 100V(ESH1B) to 200V(ESH1D) 2 Version: F2102 ESH1B – ESH1D Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 100 CAPACITANCE (pF) 1 0 25 50 75 100 125 150 10 f=1.0MHz Vsig=50mVp-p 1 175 0.1 1 LEAD TEMPERATURE (°C) INSTANTANEOUS FORWARD CURRENT (A) TJ=125°C 1 TJ=25°C 0.1 10 20 30 40 50 60 70 80 100 Fig.4 Typical Forward Characteristics 100 90 100 100 10 10 UF1DLW 1 TJ=125°C TJ=25°C 0.1 1 0.01 0.1 0.001 0.6 0.8 0.3 0.4 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Pulse width 300μs 1% duty cycle Pulse width 1.0 0.5 1.2 1.4 0.6 0.7 0.8 1.6 0.9 1.8 1 1.1 FORWARD VOLTAGE (V) Fig.5 Maximum Non-Repetitive Forward Surge Current 40 PEAK FORWARD SURGE CURRENT (A) INSTANTANEOUS REVERSE CURRENT (μA) Fig.3 Typical Reverse Characteristics 10 10 REVERSE VOLTAGE (V) (A) AVERAGE FORWARD CURRENT (A) 2 8.3ms single half sine wave 30 20 10 0 1 10 100 NUMBER OF CYCLES AT 60 Hz 3 Version: F2102 1.2 ESH1B – ESH1D Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.6 Reverse Recovery Time Characteristic and Test Circuit Diagram 4 Version: F2102 ESH1B – ESH1D Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DO-214AC (SMA) SUGGESTED PAD LAYOUT MARKING DIAGRAM 5 P/N = Marking Code G = Green Compound YW = Date Code F = Factory Code Version: F2102 ESH1B – ESH1D Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 6 Version: F2102