HS3M R7G

HS3A – HS3M Taiwan Semiconductor 3A, 50V - 1000V High Efficient Surface Mount Rectifier FEATURES ● ● ● ● ● ● ● KEY PARAMETERS Glass passivated chip junction Ideal for automated placement Low forward voltage drop Low profile package Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 APPLICATIONS PARAMETER VALUE UNIT IF 3 A VRRM 50 - 1000 V IFSM 150 A TJ MAX 150 °C Package DO-214AB (SMC) Configuration Single die ● High frequency rectification ● Freewheeling application ● Switching mode converters and inverters in computer and telecommunication MECHANICAL DATA ● ● ● ● ● ● Case: DO-214AB (SMC) Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.210g (approximately) DO-214AB (SMC) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER Marking code on the device Repetitive peak reverse voltage Reverse voltage, total rms value Forward current Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load Junction temperature Storage temperature SYMBOL HS3A HS3B HS3D HS3F HS3G HS3J HS3K HS3M UNIT HS3A HS3B HS3D HS3F HS3G HS3J HS3K HS3M VRRM 50 100 200 300 400 600 800 1000 V VR(RMS) 35 70 140 210 280 420 560 700 V IF 3 A IFSM 150 A TJ - 55 to +150 °C TSTG - 55 to +150 °C 1 Version: K2102 HS3A – HS3M Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT RӨJA 60 °C/W Junction-to-ambient thermal resistance ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER Forward voltage CONDITIONS HS3A HS3B HS3D HS3F HS3G HS3J HS3K HS3M (1) Reverse current @ rated VR TJ = 25°C (2) Junction capacitance Reverse recovery time IF = 3A, TJ = 25°C VF IR TJ = 125°C HS3A HS3B HS3D HS3F HS3G HS3J HS3K HS3M HS3A HS3B HS3D HS3F HS3G HS3J HS3K HS3M SYMBOL 1MHz, VR = 4.0V IF = 0.5A, IR = 1.0A, Irr = 0.25A TYP MAX UNIT - 1.0 V - 1.3 V - 1.7 V - 10 µA - 250 µA 80 - pF 50 - pF - 50 ns - 75 ns CJ trr Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms ORDERING INFORMATION ORDERING CODE(1) PACKAGE PACKING HS3x DO-214AB (SMC) 3,000 / Tape & Reel Notes: 1. “x” defines voltage from 50V(HS3A) to 1000V(HS3M) 2 Version: K2102 HS3A – HS3M Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 175 150 3 CAPACITANCE (pF) 2 1 125 100 HS3A - HS3G 75 50 HS3J - HS3M 25 f=1.0MHz Vsig=50mVp-p 0 0 25 50 75 100 125 0.1 150 1 LEAD TEMPERATURE (°C) INSTANTANEOUS FORWARD CURRENT (A) 100 TJ=125°C 10 TJ=25°C 1 30 40 50 60 70 80 90 100 10 10 HS3A - HS3D UF1DLW 1 TJ=125°C 1 0.1 TJ=25°C HS3G HS3J - HS3M 0.01 0.1 0.001 0.4 0.3 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Pulse width 300μs 1% duty cycle Pulse width 0.6 0.4 0.5 0.8 0.6 1.0 0.7 0.8 1.2 0.9 1.4 1 1.1 FORWARD VOLTAGE (V) Fig.5 Maximum Non-Repetitive Forward Surge Current 200 PEAK FORWARD SURGE CURRENT (A) INSTANTANEOUS REVERSE CURRENT (μA) Fig.4 Typical Forward Characteristics 1000 20 100 REVERSE VOLTAGE (V) Fig.3 Typical Reverse Characteristics 10 10 (A) AVERAGE FORWARD CURRENT (A) 4 8.3ms single half sine wave 150 100 50 0 1 10 100 NUMBER OF CYCLES AT 60 Hz 3 Version: K2102 1.2 HS3A – HS3M Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.6 Reverse Recovery Time Characteristic and Test Circuit Diagram 4 Version: K2102 HS3A – HS3M Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DO-214AB (SMC) SUGGESTED PAD LAYOUT MARKING DIAGRAM 5 P/N = Marking Code G = Green Compound YW = Date Code F = Factory Code Version: K2102 HS3A – HS3M Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 6 Version: K2102