ESH1DM RSG

ESH1DM – ESH1JM Taiwan Semiconductor 1A, 200V - 600V Ultra Fast Surface Mount Rectifier FEATURES ● ● ● ● ● ● ● KEY PARAMETERS Very low profile - typical height of 0.68mm Reduce switching and conduction loss Ideal for automated placement Ultra fast recovery times for high frequency Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 APPLICATIONS PARAMETER VALUE UNIT IF 1 A VRRM 200 - 600 V IFSM 15 A TJ MAX 150 °C Package Micro SMA Configuration Single die ● DC to DC converter ● Switching mode converters and inverters ● Freewheeling application . MECHANICAL DATA ● ● ● ● ● ● Case: Micro SMA Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.006g (approximately) Micro SMA ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL Marking code on the device ESH1DM ESH1GM ESH1JM D3 D5 D7 UNIT Repetitive peak reverse voltage VRRM 200 400 600 V Reverse voltage, total rms value VR(RMS) 140 280 420 V Forward current Surge peak forward current, 8.3ms single half sine wave superimposed on rated load Junction temperature IF 1 A IFSM 15 A TJ -55 to +150 °C Storage temperature TSTG -55 to +150 °C 1 Version: D2103 ESH1DM – ESH1JM Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT Junction-to-lead thermal resistance RӨJL 40 °C/W Junction-to-ambient thermal resistance RӨJA 92 °C/W ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER Forward voltage CONDITIONS (1) Reverse current @ rated VR IF = 1A, TJ = 25°C (2) Junction capacitance Reverse recovery time TJ = 25°C SYMBOL TYP MAX UNIT VF 1.25 1.50 V - 1 µA - 50 µA CJ 3 - pF trr - 25 ns IR TJ = 125°C 1MHz, VR = 4.0V IF = 0.5A, IR = 1.0A Irr = 0.25A Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms ORDERING INFORMATION ORDERING CODE(1) PACKAGE PACKING ESH1xM Micro SMA 12,000 / Tape & Reel Notes: 1. “x” defines voltage from 200V(ESH1DM) to 600V(ESH1JM) 2 Version: D2103 ESH1DM – ESH1JM Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Maximum Non-Repetitive Forward Surge Current 20 PEAK FORWARD SURGE CURRENT (A) 1 0 25 50 75 100 125 8.3ms single half sine wave 15 10 5 0 150 1 LEAD TEMPERATURE (°C) 1 TJ=125°C 0.1 0.01 TJ=25°C 0.0001 20 30 40 50 60 Fig.4 Typical Forward Characteristics INSTANTANEOUS FORWARD CURRENT (A) INSTANTANEOUS REVERSE CURRENT (μA) 10 10 70 80 100 NUMBER OF CYCLES AT 60 Hz Fig.3 Typical Reverse Characteristics 0.001 10 90 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 10 10 1 UF1DLW TJ=125°C TJ=125°C TJ=25°C 1 0.1 (A) AVERAGE FORWARD CURRENT (A) 2 TJ=25°C 0.01 Pulse width 300μs 1% duty cycle Pulse width 0.1 0.001 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 FORWARD VOLTAGE (V) Fig.5 Reverse Recovery Time Characteristic and Test Circuit Diagram 3 Version: D2103 ESH1DM – ESH1JM Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS Micro SMA SUGGESTED PAD LAYOUT MARKING DIAGRAM P/N YW 4 = Marking Code = Data Code Version: D2103 ESH1DM – ESH1JM Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 5 Version: D2103