NXPSC06650D
Silicon Carbide Diode
4 January 2017
Product data sheet
1. General description
Silicon Carbide Schottky diode designed for high frequency switched mode power supplies in a
TO252 (DPAK) plastic package.
2. Features and benefits
•
•
•
•
•
•
•
•
Highly stable switching performance
High forward surge capability IFSM
Extremely fast reverse recovery time
Superior in efficiency to Silicon Diode alternatives
Reduced losses in associated MOSFET
Reduced EMI
Reduced cooling requirements
RoHS compliant
3. Applications
•
•
•
•
•
•
•
Power factor correction
Telecom/Server SMPS
UPS
PV inverter
PC Silverbox
LED/OLED TV
Motor Drives
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
VRRM
repetitive peak reverse
voltage
IF(AV)
average forward
current
Tj
junction temperature
Conditions
Min
Typ
Max
Unit
-
-
650
V
-
-
6
A
-
-
175
°C
IF = 6 A; Tj = 25 °C; Fig. 6
-
1.5
1.7
V
IF = 6 A; Tj = 150 °C; Fig. 6
-
1.8
2.1
V
IF = 6 A; dIF/dt = 500 A/µs; VR = 400 V;
Tj = 25 °C; Fig. 7
-
10
-
nC
δ = 0.5 ; Tmb ≤ 125 °C; square-wave
pulse; Fig. 1; Fig. 2; Fig. 3; Fig. 4
Static characteristics
VF
forward voltage
Dynamic characteristics
Qr
recovered charge
NXPSC06650D
WeEn Semiconductors
Silicon Carbide Diode
5. Pinning information
Table 2. Pinning information
Pin
Symbol Description
1
n.c.
Simplified outline
not connected
Graphic symbol
K
mb
A
001aaa020
2
K
cathode[1]
3
A
anode
mb
K
mounting base; connected to
cathode
2
1
3
DPAK (TO252NS)
[1]
It is not possible to connect to pin 2 of the TO252 package.
6. Ordering information
Table 3. Ordering information
Type number
NXPSC06650D
NXPSC06650D
Product data sheet
Package
Name
Description
Version
DPAK
plastic single-ended surface-mounted package (DPAK); 3 leads
(one lead cropped)
TO252NS
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Silicon Carbide Diode
7. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VRRM
Conditions
Min
Max
Unit
repetitive peak reverse
voltage
-
650
V
VRWM
crest working reverse
voltage
-
650
V
VR
reverse voltage
DC
-
650
V
IF(AV)
average forward current
δ = 0.5 ; Tmb ≤ 125 °C; square-wave
pulse; Fig. 1; Fig. 2; Fig. 3; Fig. 4
-
6
A
IFRM
repetitive peak forward
current
δ = 0.5 ; tp = 25 µs; square-wave pulse
-
12
A
IFSM
non-repetitive peak
forward current
tp = 10 ms; Tj(init) = 25 °C; sine-wave pulse
-
36
A
tp = 10 µs; Tj(init) = 25 °C; square-wave
pulse
-
310
A
Tstg
storage temperature
-55
175
°C
Tj
junction temperature
-
175
°C
Ptot
(W)
aaf020-001
25
Vo = 0.444V
Rs = 0.2192Ω
20
0.1 0.2
0.5
15
δ=1
107.5
Tmb(max)
(°C)
121
IF(AV)
(A)
aaf020-002
8
125 °C
6
134.5
4
148
10
0
2
161.5
5
0
2
4
6
175
8
10
IF(AV) (A)
IF(AV) = IF(RMS) × √δ
Fig. 1. Forward power dissipation as a function of
average forward current; square waveform; maximum
values
NXPSC06650D
Product data sheet
0
-50
0
50
100
150
200
Tmb (°C)
Fig. 2. Forward current as a function of mounting base
temperature; maximum values
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Silicon Carbide Diode
Ptot
(W)
aaf020-003
80
aaf020-004
60
IF(peak)
(A)
50
60
δ = 0.1
40
δ = 0.2
40
30
20
20
10
0
25
50
75
100
125
Fig. 3. Total power dissipation as a function of
mounting base temperature
NXPSC06650D
Product data sheet
0
150
175
Tmb (°C)
δ = 0.5
δ=1
25
50
75
100
125
150
175
Tmb (°C)
Fig. 4. Current derating as a function of mounting base
temperature
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8. Thermal characteristics
Table 5. Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-mb)
thermal resistance
from junction to
mounting base
Fig. 5
-
-
2.7
K/W
Rth(j-a)
thermal resistance
from junction to
ambient free air
Device mounted on an FR4 PrintedCircuit Board
-
50
-
K/W
aae909-005
10
Zth(j-mb)
(K/W)
1
δ = 0.5
δ = 0.3
δ = 0.1
10-1
P
δ = 0.05
δ = 0.02
δ = 0.01
tp
single pulse
10-2
10-5
δ=
10-4
10-3
10-2
10-1
tp
T
t
T
1
tp (s)
10
Fig. 5. Transient thermal impedance from junction to mounting base as a function of pulse duration
NXPSC06650D
Product data sheet
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9. Characteristics
Table 6. Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IF = 6 A; Tj = 25 °C; Fig. 6
-
1.5
1.7
V
IF = 6 A; Tj = 150 °C; Fig. 6
-
1.8
2.1
V
VR = 650 V; Tj = 25 °C
-
-
200
µA
VR = 650 V; Tj = 150 °C
-
-
640
µA
Static characteristics
VF
forward voltage
IR
reverse current
Dynamic characteristics
Qr
recovered charge
IF = 6 A; dIF/dt = 500 A/µs; VR = 400 V;
Tj = 25 °C; Fig. 7
-
10
-
nC
Cd
diode capacitance
f = 1 MHz; VR = 1 V; Tj = 25 °C
-
190
-
pF
f = 1 MHz; VR = 300 V; Tj = 25 °C
-
23
-
pF
f = 1 MHz; VR = 600 V; Tj = 25 °C
-
19
-
pF
IF
(A)
aaf020-006
12
Qr
(nC)
10
10
8
8
(1)
6
aaf020-007
12
6
(2)
(3)
4
4
(4)
2
0
2
0
1
2
3
VF (V)
0
4
(1) Tj = 25 °C; typical values
(2) Tj = 100 °C; typical values
(3) Tj = 150 °C; typical values
(4) Tj = 175 °C; typical values
0
25
50
75
100
125
150
175
Tj (°C)
Fig. 7. Recovered charge as a function of junction
temperature
Fig. 6. Forward current as a function of forward voltage;
typical values
NXPSC06650D
Product data sheet
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10. Package outline
Fig. 8. Package outline DPAK (TO252NS)
NXPSC06650D
Product data sheet
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Silicon Carbide Diode
Right to make changes — WeEn Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
11. Legal information
Suitability for use — WeEn Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical
or safety-critical systems or equipment, nor in applications where failure
or malfunction of an WeEn Semiconductors product can reasonably
be expected to result in personal injury, death or severe property or
environmental damage. WeEn Semiconductors and its suppliers accept no
liability for inclusion and/or use of WeEn Semiconductors products in such
equipment or applications and therefore such inclusion and/or use is at the
customer’s own risk.
Data sheet status
Document
status [1][2]
Product
status [3]
Objective
[short] data
sheet
Development This document contains data from
the objective specification for product
development.
Preliminary
[short] data
sheet
Qualification
This document contains data from the
preliminary specification.
Product
[short] data
sheet
Production
This document contains the product
specification.
[1]
[2]
[3]
Definition
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. WeEn Semiconductors makes
no representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Please consult the most recently issued document before initiating or
completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
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Draft — The document is a draft version only. The content is still under
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Product data sheet.
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Notwithstanding any damages that customer might incur for any reason
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towards customer for the products described herein shall be limited in
accordance with the Terms and conditions of commercial sale of WeEn
Semiconductors.
NXPSC06650D
Product data sheet
Customers are responsible for the design and operation of their applications
and products using WeEn Semiconductors products, and WeEn
Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customer’s sole responsibility to determine
whether the WeEn Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should
provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
WeEn Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default
in the customer’s applications or products, or the application or use by
customer’s third party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and products using WeEn
Semiconductors products in order to avoid a default of the applications
and the products or of the application or use by customer’s third party
customer(s). WeEn does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
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WeEn Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
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customer (a) shall use the product without WeEn Semiconductors’ warranty
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Semiconductors’ standard warranty and WeEn Semiconductors’ product
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Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
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Product data sheet
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12. Contents
1. General description......................................................1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Limiting values............................................................. 3
8. Thermal characteristics............................................... 5
9. Characteristics..............................................................6
10. Package outline.......................................................... 7
11. Legal information....................................................... 8
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WeEn Semiconductors Co., Ltd. 2017. All rights reserved
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Date of release: 4 January 2017
NXPSC06650D
Product data sheet
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