MB05F
THRU
MB10F
Technical Data
Data Sheet N1456, Rev. B
MB05F THRU MB10F SINGLE PHASE
0.8AMP SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
Features
Glass passivated die construction
Low forward voltage drop
High current capability
High surge current capability
Designed for surface mount application
Plastic material-UL flammability 94V-0
This is a Pb − Free Device
“-HF” suffix is for Halogen Free Device
All SMC parts are traceable to the wafer lot
Additional testing can be offered upon request
MBF
Circuit Diagram
Mechanical Data
Case: MBF, Molded plastic
Terminals: Plated leads solderable per MIL-STD-202,
Method 208
Polarity: as marked on case
Mounting Position: Any
Lead Free: For RoHS / Lead Free Version
Maximum Ratings @TA=25°C unless otherwise specified
Type Number
Symbol
MB05F-HF THRU MB10F-HF
Marking Code
MB05F
MB1F
MB05FH MB1FH
MB2F
MB4F
MB6F
MB8F
MB10F
Units
MB2FH MB4FH MB6FH MB8FH MB10FH
Peak Repetitive Reverse Voltage
DC Blocking Voltage
VRRM
VDC
50
100
200
400
600
800
1000
V
RMS Voltage
VRMS
35
70
140
280
420
480
700
V
Average Rectified Output Current
(Note1)@TA=40℃
(Note 2)@TA=40℃
Non-Repetitive Peak Forward
Surge Current 8.3ms Single half
sine-wave superimposed on rated
load (JEDEC Method)
IO
0.5
0.8
A
IFSM
30
A
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MB05F
THRU
MB10F
Technical Data
Data Sheet N1456, Rev. B
Electrical Characteristics:@TA=25°C unless otherwise specified
Type Number
Symbol
MB05F-HF THRU MB10F-HF
Marking Code
MB05F
MB1F
MB2F
MB4F
MB6F
MB8F
MB10F
Units
MB05FH MB1FH MB2FH MB4FH MB6FH MB8FH MB10FH
VFM
1.1
V
Peak Reverse Current
@TA = 25°C
At Rated DC Blocking Voltage @TA = 125°C
IR
5
500
μA
Typical Junction Capacitance (Note 3)
Cj
13
pF
Forward Voltage per element
@IF =0.8A
* Pulse width < 300 µs, duty cycle < 2%
Thermal-Mechanical Specifications:@TA=25°C unless otherwise specified
Type Number
MB05F-HF THRU MB10F-HF
Marking Code
Typical Thermal Resistance per leg
Operating Junction and Storage Temperature
Range
Symbol
MB05F
MB1F
MB2F
MB4F
MB6F
MB8F
MB10F
Units
MB05FH MB1FH MB2FH MB4FH MB6FH MB8FH MB10FH
RθJA
RθJL
60
16
°C/W
TJ ,TSTG
-55+150
°C
Note: 1. Mounted on glass epoxy PC board with 1.3mm2 solder pad..
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
3. Thermal REsistance From Junction to Ambient
Ratings and Characteristics Curves
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MB05F
THRU
MB10F
Technical Data
Data Sheet N1456, Rev. B
Ordering Information
Device
MB05F
THRU
MB10F
MB05FTR
THRU
MB10F TR
Marking Diagram
Package
Plating
Shipping
MBF
Pure Sn
5000pcs / reel
MBF
Pure Sn
5000pcs / reel
For information on tape and reel specifications, including part
orientation and tape sizes, please refer to our tape and reel
packaging specification.
Where XXXXX is YYWWL
MB05F
MB05FH
YY
WW
L
= Type Number
= Marking Code
= Year
= Week
= Lot Number
Cautions:Molding resin
Epoxy resin UL:94V-0
MB05F
MB05F-HF
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MB05F
THRU
MB10F
Technical Data
Data Sheet N1456, Rev. B
Mechanical Dimensions MBF(Inches/Millimeters)
Carrier Tape & Reel Specification MBF
A0
Millimeters
Min.
Max.
5.41
5.21
B0
7.10
7.30
D0
D1
P0
1.50
1.40
3.90
1.60
P1
7.90
8.10
P2
1.95
2.05
E
1.65
1.85
K0
1.55
1.75
F
5.45
5.55
W
11.90
12.10
T
0.24
0.30
10P0
39.80
40.20
SYMBOL
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1.60
4.10
MB05F
THRU
MB10F
Technical Data
Data Sheet N1456, Rev. B
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC Diode Solutions sales department for the latest version of
the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC Diode Solutions be liable for any damages that may result from an accident or any other cause during
operation of the user’s units according to the datasheet(s). SMC Diode Solution assumes no responsibility for any intellectual property
claims or any other problems that may result from applications of information, products or circuits described in the datasheets.
4- In no event shall SMC Diode Solutions be liable for any failure in a semiconductor device or any secondary damage resulting from use
at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC Diode Solutions.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC
Diode Solutions.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations.
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