BAS40 RFG

BAS40 / -04 / -05 / -06 Taiwan Semiconductor 200mW, Low VF SMD Schottky Barrier Diode FEATURES KEY PARAMETERS ● ● ● ● Designed for mounting on small surface Low Capacitance Low forward voltage drop Compliant to RoHS directive 2011/65/EU and in accordance to WEEE 2002/96/EC ● Halogen-free according to IEC 61249-2-21 PARAMETER VALUE UNIT IF(AV) 200 mA VRRM 40 V IFSM 0.6 A VF at IF=40mA 1 V TJ Max. 125 °C APPLICATIONS ● ● ● ● Package Adapters For switching power supply Low stored charge Inverter SOT-23 MECHANICAL DATA ● Case: SOT-23 ● Molding compound: UL flammability classification rating 94V-0 ● Moisture sensitivity level: level 1, per J-STD-020 ● Packing code with suffix "G" means green compound (halogen-free) ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 1A whisker test ● Weight: 8 mg (approximately) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL BAS40 Marking code on the device 43 BAS40- BAS40- BAS40- 04 05 06 44 45 46 UNIT Repetitive peak reverse voltage VRRM Forward current Non-repetitive peak forward surge current @ t = 8.3ms Junction temperature range IF(AV) 40 200 V mA IFSM 0.6 A TJ -65 to +125 °C TSTG -65 to +125 °C Storage temperature range 1 Version:G1702 BAS40 / -04 / -05 / -06 Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL LIMIT UNIT RӨJA 357 °C/W Junction-to-ambient thermal resistance ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER CONDITIONS Forward voltage per diode MIN VF - IR - 0.2 μA V(BR) 40 - V CJ - 5.0 pF trr - 5.0 ns IF = 1mA, TJ = 25°C (1) IF = 40mA, TJ = 25°C Reverse current @ rated VR per diode SYMBOL VR=30V TJ = 25°C (2) Reverse Breakdown Voltage IR=10μA Junction capacitance 1 MHz, VR=1V IF=IR=10mA, RL=100ῼ, Reverse Recovery Time IRR=1mA MAX UNIT 0.38 1.00 V Notes: 1. Pulse test with PW=0.3 ms 2. Pulse test with PW=30 ms ORDERING INFORMATION PART NO. PACKING PACKING CODE CODE SUFFIX(*) RF G BAS40-XX (Note 1) PACKAGE PACKING SOT-23 3K / 7" Reel Notes: 1. “XX” is Device code from “04” to ”06”. *: optional available EXAMPLE EXAMPLE P/N PART NO. PACKING CODE BAS40-04 RFG BAS40-04 RF PACKING CODE SUFFIX G 2 DESCRIPTION Green compound Version:G1702 BAS40 / -04 / -05 / -06 Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.2 Maximum Non-Repetitve Peak Forward Surge Current Per Leg Peak Forward Surge Current (mA) PD, Power Dissipation (mW) Fig. 1 Power Derating Curve 200 100 0 0 25 50 75 100 600 8.3 ms single half sine wave 300 0 125 1 o 100 Numbers of Cycles at 60 Hz TA - Ambient Temperature ( C) Fig.3 Typical Forward Characteristics Fig.4 Typical Reverse Characteristics 10000 IR - Instantaneous Reverse Current (mA) 1 Instantaneous Forward Current (mA) 10 0.1 0.01 TA= -40 °C TA= 0 °C TA= 25 °C TA=70 °C TA= 125 °C 0.001 0.0001 TA=125 °C 1000 TA=70 °C 100 TA=25 °C 10 TA=0 °C 1 TA= -40 °C 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 10 20 30 40 VR - Reverse Voltage (V) VF, Instantaneous Forward Voltage (mV) 3 Version:G1702 BAS40 / -04 / -05 / -06 Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig. 5 Typical Total Capacitance VS. Fig.6 Typical Transient Thermal Reverse Voltage Characteristics 100 Transient Thermal Impedance (oC/W) Junction Capacitance (pF) 4 f=1.0MHz 2 0 0 5 10 15 10 1 0.1 0.01 20 Reverse Voltage (V) 0.10 1.00 10.00 100.00 Pulse Duration (sec) 4 Version:G1702 BAS40 / -04 / -05 / -06 Taiwan Semiconductor PACKAGE OUTLINE DIMENSION SOT-23 DIM. Unit(mm) Unit(inch) Min Max Min Max A 2.70 3.10 0.106 0.122 B 1.10 1.50 0.043 0.059 C 0.30 0.51 0.012 0.020 D 1.78 2.04 0.070 0.080 E 2.10 2.64 0.083 0.104 F 0.89 1.30 0.035 0.051 G 0.55 REF 0.022 REF H 0.10 REF 0.004 REF SUGGEST PAD LAYOUT DIM. Unit(mm) Unit(inch) TYP TYP Z 2.8 0.11 X 0.7 0.03 Y 0.9 0.04 C 1.9 0.07 E 1.0 0.04 PIN CONFIGURATION 5 Version:G1702 BAS40 / -04 / -05 / -06 Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 6 Version:G1702