KMB16F

PART CODE: MBFKMB16FS1006 SPECIFICATION SHEET SPECIFICATION SHEET NO. N0626-MBFKMB16FS1006 DATE June 26, 2021 REVISION A1 DESCRIPITION SMD Schottky Bridge Rectifier, MBF series, KMB16F Type, 4 Pins, Reverse Voltage 60V Max. Forward Current 1.0A Max. Operating Temp. Range -55°C ~+125°C, Package in Tape/Reel, 5000pcs/Reel RoHS/RoHS III compliant CUSTOMER CUSTOMER PART NUMBER CROSS REF. PART NUMBER ORIGINAL PART NUMBER MDD KMB16F PART CODE MBFKMB16FS1006 VENDOR APPROVE Issued/Checked/Approved DATE: June 26, 2021 CUSTOMER APPROVE DATE: 1 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: MBFKMB16FS1006 SMD BRIDGE RECTIFER MBF SERIES MAIN FEATURE • Surge overload rating: 30A peak • Low leakage • Reliable low cost construction utilizing molded • Plastic material – UL flammability 94V-0 APPLICATION • For SMD application RFQ PART CODE GUIDE Request For Quotation MBF KMB16F S 1006 1 2 3 4 1) MBF: SMD Schottky Bridge Rectifier, MBF series 2) KMB16F: Type code for original part number KMB16F 3) S: Package code, Tape/reel, 5000pcs/reel. 4) 1006: Specification code for Reverse Voltage 60V Max. Forward Current 1.0A Max. MORE ITEMS AVAILABLE MBFKMB14FS1004 MBFKMB16FS1006 MBFKMB18FS1008 MBFKMB110FS110 MBFKMB115FS115 MBFKMB120FS120 2 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: MBFKMB16FS1006 SMD BRIDGE RECTIFER MBF SERIES DIMENSION (Unit: Inch/mm) Image for reference Marking: KMB16F MBF Recommend Pad Layout Symbol Min. (Inch) Min. (mm) P1 0.236 6.00 P2 0.094 2.40 Q1 0.072 1.84 Q2 0.047 1.20 3 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: MBFKMB16FS1006 SMD BRIDGE SCHOTTKY SMD RECTIFER GENERAL BARRIER MBF RECTIFER RECTIFER SERIES MECHANICAL DATA Case Terminals Polarity Mounting Position Weight per piece JEDEC MBF molded plastic body Solder plated, Solderable per MIL-STD-750, Method 2026 Polarity symbol marking on case Any 0.0026 Ounce, 0.075 grams MAX. RATING & CHARACTERISTICS Parameter SYMBOLS VALUE Min. Typical UNITS Max. Repetitive peak reverse voltage V RRM 60 Volts RMS voltage V RMS 42 Volts DC blocking voltage V DC 60 Volts Average forward output rectified current I AV 1.0 A at Tc= 30°C, Aluminum Substrate I FSM Peak forward surge current 8.3ms single half 30 A sine-wave superimposed on rated load (JEDEC Method) Instantaneous forward voltage at 1A DC reverse current at rated DC blocking voltage Junction capacitance Thermal resistance (Note 2) Operating junction temperature range Storage temperature range TA=25℃ VF 0.70 Volts IR 0.3 µA 10 TA=100℃ CJ 80 pF R QJA 100 °C/W TJ -55 +125 T STG -55 +150 °C Note 1. Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz, resistive or inductive load, for capacitive load current derate by 20%. 2. Thermal resistance from junction to ambient and from junction to lead PCB mounted on 02”*0.2” copper pad areas. 4 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: MBFKMB16FS1006 SMD BRIDGE SMD RECTIFER GENERAL MBF RECTIFER SERIES RELIABILITY Number Experiment Items Experiment Method And Conditions Reference Documents 1 Solder Resistance Test Test 260°C± 5°C for 10 ± 2 sec. Immerse body into solder 1/16” ± 1/32" MIL-STD-750D METHOD-2031.2 2 Solderability Test 230°C ±5°C for 5 sec. MIL-STD-750D METHOD-2026.1 0 3 Pull Test 1 kg in axial lead direction for 10 sec. MIL-STD-750D METHOD-2036.4 4 Bend Test 0.5Kg Weight Applied To Each Lead, Bending Arcs 90 °C ± 5 °C For 3 Times MIL-STD-750D METHOD-2036.4 5 High Temperature Reverse Bias Test TA=100°C for 1000 Hours at VR=80% Rated VR MIL-STD-750D METHOD-1038.4 6 Forward Operation Life Test TA=25°C Rated Average Rectified Current MIL-STD-750D METHOD-1027.3 7 Intermittent Operation Life Test On state: 5 min with rated IRMS Power Off state: 5 min with Cool Forced Air. On and off for 1000 cycles. MIL-STD-750D METHOD-1036.3 8 Pressure Cooker Test 15 PSIG, TA=121°C, 4 hours MIL-S-19500 APPENOIXC 9 Temperature Cycling Test -55°C~+125°C; 30 Minutes For Dwelled Time 5 minutes for transferred time. Total: 10 cycles. MIL-STD-750D METHOD-1051.7 10 Thermal Shock Test 0°C for 5 minutes., 100°C for 5minutes, Total: 10 cycles MIL-STD-750D METHOD-1056.7 11 Forward Surge Test 8.3ms Single Sale Sine-wave One Surge. MIL-STD-750D METHOD-4066.4 12 Humidity Test TA=65°C, RH=98% for 1000 hours. MIL-STD-750D METHOD-1021.3 13 High Temperature Storage life Test 150°C for 1000 Hours MIL-STD-750D METHOD-1031.5 5 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: MBFKMB16FS1006 SMD BRIDGE RECTIFER MBF SERIES SUGGESTED REFLOW PROFILE (For Reference Only) • Recommended peak temperature is over 245℃, If peak temperature is below 245 ℃, you may adjust the following parameters; time length of peak temperature (longer), time length of soldering (longer), thickness of solder paste (thicker) • Welding shall not exceed 2 times • Remark: lead free solder paste (96.5 sn/3.0 Ag/0.5Cu) 6 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: MBFKMB16FS1006 SMD BRIDGE RECTIFER MBF SERIES RATINGS AND CHARACTERISTIC CURVES (For Reference Only) 7 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: MBFKMB16FS1006 SMD BRIDGE SCHOTTKY RECTIFER BARRIER MBF RECTIFER SERIES TAPE/REEL (Unit: mm) All Devices are packed in accordance with EIA standard RS-481-A and specifications. Item Symbol Tolerance MBF Carrier width A 0.1 2.8 Carrier Length B 0.1 5.33 Carrier Depth C 0.1 2.36 Sprocket hole d 0.05 1.50 13”Reel outside diameter D 2.0 330.00 13”Reel inner diameter D1 Min. 50.00 7”Reel outside diameter D - - 7”Reel inner diameter D1 - - Feed hole diameter D2 0.5 13.00 Sprocket hole position E 0.1 1.75 Punch hole position F 0.1 5.50 Punch hole pitch P 0.1 4.00 Sprocket hole pitch P0 0.1 4.00 Embossment center P1 0.1 2.0 Overall tape thickness T 0.1 0.28 Tape width W 0.3 12.00 Reel width W1 1.0 18.0 8 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: MBFKMB16FS1006 SMD BRIDGE RECTIFER MBF SERIES PACKAGE Case Code MBF Reel Size 13” MPQ Qty. Per Box (pcs) Inner Box L*W*H (mm) Reel Size (mm) Carton size L*W*H (mm) Qty. Per Carton (pcs) G. W (pcs) Component Spacing (mm) 5,000 - 10,000 335*340*40 330 380*380*380 80,000 14.4 (kg) DISCLAIMER NextGen Component, Inc. reserves the right to make changes to the product(s) and or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information 9 NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com